JPS59226170A - Electroless nickel plating solution - Google Patents
Electroless nickel plating solutionInfo
- Publication number
- JPS59226170A JPS59226170A JP10029783A JP10029783A JPS59226170A JP S59226170 A JPS59226170 A JP S59226170A JP 10029783 A JP10029783 A JP 10029783A JP 10029783 A JP10029783 A JP 10029783A JP S59226170 A JPS59226170 A JP S59226170A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- plating
- rhodanine
- compd
- glycolate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
(1)目的
現在公知の無電解ニツケルめつき液は数多くあるがそれ
らは管の内径が0.5mm位の内壁にはめつきが析出し
ないか 析出したとしても密着性が極めて悪い、又使用
温度も高い。例えば無電解ニツケルめつき液として代表
的なシユーマーめつき(日本カニゼン社製)の場合管の
内径が0.5mmの内壁にはめつきが析出しないし使用
温度も極めて高い(80℃〜90℃)。[Detailed Description of the Invention] (1) Purpose There are many electroless nickel plating solutions currently known, but they do not allow plating to deposit on the inner wall of tubes with an inner diameter of about 0.5 mm, and even if they do, the adhesion is poor. Extremely bad, and the operating temperature is also high. For example, in the case of Schumar plating (manufactured by Nippon Kanigen Co., Ltd.), which is a typical electroless nickel plating solution, no plating is deposited on the inner wall of the tube with an inner diameter of 0.5 mm, and the operating temperature is extremely high (80°C to 90°C). .
低温でめつきした場合は色調が悪く光沢がないのでプラ
スチツクへのめつきや形状の複雑な品物へのめつきには
適さない。本めつき液の場合素材がABS樹脂又はしん
ちゆうの管で内径が0.5mm位の内壁にもつきまわり
が良いので均一にめつき出来る。 又プラスチツクめつ
きをする時無電解めつきから電気めつきに移る際に接点
づらしをやるが本めつき液の場合はつきまわりが良いの
で その必要がないし温度も低いのでプラスチツクめつ
きには適している。以上より本めつき液は形状の複雑な
もの細い管の内壁(内径0.5mm位)、プラスチツク
へのめつきに適している。If plated at low temperatures, the color tone will be poor and there will be no gloss, so it is not suitable for gluing plastics or items with complex shapes. In the case of this plating liquid, the material is ABS resin or a solid tube, and it has good coverage even on inner walls with an inner diameter of about 0.5 mm, so it can be plated uniformly. Also, when plating plastics, it is necessary to change the contacts when moving from electroless plating to electric plating, but this plating solution has good coverage, so there is no need for this, and the temperature is low, so it is suitable for plating plastics. ing. From the above, this plating solution is suitable for plating on complex-shaped objects, the inner walls of thin tubes (with an inner diameter of about 0.5 mm), and plastics.
そして不足成分を補充することにより連続使用が出来
液寿命は半永久的である。Continuous use is possible by replenishing the missing ingredients.
The liquid life is semi-permanent.
析出層は密着性の良い光沢のあるめつき厚の厚い(10
μ/60分)めつき速度の速い事を特徴としている
(2)構成
本めつき液は可溶性ニツケル塩として硫酸ニツケルを用
いニツケルイオンを完全に全部錯化出来るだけ又はそれ
以上の錯化剤を使用する。錯化剤としては ピロリン酸
カリウム、又は グリコール酸ソーダ又はリンゴ酸ソー
ダ 又は クエン酸ソーダを使用する。The deposited layer has a glossy coating with good adhesion and is thick (10
(μ/60 minutes) is characterized by a fast plating speed. (2) The main plating solution uses nickel sulfate as a soluble nickel salt, and contains as much or more complexing agent as possible to completely complex all nickel ions. use. Potassium pyrophosphate, or sodium glycolate, sodium malate, or sodium citrate is used as the complexing agent.
還元剤は ジメチルアミンボロンを使用しジメチルアミ
ンボロンの分解防止とpH調整の為NH4OH又はKO
H又はNaOH等を使用する。めつき液全体の 安定剤
としてp−ジメチルアミノベンジリデンロダニンを微量
添加する事によつて非常に安定な液寿命の長い連続使用
の出来るめつき液になる。Dimethylamine boron is used as the reducing agent, and NH4OH or KO is used to prevent the decomposition of dimethylamine boron and adjust the pH.
Use H or NaOH, etc. By adding a small amount of p-dimethylaminobenzylidene rhodanine as a stabilizer to the entire plating solution, the plating solution becomes extremely stable and can be used continuously for a long time.
液組成は次の通りである
ピロリン酸塩タイプ
硫酸ニツケル 20g/l〜40g/lピ
ロリン酸カリウム 30g/l〜90g/lジメ
チルアミンボロン 0.06モル/l〜0.1モル
/lp−ジメチルアミノベンジリデンロダニン
1ppm/l〜30ppm/l温度
40℃〜70℃pH
10(NH3で調整)グリコール酸塩タイ
プ
硫酸ニツケル 20g/l〜40g/lグ
リコール酸ソーダ 60g/l〜120g/lジ
メチルアミンボロン 0.06モル/l〜0.1モ
ル/lp−ジメチルアミノベンジリデンロダニン
1ppm/l〜30ppm/l温
度 40℃〜70℃pH
7〜8(NH3で調整)クエン酸タイプ
硫酸ニツケル 20g/l〜40g/lク
エン酸ソーダ 1g/l〜10g/lジメチ
ルアミンボロン 0.01モル/l〜0.1モル/
lp−ジメチルアミノベンジリデンロダニン
1ppm/l〜30ppm/l温度
40℃〜60℃pH
7〜10(NH3で調整)リンゴ酸塩タイプ
硫酸ニツケル 20g/l〜40g/lリ
ンゴ酸カリウム 5g/l〜50g/lジメチ
ルアミンボロン 0.06モル/l〜0.1モル/
lp−ジメチルアミノベンジリデンロダニン
1ppm/l〜30ppm/l温度
40℃〜60℃pH
8〜11
実施例
実施例1 ピロリン酸塩タイプ
硫酸ニツケル 30g/lピロリン酸カリ
ウム 60g/lジメチルアミンボロン 0
.08モル/lp−ジメチルアミノベンジリデンロダニ
ン 10ppm/lpH 10
温度 69℃
めつき速度 8.4μ/60分
(素材 しんちゆう)実施例2
グリコール酸塩タイプ
硫酸ニツケル 30g/lグリコール酸ソ
ーダ 60g/lジメチルアミンボロン 0
.06モル/lp−ジメチルアミノベンジリデンロダニ
ン 10ppm/l温度
(42±2)℃pH
7.6
めつき速度 3.7μ/30分
(素材 しんちゆう)実施例3
クエン酸タイプ
硫酸ニツケル 30g/lクエン酸ソーダ
8g/l
ジメチルアミンボロン 0.06モル/lp−ジメ
チルアミノベンジリデンロダニン
10ppm/lpH 10
(NH3で調整)めつき速度 5μ/3
0分温度 43℃
(素材はしんちゆう)実施
例4 リンゴ酸塩タイプ
硫酸ニツケル 30g/lリンゴ酸
30g/lジメチルアミンボロン 0
.06モル/lp−ジメチルアミノベンジリデンロダニ
ン 10ppm/lpH
10(NH3で調せい)温度
52℃
めつき速度 1μ/10分
(素材はしんちゆう)(3)効果
本めつき液の場合つきまわりが良く液寿命が長いのでプ
ラスチツクめつきの場合の接点づらし等がいらない又素
材がしんちゆう又はABS樹脂で内径5mm位の細い管
の内壁にも均一に厚いめつきが出来る。そして液寿命が
長く不足成分を補充することによつて連続使用出来めつ
き速度が速く(10μ/60分)光沢のある密着性の良
い厚めつきの出来る事を特徴としている。The liquid composition is as follows: Pyrophosphate type nickel sulfate 20 g/l - 40 g/l Potassium pyrophosphate 30 g/l - 90 g/l Dimethylamine boron 0.06 mol/l - 0.1 mol/lp-dimethylamino benzylidene rhodanine
1ppm/l~30ppm/l Temperature 40℃~70℃pH
10 (Adjusted with NH3) Glycolate type nickel sulfate 20 g/l ~ 40 g/l Sodium glycolate 60 g/l ~ 120 g/l Dimethylamine boron 0.06 mol/l ~ 0.1 mol/lp-dimethylaminobenzylidene rhodium Nin
1ppm/l~30ppm/l Temperature 40℃~70℃pH
7-8 (Adjusted with NH3) Citric acid type nickel sulfate 20g/l - 40g/l Sodium citrate 1g/l - 10g/l Dimethylamine boron 0.01 mol/l - 0.1 mol/
lp-dimethylaminobenzylidene rhodanine
1ppm/l~30ppm/l temperature
40℃~60℃pH
7 to 10 (adjusted with NH3) Malate type nickel sulfate 20 g/l to 40 g/l Potassium malate 5 g/l to 50 g/l Dimethylamine boron 0.06 mol/l to 0.1 mol/
lp-dimethylaminobenzylidene rhodanine
1ppm/l~30ppm/l temperature
40℃~60℃pH
8-11 Examples Example 1 Pyrophosphate type nickel sulfate 30g/l Potassium pyrophosphate 60g/l Dimethylamine boron 0
.. 08 mol/lp-dimethylaminobenzylidene rhodanine 10 ppm/l pH 10 Temperature 69°C Plating speed 8.4 μ/60 minutes
(Material Shinchiyuu) Example 2
Glycolate type nickel sulfate 30g/l Sodium glycolate 60g/l Dimethylamine boron 0
.. 06 mol/lp-dimethylaminobenzylidene rhodanine 10 ppm/l temperature
(42±2)℃pH
7.6 Plating speed 3.7μ/30 minutes
(Material Shinchiyuu) Example 3
Citric acid type nickel sulfate 30g/l Sodium citrate 8g/l Dimethylamine boron 0.06 mol/lp-dimethylaminobenzylidene rhodanine
10ppm/lpH 10
(Adjust with NH3) Plating speed 5μ/3
0 minute temperature 43℃ (Material is new) Example 4 Malate type nickel sulfate 30g/l malic acid
30g/l dimethylamine boron 0
.. 06 mol/lp-dimethylaminobenzylidene rhodanine 10ppm/lpH
10 (adjusted with NH3) temperature
52℃ Plating speed 1μ/10 minutes
(Material: Shinchiyu) (3) Effect: The actual plating liquid has good coverage and long liquid life, so there is no need to change the contacts when using plastic plating, and the material is Shinchiyu or ABS resin with an inner diameter of about 5 mm. Even the inner wall of a thin tube can be coated with a uniform thickness. It has a long liquid life, and by replenishing missing components, it can be used continuously and has a fast plating speed (10μ/60 minutes), which allows for thick, glossy and adhesive coatings.
Claims (1)
クエン酸塩で錯化されたニツケルイオンと還元剤とし
て 水素化ホウ素化合物〔NaBH4,(CH3)2N
HBH3,KBH4,〕とを含む溶液をNH3又は ア
ルカリ性化合物で アルカリ性にしてpH調整をし ロ
ダニン又はロダニンの誘導体で液を安定化させる無電解
ニツケルめつき液[Claims] Nickel ion complexed with pyrophosphate, glycolate, malate, or citrate and a borohydride compound [NaBH4, (CH3)2N] as a reducing agent
HBH3, KBH4,] is made alkaline with NH3 or an alkaline compound to adjust the pH, and the solution is stabilized with rhodanine or a rhodanine derivative. Electroless nickel plating solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10029783A JPS59226170A (en) | 1983-06-07 | 1983-06-07 | Electroless nickel plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10029783A JPS59226170A (en) | 1983-06-07 | 1983-06-07 | Electroless nickel plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59226170A true JPS59226170A (en) | 1984-12-19 |
Family
ID=14270232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10029783A Pending JPS59226170A (en) | 1983-06-07 | 1983-06-07 | Electroless nickel plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59226170A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6250476A (en) * | 1985-08-29 | 1987-03-05 | Shinko Electric Ind Co Ltd | Method for plating nickel-boron alloy |
JP2001192848A (en) * | 2000-01-11 | 2001-07-17 | Okuno Chem Ind Co Ltd | Electroless nickel plating solution |
-
1983
- 1983-06-07 JP JP10029783A patent/JPS59226170A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6250476A (en) * | 1985-08-29 | 1987-03-05 | Shinko Electric Ind Co Ltd | Method for plating nickel-boron alloy |
JP2001192848A (en) * | 2000-01-11 | 2001-07-17 | Okuno Chem Ind Co Ltd | Electroless nickel plating solution |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2901523B2 (en) | Electroless black plating bath composition and film formation method | |
US3095309A (en) | Electroless copper plating | |
JPS5818430B2 (en) | Electroless plating bath and plating method | |
US4337091A (en) | Electroless gold plating | |
GB2266318A (en) | Electroless plating solution containing thiodiglycolic acid and arylsulphonic acid condensate with formalin | |
US4525390A (en) | Deposition of copper from electroless plating compositions | |
US3853590A (en) | Electroless plating solution and process | |
US3993801A (en) | Catalytic developer | |
US3024134A (en) | Nickel chemical reduction plating bath and method of using same | |
JP2833026B2 (en) | Electroless tin plating method | |
US3666527A (en) | Method of electroless deposition of metals with improved sensitizer | |
CA1188458A (en) | Electroless gold plating | |
GB1014271A (en) | Deposition of nickel-cobalt alloy on aluminium substrates | |
US4877450A (en) | Formaldehyde-free electroless copper plating solutions | |
US5035744A (en) | Electroless gold plating solution | |
US5206055A (en) | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate | |
US3698939A (en) | Method and composition of platinum plating | |
JPS59226170A (en) | Electroless nickel plating solution | |
US3274022A (en) | Palladium deposition | |
US3754940A (en) | Electroless plating solutions containing sulfamic acid and salts thereof | |
US2827398A (en) | Electroless iron plating | |
JPH0250993B2 (en) | ||
US3674516A (en) | Electroless codeposition of nickel alloys | |
JPS59232261A (en) | Stabilizer for electroless nickel plating solution | |
JPH07233494A (en) | Iron-group alloy electroplating bath |