JPS59110163A - Manufacture of solid-state image pick-up element - Google Patents

Abstract

PURPOSE:To perform stable adhesion by using an adhesive which is hardened by ultraviolet ray and heat, at the time of joining a CCD to a filter. CONSTITUTION:First, the surface of the CCD 6 is coated with coupling material 7 and then aged with a color array filter 1 at a high temperature. Next, after loading a package to a positioning adhesion device, the color array filter 1 is adsorbed to an arm 5, and then the CCD 6 is joined to the filter 1 with the adhesive 8. Then, the relative position of each picture element of the CCD 6 is adjusted, and thereafter the adhesive 8 is hardened by the irradiation of the ultraviolet ray from above the arm 5. At this time, glass windows 4 and 4' for positioning marks block the penetration of the ultraviolet ray, therefore the adhesive in the periphery of the filter 1 is hardened and turned to provisional checking state. Then, the package 10 is removed from the positioning device, heat treatment is stepwisely performed, thus hardening the unhardened part of the adhesive 8.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a solid-state imaging device in which a color array filter for color separation is adhered to a light-receiving surface of the imaging device in a solid-state imaging color camera.

In a single-chip solid-state imaging camera, three color signals must be extracted from one image sensor to form a color image. For this reason, it is necessary to cover each pixel of the image sensor with, for example, a three-color filter that changes color for each pixel, and to input optical information of only one color to each pixel. In order to achieve this, we are currently using colors such as red, blue, etc. on the glass surface.
The color of the array filter, which has three colors of green arranged in a checkered pattern, is adjusted to match the position corresponding to each pixel on the image sensor.
Adhesion to the light-receiving surface of the image sensor is performed. Conventionally, epoxy resin-based natural curing or thermosetting adhesives have been used for such adhesion.

However, since it takes approximately U hours for a naturally curing adhesive to completely cure, it takes a long time to use one bonding device to bond one COD and filter, which reduces productivity. It gets worse.

Also, using a thermosetting adhesive shortens the time required for curing, but the entire device must be heated while the COD and filter are aligned, which is a bummer and requires a lot of man-hours to manufacture the device. , misalignment also occurs due to differences in thermal expansion coefficients of device parts.

Furthermore, since the epoxy resin adhesive becomes extremely hard after curing, stress is generated when the adhesive hardens on the surface of the COD element, causing problems such as cutting of the bonding wire.

The above problem can be solved by using an ultraviolet curing adhesive to eliminate these defects, but when ultraviolet light is irradiated from the top of the filter, the red, blue, and green colors arranged on the filter glass surface are When ultraviolet light passes through the areas, the adhesive in the blue areas reacts and hardens, but the red and green areas do not allow UV light to pass through, so the adhesive does not harden. In addition, even if you use an adhesive that has both an ultraviolet curing type and a thermosetting type and cure it with ultraviolet light and then heat it as in the method described above, the parts that harden first when exposed to light will not work. A boundary layer is formed in the hardened part after heat exposure, which causes bubbles and peeling inside.

Furthermore, according to experimental data, the ultraviolet irradiance was reduced to 250 nTw.
/crlL is applied directly to the filter surface, and the portions that are not cured by the light are instantly peeled off. Reduce illuminance to 7 mw/cut
When irradiated with light at a certain level, bubbles do not form instantly, but there is a drawback that bubbles gradually form in areas that have not been cured by light due to subsequent heat treatment.The present invention eliminates this drawback. However, when bonding the CCD and filter, an adhesive that hardens with ultraviolet light and heat is used, a coupling material is applied to the COD surface, and the color array filter part of the filter substrate is shielded from light). After temporarily fixing the periphery with ultraviolet light, multi-stage heating is applied to provide a solid-state image sensor in a stable bonded state.

The present invention will be explained below with reference to the drawings.

The figure is a perspective sectional view of a solid-state image sensor and an arm shown for explaining one embodiment of the present invention.

In the figure, reference numeral 1 denotes a color play filter substrate, and a color filter section 2 consisting of a dyed layer and a protective film is formed on the underside of the substrate, and three colors, for example, red, blue, and green, are arranged in a checkered pattern.

Furthermore, alignment marks 3 and 3' are printed on both ends of the color filter section 2. The upper part is suctioned by a suction arm 5 having glass windows 4 and 4' for observing alignment marks. Below the color array filter substrate 1, a CCD 6 with a pixel matrix formed on its surface is coated with a coupling material. Furthermore, an ultraviolet light and thermosetting adhesive 8 is dripped onto it. C
Alignment marks 9 and 9' are provided at both ends of the CD 6, allowing the respective colors of the color matrix and pixels of the pixel matrix to be positioned in correspondence with each other. Further C
The CD 6 is fixedly wired to the package 10.

To form a solid-state image sensor having the above structure, first, a coupling material 7 is applied to the surface of the CCD 6, and the coupling material 7 is aged together with the color play filter 1 at a high temperature.

Next, package 1 is attached to the positioning adhesive device (not shown).
0, the color array filter 1 is attracted to the upper arm 5. Further, after the adhesive 8 is dropped onto the surface of the CCD 6, the arm 5 is gently lowered to join the CCD 6 and the color array filter 1.

Next, the relative positions of each pixel of the CCD 6 and each color of the color array filter 1 are aligned using the respective alignment marks 3 and 9. However, if the adhesive layer at this time is not thin and uniform,
Due to shrinkage of the adhesive 8 during heat curing, adhesive peeling occurs inside the adhesive. The amount of adhesive 8 is still the same as color array filter 1.
It should be enough to protrude from the surrounding area.

Next, the adhesive 8 is cured by irradiating the upper part of the arm 5 with ultraviolet light having an illuminance of about 7 rryw/cry for 5 to 10 seconds.

However, in this case, the arm 5 is placed on the top surface of the color array filter 1.
However, since ultraviolet light does not pass through the frame, the alignment mark glass window 4, and the glass window 4, the adhesive around the color array filter 1 is hardened and temporarily fixed. Package 1 in that state
0 from the positioning device, preheated at 100°C, and heated stepwise to 130°G and 15d'C to harden the uncured portion of the adhesive 8. .

With the adhesive 8 homogeneously cured in this way, the CCD 6
A solid-state image pickup device with the color array filter 1 adhered onto the surface is produced. Therefore, due to the light shielding effect of the coupling material 7 applied to the surface of the CCD 6 and the filter suction arm 3, there is no peeling that occurs during curing by ultraviolet light, and a cured state can be obtained by gradual heating.

Furthermore, because the temporary curing time using ultraviolet light is extremely short at 5 to 10 seconds, the time that a single solid-state image sensor occupies the adhesive device is much shorter than that of natural curing or thermosetting adhesives. Since it is short, it is possible to mass-produce it with one device, and a solid-state image sensor with a high-quality color array filter 1 can be supplied at a low cost.

Furthermore, according to the present invention, it can also be used when adhering a stripe filter for color separation in a two-plate color camera to a COD, and it can also be used when adhering a filter, etc. to the surface of a reed or other semiconductor element. be.

[Brief explanation of the drawing]

The figure is a perspective sectional view shown for explaining one embodiment of the present invention. In the figure, 1 is a color array filter, 2 is a color filter section, 3.3' and 9,9' are alignment marks, 4 and 4' are glass windows, 5 is a suction arm, and 6 is COD%
7 is a coupling material, 8 is an adhesive, and 10 is a package.

Claims (1)

[Claims] 1. Apply a coupling material to the light-receiving surface of the image sensor, dry the surface, apply a thin layer of adhesive that hardens with ultraviolet rays and heat, and place a filter substrate on top of this adhesive. The color filter portion of the filter substrate is overlapped, and the color filter portion of the filter substrate is covered with the filter substrate suction arm to block light, and the peripheral portion of the color filter substrate is cured with ultraviolet light, and then cured by stepwise heating. A method for manufacturing a solid-state image sensor. 2. The method of manufacturing a solid-state image sensor according to claim 1, wherein the suction arm has an alignment window made of a transparent material that does not transmit ultraviolet rays.