JPS58170052A - Manufacture of solid state image pickup device - Google Patents

Abstract

PURPOSE:To improve the yield of a product and to enhance the reliability of an image pickup device by interposing an ambient temperature curable adhesive between an element and a color filter, temporarily fixing the film via a photocurable adhesive on the step of a package and then curing the adhesive 24 at an ambient temperature. CONSTITUTION:An element 2 is die bonded to the prescribed position in a package 1, the element 2 and a conductive terminal 3 of a package 1 are wire bonded through fine metal wiring 4 therebetween, then the first ambient temperature curable adhesive 24 is first dropped on the element 2, and the second photocurable adhesive such as ultraviolet ray curable adhesive 25 is dropped on the step 23 of the package 1. A color filter 22 is opposed onto the element 2 to be supported by the step 23 of the package 1 at the periphery 21A of the filter, and the color filter 22 is positioned by an aligning unit. Then, a light ray for curing the adhesive 25, i.e., ultraviolet ray 11 is emitted from above the filter 22 on the part, on which the adhesive 25 is dropped, to cure the adhesive 25, thereby bonding the periphery 21A of the filter substrate 21 to the step 23 of the package 1.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a solid-state image sensor (SaW) in which a color filter is adhered onto a solid-state image sensor placed in a package.

A color solid-state imaging device using a C0D (electronic coupling device), etc. is a ceramic-based package (
A solid-state image sensor (2) is die-bonded into the device (2).
1 and the conductive terminal (3) of the package (1).
@1 metal side The color filter (i5) is made of a transparent glass substrate.A predetermined pattern of color filter components such as a red filter component (8R), a green filter component (sci), and a blue filter component (sci) are formed by dyeing layers on the - side of the filter substrate (2), which is made of a transparent glass substrate. It is constructed by depositing a color filter film made of chromium J[(9) which serves as a light shielding layer between the filter component (8B) and each color filter component KR.

Conventionally, color filters (
For bonding 5), as shown in Fig. 811, UV-curable adhesive (6) is dropped onto the element (2), and the color filter (5) is attached to the element (2) K using an alignment device. After alignment was carried out, the adhesive (6) was cured by irradiation with ultraviolet *aυ. However, in this case, the area ratio and volume ratio of the part of the adhesive (6) that has been cured by the ultraviolet rays aυ and the chromium layer (3) Kyoto (the uncured part, and the difference between the area and volume ratio when the adhesive (6) is cured) Due to shrinkage, the structure of the color filter (5), etc., the subsequent heat treatment 1
! In many cases, poor imaging occurred.

The present invention improves the drawbacks of the conventional manufacturing method as described above and provides a method for manufacturing a solid-state imaging device with high yield.

The present invention will be described in detail below with reference to Figure 2 of Tuna. In addition,
In Fig. 2, parts corresponding to those in Fig. 1 are designated by the same reference numerals, and redundant explanation will be omitted.

In the present invention, a solid-state image sensor (two
) has a filter substrate (for example, a transparent glass substrate) (21) with a larger area, and a predetermined pattern of each color filter component (8R) is placed in the center of one surface of the filter substrate υ.

(8G), (8B) Tori” Jia (91 colors y4h
A color filter (2) formed by depositing p1maa is prepared. In this case, the peripheral portion (21A) of the filter substrate 3υ that is not formed is maintained in a state 11 through which light can pass. On the other hand, inside the package (11), the color filter (
2) on the element (2), the filter substrate Glυ
A support part, in this example, a step part, is formed to support the peripheral part (21A) of.

Then, the element (2) is die-bonded to a predetermined position within the package (1), and the element (2) and the conductive terminal (3) of the package (1) are wire-bonded via a thin metal wire (4).

First, drop a room-temperature curing first adhesive (2) onto the element (2), and then apply the adhesive shown in stripe 2 of the light-curing lid, such as an ultraviolet curing adhesive (H), onto the step 03 of the package (11). ).In addition, this second adhesive (c) is added to the first adhesive (2).
) has a viscosity that does not harm the layer thickness.

Thereafter, the color filter (2) is attached to the element (2) so that it is supported by its peripheral part (21A) or by the stage sQ3 of the package (1).
The color filter (2) is aligned using an alignment device. Then, a light beam for curing this adhesive, that is, ultraviolet*aυ, is irradiated from above the color filter (2) onto the part where the ultraviolet curing adhesive 4 has been dropped, thereby applying the ultraviolet curing adhesive. After curing, the peripheral part (21A)'' of the filter substrate Qυ is adhered to the stepped part 123 of the package (1).The position of the color filter 0 is temporarily fixed from this point. Remove my device, and cure the room-temperature curing adhesive (2) interposed between the element (2) and the color filter (2) at room temperature (
A one-color filter (2) is glued onto the element (2).

As mentioned above, according to the manufacturing method of the solid-state imaging device of the present invention,
When attaching the color filter (2) to the solid-state image sensor (2), a room-temperature curing adhesive is interposed between the element (2) and the color filter IQ, and a photo-curable color filter Q is applied. Step c of package (1) via mold adhesive □□□
! After temporarily fixing the element (2) to the color filter (2), the adhesive (2) is cured at room temperature, so that the adhesive (2) for the element (2) and the color filter (2) is cured uniformly throughout. Become. As a result, the occurrence of imaging failures due to the adhesive during subsequent heat treatment and the like can be avoided. Therefore, according to the present invention, the yield of the product is high, and 4I! A solid-state imaging device with high tIllI properties can be obtained.

[Brief explanation of the drawing]

1 is a sectional view of a solid-state imaging device based on a conventional manufacturing method, and FIG. 2 is a sectional view of a solid-state imaging device based on the present invention. (1) is a package, (2) is a solid-state image sensor, (51,
cIJ is a color filter, (c) is a stepped portion of the package, (to) is a room temperature curing adhesive, and (c) is a photocuring adhesive.

Claims (1)

[Claims] When bonding a color filter to a solid-state image sensor provided in a package, a filter substrate in the color filter is formed to be larger than the solid-state image sensor, and a first layer of room-temperature curing resin is bonded between the solid-state image sensor and the color filter. An adhesive is interposed between the peripheral part of the filter substrate and a support part in the package that supports the same, and a post-adhesive coated with light curing is interposed between the peripheral part of the filter substrate and the supporting part in the package, and the peripheral part of the filter substrate is irradiated with light. Front 8
A method for manufacturing a solid-state imaging device, the method of manufacturing a solid-state imaging device comprising curing the adhesive of the self-assembled material 2 and then curing the adhesive of the 11EI at room temperature to adhere the color filter to the solid-state imaging device.