JPS59101463U - Grounding structure of electronic components - Google Patents
Grounding structure of electronic componentsInfo
- Publication number
- JPS59101463U JPS59101463U JP19543282U JP19543282U JPS59101463U JP S59101463 U JPS59101463 U JP S59101463U JP 19543282 U JP19543282 U JP 19543282U JP 19543282 U JP19543282 U JP 19543282U JP S59101463 U JPS59101463 U JP S59101463U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- copper foil
- foil pattern
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図乃至第4図は従来例を示し、第1図はプリント基
板にチップ状の電子部品を仮止めし、金属棒を挿入した
状態を示す平面図、第2図は同電子部品を半田付けした
状態を示す第1図A−A断面図、第3図は第1図に於て
シールド板を装着した状態を示す平面図、第4図は第3
図のA−A断面図、第5図乃至第7図は本考案の実施例
を示し、第5図イ1口はチップ状の電子部品の接地構造
を示し、同図イは金属端子棒をプリント基板に圧入する
状態を示す要部斜視図、同図口は同図イに更にシールド
板を嵌合する状態を示す要部斜視図。第6図は、第5図
に於て、各部品を組込み後半田付けを完了した状態に於
ける第5図口のA−A線の要部断面図、第7図は同B−
B線の要部断面図である。
15.16・・・・・・プリント基板、17・・・・・
・電子部品、18.19・・・・・・電極、20. 2
1. 28・・・・・・銅箔パターン、22・・・・・
・穴、23・・・・・・透孔、24・・・・・・金属端
子棒、26・・・・・・溝、27.29・・・・・・半
田。Figures 1 to 4 show conventional examples, Figure 1 is a plan view showing a state in which a chip-shaped electronic component is temporarily fixed to a printed circuit board and a metal rod is inserted, and Figure 2 is a plan view showing the state in which the electronic component is soldered. Figure 1 is a cross-sectional view taken along line A-A showing the state in which the shield plate is attached; Figure 3 is a plan view showing the state in which the shield plate is attached in Figure 1;
The A-A sectional view and FIGS. 5 to 7 in the figure show an embodiment of the present invention. FIG. FIG. 2 is a perspective view of a main part showing a state in which it is press-fitted into a printed circuit board, and a perspective view of a main part showing a state in which a shield plate is further fitted into FIG. 6 is a cross-sectional view of the main part of FIG. 5 taken along line A-A at the opening in FIG. 5, with each part assembled and soldering completed, and FIG.
It is a sectional view of the main part taken along the B line. 15.16...Printed circuit board, 17...
・Electronic components, 18.19... Electrodes, 20. 2
1. 28... Copper foil pattern, 22...
- Hole, 23...Through hole, 24...Metal terminal bar, 26...Groove, 27.29...Solder.
Claims (1)
面に設けた電子部品取付用の銅箔パターン上に、透孔と
、該透孔に略直交して穴を設け、該穴には金属端子棒を
圧入し、透孔には、シールド板を、該シールド板に形成
された溝に前記金属端子棒が嵌合された状態に挿入せら
れ、プリント基板の他方の表面への半田付けに韮って該
プリント基板の他方の表面に設けられた接地用の銅箔パ
ターンと、一方の表面に設けられた銅箔パターンとが、
前記金属端子棒を介して接続されるとともに前記シール
ド板と、前記プリント基板の一方の表面の銅箔パターン
とが接続されたことを特徴とする電子部品の接地構造。A through hole and a hole approximately perpendicular to the through hole are provided on the copper foil pattern for mounting electronic components provided on one surface of the printed circuit board on which an electric circuit is formed on each surface, and a metal terminal is provided in the hole. The rod is press-fitted, and a shield plate is inserted into the through hole with the metal terminal rod fitted into the groove formed in the shield plate. A grounding copper foil pattern provided on the other surface of the printed circuit board, and a copper foil pattern provided on one surface,
A grounding structure for an electronic component, characterized in that the shield plate is connected to a copper foil pattern on one surface of the printed circuit board while being connected via the metal terminal bar.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19543282U JPS59101463U (en) | 1982-12-27 | 1982-12-27 | Grounding structure of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19543282U JPS59101463U (en) | 1982-12-27 | 1982-12-27 | Grounding structure of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59101463U true JPS59101463U (en) | 1984-07-09 |
Family
ID=30419722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19543282U Pending JPS59101463U (en) | 1982-12-27 | 1982-12-27 | Grounding structure of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59101463U (en) |
-
1982
- 1982-12-27 JP JP19543282U patent/JPS59101463U/en active Pending
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