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JPS59101463U - Grounding structure of electronic components - Google Patents

Grounding structure of electronic components

Info

Publication number
JPS59101463U
JPS59101463U JP19543282U JP19543282U JPS59101463U JP S59101463 U JPS59101463 U JP S59101463U JP 19543282 U JP19543282 U JP 19543282U JP 19543282 U JP19543282 U JP 19543282U JP S59101463 U JPS59101463 U JP S59101463U
Authority
JP
Japan
Prior art keywords
hole
copper foil
foil pattern
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19543282U
Other languages
Japanese (ja)
Inventor
大磯 紘一
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP19543282U priority Critical patent/JPS59101463U/en
Publication of JPS59101463U publication Critical patent/JPS59101463U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第4図は従来例を示し、第1図はプリント基
板にチップ状の電子部品を仮止めし、金属棒を挿入した
状態を示す平面図、第2図は同電子部品を半田付けした
状態を示す第1図A−A断面図、第3図は第1図に於て
シールド板を装着した状態を示す平面図、第4図は第3
図のA−A断面図、第5図乃至第7図は本考案の実施例
を示し、第5図イ1口はチップ状の電子部品の接地構造
を示し、同図イは金属端子棒をプリント基板に圧入する
状態を示す要部斜視図、同図口は同図イに更にシールド
板を嵌合する状態を示す要部斜視図。第6図は、第5図
に於て、各部品を組込み後半田付けを完了した状態に於
ける第5図口のA−A線の要部断面図、第7図は同B−
B線の要部断面図である。 15.16・・・・・・プリント基板、17・・・・・
・電子部品、18.19・・・・・・電極、20. 2
1. 28・・・・・・銅箔パターン、22・・・・・
・穴、23・・・・・・透孔、24・・・・・・金属端
子棒、26・・・・・・溝、27.29・・・・・・半
田。
Figures 1 to 4 show conventional examples, Figure 1 is a plan view showing a state in which a chip-shaped electronic component is temporarily fixed to a printed circuit board and a metal rod is inserted, and Figure 2 is a plan view showing the state in which the electronic component is soldered. Figure 1 is a cross-sectional view taken along line A-A showing the state in which the shield plate is attached; Figure 3 is a plan view showing the state in which the shield plate is attached in Figure 1;
The A-A sectional view and FIGS. 5 to 7 in the figure show an embodiment of the present invention. FIG. FIG. 2 is a perspective view of a main part showing a state in which it is press-fitted into a printed circuit board, and a perspective view of a main part showing a state in which a shield plate is further fitted into FIG. 6 is a cross-sectional view of the main part of FIG. 5 taken along line A-A at the opening in FIG. 5, with each part assembled and soldering completed, and FIG.
It is a sectional view of the main part taken along the B line. 15.16...Printed circuit board, 17...
・Electronic components, 18.19... Electrodes, 20. 2
1. 28... Copper foil pattern, 22...
- Hole, 23...Through hole, 24...Metal terminal bar, 26...Groove, 27.29...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 各々表面に電気回路を形成せるプリント基板の一方の表
面に設けた電子部品取付用の銅箔パターン上に、透孔と
、該透孔に略直交して穴を設け、該穴には金属端子棒を
圧入し、透孔には、シールド板を、該シールド板に形成
された溝に前記金属端子棒が嵌合された状態に挿入せら
れ、プリント基板の他方の表面への半田付けに韮って該
プリント基板の他方の表面に設けられた接地用の銅箔パ
ターンと、一方の表面に設けられた銅箔パターンとが、
前記金属端子棒を介して接続されるとともに前記シール
ド板と、前記プリント基板の一方の表面の銅箔パターン
とが接続されたことを特徴とする電子部品の接地構造。
A through hole and a hole approximately perpendicular to the through hole are provided on the copper foil pattern for mounting electronic components provided on one surface of the printed circuit board on which an electric circuit is formed on each surface, and a metal terminal is provided in the hole. The rod is press-fitted, and a shield plate is inserted into the through hole with the metal terminal rod fitted into the groove formed in the shield plate. A grounding copper foil pattern provided on the other surface of the printed circuit board, and a copper foil pattern provided on one surface,
A grounding structure for an electronic component, characterized in that the shield plate is connected to a copper foil pattern on one surface of the printed circuit board while being connected via the metal terminal bar.
JP19543282U 1982-12-27 1982-12-27 Grounding structure of electronic components Pending JPS59101463U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19543282U JPS59101463U (en) 1982-12-27 1982-12-27 Grounding structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19543282U JPS59101463U (en) 1982-12-27 1982-12-27 Grounding structure of electronic components

Publications (1)

Publication Number Publication Date
JPS59101463U true JPS59101463U (en) 1984-07-09

Family

ID=30419722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19543282U Pending JPS59101463U (en) 1982-12-27 1982-12-27 Grounding structure of electronic components

Country Status (1)

Country Link
JP (1) JPS59101463U (en)

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