JPS5822764U - Mounting device for chip-shaped parts - Google Patents
Mounting device for chip-shaped partsInfo
- Publication number
- JPS5822764U JPS5822764U JP11706981U JP11706981U JPS5822764U JP S5822764 U JPS5822764 U JP S5822764U JP 11706981 U JP11706981 U JP 11706981U JP 11706981 U JP11706981 U JP 11706981U JP S5822764 U JPS5822764 U JP S5822764U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- mounting device
- pair
- shaped part
- shaped parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のチップ状部品の取付構造を示す概要図、
第２図はこの考案の一実施例である取付装置を示す概要
図、第３図は第２図における組立状態を示す断面図であ
る。
図中、１はプリント基板、１ａ、１ｂは銅箔パターン部
、２はチップ状部品、２ａは半田付は部、２ｂは透孔、
４は導電ピン、４ａは屈曲部である。
なお、図中、同一符号は同一あるいは相当する部分を示
すものとする。Figure 1 is a schematic diagram showing the mounting structure of conventional chip-shaped parts.
FIG. 2 is a schematic diagram showing a mounting device which is an embodiment of this invention, and FIG. 3 is a sectional view showing an assembled state in FIG. 2. In the figure, 1 is a printed circuit board, 1a and 1b are copper foil pattern parts, 2 is a chip-shaped component, 2a is a soldering part, 2b is a through hole,
4 is a conductive pin, and 4a is a bent portion. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
リント基板の銅箔パターン部にそれぞれ植設され、中間
部に弾性変形可能な屈曲部を有する一対の導電ピン、両
端に半田付は部が形成されるとともにこの半田付は部に
透孔が形成されたチップ状部品を備え、上記一対の導通
ピンに上記チップ状部品の透孔を挿通して上記屈曲部よ
り係合保持させ、上記導通ピンとチップ状部品の半田付
は部とを半田付けしたことを特徴とするチップ状部品の
取付装置。, a printed circuit board having a pair of copper foil pattern parts, a pair of conductive pins implanted in each of the copper foil pattern parts of this printed circuit board, each having an elastically deformable bent part in the middle part, and solder parts formed at both ends. At the same time, this soldering is provided with a chip-shaped part having a through hole formed in the part, and the through-hole of the chip-shaped part is inserted into the pair of conductive pins to be engaged and held from the bent part, and the conductive pin and A mounting device for a chip-shaped part, characterized in that the soldering part of the chip-shaped part is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11706981U JPS5822764U (en) | 1981-08-05 | 1981-08-05 | Mounting device for chip-shaped parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11706981U JPS5822764U (en) | 1981-08-05 | 1981-08-05 | Mounting device for chip-shaped parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5822764U true JPS5822764U (en) | 1983-02-12 |
Family
ID=29911275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11706981U Pending JPS5822764U (en) | 1981-08-05 | 1981-08-05 | Mounting device for chip-shaped parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5822764U (en) |
-
1981
- 1981-08-05 JP JP11706981U patent/JPS5822764U/en active Pending
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