JPS5787932A - Mold for injection compression molding - Google Patents
Mold for injection compression moldingInfo
- Publication number
- JPS5787932A JPS5787932A JP16457380A JP16457380A JPS5787932A JP S5787932 A JPS5787932 A JP S5787932A JP 16457380 A JP16457380 A JP 16457380A JP 16457380 A JP16457380 A JP 16457380A JP S5787932 A JPS5787932 A JP S5787932A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- path
- sprue
- rotary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C45/561—Injection-compression moulding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To prevent backflowing of a resin and to prevent the damage of mold due to an excessive clamping, by a method wherein the sprue gate for a resin path is mounted immediately under a sprue, and is caused to operated in relation to pressure and temperature of a resin in a cavity. CONSTITUTION:A fused resin is poured in a cavity 6 through a sprue 2 and a path 3. Pressure and temperature of a resin in the cavity are detected by detectors 10 and 11 to be supplied to a controlling mechanism 12. If the value attains a given value, a signal from a signal output part 13 is transmitted to a rotary driving part 9 to rotate it, and a rotary sprue gate 8, operating in synchronism with the rotary drive part, rotates to closed the resin path 3. A signal is then sent from the controlling mechanism 12 via a control signal output part 13 to drive a compression mechanism 7 to compress the cavity 6. The resin path 3 is closed thereupon, and this causes the resin to be prevented from backflowing and be compressed in the cavity 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16457380A JPS5787932A (en) | 1980-11-25 | 1980-11-25 | Mold for injection compression molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16457380A JPS5787932A (en) | 1980-11-25 | 1980-11-25 | Mold for injection compression molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5787932A true JPS5787932A (en) | 1982-06-01 |
Family
ID=15795730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16457380A Pending JPS5787932A (en) | 1980-11-25 | 1980-11-25 | Mold for injection compression molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5787932A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01127309A (en) * | 1987-11-13 | 1989-05-19 | Sanraito Kasei Kk | Operating circuit for injection molding device |
US7687003B2 (en) * | 2004-12-08 | 2010-03-30 | Visteon Global Technologies, Inc. | Method of forming plastic part having hidden thin walled section |
-
1980
- 1980-11-25 JP JP16457380A patent/JPS5787932A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01127309A (en) * | 1987-11-13 | 1989-05-19 | Sanraito Kasei Kk | Operating circuit for injection molding device |
JPH0377052B2 (en) * | 1987-11-13 | 1991-12-09 | Sanraito Kasei Kk | |
US7687003B2 (en) * | 2004-12-08 | 2010-03-30 | Visteon Global Technologies, Inc. | Method of forming plastic part having hidden thin walled section |
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