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JPS55121044A - Transfer molding equipment capable of continuous molding - Google Patents

Transfer molding equipment capable of continuous molding

Info

Publication number
JPS55121044A
JPS55121044A JP2794679A JP2794679A JPS55121044A JP S55121044 A JPS55121044 A JP S55121044A JP 2794679 A JP2794679 A JP 2794679A JP 2794679 A JP2794679 A JP 2794679A JP S55121044 A JPS55121044 A JP S55121044A
Authority
JP
Japan
Prior art keywords
mold
pot
molding
composition
introducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2794679A
Other languages
Japanese (ja)
Inventor
Motoharu Kusakabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoac Corp
Original Assignee
Inoue MTP KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue MTP KK filed Critical Inoue MTP KK
Priority to JP2794679A priority Critical patent/JPS55121044A/en
Publication of JPS55121044A publication Critical patent/JPS55121044A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C2045/027—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity heat insulated cold transfer moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C2045/027—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity heat insulated cold transfer moulding
    • B29C2045/028—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity heat insulated cold transfer moulding using auxiliary curing or setting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To enable to effect continuous molding without generating a residual cured material by a method wherein a pot mold, having a special configuration and capable of being abutted against a mold upon introducing a molding composition into the mold and being taken out of the mold upon molding, is equipped. CONSTITUTION:A pot mold 20 for introducing a molding composition into a cavity 13 in a mold 10 is provided with a pot 21 for introducing the molding composition at an upper portion thereof while sprue holes 22 communicating with the pot 21 through gates 14 for a cavity 13 at a lower portion thereof. Open holes 26 for radiation is preferable to be provided around the sprue holes 22. When the molding composition is introduced into the cavity 13, the pot mold 20 is abutted against the mold 10 and the composition is introduced into the pot 21, thereafter, a plunger 30 is pressed into the pot 21. When the composition is cured under heating, the pot mold 20 is taken out of the mold 10 and a heating plate 39 is abutted against an upper portion of the mold 10.
JP2794679A 1979-03-10 1979-03-10 Transfer molding equipment capable of continuous molding Pending JPS55121044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2794679A JPS55121044A (en) 1979-03-10 1979-03-10 Transfer molding equipment capable of continuous molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2794679A JPS55121044A (en) 1979-03-10 1979-03-10 Transfer molding equipment capable of continuous molding

Publications (1)

Publication Number Publication Date
JPS55121044A true JPS55121044A (en) 1980-09-17

Family

ID=12235051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2794679A Pending JPS55121044A (en) 1979-03-10 1979-03-10 Transfer molding equipment capable of continuous molding

Country Status (1)

Country Link
JP (1) JPS55121044A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1386714A1 (en) * 2002-07-30 2004-02-04 RUTIL S.r.l. An injection moulding system for a material vulcanizable by heat
WO2005120799A1 (en) * 2004-06-11 2005-12-22 Fico B.V. Method and device for controllable encapsulation of electronic components
JP2012200887A (en) * 2011-03-23 2012-10-22 Mitsuba Corp Method and apparatus for molding thermosetting plastic

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51115580A (en) * 1975-04-03 1976-10-12 Fuji Industries Co Ltd Process for manufacturing transfer to convey pot

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51115580A (en) * 1975-04-03 1976-10-12 Fuji Industries Co Ltd Process for manufacturing transfer to convey pot

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1386714A1 (en) * 2002-07-30 2004-02-04 RUTIL S.r.l. An injection moulding system for a material vulcanizable by heat
WO2005120799A1 (en) * 2004-06-11 2005-12-22 Fico B.V. Method and device for controllable encapsulation of electronic components
US8425826B2 (en) 2004-06-11 2013-04-23 Fico B.V. Method and device for controllable encapsulation of electronic components
JP2012200887A (en) * 2011-03-23 2012-10-22 Mitsuba Corp Method and apparatus for molding thermosetting plastic

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