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JPS57193049A - Aluminum heat sink for semiconductor element - Google Patents

Aluminum heat sink for semiconductor element

Info

Publication number
JPS57193049A
JPS57193049A JP7735581A JP7735581A JPS57193049A JP S57193049 A JPS57193049 A JP S57193049A JP 7735581 A JP7735581 A JP 7735581A JP 7735581 A JP7735581 A JP 7735581A JP S57193049 A JPS57193049 A JP S57193049A
Authority
JP
Japan
Prior art keywords
base
casting
heat sink
prescribed
cast
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7735581A
Other languages
Japanese (ja)
Inventor
Mayumi Oda
Norihiko Kono
Koichi Ozaki
Susumu Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP7735581A priority Critical patent/JPS57193049A/en
Publication of JPS57193049A publication Critical patent/JPS57193049A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain an aluminum heat sink having small size and high performance by casting part of plate-shaped fins of prescribed thickness and shape in a base. CONSTITUTION:Aluminum fins 2a formed in advance in the prescribed thickness and shape are aligned at the prescribed interval in parallel with each other, the edges of the same side are cast, and an aluminum base 2b of the prescribed outer diameter is integrally formed. When it is cast under pressure, no cavity is formed in the base 2b. A vacuum casting may be adopted. According to this structure, a fin base can be integrally formed similarly to the heat sink by an extruding die material or a casting, and when casting conditions are determined, an elevated technique is not necessary, and the manufacture can be simply facilitated. The shape and the thickness of the base can be arbitrarily formed, thin fins can be formed in high density, thereby enabling small size and high performance. When a copper plate is cast to a semiconductor element mounting surface 2b or a terminal mounting part at the time of casting under pressure, a preferable heat sink can be obtained with inexpensive cost.
JP7735581A 1981-05-23 1981-05-23 Aluminum heat sink for semiconductor element Pending JPS57193049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7735581A JPS57193049A (en) 1981-05-23 1981-05-23 Aluminum heat sink for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7735581A JPS57193049A (en) 1981-05-23 1981-05-23 Aluminum heat sink for semiconductor element

Publications (1)

Publication Number Publication Date
JPS57193049A true JPS57193049A (en) 1982-11-27

Family

ID=13631598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7735581A Pending JPS57193049A (en) 1981-05-23 1981-05-23 Aluminum heat sink for semiconductor element

Country Status (1)

Country Link
JP (1) JPS57193049A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US6543521B1 (en) * 1999-10-04 2003-04-08 Matsushita Electric Industrial Co., Ltd. Cooling element and cooling apparatus using the same
CN104066526A (en) * 2011-11-30 2014-09-24 施耐德电气It公司 Method of fabricating a heat sink
CN106486724A (en) * 2015-08-27 2017-03-08 苏州市永创金属科技有限公司 A kind of high load capacity filter cavity and its processing method
CN106486722A (en) * 2015-08-27 2017-03-08 苏州市永创金属科技有限公司 A kind of strong filter cavity of local heat-sinking capability and its processing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US6543521B1 (en) * 1999-10-04 2003-04-08 Matsushita Electric Industrial Co., Ltd. Cooling element and cooling apparatus using the same
CN104066526A (en) * 2011-11-30 2014-09-24 施耐德电气It公司 Method of fabricating a heat sink
CN104066526B (en) * 2011-11-30 2016-03-30 施耐德电气It公司 Manufacture the method for radiator
US9791219B2 (en) 2011-11-30 2017-10-17 Schneider Electric It Corporation Method of fabricating a heat sink
CN106486724A (en) * 2015-08-27 2017-03-08 苏州市永创金属科技有限公司 A kind of high load capacity filter cavity and its processing method
CN106486722A (en) * 2015-08-27 2017-03-08 苏州市永创金属科技有限公司 A kind of strong filter cavity of local heat-sinking capability and its processing method

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