JPS608476Y2 - electrical circuit parts - Google Patents

Description

[Detailed Description of the Invention] The present invention is suitable for use in electrical circuit components in which circuit elements are mounted on a mounting plate that also serves as a cooling plate, particularly in electrical circuit components that generate a large amount of heat.

Figure 1 shows an example of a hybrid integrated circuit as an electric circuit component P. 1 is a mounting plate that also serves as a cooling plate, and various semiconductor chips, printed resistors, and chip capacitors are mounted on this mounting plate 1. The parts on which these circuit elements are mounted are molded with a suitable resin molding material 2.

A terminal 3 is connected to a desired position of a circuit formed by a combination of circuit elements on the mounting plate 1, and is also fixed with a molding material 2.

A plurality of electrical circuit components P configured in this manner are attached to a substrate H1 which also serves as a cooling plate and is generally called a heat sink, which is made of aluminum or the like.

For installation, the surface of the mounting plate 1 on which no circuit elements are mounted is brought into contact with the surface of the base plate H, and is tightly fixed to the base plate H using suitable fixing means 4 such as bolts or nuts.

In this way, the heat generated by the circuit elements will be transferred to the mounting plate 1.
is conducted to the base H, and is effectively released from the base H.

Furthermore, the base H is fixed to a fixed part such as a suitable outer frame.

6 is a mounting hole for this purpose. In such a structure, if the degree of adhesion between the mounting plate 1 and the base H is poor, the thermal resistance of this portion increases, resulting in poor cooling.

Generally, the mounting plate 1 is constructed by, for example, press punching or machining a metal plate, and has a planar shape, and the surface of the base H is also planar.

As is well known, it is extremely difficult to bring two planes into close contact with each other, and especially when the area of the mounting plate 1 is large, most of them will be floating above the surface of the base H, resulting in low thermal resistance. It has the disadvantage that it increases the

The present invention was developed in order to solve the above-mentioned drawbacks, and its purpose is to obtain an electric circuit component that can increase the contact area between the base and the mounting plate.

In order to achieve the above object, the present invention is characterized by deforming the mounting plate by closely fixing the mounting plate of the electric circuit component to the base, so that the restoring force caused by this deformation acts as an adhesion force. The central part of the mounting plate is curved in advance so as to bulge toward the base.

An embodiment of the present invention shown in FIGS. 2 and 3 will be described below.

This figure shows the case where mounting holes 5 are provided at both ends of the mounting plate 1, and electric circuit components P are mounted on the board H at both ends. Curve into shape.

That is, the central portion of the mounting plate 1 is curved so as to protrude from the base H.

When attaching to the board H, both ends of the electric circuit component P are fixed with fixing means 4 such as bolts and nuts, so that both ends are tightly attached to the board H.

Therefore, the mounting plate 1 is deformed as shown by the broken line.

As a result, stress remains on the mounting plate 1, and a force acts on the mounting plate 1 to restore it to the position shown by the two-dot chain line.

Due to this restoring force, the mounting plate 1 is pressed against the base H.
It is tightly fixed to the

That is, in this case, the restoring force of the mounting plate 1 causes the mounting plate 1 and the base H to come into close contact over a wider area.

Therefore, the thermal resistance between the mounting plate 1 and the base H can be further reduced.

Figures 4 and 5 show the case where the electric circuit component P is tightened and fixed to the base H at four locations around the resin mold 2, and all the fixing means contribute to the generation of restoring force. As such, the mounting plate 1 is curved to make up a part of the general method.

Note that the degree of curvature of the mounting plate 1 is exaggerated in the drawing for clarity, but the actual degree of curvature is quite small, and when installed with appropriate tightening force, it will not deform due to the degree of curvature. However, it is set to such an extent that it effectively comes into close contact with the plane of the base H.

Such curvature can be easily performed, for example, simultaneously or in a separate process when the mounting plate 1 is punched out from a metal plate by press punching or the like.

In addition, since the processing accuracy when bending the mounting plate 1 does not require very high precision, it is extremely easy to manufacture compared to conventional flat processing, but the gap between the mounting plate 1 and the base H is Therefore, a sufficient adhesion area can be obtained.

As is clear from the above description, according to the present invention, it is possible to obtain an electric circuit component that can increase the contact area between the base and the mounting plate.

Therefore, when attaching to the base, the thermal resistance between the base and the mounting plate can be further reduced.

Furthermore, processing to obtain a sufficient contact area is extremely easy compared to conventional mounting plates that are made flat.

Further, according to the present invention, the central portion of the mounting plate where the generated heat is concentrated comes into better contact with the base, so that better heat radiation can be achieved.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a conventional example, Fig. 2 is a front view showing an embodiment of the present invention, Fig. 3 is a side view of the same, and Fig. 4 is a front view showing another embodiment of the present invention. , FIG. 5 is a side view of the same. P: Electric circuit parts, 1: Mounting plate, 2: Resin mold material,
3: Terminal, H: Base.

Claims (1)

[Scope of utility model registration request] The circuit element is mounted in the center of the mounting plate that also serves as a cooling plate.
An electrical circuit component having a mounting portion at a peripheral end is tightly fixed to a base plate that also serves as a cooling plate, with the side of the mounting plate on which no circuit elements are mounted, the mounting plate being attached to the base plate. An electric circuit component comprising: deforming the mounting plate by closely fixing the mounting plate; and bending the central part of the mounting plate in advance so as to bulge toward the base so that the restoring force resulting from this deformation acts as an adhesion force.