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JPS57131223A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS57131223A
JPS57131223A JP1566081A JP1566081A JPS57131223A JP S57131223 A JPS57131223 A JP S57131223A JP 1566081 A JP1566081 A JP 1566081A JP 1566081 A JP1566081 A JP 1566081A JP S57131223 A JPS57131223 A JP S57131223A
Authority
JP
Japan
Prior art keywords
resin composition
aryl
alkyl
resin
backbone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1566081A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Masahiro Kitamura
Ritsuro Tada
Hiroshi Suzuki
Masaji Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1566081A priority Critical patent/JPS57131223A/en
Publication of JPS57131223A publication Critical patent/JPS57131223A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To resin composition excellent in heat resistance, bending elasticity, etc., and suitable for sealing semiconductor elements, containing a polyfunctional epoxy compound, a p-alkyl-or aryl-substituted phenol resin and a rubber component having unsaturated double bonds in the backbone of the skeleton.
CONSTITUTION: The purpose resin composition is obtained by mixing (A) 100pts.wt. polyfunctional epoxy compound such as diglycidyl ether of bisphenol A or butadiene epoxide, with (B) about 30W80pts.wt. p-alkyl-or aryl-substituted phenol resin (e.g., a resin of the formula, wherein R is an alkyl or an aryl, and n is 0W9, and (C) about 5W40wt% rubber component containing unsaturated double bonds in the backbone of the skeleton (e.g., polybutadiene or isoprene rubber). Preferably, a resin composition having excellent properties is prepared by premixing components B and C, prereacting the mixture by heating, and adding the resulting product to component A.
COPYRIGHT: (C)1982,JPO&Japio
JP1566081A 1981-02-06 1981-02-06 Resin composition Pending JPS57131223A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1566081A JPS57131223A (en) 1981-02-06 1981-02-06 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1566081A JPS57131223A (en) 1981-02-06 1981-02-06 Resin composition

Publications (1)

Publication Number Publication Date
JPS57131223A true JPS57131223A (en) 1982-08-14

Family

ID=11894887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1566081A Pending JPS57131223A (en) 1981-02-06 1981-02-06 Resin composition

Country Status (1)

Country Link
JP (1) JPS57131223A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943017A (en) * 1982-09-03 1984-03-09 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPS59227146A (en) * 1983-06-07 1984-12-20 Sharp Corp Resin-molded semiconductor device
JPS6036527A (en) * 1983-08-09 1985-02-25 Toshiba Chem Corp Sealing resin composition
JPS6110260A (en) * 1984-06-26 1986-01-17 Matsushita Electric Ind Co Ltd Manufacture of resin-sealed type electronic component
JPS6197319A (en) * 1984-10-12 1986-05-15 シーメンス、アクチエンゲゼルシヤフト Compound for sealing electric and electronic device and its production
JPS61285244A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Molding material for electronic parts
JPS61285215A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Molding material for electronic parts
JPS61285243A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Molding material for electronic parts
JPS62246920A (en) * 1986-04-21 1987-10-28 Nippon Zeon Co Ltd Epoxy resin composition for semiconductor sealing
JPS63207816A (en) * 1987-02-23 1988-08-29 Ube Ind Ltd Epoxy resin composition for sealing semiconductor
JPH0341146A (en) * 1989-12-15 1991-02-21 Hitachi Ltd Resin composition
JPH08100049A (en) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc Epoxy resin composition for semiconductor-sealing material
US6467520B2 (en) 2000-12-19 2002-10-22 The Goodyear Tire & Rubber Company Tire with apex rubber containing in-situ resin

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5072930A (en) * 1973-10-29 1975-06-16
JPS5349055A (en) * 1976-10-15 1978-05-04 Matsushita Electric Works Ltd Thermosetting composition
JPS53134834A (en) * 1977-04-30 1978-11-24 Mitsubishi Electric Corp Resin composition for bonding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5072930A (en) * 1973-10-29 1975-06-16
JPS5349055A (en) * 1976-10-15 1978-05-04 Matsushita Electric Works Ltd Thermosetting composition
JPS53134834A (en) * 1977-04-30 1978-11-24 Mitsubishi Electric Corp Resin composition for bonding

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943017A (en) * 1982-09-03 1984-03-09 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPH0136984B2 (en) * 1983-06-07 1989-08-03 Sharp Kk
JPS59227146A (en) * 1983-06-07 1984-12-20 Sharp Corp Resin-molded semiconductor device
JPS6036527A (en) * 1983-08-09 1985-02-25 Toshiba Chem Corp Sealing resin composition
JPH0330615B2 (en) * 1983-08-09 1991-05-01 Toshiba Chem Prod
JPS6110260A (en) * 1984-06-26 1986-01-17 Matsushita Electric Ind Co Ltd Manufacture of resin-sealed type electronic component
JPS6197319A (en) * 1984-10-12 1986-05-15 シーメンス、アクチエンゲゼルシヤフト Compound for sealing electric and electronic device and its production
JPS61285243A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Molding material for electronic parts
JPS61285215A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Molding material for electronic parts
JPS61285244A (en) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd Molding material for electronic parts
JPH0528242B2 (en) * 1985-06-13 1993-04-23 Matsushita Denko Kk
JPS62246920A (en) * 1986-04-21 1987-10-28 Nippon Zeon Co Ltd Epoxy resin composition for semiconductor sealing
JPS63207816A (en) * 1987-02-23 1988-08-29 Ube Ind Ltd Epoxy resin composition for sealing semiconductor
JPH0341146A (en) * 1989-12-15 1991-02-21 Hitachi Ltd Resin composition
JPH08100049A (en) * 1994-09-30 1996-04-16 Dainippon Ink & Chem Inc Epoxy resin composition for semiconductor-sealing material
US6467520B2 (en) 2000-12-19 2002-10-22 The Goodyear Tire & Rubber Company Tire with apex rubber containing in-situ resin

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