Nothing Special   »   [go: up one dir, main page]

JPS55161842A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS55161842A
JPS55161842A JP6892979A JP6892979A JPS55161842A JP S55161842 A JPS55161842 A JP S55161842A JP 6892979 A JP6892979 A JP 6892979A JP 6892979 A JP6892979 A JP 6892979A JP S55161842 A JPS55161842 A JP S55161842A
Authority
JP
Japan
Prior art keywords
thermosetting resin
epoxy
inorg
filler
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6892979A
Other languages
Japanese (ja)
Inventor
Shigeo Hosaka
Koji Fujisaki
Toshikazu Narahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6892979A priority Critical patent/JPS55161842A/en
Publication of JPS55161842A publication Critical patent/JPS55161842A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: To provide a thermosetting resin compsn. having impact resistance together with good heat resistance and suitable for use in an insulating mold of large- sized electrical apparatuses, by a method wherein two kinds of epoxy resins and an acid anhydride hardener are blended with an inorg. filler in a specified ratio.
CONSTITUTION: (i) 100Pts.wt. of bisphenol A diglycidyl ether having an epoxy eq. of 180W200, (ii) 30W70pts.wt. of a hydrogenated bisphenol A diglycidyl ether having an epoxy eq. of 230W260 and (iii) an acid anhydride hardener (e.g. methyltetrahydrophalic anhydride) are mixed with (iv) 300W800pts.wt. of an inorg. filler (e.g. silica, asbestos) to obtain the desired compsn.
COPYRIGHT: (C)1980,JPO&Japio
JP6892979A 1979-06-04 1979-06-04 Thermosetting resin composition Pending JPS55161842A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6892979A JPS55161842A (en) 1979-06-04 1979-06-04 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6892979A JPS55161842A (en) 1979-06-04 1979-06-04 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS55161842A true JPS55161842A (en) 1980-12-16

Family

ID=13387831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6892979A Pending JPS55161842A (en) 1979-06-04 1979-06-04 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS55161842A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676448A (en) * 1979-11-29 1981-06-24 Hitachi Chem Co Ltd Epoxy resin composition
US4464494A (en) * 1983-05-13 1984-08-07 Exxon Research & Engineering Co. Adhesive system for production of spiral wound membrane elements for use in organic fluid mixture separations
EP0199180A2 (en) * 1985-04-10 1986-10-29 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676448A (en) * 1979-11-29 1981-06-24 Hitachi Chem Co Ltd Epoxy resin composition
JPS5824458B2 (en) * 1979-11-29 1983-05-21 日立化成工業株式会社 epoxy resin composition
US4464494A (en) * 1983-05-13 1984-08-07 Exxon Research & Engineering Co. Adhesive system for production of spiral wound membrane elements for use in organic fluid mixture separations
EP0199180A2 (en) * 1985-04-10 1986-10-29 Mitsubishi Denki Kabushiki Kaisha Epoxy resin composition

Similar Documents

Publication Publication Date Title
JPS6424825A (en) Epoxy resin composition
MY102533A (en) Resin composition and a process for preparing laminates therefrom.
JPS55165916A (en) Epoxy resin composition
JPS57131223A (en) Resin composition
JPS55161842A (en) Thermosetting resin composition
JPS5569616A (en) Epoxy resin composition for carbon fiber-reinforcement
JPS5659837A (en) Epoxy resin composition
JPS5388097A (en) Epoxy resin composition
JPS56157425A (en) Curable resin composition
JPS56120727A (en) Resin composition for electrically insulating base plate
JPS5742760A (en) Epoxy resin composition
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS51135999A (en) Epoxy res in composition
JPS56149454A (en) Preparation of epoxy resin molding compound
JPS5749613A (en) Thermosetting resin composition
JPS5716023A (en) Thermosetting resin composition
JPS5682817A (en) Epoxy resin composition
JPS5725322A (en) Epoxy resin composition
JPS57162764A (en) Preparation of chemically platable powder coating
JPS57167318A (en) Epoxy resin composition
JPS5598243A (en) Thermosetting resin composition
JPS57190018A (en) Epoxy resin composition
JPS56118416A (en) Novel flame-retardant thermosetting composition
JPS55137153A (en) Electrical insulating resin composition
JPS5674117A (en) Epoxy resin composition