JPS55135155A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS55135155A JPS55135155A JP4156579A JP4156579A JPS55135155A JP S55135155 A JPS55135155 A JP S55135155A JP 4156579 A JP4156579 A JP 4156579A JP 4156579 A JP4156579 A JP 4156579A JP S55135155 A JPS55135155 A JP S55135155A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- aluminum
- formula
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin composition which provides cured products having excellent mechanical properties, electrical properties, thermal properties and resistance to SF6 decomposition gas, comprising an epoxy resin, a curing agent, an alumina filler and a specific coupling agent.
CONSTITUTION: To (A) 100pts.wt. of an epoxy resin are added (B) a curing agent such as phthalic anhydride or methylnadic anhydride (C) 100W600pts.wt. of an alumina filler having a particle diameter of below 50μ and (D) 0.1W10pts.wt. of at least one aluminum chelate, as a coupling agent, selected from the group consisting of (ethyl acetoacetate) aluminum diisopropylate represented by formula I and aluminum tris(ethyl acetoacetate) represented by formula II.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156579A JPS55135155A (en) | 1979-04-07 | 1979-04-07 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156579A JPS55135155A (en) | 1979-04-07 | 1979-04-07 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55135155A true JPS55135155A (en) | 1980-10-21 |
Family
ID=12611958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156579A Pending JPS55135155A (en) | 1979-04-07 | 1979-04-07 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55135155A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074599A (en) * | 1983-09-30 | 1985-04-26 | 株式会社日立製作所 | Printed circuit board and method of producing same |
| JP2008106181A (en) * | 2006-10-26 | 2008-05-08 | Matsushita Electric Works Ltd | Epoxy resin composition and semiconductor device |
| JP2014098055A (en) * | 2012-11-13 | 2014-05-29 | Sumitomo Bakelite Co Ltd | Composition for forming insulating layer, film for forming insulating layer, and substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145863A (en) * | 1977-05-26 | 1978-12-19 | Mitsubishi Electric Corp | Epoxy resin composition |
-
1979
- 1979-04-07 JP JP4156579A patent/JPS55135155A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145863A (en) * | 1977-05-26 | 1978-12-19 | Mitsubishi Electric Corp | Epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6074599A (en) * | 1983-09-30 | 1985-04-26 | 株式会社日立製作所 | Printed circuit board and method of producing same |
| JP2008106181A (en) * | 2006-10-26 | 2008-05-08 | Matsushita Electric Works Ltd | Epoxy resin composition and semiconductor device |
| JP2014098055A (en) * | 2012-11-13 | 2014-05-29 | Sumitomo Bakelite Co Ltd | Composition for forming insulating layer, film for forming insulating layer, and substrate |
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