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JPS5550020A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS5550020A
JPS5550020A JP12274178A JP12274178A JPS5550020A JP S5550020 A JPS5550020 A JP S5550020A JP 12274178 A JP12274178 A JP 12274178A JP 12274178 A JP12274178 A JP 12274178A JP S5550020 A JPS5550020 A JP S5550020A
Authority
JP
Japan
Prior art keywords
substituted
resin composition
acid anhydride
tetrahydrophthalic acid
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12274178A
Other languages
Japanese (ja)
Other versions
JPS5914490B2 (en
Inventor
Akio Nishikawa
Hiroshi Suzuki
Hisashi Takagame
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12274178A priority Critical patent/JPS5914490B2/en
Publication of JPS5550020A publication Critical patent/JPS5550020A/en
Publication of JPS5914490B2 publication Critical patent/JPS5914490B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: To provide a rapid-setting heat-resistant resin composition having excellent moldability, and useful for the insulation of semiconductor devices, by mixing an epoxy compound to a reaction product obtained by melting and mixing an amine having two or more amino groups and tetrahydrophthalic acid anhydride or its derivative.
CONSTITUTION: The title resin composition is prepared by mixing (A) 100 parts by weight of an epoxy compound and (B) 5W60 parts by weight of a reaction product obtained by the heat reaction of (a) 1mol of an amine having two or more amino groups such as metaphenylenediamine, and 2,4-diaminodiphenylamine, with (b) 0.05W0.8mol of a substituted or non-substituted tetrahydrophthalic acid anhydride or substituted or non-substituted endoalkylene-tetrahydrophthalic acid anhydride and 3,6-endomethylene-tetrahydrophthalic acid anhydride.
COPYRIGHT: (C)1980,JPO&Japio
JP12274178A 1978-10-06 1978-10-06 Heat resistant resin composition Expired JPS5914490B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12274178A JPS5914490B2 (en) 1978-10-06 1978-10-06 Heat resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12274178A JPS5914490B2 (en) 1978-10-06 1978-10-06 Heat resistant resin composition

Publications (2)

Publication Number Publication Date
JPS5550020A true JPS5550020A (en) 1980-04-11
JPS5914490B2 JPS5914490B2 (en) 1984-04-04

Family

ID=14843436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12274178A Expired JPS5914490B2 (en) 1978-10-06 1978-10-06 Heat resistant resin composition

Country Status (1)

Country Link
JP (1) JPS5914490B2 (en)

Also Published As

Publication number Publication date
JPS5914490B2 (en) 1984-04-04

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