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JPS5492170A - Manufacture of electrode substrate - Google Patents

Manufacture of electrode substrate

Info

Publication number
JPS5492170A
JPS5492170A JP16032577A JP16032577A JPS5492170A JP S5492170 A JPS5492170 A JP S5492170A JP 16032577 A JP16032577 A JP 16032577A JP 16032577 A JP16032577 A JP 16032577A JP S5492170 A JPS5492170 A JP S5492170A
Authority
JP
Japan
Prior art keywords
electrode
base
layer
conductive layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16032577A
Other languages
Japanese (ja)
Inventor
Yoshinori Miyashita
Tsutae Shinoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16032577A priority Critical patent/JPS5492170A/en
Publication of JPS5492170A publication Critical patent/JPS5492170A/en
Pending legal-status Critical Current

Links

Landscapes

  • Gas-Filled Discharge Tubes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE: To obtain an electrode of excellent airtightness between its substrate glass and electrode and of excellent discharging characteristics with the manufacture process simplified by oxidizing the exposure part of a base-material metal layer when froming the electrode substrate used for a gas discharge panel, etc.
CONSTITUTION: On two entire substrates 1, three layers of, for example, Cr for base-material layer 2, Cu for conductive layer 3 and Cr for protective layer 8 are formed in sequence and in the normal process, patterning electrode terminal part 8 and conductive layer 3 of the display part is completed. Next, the etching process for base-material Cr layer 2 is omitted which is a normal process, and low-melting- point glass 4 is applied on the electrode of the display part and burned to attain the thermal oxidation of the base-material Cr film, so that the base-material Cr film between both electrodes will change into insulating chrome-oxide film 6 to insulate conductive layer 3. As a result, the chrome-oxide film will not crack finely even in a following thermal oxidation process, improves the airtightness between the electrode and substrate glass, and generates no canopy between the electrode and base-material layer in addition to the simplification of the processes with discharging characteristics improved.
COPYRIGHT: (C)1979,JPO&Japio
JP16032577A 1977-12-29 1977-12-29 Manufacture of electrode substrate Pending JPS5492170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16032577A JPS5492170A (en) 1977-12-29 1977-12-29 Manufacture of electrode substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16032577A JPS5492170A (en) 1977-12-29 1977-12-29 Manufacture of electrode substrate

Publications (1)

Publication Number Publication Date
JPS5492170A true JPS5492170A (en) 1979-07-21

Family

ID=15712511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16032577A Pending JPS5492170A (en) 1977-12-29 1977-12-29 Manufacture of electrode substrate

Country Status (1)

Country Link
JP (1) JPS5492170A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664494A (en) * 1979-10-30 1981-06-01 Cho Lsi Gijutsu Kenkyu Kumiai Method of manufacturing ceramic circutt board
JPS5691494A (en) * 1979-12-25 1981-07-24 Nippon Electric Co Method of forming conductor pattern
JPS56131991A (en) * 1980-03-19 1981-10-15 Matsushita Electric Works Ltd Method of producing electric circuit board or sheet
JPS5720373A (en) * 1980-07-14 1982-02-02 Hitachi Ltd Heat-sensitive recording head and production thereof
US7230381B2 (en) * 2002-08-30 2007-06-12 Fujitsu Hitachi Plasma Display Limited Method of manufacturing a plasma display panel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153490A (en) * 1974-11-06 1976-05-11 Fujitsu Ltd Handotaisochino seizohoho
JPS5270751A (en) * 1975-12-09 1977-06-13 Fujitsu Ltd Manufacture of electrode of gas discharge panel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153490A (en) * 1974-11-06 1976-05-11 Fujitsu Ltd Handotaisochino seizohoho
JPS5270751A (en) * 1975-12-09 1977-06-13 Fujitsu Ltd Manufacture of electrode of gas discharge panel

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664494A (en) * 1979-10-30 1981-06-01 Cho Lsi Gijutsu Kenkyu Kumiai Method of manufacturing ceramic circutt board
JPS5691494A (en) * 1979-12-25 1981-07-24 Nippon Electric Co Method of forming conductor pattern
JPS56131991A (en) * 1980-03-19 1981-10-15 Matsushita Electric Works Ltd Method of producing electric circuit board or sheet
JPS5720373A (en) * 1980-07-14 1982-02-02 Hitachi Ltd Heat-sensitive recording head and production thereof
JPS6311991B2 (en) * 1980-07-14 1988-03-16 Hitachi Ltd
US7230381B2 (en) * 2002-08-30 2007-06-12 Fujitsu Hitachi Plasma Display Limited Method of manufacturing a plasma display panel

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