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JPS54137985A - Field effect semiconductor device of insulation gate type - Google Patents

Field effect semiconductor device of insulation gate type

Info

Publication number
JPS54137985A
JPS54137985A JP4616378A JP4616378A JPS54137985A JP S54137985 A JPS54137985 A JP S54137985A JP 4616378 A JP4616378 A JP 4616378A JP 4616378 A JP4616378 A JP 4616378A JP S54137985 A JPS54137985 A JP S54137985A
Authority
JP
Japan
Prior art keywords
layer
film
ions
gate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4616378A
Other languages
Japanese (ja)
Inventor
Koji Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP4616378A priority Critical patent/JPS54137985A/en
Publication of JPS54137985A publication Critical patent/JPS54137985A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/792Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)

Abstract

PURPOSE:To make the operation speed high and to imporve the degree of integration by burying a source region certain-distance away from a gate insulating film. CONSTITUTION:On N epitaxial layer 32 on N<+>-type Si substrate 31, SiO233 is formed and film 33 is etched by a mask of Si3N4. After the injection of B ions, P layer 36 and SiO237 are formed through thermal oxidation, a selective opening is made in films 34 and 33, and B ions are injected to form P layer 38. After films 34 and 33 are removed, SiO239 is provided, B ions are injected into the entire surface to form B ion injection layer 40, and a pn junction is made certain-distance away from gate film 39 under control. Next, an opening is made in poly-Si42 and layer 39 and phosphorus is thermally diffused to provide N+ layer 43 and P layer 41. At this time, film 39 should be away from the edge of P layer 38 at distance L. When the depth of layer 43 is set l, the effective channel length is L-l and there is a little influence of the channel length upon characteristics. Lastly, electrodes of gate 45, drain 46 and source 47 are provided. In this constitution, the occupied area of the element is reduced and high-frequency characteristics are also excellent.
JP4616378A 1978-04-18 1978-04-18 Field effect semiconductor device of insulation gate type Pending JPS54137985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4616378A JPS54137985A (en) 1978-04-18 1978-04-18 Field effect semiconductor device of insulation gate type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4616378A JPS54137985A (en) 1978-04-18 1978-04-18 Field effect semiconductor device of insulation gate type

Publications (1)

Publication Number Publication Date
JPS54137985A true JPS54137985A (en) 1979-10-26

Family

ID=12739337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4616378A Pending JPS54137985A (en) 1978-04-18 1978-04-18 Field effect semiconductor device of insulation gate type

Country Status (1)

Country Link
JP (1) JPS54137985A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393157A (en) * 1986-10-08 1988-04-23 Nippon Denso Co Ltd Manufacture of semiconductor device
US4933730A (en) * 1986-05-23 1990-06-12 Fujitsu Limited Semiconductor device having a high breakdown voltage characteristic
US5231474A (en) * 1986-03-21 1993-07-27 Advanced Power Technology, Inc. Semiconductor device with doped electrical breakdown control region

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231474A (en) * 1986-03-21 1993-07-27 Advanced Power Technology, Inc. Semiconductor device with doped electrical breakdown control region
US5434095A (en) * 1986-03-21 1995-07-18 Sundstrand Corporation Method for controlling electrical breakdown in semiconductor power devices
US4933730A (en) * 1986-05-23 1990-06-12 Fujitsu Limited Semiconductor device having a high breakdown voltage characteristic
JPS6393157A (en) * 1986-10-08 1988-04-23 Nippon Denso Co Ltd Manufacture of semiconductor device

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