JPH1168415A - Integrated circuit for microwave use - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an integrated circuit for microwave use having a stable characteristic against temperature changes, vibrating shock or the like. SOLUTION: A recessed part 11 is formed on a conductor chassis 3 formed on the lower part of an I/O connection part between adjacent 1st and 2nd devices 1, 2 in the vertical direction of a microstrip line and a ground contacting member 12 is inserted into the recessed part 11 so that the grounding parts of respective devices 1, 2 are connected while holding a certain fixed pressure on their end faces. Consequently a stable characteristic against temperature changes, vibrating shock or the like can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to stabilization of characteristics at connection portions of a microwave integrated circuit.

[0002]

2. Description of the Related Art FIGS. 4A and 4B show an example of connection of a conventional microwave integrated circuit. FIG. 4A is a plan view, FIG. 4B is a sectional view, and FIGS. It is the enlarged view which divided and showed the contact part with a chassis in the state before and after a temperature change and vibration shock application. In these figures, 1 is the first device, 2 is the second device, 3 is the conductor chassis, 4
Is the first dielectric substrate, 5 is the second dielectric substrate, and 6 is the first dielectric substrate.
, 7 is a second carrier, 8 is an input / output microstrip line, 9 is a conductor ribbon, and 10 is a fixing screw.

Next, the operation will be described. The input / output microstrip line 8 of the first device 1 is connected to the input / output microstrip line 8 of the second device 2 by a conductor ribbon 9. On the other hand, the first device 1
Is connected to the second carrier 7 which is the ground of the second device 2 via the conductor chassis 3 which is crimped to the first carrier 6.

[0004]

In the conventional micro integrated circuit, the grounds are connected to each other via the screwed chassis as described above. In this case, since both the metal carriers 6 and 7 and the conductor chassis 3 have minute irregularities on the surface, the actual connection portion had unstable point contact as shown in FIG. 3C. Therefore, temperature change
When the metal carrier or the chassis is distorted due to the application of vibration and shock, the contact point of the ground changes as shown in FIG. 3D, and unnecessary reactance components are inserted into the circuit, and the characteristics of the microwave integrated circuit are changed. There was a problem that would change.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to obtain stable characteristics of a microwave integrated circuit even when a temperature change, vibration and shock are applied.

[0006]

According to a first aspect of the present invention, there is provided a microwave integrated circuit, wherein a recess is arranged in a portion of a conductor chassis facing an input / output connection portion of two adjacent devices.
A ground contact member is inserted into the recess so as to come into contact with carriers of two adjacent devices.

A microwave integrated circuit according to a second aspect of the present invention
In the first invention, a ground contact member formed in a triangular prism shape is used as the ground contact member.

[0008] A microwave integrated circuit according to a third aspect of the present invention comprises:
In the first invention, a metal spring is used as the ground contact member.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 shows a first embodiment of the present invention, in which (a) is a plan view,
(B) is a sectional view. In these figures, reference numeral 11 denotes a conductor ribbon 9 of the conductor chassis (first and second devices 1, 2).
2 (input / output connection portion 2), and is formed in a direction perpendicular to the microstrip line 8. Reference numeral 12 is a ground contact member.

In the microwave integrated circuit described above,
The diameter of the ground contact member 12 made of conductive rubber or the like is slightly larger than the depth of the groove of the concave portion 11 provided in the conductor chassis 3. Therefore, by attaching the first device 1 and the second device 2 to the conductor chassis 3 with the fixing screws 10, the ground contact member 12 is attached.
Can directly contact the respective end faces of the first carrier 6 and the second carrier 7 while maintaining a certain pressure.

As described above, according to the present invention, the ground of each device is connected by the ground contact member while maintaining a certain constant pressure at the end face, so that stable characteristics against temperature change, vibration and shock application, etc. can be obtained. It is possible to obtain

Embodiment 2 FIG. FIG. 2 shows a second embodiment of the present invention, in which (a) is a plan view and (b) is a cross-sectional view. In these figures, reference numeral 12a denotes a ground contact member formed in a triangular prism shape.

In general, when a microwave integrated circuit is mounted, if the carriers of two devices are mounted so as to be in direct contact with each other, a contact portion may be attached or detached due to a temperature change, application of a vibration shock, or the like. Characteristics become unstable. Therefore, it is necessary to arrange them with a gap of about 0.1 mm so that the two carriers do not come into direct contact with each other, and the management is generally performed using a microscope or the like. In the microwave integrated circuit described above, the height of the ground contact member 12a formed in a triangular prism shape is
The depth of the groove of the concave portion 11 provided in the above is higher than the depth of the groove. Therefore, by attaching the first device 1 and the second device 2 to the conductor chassis 3 with the fixing screws 10,
Ground contact members 12a formed in a triangular prism shape are provided on the end faces of the first carrier 6 and the second carrier 7, respectively.
Direct contact is possible while maintaining a certain pressure, and the interval can be controlled to a constant value so that the two carriers do not directly contact.

As described above, according to the present invention, the ground of each device is a ground contact member 1 formed in a triangular prism shape.
According to 2a, the end faces are connected while maintaining a certain pressure, and the gap between the carriers can be controlled to a constant value, so that it is possible to obtain stable characteristics against temperature change, vibration impact, and the like.

Embodiment 3 FIG. 3 shows a third embodiment of the present invention, in which (a) is a plan view and (b) is a sectional view. In these figures, reference numeral 12b denotes a metal spring serving as a ground contact member.

In general, conductive rubber and the like are deteriorated by aging and their elasticity is deteriorated. Therefore, application to a part used for a long period of time or a part requiring high reliability is inappropriate. In the microwave integrated circuit described above, the height of the metal spring 12 b is slightly larger than the depth of the groove of the concave portion 11 provided in the conductor chassis 3. Also, two projections are provided on the upper part. For this reason, by attaching the first device 1 and the second device 2 to the conductor chassis 3 with the fixing screws 10, the protrusions above the metal springs 12 b cause the protrusions of the first carrier 6 and the second carrier 7 respectively. It is possible to directly contact the end face while maintaining a certain pressure. Further, since a metal spring is used as the ground contact member, stable contact can be obtained without aging even during long-term use.

As described above, in the present invention, the ground of each device is connected by a metal spring while maintaining a certain constant pressure at the end face, so that stable characteristics against temperature change, vibration impact, and the like are obtained. It is possible. In addition, stable characteristics can be obtained without aging even during long-term use.

[0018]

According to the first invention, each device is formed by forming a concave portion in the conductor chassis portion facing the input / output connection portion of two adjacent devices and inserting a ground contact member into the concave portion. Is connected while maintaining a certain pressure at the end face, it is possible to obtain stable characteristics against temperature change, vibration shock and the like.

According to the second aspect of the present invention, by using a triangular prism-shaped ground contact member as the ground contact member, the grounds of the devices are connected at their end faces while maintaining a constant pressure, and Since the gap between the carriers can be controlled to a constant value, it is possible to obtain stable characteristics against temperature change, vibration impact, and the like.

According to the third aspect of the present invention, the use of a metal spring as the ground contact member allows the grounds of the devices to be connected while maintaining a certain constant pressure at the end faces. It is possible to obtain stable characteristics against the above. In addition, stable characteristics can be obtained without aging even during long-term use.

[Brief description of the drawings]

FIG. 1 is a diagram showing Embodiment 1 of a microwave integrated circuit according to the present invention.

FIG. 2 is a diagram showing Embodiment 2 of a microwave integrated circuit according to the present invention.

FIG. 3 is a diagram showing Embodiment 3 of a microwave integrated circuit according to the present invention.

FIG. 4 is a diagram showing a conventional microwave integrated circuit.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 first device, 2 second device, 3 conductor chassis, 4 first dielectric substrate, 5 second dielectric substrate, 6 first carrier, 7 second carrier, 8 input / output microstrip line , 9 conductor ribbon, 10
Fixing screw, 11 recess, 12 Ground contact member, 1
2a Ground contact member formed in a triangular prism shape, 12b
Metal spring.

Claims (3)

[Claims] 1. A first carrier and a first dielectric substrate forming a first device, a second carrier and a second dielectric substrate forming a second device, and the first dielectric A microwave integrated circuit comprising: a conductor ribbon for connecting the input / output microstrip line of the body substrate to the input / output microstrip line of the second dielectric substrate; and a conductor chassis for fixing the first and second devices. In the circuit, a concave portion is formed in a portion of the conductive chassis facing the conductive ribbon, and a ground contact member is provided in the concave portion so as to contact the first and second carriers. Integrated circuit. 2. The microwave integrated circuit according to claim 1, wherein a ground contact member formed in a triangular prism shape is used as said ground contact member. 3. The microwave integrated circuit according to claim 1, wherein a metal spring is used as said ground contact member.