JPH11135988A - Method for mounting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts by which the mounting speed of electronic parts can be improved, by shortening the tact time required for recognizing the position of electronic parts in mounting the electronic parts on a substrate by using multiple transfer heads. SOLUTION: Many parts feeders carry electronic parts having high, intermediate, and low scanning rates for the position recognition by means of a recognizing device 13. Three transfer heads 21 pick up the electronic parts Pa having nearly the same scanning speeds, for example, the high scanning speeds. The parts feeders mount the parts Pa on a substrate after recognizing the positions of the parts Pa while the feeders move above the recognizing device 13 at constant speeds.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate by using a multiple transfer head.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, an electronic component provided in a parts feeder is vacuum-adsorbed to a lower end portion of a nozzle of a transfer head while a transfer head is horizontally moved in a X direction or a Y direction by a moving table. Pickup and transfer to a substrate are widely practiced.

This type of electronic component mounting apparatus has an advantage that it has a relatively simple structure and can mount various kinds of electronic components on a substrate, but has a disadvantage that its mounting speed is relatively slow. . Therefore, in recent years, a device equipped with a multiple transfer head has been proposed to improve the disadvantages of this type of electronic component mounting apparatus (Japanese Patent Application Laid-Open No. 9-186492).
issue). In the multiple type, multiple transfer heads are integrated side by side to form a head unit.Electronic components of the parts feeder are vacuum-adsorbed to the nozzles of the multiple transfer heads and picked up, and Since the transfer head is mounted, the mounting speed is higher than that of a single transfer head.

[0004]

An electronic component mounting apparatus having a multiple transfer head is provided with a number of parts feeders such as a tray feeder, a tube feeder and a tape feeder. These parts feeders are provided with various types of electronic components such as QFPs, SOPs, chip capacitors, and resistor chips. The transfer head picks up the electronic components of the parts feeder by vacuum suction at the lower end of the nozzle and mounts the electronic components on the substrate. Recognize the position of parts. Then, the electronic components are corrected for positional deviation according to the position recognition result, and are mounted on a board.

A line sensor or the like is widely used as a recognition device. While moving a transfer head above the line sensor, an electronic component vacuum-adsorbed to the lower end of the nozzle is optically scanned. Performs position recognition of electronic components. As described above, there are various types of electronic components. For example, a QFP having a narrow pitch lead needs to be scanned at a relatively low speed, and an SOP having a relatively wide pitch lead in two directions. For example, scanning at a medium speed may be performed, and chip capacitors, resistor chips, and the like with low required mounting accuracy may be scanned at a high speed.

[0006] As described above, the scanning speed required for each type of electronic component differs. When a plurality of transfer heads pick up electronic components having different scanning speeds and recognize the positions of these electronic components, the scanning speed must be adjusted to the electronic component having the lowest scanning speed. Since the moving speed of the transfer head is governed by the slowest scanning speed in this way, if multiple transfer heads pick up electronic components having different scanning speeds, the tact time for position recognition of the electronic components becomes longer. The mounting speed does not increase.

Accordingly, the present invention provides an electronic component mounting method capable of shortening a tact time required for recognizing a position of an electronic component and increasing a mounting speed in mounting an electronic component using a multiple transfer head. The purpose is to:

[0008]

According to the present invention, electronic components provided in a parts feeder are vacuum-adsorbed and picked up at the lower ends of nozzles of a plurality of multiple transfer heads, and these are moved by a moving table. An electronic component in which the electronic component is optically scanned by a recognition device provided below the moving path to recognize its position while horizontally moving the transfer head, and then the electronic component is mounted on a substrate. A mounting method, wherein the plurality of transfer heads pick up electronic components having the same scanning speed, and moving the plurality of transfer heads above the recognition device at a constant speed. Recognized the position of electronic components.

According to the above configuration, the plurality of transfer heads pick up electronic components having the same scanning speed. Therefore, while moving the transfer head at a constant speed optimal for scanning the electronic components, the plurality of transfer heads pick up the electronic components. Of electronic components can be recognized.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a perspective view of the head unit and a recognition device, FIG. FIG. 5 is a side view of the head unit and the recognition device during recognition of the electronic component.

In FIGS. 1 and 2, a guide rail 2 is provided at the center of a base 1, and a substrate 3 is positioned on the guide rail 2. A large number of parts feeders 4 are arranged on both sides of the guide rail 2. The parts feeder 4 includes electronic components mounted on the substrate 3. A recognition device 13 is provided between the guide rail 2 and the parts feeder 4.

A Y table 5 is erected on the base 1, and an X table 6 is erected on the Y table 5. As shown in FIG.
And a Y-axis motor 8 for rotating the feed screw 7. The X table 6 also has a built-in feed screw 9 and an X-axis motor 10 for rotating the feed screw 9. In FIG. 1, a head unit 20 is mounted on the lower surface of the X table 6, and when the motors 8 and 10 are driven, the head unit 20
Horizontal movement in the direction and Y direction. 12 is a guide rail in the Y direction. That is, X table 6 and Y table 5
Is a moving table for moving the head unit 20 in the horizontal direction.

Next, the recognition device 13 and the head unit 20 will be described with reference to FIG. The recognition device 13 includes a cover case 14 and a line sensor 15 built in the cover case 14. A slit 16 is formed in the upper surface of the cover case 14, and the line sensor 15 recognizes an electronic component through the slit 16. 17 is a light source unit.

The head unit 20 is of a multiple type and includes a plurality (three in this embodiment) of transfer heads 21 arranged side by side. Each transfer head 21 includes a vertical nozzle 22, a unique θ-axis motor 23 and a belt 2 independent of each other as θ-rotation means for rotating the nozzle 22 about its axis.
4. Feed screw 2 for causing nozzle 22 to move up and down
5, a nut 26, and a Z-axis motor 27. When the feed screw 25 is rotated by driving the Z-axis motor 27, the nut 26 moves up and down along the feed screw 25, and the nozzle 22 connected to the nut 26 also moves up and down. A back plate 28 for electronic component recognition is mounted below the nozzle 22. Pa is an electronic component held by vacuum suction at the lower end of the nozzle 22.

In FIG. 4, a number of parts feeders 4
Is equipped with various types of electronic components. In the figure, A
Is a parts feeder having an electronic component Pa having a high scanning speed, B is a parts feeder having an electronic component Pb having a medium speed, and C is a parts feeder having an electronic component Pc having a low scanning speed. As shown in the figure, the parts feeders provided with the electronic parts of the same speed are arranged as concentrated as possible for the convenience of pickup by the multiple transfer heads 21.

This electronic component mounting apparatus is configured as described above, and the operation will be described next. 1 and 2, when the X table 6 and the Y table 5 are driven, the head unit 20 moves above the parts feeder 4, where the nozzles 22 of the transfer heads 21 move up and down, thereby The nozzle 22 picks up the electronic component provided in the parts feeder 4 by vacuum-sucking the electronic component at its lower end.

In this case, the three transfer heads 21 pick up electronic components having the same scanning speed as much as possible. Specifically, in FIG. 4, three transfer heads 2
1 picks up only the high-speed electronic component Pa, only the medium-speed electronic component Pb, or only the low-speed electronic component Pc.

FIGS. 3 and 5 show three transfer heads 21.
Pick up the high-speed electronic component Pa, move the recognition device 13 above in the direction of arrow N, and
5 shows how the position recognition is performed. In this case, since the three electronic components Pa are all high-speed and the scanning speed for position recognition is the same, these electronic components Pa are moved at a constant speed in the direction of arrow N at a high speed. The position of the component Pa can be recognized. Then, according to the result of the position recognition of each electronic component Pa, the head unit 20 is moved above the substrate 3, and each electronic component Pa is mounted on the substrate 3.

Medium-speed electronic component Pb and low-speed electronic component Pc
The same applies to the case of (1). In any case, only the electronic component Pb or the electronic component Pc is picked up by the three transfer heads 21 and the upper part of the recognition device 13 is moved at a constant speed of medium speed or low speed. These electronic components Pb or Pc
Is recognized and mounted on the board 3.

As described above, the three transfer heads 21 pick up electronic components having the same scanning speed and mount them on the substrate 3.
In some cases, electronic components having different scanning speeds must be mixed and picked up. In this case, high-speed electronic components Pa and low-speed electronic components Pc are avoided as much as possible, and high-speed electronic components Pa and medium-speed electronic components Pb, or medium-speed electronic components Pb and low-speed electronic components Pc are avoided. It is desirable to pick up by mixing them in order to shorten the tact time for electronic component recognition.

[0021]

According to the present invention, a plurality of transfer heads pick up electronic components having the same scanning speed, thereby moving the transfer head at a constant speed optimal for scanning the electronic components. However, since the position of these electronic components can be recognized, the tact time for position recognition of the electronic components can be reduced, and the mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a perspective view of a head unit and a recognition device of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a plan view of a parts feeder of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 5 is a side view of the head unit and the recognizing device of the electronic component mounting apparatus according to the embodiment of the present invention while recognizing the electronic component;

[Explanation of symbols]

 Reference Signs List 3 board 4 parts feeder 5 Y table 6 X table 13 recognition device 15 line sensor 20 head unit 21 transfer head 22 nozzle Pa electronic component (high speed) Pb electronic component (medium speed) Pc electronic component (low speed)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H05K 13/08 H05K 13/08 B

Claims (1)

[Claims] An electronic component provided in a parts feeder is vacuum-adsorbed and picked up at a lower end of a nozzle of a plurality of multiple transfer heads while a plurality of transfer heads are horizontally moved by a moving table. An electronic component mounting method in which an electronic component is optically scanned by a recognition device provided below a moving path to recognize its position, and then the electronic component is mounted on a substrate. The plurality of transfer heads pick up electronic components having the same scanning speed, and perform the position recognition of these electronic components while moving the plurality of transfer heads above the recognition device at a constant speed. An electronic component mounting method, characterized in that: