JP3853043B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate by a multiple transfer head.
[0002]
[Prior art]
As an electronic component mounting apparatus, the transfer head is horizontally moved in the X direction and the Y direction by a moving table, and the electronic component provided in the parts feeder is vacuum-sucked and picked up at the lower end of the nozzle of the transfer head. The ones that are transported and mounted on are widely implemented.
[0003]
This type of electronic component mounting apparatus has the advantage that the structure is relatively simple and a wide variety of electronic components can be mounted on a substrate, but the mounting speed is relatively slow. Therefore, in recent years, as a means for improving the disadvantages of this type of electronic component mounting apparatus, one having a multiple transfer head has been proposed (Japanese Patent Laid-Open No. 9-186492). In the multiple system, a plurality of transfer heads are integrated side by side into a head part, and the electronic parts of the parts feeder are vacuum-sucked to the nozzles of the plurality of transfer heads, respectively, and picked up on the substrate. Since mounting is carried out, the mounting speed is faster than that of a single transfer head.
[0004]
[Problems to be solved by the invention]
An electronic component mounting apparatus having a multiple transfer head is provided with a number of parts feeders such as a tray feeder, a tube feeder, and a tape feeder. These parts feeders are provided with various types of electronic components such as QFP, SOP, chip capacitors, and resistor chips. The transfer head picks up the electronic parts of the parts feeder by vacuum suction at the lower end of the nozzle and mounts them on the substrate. Before mounting on the substrate, the transfer head uses the recognition device provided on the transfer path of the transfer head. Recognize the position of the part. Then, the positional deviation of the electronic component is corrected according to the position recognition result and mounted on the board.
[0005]
As the recognition device, a line sensor or the like is frequently used. While moving the transfer head above the line sensor, the electronic component vacuum-adsorbed on the lower end of the nozzle is optically scanned to detect the electronic component. Perform position recognition. As described above, there are various types of electronic components. For example, QFP having a narrow pitch lead needs to be scanned at a relatively low speed, and SOP having a relatively wide pitch lead in two directions. For example, it is sufficient to scan at a medium speed, and chip capacitors and resistor chips with low mounting accuracy that are required may be scanned at a high speed.
[0006]
As described above, the scanning speed required for each electronic component varies depending on the product type. When a plurality of transfer heads pick up electronic components having different scanning speeds and recognize the positions of these electronic components, the scanning speed must be adjusted to the electronic component having the slowest scanning speed. As described above, since the moving speed of the transfer head is governed by the slowest scanning speed, when a plurality of transfer heads pick up electronic parts having different scanning speeds, the tact time for position recognition of the electronic parts is increased accordingly. Therefore, the mounting speed will not increase.
[0007]
Accordingly, an object of the present invention is to provide an electronic component mounting method capable of shortening the tact time required for position recognition of an electronic component and increasing the mounting speed in electronic component mounting using a multiple transfer head. And
[0008]
[Means for Solving the Problems]
The present invention picks up and picks up the electronic components provided in the parts feeder at the lower end of the nozzles of a plurality of transfer heads in a multiple manner, and horizontally moves these transfer heads by a moving table, An electronic component mounting method in which an electronic component is optically scanned by a recognition device provided below a movement path and its position is recognized, and then the electronic component is mounted on a substrate . Parts feeders equipped with electronic parts are arranged in a concentrated manner for the convenience of pickup by multiple transfer heads , and the plurality of transfer heads pick up electronic parts having the same scanning speed, The positions of these electronic components are recognized while moving a plurality of transfer heads above the recognition device at a constant speed.
[0009]
According to the above configuration, since the plurality of transfer heads pick up electronic components having the same scanning speed, these electronic components are moved while moving the transfer head at a constant speed optimum for scanning of the electronic components. Can be recognized.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a perspective view of the head unit and a recognition device, and FIG. 4 is a plan view of the parts feeder. FIG. 5 is a side view of the head unit and the recognition device that are recognizing the electronic component.
[0011]
In FIG. 1 and FIG. 2, a guide rail 2 is provided at the center of the base 1, and a substrate 3 is positioned on the guide rail 2. A large number of parts feeders 4 are arranged on both sides of the guide rail 2. The parts feeder 4 is provided with electronic components mounted on the substrate 3. A recognition device 13 is provided between the guide rail 2 and the parts feeder 4.
[0012]
A Y table 5 is erected on the base 1, and an X table 6 is erected on the Y table 5. As shown in FIG. 2, the Y table 5 includes a feed screw 7 and a Y-axis motor 8 that rotates the feed screw 7. The X table 6 also includes a feed screw 9 and an X-axis motor 10 that rotates the feed screw 9. In FIG. 1, a head portion 20 is mounted on the lower surface of the X table 6, and when the motors 8 and 10 are driven, the head portion 20 moves horizontally in the X direction and the Y direction. Reference numeral 12 denotes a guide rail in the Y direction. That is, the X table 6 and the Y table 5 are moving tables that move the head unit 20 in the horizontal direction.
[0013]
Next, the recognition device 13 and the head unit 20 will be described with reference to FIG. The recognition device 13 includes a cover case 14 and a line sensor 15 built in the cover case 14. A slit 16 is formed in the upper surface of the cover case 14, and the electronic component is recognized by the line sensor 15 through the slit 16. Reference numeral 17 denotes a light source unit.
[0014]
The head unit 20 is a multiple type, and includes a plurality (three in this example) of transfer heads 21 side by side. Each of the transfer heads 21 causes the vertical nozzle 22 and the independent θ-axis motor 23 and the belt 24 and the nozzles 22 as the θ-rotating means for rotating the axis of the nozzle 22 to move up and down. A feed screw 25, a nut 26, and a Z-axis motor 27. When the feed screw 25 is rotated by driving the Z-axis motor 27, the nut 26 moves up and down along the feed screw 25, and the nozzle 22 coupled to the nut 26 also moves up and down. A back plate 28 for recognizing electronic components is mounted below the nozzle 22. Pa is an electronic component held by vacuum suction at the lower end of the nozzle 22.
[0015]
In FIG. 4, a large number of parts feeders 4 are provided with various types of electronic components. In the figure, A is a parts feeder having an electronic component Pa with a high scanning speed, B is a parts feeder having a medium speed electronic component Pb, and C is a parts feeder having a low speed electronic component Pc. As shown in the drawing, the parts feeders having the same speed electronic components are arranged as concentrated as possible for convenience of pickup by the multiple transfer head 21.
[0016]
This electronic component mounting apparatus has the above-described configuration, and the operation will be described next. 1 and 2, the head unit 20 is moved above the parts feeder 4 by driving the X table 6 and the Y table 5, and the nozzles 22 of the respective transfer heads 21 are moved up and down. The nozzles 22 pick up the electronic components provided in the parts feeder 4 by vacuum suction to the lower ends thereof.
[0017]
In this case, the three transfer heads 21 pick up electronic components having the same scanning speed as much as possible. Specifically, in FIG. 4, the three transfer heads 21 pick up only the high-speed electronic component Pa, only the medium-speed electronic component Pb, or only the low-speed electronic component Pc.
[0018]
3 and 5, all three transfer heads 21 pick up the high-speed electronic component Pa, move in the direction of arrow N above the recognition device 13, and perform position recognition with the line sensor 15. Is shown. In this case, since all the three electronic parts Pa are high-speed and the scanning speed for recognizing their positions is the same, these electronic parts Pa are moved at high speed at a constant speed in the direction of arrow N. The position of the component Pa can be recognized. Then, according to the result of position recognition of each electronic component Pa, the head unit 20 is moved above the substrate 3 to mount each electronic component Pa on the substrate 3.
[0019]
The same applies to the medium-speed electronic component Pb and the low-speed electronic component Pc. In either case, only the electronic component Pb or the electronic component Pc is picked up by the three transfer heads 21, and the upper part of the recognition device 13 is moved. The position of the electronic component Pb or Pc is recognized while being moved at a constant speed of medium speed or low speed, and mounted on the substrate 3.
[0020]
As described above, the three transfer heads 21 pick up electronic components having the same scanning speed and mount them on the substrate 3. However, electronic components having different scanning speeds are mixed in the electronic component mounting program. In some cases, it must be picked up. In this case, the high-speed electronic component Pa and the low-speed electronic component Pc are avoided as much as possible, and the high-speed electronic component Pa and the medium-speed electronic component Pb, or the medium-speed electronic component Pb and the low-speed electronic component Pc. It is desirable to pick up by mixing them in order to shorten the tact time for electronic component recognition.
[0021]
【The invention's effect】
In the present invention , parts feeders equipped with electronic components of the same speed are arranged in a concentrated manner for the convenience of pick-up by multiple transfer heads , and a plurality of transfer heads are electronic devices having the same scanning speed. while pick up parts are moved at an optimal constant speed scanning, you have to perform the position recognition of the electronic component Runode to shorten the tact time for the position recognition of the electronic component, increasing the mounting efficiency be able to.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a plan view of a parts feeder of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 5 is an electronic component mounting according to an embodiment of the present invention. Side view of the head unit and the recognition device while recognizing the electronic components of the device
3 Substrate 4 Parts feeder 5 Y table 6 X table 13 Recognition device 15 Line sensor 20 Head unit 21 Transfer head 22 Nozzle Pa Electronic component (high speed)
Pb electronic components (medium speed)
Pc electronic parts (low speed)

Claims (1)

The electronic parts provided in the parts feeder are picked up by vacuum suction at the lower end of the nozzles of multiple transfer heads in a multi-channel system, and these transfer heads are moved horizontally by a moving table while moving down the moving path. An electronic component mounting method in which an electronic component is optically scanned by a recognition device provided on the substrate and its position is recognized, and then the electronic component is mounted on a substrate, the electronic component having the same speed. The parts feeders are arranged in a concentrated manner for the convenience of pick-up by multiple transfer heads , the plurality of transfer heads pick up electronic components having the same scanning speed , and the plurality of transfer heads. An electronic component mounting method characterized in that the position of these electronic components is recognized while moving the mounting head above the recognition device at a constant speed.

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