JPH10286688A - Soldered article - Google Patents
Soldered articleInfo
- Publication number
- JPH10286688A JPH10286688A JP9766497A JP9766497A JPH10286688A JP H10286688 A JPH10286688 A JP H10286688A JP 9766497 A JP9766497 A JP 9766497A JP 9766497 A JP9766497 A JP 9766497A JP H10286688 A JPH10286688 A JP H10286688A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring
- circuit board
- composition
- addition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半田付け物品に関す
るものである。[0001] The present invention relates to a soldered article.
【０００２】[0002]
【従来の技術】従来より、電子部品と回路基板との電気
的・機械的な接続を得るために半田が用いられている。
この半田は、ＳｎとＰｂを主成分としたＳｎ／Ｐｂ共晶
半田が一般的に用いられてきたが、融点が１８３℃と低
く、Ｐｂが回路基板のＣｕ配線へのＳｎの拡散を助長
し、Ｃｕ配線とＳｎ／Ｐｂ共晶半田との間にＣｕ−Ｓｎ
金属間化合物層（Ｃｕ3ＳｎやＣｕ6Ｓｎ5）が厚く形成
される。図７にはＳｎの拡散に起因するＣｕ−Ｓｎ金属
間化合物層の成長度合いを示している。2. Description of the Related Art Conventionally, solder has been used to obtain an electrical and mechanical connection between an electronic component and a circuit board.
As this solder, Sn / Pb eutectic solder containing Sn and Pb as main components has been generally used. , Cu-Sn between the Cu wiring and the Sn / Pb eutectic solder
An intermetallic compound layer (Cu 3 Sn or Cu 6 Sn 5 ) is formed thick. FIG. 7 shows the degree of growth of the Cu—Sn intermetallic compound layer caused by Sn diffusion.
【０００３】[0003]
【発明が解決しようとする課題】一般に金属間化合物層
は硬くて脆いため、このような半田接合部では図８に示
すように接合強度の劣化が生じてしまう。Generally, since the intermetallic compound layer is hard and brittle, such soldered joints are deteriorated in joint strength as shown in FIG.
【０００４】本発明の目的は、半田接合部における接合
強度の劣化を防止することが可能な半田付け物品を提供
することにある。[0004] It is an object of the present invention to provide a soldered article capable of preventing the joint strength from being deteriorated at a solder joint.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記の課題を
解決するために半田付け物品を完成するに至った。本願
第１の発明の半田付け物品は、導体を有する部品をＣｕ
回路基板に半田で接合してなる半田付け物品であって、
前記半田の組成はＣｕとＳｎとの２成分を含有してなる
ことに特徴がある。SUMMARY OF THE INVENTION The present invention has completed a soldered article to solve the above-mentioned problems. The soldering article of the first invention of the present application is a component having a conductor formed of Cu.
A soldered article formed by bonding to a circuit board with solder,
The composition of the solder is characterized in that it contains two components of Cu and Sn.
【０００６】半田組成にＳｎ−Ｃｕ２成分半田を用いれ
ば、融点はＳｎ−Ｐｂ共晶半田に比べて高く、かつ、回
路パターンの配線材料であるＣｕが半田中に含まれるの
で、半田中のＳｎのＣｕ配線への熱拡散が抑えられ、拡
散層（Ｃｕ3Ｓｎ、Ｃｕ6Ｓｎ5）の成長が小さく、ま
た、配線材料のＣｕが半田中に溶解するＣｕ喰われ（溶
解）も防止できるので、接合強度の劣化を抑制すること
ができる。If Sn—Cu two-component solder is used for the solder composition, the melting point is higher than that of Sn—Pb eutectic solder, and Cu, which is the wiring material of the circuit pattern, is contained in the solder. Thermal diffusion into the Cu wiring is suppressed, the growth of the diffusion layer (Cu 3 Sn, Cu 6 Sn 5 ) is small, and Cu erosion (dissolution) in which Cu of the wiring material is dissolved in the solder can be prevented. In addition, it is possible to suppress the deterioration of the bonding strength.
【０００７】本願第２の発明の半田付け物品は、前記半
田の組成はＣｕ０．５〜４．０重量％と残りＳｎとを含
有してなることが好ましい。In the soldering article according to the second aspect of the present invention, it is preferable that the composition of the solder contains 0.5 to 4.0% by weight of Cu and the balance of Sn.
【０００８】半田の組成において、Ｃｕの添加量を０．
５〜４．０重量％としたのは、Ｃｕの添加量が０．５重
量％未満の場合には、添加効果に乏しく配線材料のＣｕ
喰われに対して有効でないので好ましくない。一方、Ｃ
ｕの添加量が４．０重量％を越える場合には、液相線温
度が約３８０℃程度と高いため、半田付け実装用として
は好ましくない。In the composition of the solder, the amount of Cu added is set to 0.1.
The reason for setting the content to 5 to 4.0% by weight is that when the added amount of Cu is less than 0.5% by weight, the effect of addition is poor and Cu
It is not preferable because it is not effective against biting. On the other hand, C
If the added amount of u exceeds 4.0% by weight, the liquidus temperature is as high as about 380 ° C., which is not preferable for solder mounting.
【０００９】本願第３の発明の半田付け物品は、前記回
路基板は両面回路基板であることに特徴がある。A third aspect of the present invention is characterized in that the circuit board is a double-sided circuit board.
【００１０】[0010]
【発明の実施の形態】本発明において半田付け物品と
は、導体を有する部品、回路基板、および電気的、機械
的に接合した半田接合部を含めた全体を意味するもので
ある。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, an article to be soldered means a whole including a component having a conductor, a circuit board, and an electrically and mechanically joined solder joint.
【００１１】本発明においてＣｕ回路基板の配線とは、
Ｃｕ金属のみからなる配線だけでなく、Ｃｕペーストを
焼き付けて形成される厚膜Ｃｕ電極からなる配線なども
意味する。In the present invention, the wiring of the Cu circuit board is
This means not only a wiring made of Cu metal alone but also a wiring made of a thick-film Cu electrode formed by baking a Cu paste.
【００１２】本発明における両面回路基板の例として
は、ガラスエポキシ製のプリント基板やフェノール製の
プリント基板、アルミナやムライトなどのセラミック基
板の両面に配線回路を形成したものなどがある。Examples of the double-sided circuit board in the present invention include a printed circuit board made of glass epoxy, a printed board made of phenol, and a circuit board formed on both sides of a ceramic substrate made of alumina or mullite.
【００１３】次に、本発明に基づき、さらに具体的に説
明するが、本発明はかかる実施例のみに限定されるもの
ではない。Next, the present invention will be described more specifically based on the present invention. However, the present invention is not limited to only such an embodiment.
【００１４】[0014]
【実施例】図１は配線材料を金属Ｃｕとした場合のＣｕ
−Ｓｎ金属間化合物層の成長度合いをＳｎ−Ｐｂ共晶半
田と比較したものである（エージングは１５０℃）。明
らかに拡散速度が遅いことが分かる。図２、図３は配線
材料に焼成Ｃｕを選んだ場合であるが、同じ結果が得ら
れた（図２は９７Ｓｎ−３Ｃｕ、図３は９８Ｓｎ−２Ｃ
ｕの例、エージングは１５０℃）。FIG. 1 shows a case where the wiring material is metal Cu.
It is a comparison of the degree of growth of the Sn-intermetallic compound layer with that of the Sn-Pb eutectic solder (aging is 150 ° C). Obviously, the diffusion rate is slow. 2 and 3 show the case where calcined Cu was selected as the wiring material, and the same result was obtained (FIG. 2 shows 97Sn-3Cu, FIG. 3 shows 98Sn-2C).
u, aging is 150 ° C.).
【００１５】図４は配線材料を金属Ｃｕとした場合の半
田接合強度を電子部品実装後のプッシュ強度で比較した
ものであるが（１５０℃で放置）、Ｓｎ−Ｐｂ共晶半田
に比べてＳｎ−Ｃｕ半田の優位性が示されている。図
５、図６の焼成Ｃｕの場合にも同じ効果が得られている
（図５は９７Ｓｎ−３Ｃｕ、図６は９８Ｓｎ−２Ｃｕの
例、いずれも１５０℃で放置）。FIG. 4 shows a comparison of the solder joint strength when the wiring material is metal Cu with the push strength after mounting the electronic component (leaving at 150 ° C.). -The superiority of Cu solder is shown. The same effect is obtained also in the case of the calcined Cu in FIGS.
【００１６】[0016]
【発明の効果】本発明の半田付け物品を用いれば、半田
接合部における接合強度の劣化を防止することが可能と
なる。よって、信頼性の高い実装構造を形成することが
可能となる。The use of the soldering article of the present invention makes it possible to prevent the joint strength at the solder joint from deteriorating. Therefore, a highly reliable mounting structure can be formed.
【図１】金属Ｃｕにおける９７Ｓｎ／３ＣｕとＳｎ−Ｐ
ｂ共晶半田のエージング時間と拡散層厚みとの関係を示
すグラフ。FIG. 1 97Sn / 3Cu and Sn-P in metal Cu
b Graph showing the relationship between the aging time of eutectic solder and the thickness of the diffusion layer.
【図２】焼成Ｃｕにおける９７Ｓｎ／３ＣｕとＳｎ−Ｐ
ｂ共晶半田のエージング時間と拡散層厚みとの関係を示
すグラフ。FIG. 2 97Sn / 3Cu and Sn-P in calcined Cu
b Graph showing the relationship between the aging time of eutectic solder and the thickness of the diffusion layer.
【図３】焼成Ｃｕにおける９８Ｓｎ／２ＣｕとＳｎ−Ｐ
ｂ共晶半田のエージング時間と拡散層厚みとの関係を示
すグラフ。FIG. 3 98Sn / 2Cu and Sn-P in calcined Cu
b Graph showing the relationship between the aging time of eutectic solder and the thickness of the diffusion layer.
【図４】金属Ｃｕにおける９７Ｓｎ／３ＣｕとＳｎ−Ｐ
ｂ共晶半田の経過時間と接合強度との関係を示すグラ
フ。FIG. 4 shows 97Sn / 3Cu and Sn-P in metal Cu.
b Graph showing the relationship between elapsed time of eutectic solder and bonding strength.
【図５】焼成Ｃｕにおける９７Ｓｎ／３ＣｕとＳｎ−Ｐ
ｂ共晶半田の経過時間と接合強度との関係を示すグラ
フ。FIG. 5: 97Sn / 3Cu and Sn-P in calcined Cu
b Graph showing the relationship between elapsed time of eutectic solder and bonding strength.
【図６】焼成Ｃｕにおける９８Ｓｎ／２ＣｕとＳｎ−Ｐ
ｂ共晶半田の経過時間と接合強度との関係を示すグラ
フ。FIG. 6: 98Sn / 2Cu and Sn—P in calcined Cu
b Graph showing the relationship between elapsed time of eutectic solder and bonding strength.
【図７】金属Ｃｕと焼成ＣｕにおけるＳｎ−Ｐｂ共晶半
田のエージング時間と拡散層厚みとの関係を示すグラフ
（１５０℃エージング）。FIG. 7 is a graph (150 ° C. aging) showing the relationship between the aging time of Sn—Pb eutectic solder and the diffusion layer thickness in metal Cu and fired Cu.
【図８】焼成ＣｕにおけるＳｎ−Ｐｂ共晶半田の経過時
間と接合強度との関係を示すグラフ（１５０℃放置）。FIG. 8 is a graph showing the relationship between the elapsed time of Sn—Pb eutectic solder in baked Cu and the bonding strength (150 ° C. left).
Claims (3)
で接合してなる半田付け物品であって、前記半田の組成
はＣｕとＳｎとの２成分を含有してなることを特徴とす
る半田付け物品。1. A soldering article formed by joining a component having a conductor to a Cu circuit board by soldering, wherein the composition of the solder contains two components of Cu and Sn. Accessories.
量％と残りＳｎとを含有してなることを特徴とする請求
項１に記載の半田付け物品。2. The soldered article according to claim 1, wherein the composition of the solder contains 0.5 to 4.0% by weight of Cu and the balance of Sn.
を特徴とする請求項１または請求項２に記載の半田付け
物品。3. The soldered article according to claim 1, wherein the circuit board is a double-sided circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9766497A JPH10286688A (en) | 1997-04-15 | 1997-04-15 | Soldered article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9766497A JPH10286688A (en) | 1997-04-15 | 1997-04-15 | Soldered article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10286688A true JPH10286688A (en) | 1998-10-27 |
Family
ID=14198326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9766497A Pending JPH10286688A (en) | 1997-04-15 | 1997-04-15 | Soldered article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10286688A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1177367A (en) * | 1997-09-05 | 1999-03-23 | Murata Mfg Co Ltd | Solder composition |
| WO2000075940A1 (en) * | 1999-06-09 | 2000-12-14 | Matsushita Electric Industrial Co., Ltd. | Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| WO2002038328A1 (en) * | 2000-11-10 | 2002-05-16 | Hitachi Chemical Co., Ltd. | Water-soluble flux composition and process for producing soldered part |
| JP2010036250A (en) * | 2008-07-11 | 2010-02-18 | Gunma Univ | Method of joining aluminum member with copper member |
-
1997
- 1997-04-15 JP JP9766497A patent/JPH10286688A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1177367A (en) * | 1997-09-05 | 1999-03-23 | Murata Mfg Co Ltd | Solder composition |
| WO2000075940A1 (en) * | 1999-06-09 | 2000-12-14 | Matsushita Electric Industrial Co., Ltd. | Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
| WO2002038328A1 (en) * | 2000-11-10 | 2002-05-16 | Hitachi Chemical Co., Ltd. | Water-soluble flux composition and process for producing soldered part |
| JP2010036250A (en) * | 2008-07-11 | 2010-02-18 | Gunma Univ | Method of joining aluminum member with copper member |
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