JPH10189653A - Semiconductor element and circuit module having this semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor element, which can be easily subjected to flip chip-mounting to a circuit board and is suitable for high-density mounting, although the element is formed into such a constitution that electrodes are arranged on the center part of the element surface, by a method wherein support projections which come into contact with the circuit board are arranged on both sides, which hold the electrodes on the center part of the element surface between them, of the element surface opposing to the circuit board. SOLUTION: A plurality of electrodes 7, which are directly bonded to a circuit board, are arranged in line on the center part of an element surface 4a opposite to the circuit board of a semiconductor element 3. Moreover, at least one support projection 12 which comes into contact with the circuit board is arranged on the element surface 4a in such a way as to position on each of both sides, which hold the electrodes 7 between them, of the element surface 4a. For example, four auxiliary electrodes 10a to 10d, which have the same form and size as those of electrodes 7, are respectively arranged at the four corner parts 5a to 5d of an element surface 4a. With a ball-shaped solder bump 11 formed on each electrode 7, ball-shaped solder bumps 12, which have the same form and size as those of the bumps 11 and are used as support projects, are respectively formed on the electrodes 10a to 10d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bare semiconductor element called a bare chip and a circuit module having the semiconductor element mounted on a circuit board.

[0002]

2. Description of the Related Art An electronic device such as a portable computer has a large number of semiconductor elements in order to form a large capacity memory. Conventional semiconductor devices for memory
A large number of electrodes are arranged on the periphery of the element surface facing the circuit board.
An I circuit is arranged. And this semiconductor element,
It is flip-chip connected to the circuit board.

In this type of semiconductor device, since the LSI circuit is arranged in a region surrounded by the electrodes, when the semiconductor device is miniaturized, the region of the LSI circuit tends to be narrowed. For this reason, recently, the above-mentioned electrodes are arranged in a line at the center of the element surface so as to increase the area in which the LSI circuit is arranged.
2. Description of the Related Art A semiconductor element having a (lead on chip) structure is known.

[0004] In a semiconductor device having a LOC structure, since there is no electrode in the peripheral portion of the device surface, if the semiconductor device is flip-chip connected to a circuit board, the peripheral portion of the device surface of the semiconductor device cannot be supported. As a result, the mounting posture of the semiconductor element becomes unstable. Therefore, a semiconductor element adopting the LOC structure is packaged as one module by wire bonding the above-mentioned electrodes to a lead frame and then molding the whole with a sealing resin.

[0005] In a typical SOJ (Small Outline J-leaded Package) as a memory package,
A plurality of leads project from both side edges of the package, and these leads are soldered to pads on a circuit board.

[0006]

However, the package of the LOC structure has a larger package shape than the semiconductor element because the semiconductor element is molded with a sealing resin. In addition, since a plurality of leads protrude from both side edges of the package, the package size becomes very large as compared with the size of the semiconductor element.

Therefore, there is a problem in that the area occupied by the package on the circuit board increases, and it becomes impossible to increase the mounting density on the circuit board. The present invention has been made in view of such circumstances, and has a configuration in which electrodes are arranged in a line in the center of the element surface, but can be easily flip-chip mounted on a circuit board, and a high density An object of the present invention is to provide a semiconductor element suitable for mounting and a circuit module having the semiconductor element.

[0008]

In order to achieve the above object, a semiconductor device according to the present invention has an element surface facing a circuit board, and is directly joined to the circuit board at a central portion of the element surface. A plurality of electrodes are arranged in a line, and at least one support projection is provided on the element surface on both sides of the electrode and in contact with the circuit board.

According to this structure, the support projections located on both sides sandwiching the electrode form a kind of pillar for supporting the semiconductor element, so that when the semiconductor element is mounted on a circuit board, the posture of the semiconductor element is stable. I do. Therefore, the semiconductor element can be easily flip-chip connected to the circuit board, and high-density mounting can be realized.

[0010] According to a second aspect, the element surface according to the first aspect has four corners, and a support projection is arranged at each of the corners. According to this configuration, since the semiconductor element is supported by the circuit board at the four corners of the element surface, the posture when the semiconductor element is mounted on the circuit board becomes more stable.

According to a third aspect, the support projections according to the first aspect are arranged so as to be located at the vertices of a triangle when the element surface is viewed in a plane. I have. According to this configuration, since the semiconductor element is supported on the circuit board at three points around the electrodes, the posture when the semiconductor element is mounted on the circuit board is stabilized.

According to the fourth aspect, the support projection according to the first aspect also has a function as an electrode. According to this configuration, since the number of electrodes arranged on the element surface increases, the arrangement interval of the electrodes arranged in the central portion of the element surface can be increased, and positioning and mounting on the circuit board can be easily performed. it can.

According to another aspect of the present invention, there is provided a semiconductor device having an element surface facing a circuit board, and a plurality of electrodes directly connected to the circuit board in a central portion of the element surface. At least one auxiliary electrode is arranged on the element surface on both sides of the electrode, and bumps to be bonded to the circuit board are formed on the auxiliary electrodes. Features.

According to this structure, by arranging the auxiliary electrode on the element surface, a bump serving as a pillar for supporting the semiconductor element can be formed on the auxiliary electrode. For this reason, when the semiconductor element is mounted on a circuit board, the attitude of the semiconductor element is stabilized, and the semiconductor element has a so-called LOC structure in which electrodes are arranged in a line in the center of the element surface. Can be easily flip-chip connected to a circuit board.

In order to achieve the above object, a circuit module according to claim 6 has a circuit board; an element surface mounted on the circuit board and facing the circuit board, and a central part of the element surface. A semiconductor element in which a plurality of electrodes directly joined to the circuit board are arranged in a line.

Further, at least one support projection in contact with the circuit board is disposed on both sides of the electrode on the element surface of the semiconductor element. According to this configuration, the support projections located on both sides sandwiching the electrodes serve as a kind of pillar for supporting the semiconductor element, so that when the semiconductor element is mounted on the circuit board, the posture of the semiconductor element is stabilized. Therefore, the semiconductor element can be easily flip-chip connected to the circuit board, and high-density mounting can be realized.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 2 shows a circuit module 1 mounted on an electronic device such as a portable computer. This circuit module 1
Includes a circuit board 2 and a semiconductor element 3 for memory mounted on the circuit board 2.

The semiconductor device 3 has a silicon base 4. The silicon base 4 has a flat element surface 4a facing the circuit board 2, and the element surface 4a has a rectangular shape including four corners 5a to 5d.

As shown in FIG. 1, a large number of electrodes 7 are arranged in a row at the center of the element surface 4a at intervals. The element surface 4a of the silicon base 4
Is divided into a first circuit area 8a and a second circuit area 8b by the electrodes 7, and these circuit areas 8a and 8b are provided with aluminum wiring constituting an LSI circuit (not shown). . This wiring is electrically connected to the electrode 7. Therefore, the semiconductor element 3 has a LOC structure.

The display surface 4a has four auxiliary electrodes 10a to 10a.
10d are arranged. The auxiliary electrodes 10a to 10d
It has the same shape and size as the electrode 7 and is electrically connected to the wiring. These auxiliary electrodes 10a-1
0d is arranged at the four corners 5a to 5d of the display surface 4a, and the protrusion to the first and second circuit areas 8a and 8b is suppressed as small as possible.

Therefore, the first to fourth auxiliary electrodes 10
The auxiliary electrodes 10a to 10d are distributed two by two on both sides of the electrode 7, and these auxiliary electrodes 10a to 10d have a positional relationship of square vertices as shown by a two-dot chain line in FIG. Are located.

Each electrode 7 has a ball-shaped solder bump 11
Are formed. In addition, ball-shaped solder bumps 12 as support projections are formed on the auxiliary electrodes 10a to 10d. These solder bumps 11 and 12 have the same shape and size as each other.

As shown in FIG. 2, the circuit board 2 has a large number of pads 14 on the mounting portion of the semiconductor element 3. The pads 14 correspond to the solder bumps 11 and 12, and the pads 14
2 is soldered. Therefore, the semiconductor element 3
It is flip-chip connected to the circuit board 2, and the solder balls 12 at the four corners 5 a to 5 d of the element surface 4 a form a kind of pillar that supports the semiconductor element 3.

In the present embodiment, an adhesive 15 is filled between the element surface 4a of the semiconductor element 3 and the circuit board 2, and the adhesive 15
The connecting portions between the pads 1 and 12 and the pads 14 are reinforced.

According to such a configuration, the auxiliary electrodes 10a to 10d are provided at the four corners 5a to 5d of the element surface 4a of the semiconductor element 3.
10d, and the solder bumps 12 were formed on the auxiliary electrodes 10a to 10d.
In this state, the solder ball 12 functions as a pillar for supporting the peripheral portion of the semiconductor element 3. Therefore, the semiconductor element 3 is supported by the circuit board 2 not only at the electrode 7 at the center of the element surface 4a but also at four points around the element surface 4a.

Accordingly, the semiconductor element 3 is mounted on the circuit board 2 in a stable manner, and the semiconductor element 3 is mounted on the circuit board 2 in spite of adopting the LOC structure in which the electrodes 7 are arranged in a line at the center of the element surface 4a. 2 can be easily flip-chip connected.

As a result, the area occupying the circuit board 2 is smaller than that of the conventional package, and higher-density mounting is possible. Further, the solder bumps 12 supporting the semiconductor element 3 are provided at first to fourth corners 5a to 5c of the element surface 4a.
5d, the first wiring for the LSI circuit is provided.
In addition, overhang to the second circuit areas 8a and 8b can be suppressed as small as possible. Therefore, the first and second
That the circuit areas 8a and 8b can be sufficiently secured.
The advantage of the original LOC structure is not lost.

Further, the first to fourth auxiliary electrodes 10a
Since the electrodes 10 to 10d are connected to the wiring of the silicon base 4 similarly to the electrodes 7, the electrode portions can be dispersedly arranged at the first to fourth corners 5a to 5d of the element surface 4a. Therefore, the number of electrodes 7 arranged at the central portion of the element surface 4a can be reduced and the arrangement interval can be widened, so that workability in flip-chip connecting the semiconductor element 3 to the circuit board 2 can be improved.

The present invention is not limited to the first embodiment, and FIG. 3 shows a second embodiment of the present invention. In the second embodiment, the second and fourth auxiliary electrodes 10b and 10d are arranged on both sides of the element surface 4a sandwiching the electrode 7, and at the center in the longitudinal direction. Therefore, the first to fourth auxiliary electrodes 10a to 10a to
10d are arranged in such a manner that they are located at the vertices of a parallelogram, as indicated by the two-dot chain line in FIG.

Also in such a configuration, the semiconductor element 3 can be supported at four places around the element surface 4a, and the posture of the semiconductor element 3 is stabilized. FIG. 4 discloses a third embodiment of the present invention.

In the third embodiment, first to third three auxiliary electrodes 10a to 10c are arranged on the element surface 4a. The first auxiliary electrode 10a is arranged on one side of the element surface 4a at the center in the longitudinal direction. The second and third auxiliary electrodes 10b and 10c
And the second and third corners 5b, 5c located on the opposite side of the electrode 7 with respect to the auxiliary electrode 10a. The first to third auxiliary electrodes 10a are arranged in such a manner as to be located at the vertices of a triangle, as indicated by the two-dot chain line in FIG.

According to such a configuration, the periphery of the element surface 4a of the semiconductor element 3 can be supported at the positions of the vertices of the triangle, and the attitude of the semiconductor element 3 is stabilized. FIG. 5 discloses a fourth embodiment of the present invention.

In the fourth embodiment, the first auxiliary electrode 10a is arranged at the first corner 5a of the element surface 4a, and the other structure is the same as that of the third embodiment. is there. Also in this configuration, the periphery of the element surface 4a of the semiconductor element 3 can be supported by the positional relationship of the vertices of the triangle, and the attitude of the semiconductor element 3 is stabilized.

FIG. 6 discloses a fifth embodiment of the present invention. In the fifth embodiment, the element surface 4
The first and second auxiliary electrodes 10a and 10b are arranged on a. The first auxiliary electrode 10a is arranged at a first corner 5a of the element surface 4a, and the second auxiliary electrode 10a
b is arranged at the second corner 5b of the element surface 4a.
These first and second auxiliary electrodes 10a and 10b face each other with the electrode 7 interposed therebetween at one end along the longitudinal direction of the element surface 4a. Therefore, as shown by a two-dot chain line in FIG. 6, the first and second auxiliary electrodes 10a, 1
0b and the electrode 7 located at the end opposite to the auxiliary electrodes 10a and 10b are arranged so as to be located at the vertex of the triangle.

According to such a configuration, the semiconductor element 3 can be supported at three places around the element surface 4a. Therefore, the first and second two auxiliary electrodes 10a, 10a
b can stably support the semiconductor element 3 and can be used as the first and second extended areas 8a, 8b up to the corners of the third and fourth corners 5c, 5d of the element surface 4a. it can.

FIG. 7 discloses a sixth embodiment of the present invention. In the sixth embodiment, the first and second auxiliary electrodes 10a and 10b are arranged at the center in the longitudinal direction on both sides of the element surface 4a facing each other with the electrode 7 interposed therebetween.

According to this configuration, the first and second auxiliary electrodes 10a and 10b and the electrodes 7 at both ends are in a relationship such that they are located at the vertexes of a square as shown by a two-dot chain line in FIG. The semiconductor element 3 can be supported at four locations around the surface 4a. Therefore, similarly to the fifth embodiment, the first and second two auxiliary electrodes 10a and 10a are provided.
The semiconductor element 3 can be stably supported only by adding b.

At the same time, all the first to fourth corners 5a to 5d of the element surface 4a can be used as the first and second extended areas 8a and 8b, and the original advantage of the LOC structure can be obtained. It can be fully utilized.

In each of the above-described embodiments, the solder bump is formed on the auxiliary electrode having the electrical conduction function. However, the auxiliary electrode is a so-called dummy electrode having no electrical conduction function. May be formed with solder bumps.

The shape of the solder bump is not limited to the ball shape, but may be, for example, a mushroom shape or a pin shape. Further, in the above embodiment, a solder bump was formed on the auxiliary electrode, and this solder bump was used as a support protrusion.
The present invention is not limited to this. By plating the auxiliary electrode with gold, copper, nickel or solder instead of the solder bump, a plating layer is laminated on the auxiliary electrode, and the plated layer is used as a support protrusion. You may do it. Similarly,
The electrodes of the semiconductor element are not limited to those bonded to the pads on the circuit board via the solder bumps.A plating layer is formed instead of the solder bumps, and the plating layer is applied to the pads on the circuit board. You may make it solder.

Also, instead of the solder bumps, gold bumps are formed on the electrodes and auxiliary electrodes using a wire bonder,
This gold bump may be soldered to a pad on a circuit board.

[0042]

According to the present invention described in detail above, the support projections on both sides sandwiching the electrode function as a kind of pillar for supporting the semiconductor element.
A semiconductor element having a C structure can be easily flip-chip connected to a circuit board. Therefore, an area occupying the circuit board is smaller than that of the conventional package, and higher-density mounting is possible.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a circuit module showing a state where a semiconductor element is mounted on a circuit board.

FIG. 3 is a perspective view of a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a perspective view of a semiconductor device according to a third embodiment of the present invention.

FIG. 5 is a perspective view of a semiconductor device according to a fourth embodiment of the present invention.

FIG. 6 is a perspective view of a semiconductor device according to a fifth embodiment of the present invention.

FIG. 7 is a perspective view of a semiconductor device according to a sixth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Circuit module 2 ... Circuit board 3 ... Semiconductor element 4a ... Element surface 7 ... Electrode 12 ... Support protrusion (solder bump)

Claims (6)

[Claims] 1. A semiconductor device having an element surface facing a circuit board, and a plurality of electrodes directly connected to the circuit board arranged in a line at a central portion of the element surface. A semiconductor device, wherein at least one support protrusion in contact with the circuit board is disposed on both sides of the electrode. 2. The semiconductor device according to claim 1, wherein the element surface has four corners, and a support projection is arranged on each of the corners. 3. The device according to claim 1, wherein the support protrusions are arranged so as to be located at the vertices of a triangle when the element surface is viewed in a plan view. Semiconductor device. 4. The semiconductor device according to claim 1, wherein the support projection also functions as an electrode. 5. A semiconductor device having an element surface facing a circuit board, and a plurality of electrodes directly connected to the circuit board arranged in a line in a central portion of the element surface, wherein the element surface has A semiconductor device comprising at least one auxiliary electrode disposed on both sides of said electrode, and bumps formed on said auxiliary electrodes to be joined to said circuit board. 6. A circuit board; mounted on the circuit board;
A semiconductor element having an element surface facing the circuit board, and a semiconductor element in which a plurality of electrodes directly connected to the circuit board are arranged in a line at a central portion of the element surface; A circuit module, wherein at least one support projection in contact with the circuit board is disposed on both sides of the electrode on the element surface of the semiconductor element.