JPH0379453U - - Google Patents
Info
- Publication number
- JPH0379453U JPH0379453U JP1989140676U JP14067689U JPH0379453U JP H0379453 U JPH0379453 U JP H0379453U JP 1989140676 U JP1989140676 U JP 1989140676U JP 14067689 U JP14067689 U JP 14067689U JP H0379453 U JPH0379453 U JP H0379453U
- Authority
- JP
- Japan
- Prior art keywords
- chip capacitor
- chip
- electrode plate
- ground electrode
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Semiconductor Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の正面図、第２図は
その断面図である。
１……パツケージ材、２……端子、３……ボン
デイングワイヤ、４……シリコンチツプ、５……
チツプコンデンサ、６……アース電極接続線、７
……アース電極板。
FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a sectional view thereof. 1...Package material, 2...Terminal, 3...Bonding wire, 4...Silicon chip, 5...
Chip capacitor, 6... Earth electrode connection wire, 7
...Earth electrode plate.
Claims (1)
極板上にシリコンチツプを搭載し、その周囲にア
ース電極板に接続したチツプコンデンサを配置し
、シリコンチツプとチツプコンデンサ、チツプコ
ンデンサと端子をそれぞれ接続する構造をもつこ
とを特徴とする半導体装置。 In a microcomputer IC, a silicon chip is mounted on a ground electrode plate, a chip capacitor connected to the ground electrode plate is placed around it, and the silicon chip and the chip capacitor are connected to each other, and the chip capacitor and the terminal are connected to each other. Characteristic semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989140676U JPH0379453U (en) | 1989-12-06 | 1989-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989140676U JPH0379453U (en) | 1989-12-06 | 1989-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379453U true JPH0379453U (en) | 1991-08-13 |
Family
ID=31687628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989140676U Pending JPH0379453U (en) | 1989-12-06 | 1989-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379453U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037239A (en) * | 2001-07-24 | 2003-02-07 | Sanyo Electric Co Ltd | Semiconductor device and manufacturing method therefor |
-
1989
- 1989-12-06 JP JP1989140676U patent/JPH0379453U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037239A (en) * | 2001-07-24 | 2003-02-07 | Sanyo Electric Co Ltd | Semiconductor device and manufacturing method therefor |
| JP4618941B2 (en) * | 2001-07-24 | 2011-01-26 | 三洋電機株式会社 | Semiconductor device |