JPH0242445U - - Google Patents
Info
- Publication number
- JPH0242445U JPH0242445U JP1988121336U JP12133688U JPH0242445U JP H0242445 U JPH0242445 U JP H0242445U JP 1988121336 U JP1988121336 U JP 1988121336U JP 12133688 U JP12133688 U JP 12133688U JP H0242445 U JPH0242445 U JP H0242445U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- lead frame
- circuit chip
- conductive plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体集積回路装置の第１実
施例の縦断面図、第２図は第１図の内部構造の平
面図、第３図は本考案の第２実施例の模式的な平
面図、第４図は第３図の一部の縦断面図である。
１……半導体集積回路チツプ、２，２Ａ……リ
ードフレーム、２′……搭載部、２ａ……電源リ
ード、２ｂ……地気リード、３……ワイヤ、４…
…誘電体、５，６……導電板、５ａ，６ａ……リ
ード端子、７……樹脂、Ｃ……コンデンサ。
FIG. 1 is a vertical cross-sectional view of a first embodiment of the semiconductor integrated circuit device of the present invention, FIG. 2 is a plan view of the internal structure of FIG. 1, and FIG. 3 is a schematic diagram of the second embodiment of the present invention. The plan view, FIG. 4, is a longitudinal sectional view of a portion of FIG. 3. DESCRIPTION OF SYMBOLS 1...Semiconductor integrated circuit chip, 2, 2A...Lead frame, 2'...Mounting part, 2a...Power lead, 2b...Earth lead, 3...Wire, 4...
...Dielectric material, 5, 6... Conductive plate, 5a, 6a... Lead terminal, 7... Resin, C... Capacitor.
Claims (1)
してパツケージ封止してなる半導体集積回路装置
において、誘電体を挾持した一対の導電板からな
るコンデンサを前記リードフレームに近接配置し
、これら各導電板に接続されるリード端子を前記
リードフレームの所要のリードに接続し、かつこ
のコンデンサを前記半導体集積回路チツプと一体
的にパツケージ封止したことを特徴とする半導体
集積回路装置。 In a semiconductor integrated circuit device in which a semiconductor integrated circuit chip is mounted on a lead frame and sealed in a package, a capacitor consisting of a pair of conductive plates sandwiching a dielectric material is placed close to the lead frame and connected to each of these conductive plates. A semiconductor integrated circuit device, characterized in that the lead terminals of the semiconductor integrated circuit chip are connected to required leads of the lead frame, and the capacitor is packaged integrally with the semiconductor integrated circuit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121336U JPH0242445U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121336U JPH0242445U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242445U true JPH0242445U (en) | 1990-03-23 |
Family
ID=31368251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121336U Pending JPH0242445U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242445U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141137A (en) * | 2007-12-06 | 2009-06-25 | Denso Corp | Electronic apparatus and wheel speed sensor |
| JP2019192847A (en) * | 2018-04-27 | 2019-10-31 | ルネサスエレクトロニクス株式会社 | Electronic device |
-
1988
- 1988-09-16 JP JP1988121336U patent/JPH0242445U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009141137A (en) * | 2007-12-06 | 2009-06-25 | Denso Corp | Electronic apparatus and wheel speed sensor |
| JP4553003B2 (en) * | 2007-12-06 | 2010-09-29 | 株式会社デンソー | Electronic device and wheel speed sensor |
| JP2019192847A (en) * | 2018-04-27 | 2019-10-31 | ルネサスエレクトロニクス株式会社 | Electronic device |