JPH03295226A - Wafer boat carrying jig - Google Patents

Abstract

PURPOSE:To lower the temperature in a chuck part for restraining the thermal expansion and reducing the position slip or deflection thereby avoiding the contact.collision accident by a method wherein radiating fins are provided between the chuck part and A boat holding part. CONSTITUTION:A wafer boat jig 10 is composed of a wafer boat carrying jig main body and radiating fins 11. The main body is composed of Si impregnated SiC while the front end is formed into a holding part 12 holding a boat. The holding part 12 in plane-table type is to be inserted into the rear part of the wafer boat. The rear end is formed into a chuck part 13 to be held by the arm part of a shifting device. multiple radiating fins 11 are fixed on the intermediate part 14 between the holding part 12 and the chuck part 13. The chuck part 13 and the intermediate part 14 are hollow and cylindrical. The radiating fins ll made of Si impregnated SiC are bonded onto the wafer boat carrying jig main body using a bond material comprising organic base binder added Si powder.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a jig for transporting wafer boats used in high-temperature conditions, and particularly used when installing wafer boats in a diffusion furnace and when taking out boats from a diffusion furnace after diffusion processing. Related to wafer boat transport jig. Note that when the boat is transferred into the reactor core tube and processing is performed while the boat is retained, the wafer boat transfer jig is also called a cantilever, but in this specification, the wafer boat transfer jig includes the cantilever. shall be held.

In conventional ICs with a high degree of technological integration, there is a high possibility that dust generated during high temperature processing will have a negative effect on product quality.

For this reason, methods that generate less dust have been adopted for moving boats loaded with wafers into and out of reactor core tubes. In other words, from an autoloader method, a method in which a boat carrying wafers is installed on a wheeled mother boat and the mother boat is moved, etc., to a method in which the boat is moved without contacting the reactor core tube using a wafer boat transfer jig, and the wafer boat is moved. Ueno 1 with short contact time between transport jig and boat
-There has been a shift to port transfer jig systems and cantilever systems that perform processing while loading and holding boats loaded with wafers.

The wafer port transport jig (including cantilevers) used in these systems has a portion of 60% to 75% of its total length inserted into the reactor core tube when the wafer port is moved in and out. At this time, the chuck portion at the rear end of the wafer port transfer jig is chucked by the arm of the transfer device, but the temperature of the chuck portion also rises to 200 to 300° C. due to heat conduction.

Problems to be Solved by the Invention In the soft landing method, the port is supported by a wafer port transport jig and installed in the reactor core tube, and after the port is installed, the level of the wafer port transport jig is lowered and the wafer port is Remove the transport jig. Furthermore, when taking out the port, the wafer boat transporting jig is inserted into the furnace core tube at a low level, and the level of the wafer port transporting jig is raised to lift and take out the port. The vertical movement distance of the wafer boat transport jig is about 10 mm. During port installation and removal work, the wafer boat transport jig is not exposed to high temperatures for a long time.

However, if thermal expansion occurs in the chuck portion at the rear of the wafer port transfer jig, there is a risk that the tip of the wafer boat transfer jig will move significantly, resulting in a collision or the like.

On the other hand, in the cantilever one-way method, there is no need to move the cantilever up and down, but the holding time in the furnace is considerably longer than in the wafer port transport jig method. Therefore, the thermal expansion was large, and there was a possibility of an accident similar to the oil-free system for wafer port transportation.

In addition, when the arm of the transfer device thermally expands due to the chuck part of the wafer boat transfer jig and heat transfer from there,
There was also a problem that the holding by the arm became uncertain. Furthermore, the transfer device following the arm also becomes hot due to heat conduction, so there is a risk that the transfer device will also be adversely affected.

OBJECT OF THE INVENTION In view of the problems of the prior art, an object of the present invention is to provide a wafer port transfer jig that can reduce thermal expansion of the chuck portion.

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the gist of the present invention is a wafer port transfer jig according to claim 1.

Means for Solving the Problems The wafer boat transport jig of the present invention is characterized in that a heat radiation fin is provided between the chuck part and the port support part.

A port support portion for supporting the port is provided in front of the wafer port transport jig.

The chuck section is provided at the rear of the wafer port transfer jig, and is held by the arm section of the transfer device.

The main body of the wafer port transport jig is made of SiC or Si-impregnated S.
It is desirable to configure the iC.

The radiation fins are made of 5iCSSi impregnated SiC, aluminum brass, iron, steel, stainless steel, etc.

The radiation fins may be constructed integrally with the wafer port transporting jig main body, or may be constructed as a separate body and fixed to the wafer boat transporting jig main body by adhesion or fitting. The heat dissipation characteristics will be better if the structure is integrated. It is desirable to use an adhesive obtained by adding an organic binder with a high carbonization rate to SiC powder. When the organic binder hardens, it has a fixing effect and has the effect of adhering SiC to SiC.

There is no problem whether pores are formed in the carbonized binder because the pores are filled by S1 impregnation after adhesion.

The value of (outer diameter of fin)/(outer diameter of fin installation part) is 1
．． It is desirable that the ratio is 5/1 to 3/1. If the value of this ratio is less than 1.5, the cooling effect is small and the desired effect cannot be obtained.

The pitch of the fins is preferably 10 mm or more.

If the thickness is less than 10 mm, the fins will interfere with each other, which cancels out the cooling effect, which is not desirable.

Function: The heat dissipation fins dissipate heat, which lowers the temperature of the chuck, suppresses thermal expansion, and prevents misalignment and deflection.

Example Hereinafter, the present invention will be described in detail with reference to the drawings.

The wafer boat transport jig 10 shown in FIGS. 1 and 2 is composed of a wafer boat transport jig main body and heat radiation fins 11. The wafer boat transport jig 10 shown in FIGS.

The main body of the wafer port transport jig is made of Si-impregnated SiC. The tip of the wafer port transfer jig is a support portion 12 that supports the boat. The support portion 12 has a flat plate shape and is configured to be inserted into the lower part of the wafer boat. The rear part of the wafer port transfer jig is a chuck part 13, and the arm part of the transfer device (not shown)
holds this place.

A plurality of heat radiation fins 11 are fixed to an intermediate portion 14 between the support portion 12 and the chuck portion 13. The chuck portion 13 and the intermediate portion 14 have a hollow cylindrical shape. The radiation fin 11 is S1
It is made of impregnated SiC and is bonded to the main body of the wafer boat transport jig using an adhesive containing Si powder and an organic binder (for example, phenol resin). Incidentally, the impregnation of Si into the wafer boat transport jig body and the radiation fins is performed after the radiation fins 11 are bonded.

For example, in the case of a wafer port transfer jig with a total length of 3000 mm, the length of the chuck part is 300 to 400 mm.
It is desirable that the fin installation length be 300 to 400 +++ m. Then, about 75% of the total length is inserted into the furnace.

The outer diameter of the fin was set to be about three times the outer diameter of the fin attachment section, that is, the intermediate section 14. Further, the pitch was approximately 60 mm.

Since the temperature near the chuck portion 13 is not high, for example, the heat dissipation fin at the right end may be made of metal such as aluminum or brass. In this case, it is convenient to configure the fins in a buckle type.

We conducted an experiment to investigate the cooling effect of heat dissipation fins and reported the results in the third section.
Shown in the figure. The vertical axis represents the temperature, and the horizontal axis represents the distance from the end surface on the chuck portion side. In addition, as a conventional example, a wafer port transfer jig of the same material and the same size without heat dissipation fins was used. Looking at these results, the cooling effect of the radiation fins is obvious.

Note that the present invention is not limited to the above-described embodiments. As the overall shape of the wafer port transport jig and the shape of each part of the wafer boat transport jig, various conventionally used shapes can be adopted. Furthermore, various materials can be used for the wafer port transfer jig.

Effects of the Invention According to the wafer port transfer jig (including the cantilever) according to the present invention, the heat dissipation effect of the heat dissipation fins can lower the temperature of the chuck part and suppress thermal expansion, and furthermore, the heat transfer to the am of the transfer device can be suppressed. can be kept low. Therefore,
It is possible to reduce misalignment and deflection of the wafer port transport jig, making it possible to prevent contact and collision accidents.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of the wafer boat transfer jig of the present invention, FIG. 2 is a top view thereof, and FIG. 3 is a graph showing the temperature distribution of the wafer boat transfer jig. 10... Wafer boat transport jig 11
...... Heat dissipation fin 12 ... Support part 13 ... Chuck part FIG, / F / 6.2

Claims (1)

[Claims] A wafer boat transport jig characterized by having heat radiation fins provided between a chuck part and a boat support part.