JPH03210481A - Movable probe type multipoint contact apparatus for inspecting printed circuit board - Google Patents

Abstract

PURPOSE:To accurately position a contact probe at an inspection place by mounting a plurality of the contact probes forming pairs along with a plurality of Z-axis drive parts and being in contact with the check land coordinates positions of a board to be inspected. CONSTITUTION:One of the nearest coordinates positions where there is possibility such that the contact probes P1 - P4 on a board 13 to be inspected interfere each other is found out. Next, on the basis of the X-coordinates of the found-out nearest land coordinates position, the contact probes having no possibility interfering with the contact probes operated later and not positioned are allotted and positioned by the contact probes successively movable in both directions from the contact land coordinates position most separated in (+) and (-) directions. After all of the contact probes P1 - P4 are positioned, they are brought into contact with the respective land coordinates positions by Z-axis drive parts 9 - 12.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probe contact device used in a printed circuit board measurement and inspection device used for inspection, repair, and adjustment of printed circuit boards, and a control method thereof.

[Conventional technology]

When inspecting each electronic component mounted on a printed circuit board and its operation, a printed circuit board measurement and inspection device that checks electrical performance by contacting a contact probe at each inspection position has conventionally used a movable device as shown in Fig. 15. A probe-type printed circuit board measurement and inspection device has been proposed, and this device has three XY drive shafts 62 that can be moved independently onto a test board 69 that is positioned at a predetermined position by a guide 68 and mounted. The contact probes (63A to 63C) attached in pairs can be positioned and brought into contact with three inspection points by a position control section 65 that controls the contact probes in the XY force direction and the vertical direction.

In this movable probe type printed circuit board measurement/inspection device, inspection position control data is read out from a table stored in a control section 66, and the position control section 65 controls the XY drive axes based on this data to control the contact probe (63A).
~63C) are brought into positioning contact. Then, a predetermined voltage is applied by the electrical performance testing section 64 to perform measurement, and when the measurement is completed, the contact probe is raised to read the next data. The above inspection is repeated as many times as a preset number of measurements for one printed circuit board. Note that by changing the data in this table, the number and number of contact probe positioning operations can be set.

[Problem to be solved by the invention]

In the above movable probe type printed circuit board measurement and inspection equipment,
As the positioning method on the test board, the contact probe is positioned only based on the position coordinate data of each inspection point on the test board stored in the control unit, without checking for interference. If there are errors or other deficiencies in this stored position coordinate data, the contact probe and its XY drive axes may interfere with each other during the positioning operation of the contact probe, and it may not be possible to accurately position each inspection point. be.

Furthermore, if the movable probe is positioned at high speed when the inspection coordinates are close to each other, there is a risk that the movable probe will overrun the predetermined position due to excessive force, so-called overrun, and the probe may interfere.

The present invention is a printed circuit board that allows the contact probe to easily accurately position and contact at least four inspection points on the test board over the entire area of the test board without interference between the contact probe and the XY drive axes. The object of the present invention is to provide a probe contact device for testing circuit boards.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides a board inspection apparatus for electrically testing a printed circuit board, in which boards of different heights are provided facing each other so as to sandwich the board to be tested from both sides and are movable independently. A total of four or more X-axis drive units in at least two stages, located on the test board in a direction perpendicular to the X-axis drive units, forming a pair with the X-axis drive unit, and each of which is movable independently. At least four or more Y-axis drive sections each having a limit sensor, and Y-axis drive sections of equal height located on both sides of the opposing X-axis drive section from the substrate to be tested are mounted on opposite sides. At least four or more Z-axis drive units that are movable independently, and at least four or more contacts that form a pair with the Z-axis drive units and that contact the check lands of the test board and the land coordinate positions corresponding thereto. The present invention is characterized in that it includes a probe, a holding bin for positioning and fixing the test board, and a mounting base to obtain a check signal necessary for electrical testing.

[For production]

In the present invention, first, an operation is performed to position and collect all the contact probes at one location, which is the closest position, and during this operation, detection is performed using a limit sensor or the like to verify the possibility of interference. Once it is confirmed that there is no possibility of interference, the contact probe corresponding to each inspection coordinate position is positioned.

As a procedure for positioning the contact probe at the check land coordinate position, first, one of the land coordinate positions to be contacted on the test board, which is the closest land coordinate position where the contact probe may interfere, is found. Next, among the contact probes to be brought into contact with each land coordinate position, one contact probe that is most suitable to be assigned to the found closest land coordinate position is set to that land coordinate so that there is no possibility of interference with the contact probe that will perform positioning operation later. Position it using the XY axis drive unit. Thereafter, all of the contact probes on the land are brought closest to each other by the remaining XY-axis drive units until the limit sensor operates at the found closest land coordinate position. Next, based on the X coordinate of the found closest land coordinate position, the unpositioned contacts that will be operated later by the contact probe movable in the child direction are sequentially moved from the farthest land coordinate position in the child direction to be contacted. Allocate and position a contact probe without fear of interfering with the probe. Similar positioning is performed in one direction as well. After all the contact probes are positioned, the Z-axis drive section brings the contact probe into contact with each land coordinate position.

〔Example〕

(First example) A first embodiment of the present invention will be described below with reference to the drawings.

(Configuration) Fig. 1(b) shows a top view of the printed circuit board inspection device of this embodiment, and Fig. 1(a) shows the same as Fig. 1(a).
A cross-sectional view taken along the dashed-dotted line is shown in the direction of the arrow.

The movable probe type multi-point contact device for testing printed circuit boards of the present invention includes four X-axis drive units 5. 6. 7. 8, Y-axis drive unit 1, 23.4 having a limit sensor, and test board 1
Contact probes PL, P that can each independently contact the check lands of No. 3 and the corresponding land coordinate positions;
2. P3. Z-axis drive with P4 9.10.11
12. To fix the test board 13 to the fixing base 15, place the test board on the stepped holding pins 14 which are fixed to the mounting base 16 and position and fix the test board.
6 by fixing it on a fixing table 15. The X-axis drive units 5 to 8 are arranged adjacently with two axes facing each other so as to sandwich the test substrate 13 from both sides. The X drive shaft 6.8 is set higher on the far side.The Y-axis drive unit L2.3.4 is arranged in pairs with the X-axis drive unit 5.6.78, respectively. , are positioned above the test substrate 13 in a direction perpendicular to the X-axis drive unit.

For the limit sensor, the tall X-axis drive unit 6,8
A limit sensor S1 is provided on the opposing surfaces of the two Y-axis drive units 2.4 paired with the two Y-axis drive units 5-6, 7-8 paired with the adjacent X-axis drive units 5-6. Drive part 1-
2. Limit sensors S2b and S2a are provided on the faces of the comrades facing each other.

Z-axis drive section 9.10.11.12 is Y-axis drive section 1, 23
．． Y-axis drive unit 2-3, which is paired with 4 and has the same height.
．． Position 1-3 on the opposite side.

Contact probe PL, P2. P3. P4 is Z
The Z-axis drive units 9, 10, 12, and 11 are paired with each other, and the Z-axis drive units 9-11, 10-12, which have the same height, are located on opposite sides. The distance between this device and the closest contact probe in the XY force direction, that is, the minimum pitch between the contact probes, is 0.5 mm.

This depends on the current limit of land adjacency pinch, which is 0.5 mm.

(for production) 1st. 2. 3. This will be explained using Figures 4 and 5.

In FIG. 1(a), when the Y-axis drive parts 3.4 approach each other and are lined up on the same vertical line, that is, when the limit sensors S2a come closest to each other, the contact probes P3 and P4 have the minimum pitch on the X-axis. If the distance is 0.5 mm, the limit sensor S2a will be activated and the Y-axis drive unit 3 will move to the right of the Y-axis drive unit 4. Conversely, the Y-axis drive unit 4 will move to the right of the Y-axis drive unit 3. You will no longer be able to move to the left. Similarly, in the Y-axis drive unit 1.2, when the contact probes P1 and P2 approach each other and are lined up on the same vertical line, that is, when the limit sensors S2b are closest to each other, the contact probes P1 and P2 have a minimum pinch of 0.5 mm on the X-axis. When the Y-axis drive unit 1 moves to the left of the Y-axis drive unit 2, and vice versa, the Y-axis drive unit 2 moves to the right of the Y-axis drive unit 1. will no longer be able to do so. Furthermore, the Y-axis drive unit 2.4 approaches each other, and the two contact probes P3 and P2
When the pinch on the axis becomes smaller than 05, the limit sensor S1 works, and the Y-axis drive units 2 and 4 cannot approach each other any more. In other words, when the four contact probes come closest to each other, as shown in FIG. 2(a), when viewed from the side, contact probes P4 and P3. P
3 and P2P2 and pH each pitch is 0.5mm,
When viewed from above, all the contact probes are aligned in a straight line as shown in FIG. 2(b), and this is detected by limit sensors S2a, S2b and Sl.

This contact device and a control unit that manages and controls the movement of the XYZ axes and the sensing of the sensor unit are connected as shown in FIG.

FIG. 4 is an operation flowchart of this embodiment, which will be explained using an example of the land coordinate positions of the test board shown in FIG.

In order to prevent contact probes from interfering with each other during positioning, contact probes PL, P2. P3. P
4, and the closest land coordinate pinch limit found below is 10 mm. First, control section 2
The four XY land coordinates of the inspection items are Di and D2.
．． D3. D4 is read. Among these land coordinates, the closest land coordinate position DID2 that is likely to interfere with the contact probe is found (FIG. 5(a)). The contact probe P2 corresponding to the second data D2, counting from the smallest X coordinate among the land coordinate positions closest to each other, is selected. Here, depending on the previous data, the contact probe P2, which was positioned on the land coordinate position D2-, or the land coordinate position D, depending on the current data.
If there is a risk of interference with other contact probes when moving to P2 (Fig. 5 (b)), return all contact probes to their origin once (Fig. 5 (C)), and then move the contact probe P2. (Fig. 5(d))
). If there is no risk of interference (Fig. 5(e)), position the contact probe P2 as is (Fig. 5(e)).
f)). Next, the closest land coordinate position Di, D
If the pinch between the two contact probes is 10 mm or less, the remaining contact probes Pi, P3. P4 is sequentially moved to the closest land coordinate position D2 to the limit sensor S1. (Fig. 5 axis)). Note that if this pinch exceeds 10 mm, the contact probes are not brought closer to each other.

Then, the remaining unpositioned land coordinate positions DID3, excluding the positioned land coordinate position D2. D
4, corresponding contact probes PL, P3. Assign P4. Here, the land coordinate positions Di'', D3- and D4- according to the previous data are
Contact probes PL and P positioned above
3. D4 is the land coordinate position Di according to the current data,
D3. If there is a risk of interference with the contact probes in the pond when moving to D4, all contact probes in the pond except contact probe P2 are returned to their origin (FIG. 5(h)). Then, from the nearest land coordinate position in the soil direction to the farthest land coordinate position, centering on the X coordinate of the positioned land coordinate position D2,
Next, the contact probe is positioned from the inside as P3→P4→P1 from the nearest land coordinate position to the farthest land coordinate position in one direction from D3→D3→D1 (FIG. 5(k)).

Previous data land coordinate position Di-, D3-, D4
- to the current data land coordinate position D1. D3. D
When moving the contact probe to 4, if there is no risk of interference with other contact probes, do not return to the origin and move the contact probe from the land coordinate position furthest away in the + direction from the X coordinate of land coordinate position D2 to the nearest land. Position the contact probe from the outside in the order of D4 → D3 → D1 from the farthest land coordinate position in one direction to the nearest land [target position in sequence from P4 → P3 → pt (Fig. 5). (k)).

, all contact probes (PL, P2. P3
．． P4) is positioned, contact probes are brought into contact with the land coordinate positions corresponding to each contact probe (Di-Pi, D2-P2. D3-P3.
D4-P4) Perform measurements. After the measurement is completed, all contact probes PL, P2°P3. from each land coordinate position (Di, D2D3. D4). Release P4,
Read the next data. If the next land coordinate position data is available, calculate the closest land coordinate and operate as described above. If there is no next data, each contact probe is returned to its origin and all operations are completed.

In the operation of this embodiment, the distance between the closest land coordinates is 10
If it is clear that there is no risk of interference between contact probes due to overrun during positioning of the contact probes even if the distance is less than mm, it is possible to perform a simulation without actually performing the actual operation of bringing the next contact probe closest to each other. be.

(Effects) According to this embodiment, the operation simulation allows accurate, quick and appropriate contact probe assignment, and other contact probe assignments, regardless of the size of the pinch between inspection land coordinates, without performing any actual operations. It is possible to position at least four land coordinate positions without interference with the land coordinates.

(Second Embodiment) (Structure) Fig. 6(b) shows a top view of the second embodiment of the present invention (-1 Fig. 6(a) shows the - point in Fig. 6(b)). A cross-sectional view taken along the chain line is shown in the direction of the arrow, and FIG. 7 shows a schematic configuration diagram of the substrate positioning base plate of this embodiment.

The test board 13 is positioned and fixed on the test board holder mounting base plate 7-5. This test board holder mounting base plate 7
-5 is a reference positioning holder 7-1 fixed to one corner of the plate, and mounting holes 7-4 regularly arranged on the base plate 7-5 and capable of being mounted universally;
A holding bin 7-2 that can be freely moved on the base plate along the edge of the test board 13 and can be attached to the hole 7-4;
It can be moved freely within the area of the test board 13 and can be mounted in the mounting hole without interfering with the mounted components. , and a contact probe 76 that can be attached to a mounting hole and contacts the inspection coordinate position on the substrate to be inspected. The reason why this contact probe 76 is provided is that since circuits are provided on both sides of the board, it is not possible to inspect the connection state with the back side by connecting with the contact probe from the front side.

The configurations of the X, Y, and Z axis drive units, limit sensors, contact probes, test board positioning and holding pins, mounting base, fixing base, etc., and the minimum pitch between contact probes are the same as those described for the first embodiment. Therefore, detailed explanation thereof will be omitted.

(Function) In this example, the end of the test board 13 with the origin is placed on the reference positioning holder 7-1, and the remaining three ends are placed on the holding pin 7.
-2, the test board 13 is mounted in the mounting hole 7-4 so as not to move.

At the same time, without interfering with the components mounted on the lower surface of the test board 13, the required number of holding bottles 7-3 are erected and installed in the mounting holes. Further, the contact blower 6 is attached to an appropriate mounting hole so that the contact probe contacts the inspection coordinate position on the lower surface of the substrate 13 to be fixed.

Since the X, Y, and Z axis drive sections, the movement of the contact probe, the function of the nomit sensor, and the simulation method are the same as those described for the first embodiment, detailed explanation thereof will be omitted.

(Effects) According to this embodiment, positioning and fixing of the test board becomes extremely easy regardless of its size. Further, when the contact probe provided in the Z-axis drive unit contacts the test substrate, warping of the test board can be prevented, and the test board can be protected and accurate contact can be made to the test coordinate position. Furthermore, even if there are inspection coordinate positions on both sides of the substrate to be inspected, contact with a contact probe for inspecting the substrate can be made very easily.

(Third Embodiment) (Structure) FIG. 8(b) shows a top view of this embodiment.
Figure (a) shows a cross-section taken along the - dotted chain line in Figure (b), viewed from the direction of the arrow.

In this example, the configurations of the X, Y, and Z axis drive units, limit sensors, and contact probes located on the top surface of the fixedly positioned test substrate are the same as those described for the first example, so the details will be explained below. Further explanation will be omitted. X-axis drive units 56-.X-axis drive units 56-. 7-,] and an X-axis drive unit 1-. 2-. 3-. 4 and contact probes PL-, P2-, P3'', and P4- that can each independently contact the chiseled land existing on the lower surface of the test substrate 13 and the corresponding land coordinate positions.
A Z-axis drive unit 9-. A test substrate 13 having reference numbers 10'', 11'', and 12- located on the lower surface of the test substrate is fixed to a fixing base 15 by a holder 14 for positioning and fixing it. X-axis drive section 5-. 6-. 7-. 8- are two adjacent axes facing each other so as to sandwich the substrate 13 to be tested from both sides, and of the two axes, the X-axis drive unit 6-. 8” or lower, far side X-axis drive 5-17
Stay at 1- so that - or higher. X-axis drive unit 1-. 2-
．． 3”, 4- are X-axis drive parts 5-96+, 7-, s-
They are paired with each other, and are positioned below the test substrate in the vertical direction from the X-axis drive unit.

As a limit sensor, a limit sensor S1 is positioned on the surface facing each of the X-axis drive sections 2-4 that form a pair with the X-axis drive section 6-18', and an adjacent X-axis drive section 5-
Two sets of X-axis drive units 1 paired with -6-, 7--8-
-2+, 3'-4" on the opposite sides,
Limit sensors S2b' and S2a are installed. The Z-axis drive units 9' and 1F11-12- are respectively connected to the X-axis drive unit 1-. 2-. The contact probes PL", P2", P3-,
P4- are Z-axis drive units 9-, 10', 11, respectively.
” , 12- and the Z-axis drive unit with the same height!-
11'', 10''-12' are located on opposite sides. The minimum pitch between contact probes is the same as in the first embodiment.

(Function) According to this example, the X-axis (
1, 2, 3, 4), Y axis (5, 6, 7, 8), Z axis (9
10, 1112), drive unit, limit sensor (Sl,
S2a.

52b), contact probe (Pi, P2. P3
．． P4) operates with respect to the inspection land coordinate position existing on the top surface of the fixed board to be tested, and
X-axis located below (1”, 2-, 3”, 4”
), Y axis (56-, 7-, EI), Z-axis (9-, 10-
, 11-, 12-) drive unit, limit sensor (81”,
52a-, 52b-), contact probe (PL-
, P2-, P3-, and P4N operate with respect to the inspection land coordinate positions existing on the lower surface of the fixedly positioned test substrate 13. Since the XY-axis drive unit, the movement of the contact probe, the function of the limit sensor, and the simulation method are the same as those described for the first embodiment, detailed explanation thereof will be omitted.

(Effect) According to this example, even if the test land coordinates of the board to be tested are located on both sides of the board, the contact probe can be moved to the test land coordinate position without inverting the board after one-sided inspection. positioning can be performed extremely quickly.

(Fourth embodiment) (Structure) FIG. 9(b) shows a top view of this embodiment.
Figure (a) shows a cross section taken along the dashed line in Figure (b) as seen from the arrow. In this example, the substrate to be tested 16' is set on an X-Y movable stage 13' that can be independently moved in the X-Y directions by means of holding pins 14' that position and fix the substrate to be tested. The configurations of the X, Y, and Z axis drive units, limit sensors, contact probes, etc., and the minimum pitch between the contact probes are the same as those described for the first embodiment, and therefore, the description thereof will be omitted.

(Operation) FIG. 10 is an operation flowchart of this embodiment.
This will be explained using an example of the inspection coordinate position data of the substrate to be inspected shown in FIG.

Four XY land coordinates of inspection items Dl, D2D
3. D4 is read, and the closest land coordinate position Di, which may interfere with the contact probe, is read.
D2 is found (FIG. 11(a)). Among the closest land coordinate positions, the contact probe P2 corresponding to the second data D2 is selected, counting from the one with the smallest X coordinate, and the X-Y movable stage 13' is moved to position the contact probe P2 (11th Figure (b) dashed line → solid line)
. Next, if the pitch between the closest land coordinate position Di and 02 is 10 mm or less, the remaining contact probe PL
, P3. P4 sequentially to its closest land coordinate position D
2, the limit sensor 81. The vehicle is brought to its closest approach until just before S2 is activated (FIG. 11(C)). The pitch is 10m
If the distance exceeds m, the contact probes will not be brought closest to each other. The subsequent movement of the drive unit relative to the limit sensor and the simulation are all the same as described for the first embodiment, so detailed explanation thereof will be omitted (respectively g and h in Fig. 5).

i, j correspond to c, d, f, e in FIG. 11).

(Effects) According to this example, in positioning the contact probes to the inspection land coordinate positions on the test board, the movement of each contact probe and the movement of the X-Y movable stage are used together, so that the contact probes can be moved extremely quickly. positioning to the inspection land coordinate position is possible.

(Fifth Embodiment) (Structure) Fig. 12(b) shows a top view of this embodiment, and Fig. 12(a) shows a cross section taken along the dashed line in Fig. 12(b) as seen from the arrow. Figure shown below. In this example, in addition to the two-stage configuration of the first embodiment, X-axis drive units 41 are provided, one on each side of the substrate to be tested, each independently movable over the substrate to be tested 51.
．． 46, and the limit sensor 5 paired with the X-axis drive section.
2a-9S2b-, and a Z-axis drive unit 21 having contact probes PL and P6 that can independently contact the check lands of the test board 51 and the land coordinate positions corresponding thereto. It has a three-stage configuration with the addition of .26. The other configurations and the longest pitch between contact probes are the same as those described for the first embodiment, so detailed explanation thereof will be omitted.

(Function) The approach of the contact probes shown below refers to the same state as the contact probes P3 and P2, P4 and P3, or P2 and Pl in Fig. 2, and the limit sensor function and X-Y axis drive at that time. Since the movement of the parts is the same as that described for the first embodiment, detailed explanation thereof will be omitted.

FIG. 13 is an operation flowchart of this embodiment, and the first
This will be explained using an example of the inspection coordinate position of the substrate to be inspected shown in FIG. Contact probes PL, P2. P3. P4゜P5
．． Assign P6. (Di-PL, D2-P2.
D3-P3. D4-P4. D5-P5. D6-
P6).

First, the six XY land coordinates of the inspection items Di, D2. D3. D4. D5. D6
is loaded. Return all contact probes to their origin. Figure 14: Position the contact probe P3 at the machining land coordinate position D3 (Figure 14(b)).If the pitch between the land coordinates (D3 and D4) is 10 mm or less, move the contact probe P4 closer to P3. (Fig. 14 (C)). If the pitch is larger than 10 mm, they will not approach. Next, position the contact probe P4 (Fig. 14 (d)). Land coordinates D3 and D4
Find the closest land coordinate position excluding the gap. The closest land coordinate position (X coordinate) found is data D3.
The case where it is smaller than D4 (data D3 and D2 or D2 and Di) and the case where it is larger (data D3 and D5 or D5 and 06) will be explained separately.

First, if the found land coordinate position is smaller than the data D3D4, the pitch between the land coordinate positions D2 and D3 is compared with 10 mm. If the pitch is 10 mm or less, contact probe P2 is brought closer to P3 (14th
Figure (e)), positioning the contact probe P2 (
Figure 14(f)). If the pitch is larger than 11011I, the contact probe P2 is positioned as is (FIG. 14(f)). Similarly, land coordinate position D2
and DID4 and D5 and D5 and D6 pinch by 10mm
In contrast, if the distance is 10 mm or less, each position is sequentially determined through an "approach" operation. If it is larger than 10 mm, position it as is.

The land coordinate position that I found is D3. If larger than D4, the land coordinate positions D4 and D5 . D6 and D5. The pitch of D2 and D3 and D2 and DI is 10m.
m and the ratio, and if the distance is smaller than 10+nm, positioning is performed sequentially via an "approach" operation. 10mm
If it is larger than , position it as is.

Once the contact probe is fully positioned (14th
Figure (i)), the contact probe is brought into contact with the land coordinate position corresponding to each contact probe (P1→Di,
P2-D2. P3-D3. P4-D4. P5-
D5. P6-D6) Perform measurement. After the measurement is completed, remove each contact probe from each land coordinate position and read the next data. If you have the following land coordinate position data,
The contact probe is returned to its origin and operated in the same manner as described above. If there is no next data, each contact probe is not returned to its origin and the operation is ended.

Since the method of performing simulation without performing actual operation is the same as that described for the first embodiment, detailed explanation thereof will be omitted.

(Effects) According to this example, the land coordinates can be inspected without performing any actual operation by operation simulation, and the land coordinates of at least 6 points can be accurately and quickly maintained without interference with other contact probes, regardless of the size of the pitch. Positioning becomes possible.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to appropriately allocate a large number of contact probes that do not interfere with the contact probes and the XY-axis moving parts, and to perform inspection coordinates that are very closely concentrated or scattered over the entire area of the test board. Accurate and quick positioning and contact of the contact probe at a certain position becomes extremely easy.

[Brief explanation of drawings]

FIG. 1(b) is a configuration diagram of the first embodiment of the present invention seen from above; FIG. 1(a) is a cross-sectional view taken along the dashed line - in FIG. 1(b), as seen from the arrow; Figure (a) is a cross-sectional view showing the state when the four contact probes in the first embodiment are closest to each other, and Figure 2 (b) is a cross-sectional view showing the state when the four contact probes in the first embodiment are closest to each other. 3 is an overall configuration diagram of the 1.2, 3.4.5 embodiments of the present invention, 4 is an operation flowchart of the 1st embodiment of the present invention, and 5. The figure is an explanatory diagram of the procedure for positioning the contact probe to the inspection land coordinate position on the test board according to the first embodiment of the present invention. FIG. 6(b) is the configuration seen from the top of the second embodiment of the present invention. 6(a) is a side view of the cross-section taken along the dashed line - in FIG. 6(b) as viewed from the arrow, and FIG. 7 is an overall schematic diagram of the base plate for positioning the substrate to be tested according to the second embodiment of the present invention. , FIG. 8(b) is a configuration diagram of the third embodiment of the present invention seen from the top, FIG. 8(a) is a side view of the cross section taken along the dashed line - in FIG. 8(b), seen from the arrow; 9(b) is a configuration diagram of the fourth embodiment of the present invention seen from above, FIG. 9(a) is a side view of the cross section taken along the dashed line - in FIG. 9(b), seen from the arrow, and FIG. is an operation flowchart of the fourth embodiment of the present invention, FIG. 11 is an explanatory diagram of the procedure for positioning the contact probe to the inspection land coordinate position on the test board according to the fourth embodiment of the present invention, and FIG. 12 (b) ) is a configuration diagram of the fifth embodiment of the present invention seen from above, FIG. 12(a) is a side view of the cross section taken along the dashed line - in FIG. 12(b), seen from the arrow, and FIG. An operation flowchart of the fifth embodiment, FIG. 14 is an explanatory diagram of the procedure for positioning the contact probe to the inspection land coordinate position on the test board according to the fifth embodiment of the present invention, and FIG. 15 is a conventional printed circuit board measurement and inspection device. FIG. 2 is a schematic overall configuration diagram. 1.2.3.4 ... Y-axis drive section 5.6.7.8 ... X-axis drive section 9.10.11.12 ... Z-axis drive section 13
... Test board 14 ... Test board positioning and holding pin 15 ・
・・Fixing base 16 ・・Mounting base

Claims (1)

[Scope of Claims] 1. In a board inspection device for electrically testing printed circuit boards, at least two stages of different heights are provided facing each other so as to sandwich the board to be tested from both sides and are movable independently. With the above, there are a total of four or more X-axis drive units, each of which is located perpendicular to the X-axis drive unit on the test board, forms a pair with the X-axis drive unit, is movable independently, and has a limit sensor. At least four or more Y-axis drive units having the same height as each other, and Y-axis drive units of equal height located on both sides of the opposing X-axis drive unit on the test board are attached to opposite sides and each moves independently. At least four possible Z-axis drive units, at least four contact probes that form a pair with the Z-axis drive unit and contact the check land of the test board and the corresponding land coordinate position, and the test board. A movable probe type multi-point contact device for testing printed circuit boards, characterized by comprising holding pins for positioning and fixing the test board and a mounting base to obtain check signals necessary for electrical testing. 2. In the movable probe type multi-point contact device for inspecting printed circuit boards according to claim 1, the means for positioning the contact probes to the check lands of the test board and the land coordinate positions corresponding thereto includes the following steps: 1. Among the land coordinate positions to be contacted, one of the closest land coordinate positions where there is a risk of interference with the contact probe is found. 2. The closest land coordinate position found without the risk of interference with the contact probe to be brought into contact with each land coordinate position. Obtain the best contact probe to be assigned to the position and position it at this land coordinate position. 3. Bring all other contact probes closest to the found land coordinate position until the limit sensor works. 4. , a contact probe that can be sequentially moved in the + direction from the farthest land coordinate position to be contacted in the + direction based on the X coordinate of the found closest land coordinate position, and a contact probe that is not positioned and will operate later. Allocate and position contact probes that have no risk of interference; 5. Move in the same way in one direction; 6. After all contact probes are positioned, the contact probe contacts the land coordinate position. A movable probe type multi-point contact device for inspecting printed circuit boards, characterized in that: