JPH046475A - Fixed state tester for electronic component - Google Patents

Abstract

PURPOSE:To achieve positive contact between each contactor and each contact land by providing a movable contact unit which is movable independently from a contactor unit body and positioned by means of a positioning means mounted on a printed board. CONSTITUTION:A printed board 104 is positioned by means of a positioning pin 105 whereas a contactor body 101 is positioned by means of a guide pin 111. When the body 101 is moved downward so that each contactor 103 contacts with each contact land on the board 104, each contactor 103 is brought into contact with each contact land positioned by means of the positioning pin. On the other hand, each contactor 103 fixed to a movable contact unit 102 is positioned, when a positioning probe 109 enters into each reference hole 110 made in the board 104, and brought into contact with each contact land of electronic components mounted with high density. An electronic circuit block 106 then judges the fixed state while confirming the contacting state.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting state testing device for testing the mounting state of electronic components mounted on a printed circuit board.

[Conventional technology]

FIG. 5 is a longitudinal cross-sectional view showing the configuration of a conventional electronic component mounting condition testing device.

The plurality of contacts 503 provided in the contactor unit 501 are individually brought into contact with the plurality of contact lands of the printed circuit board 504 placed on the pedestal 512 . Each contactor 503 applies a test signal to each contact land, or manually inputs the test signal that has passed through the electronic components mounted on the printed circuit board 503. Each contact 50
Reference numeral 3 is connected to an electronic circuit block (not shown), and the electronic circuit block determines the mounting state of the electronic component based on the input/output state of test signals.

A pair of positioning bins 505 and guide bins 510 are provided on the pedestal 512 for positioning the printed circuit board 504 and the contactor unit 501, respectively.
03 or each contact land.

[Problem to be solved by the invention]

In the conventional example described above, the printed circuit board is positioned by a pair of positioning bins provided on the pedestal, and the contactor unit is positioned by guide pins provided on the pedestal. Therefore, the printed circuit board and the contactor unit are positioned using the pedestal as a common reference.

Many of the contact lands of printed circuit boards used in recent years have narrower pitches between the contact lands and have a larger number of high-density wirings. In areas where such electronic components are mounted at a high density, the positioning method of the printed circuit board and contact unit as described above will result in large errors, making it difficult for each contact to reliably contact its corresponding contact land. The drawback is that it cannot be done.

The present invention has been made in view of the drawbacks of the above-mentioned prior art, and provides an electronic component mounting condition testing device capable of testing the mounting condition regardless of the type of electronic component mounted on a printed circuit board. The aim is to realize this.

[Means to solve the problem]

The present invention provides an electronic component installation state testing device.

The mounting state of the electronic components mounted on the printed circuit board is checked using a contact unit in which contacts are respectively arranged at a plurality of predetermined locations according to the mounting positions of the electronic components mounted on the printed circuit board. In the installation state testing device for electronic components to be tested, positioning means is provided on the upper surface of the printed circuit board as a predetermined reference, and the contact unit has a contact unit main body that is positioned according to a common reference with the printed circuit board; It is composed of a movable contact unit that is movable independently of the contact unit main body and is positioned by positioning means provided on the printed circuit board.

[For production]

The movable contact unit, which is movable independently of the contact unit main body, is positioned by positioning means provided on the printed circuit board. As a result, the contacts installed on the movable contact unit come into contact with the mounting position of the printed circuit board with extremely high precision positioning compared to the contacts installed on the contact unit main body. Even when mounted, contact can be made reliably.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1(a) is a perspective view showing the structure of a first embodiment of the present invention, and FIG. 1(b) is a longitudinal sectional view showing the structure of the contact portion.

In FIG. 1(a), 101 is the contactor unit body, 102
103 is a movable contact unit that constitutes a contact unit together with the contact unit main body 101; 103 is a plurality of contacts provided in the contact unit main body 101 and the movable contact unit 102; and 104 is an electronic component mounted thereon; Printed circuit board to be tested for condition, 105 is pedestal 1
Positioning pins protruding from 13 are used to position the printed circuit board 104 when installing it; 106 is an electronic circuit block that connects with each contact 103 and determines the mounting state of the electronic component; 107 is an electronic circuit block that connects each contact 103; A plurality of signal lines 111 connect the electronic circuit block 106 and the contactor unit body 101, and serve as guides when moving the contactor unit body 101 up and down in the Z direction in the figure. , 112 is a holding plate for locking the movable contact unit 102 to the contact unit main body 101; 113;
is a pedestal on which the printed circuit board 104 is installed.

In this embodiment, the positioning pin 105 and the guide pin 111 are provided on the pedestal 113, and the printed circuit board 10
4 is a positioning edge by a positioning bin 105, and the contactor unit main body 101 is positioned by a kite pin 111. The movable contact unit 102 on a rectangular flat plate is used to test parts where electronic components are mounted at high density. It is held between the upper and lower sides of the plate 112 and is applied to a rectangular notch provided in the contactor unit main body 101. As shown in FIG. 1(b), springs 108 are built in between the contact unit main body 101 sandwiched between the eight holding plates 102 and the movable contact unit 102, so that the movable contact The unit 102 is slightly movable in the XY force directions in the figure, which are horizontal directions.

At the bottom of the movable contactor unit 102, two positioning probes 109 each having a conical tip are provided facing downward. A positioning probe 109 is attached to the printed circuit board 104 at a position corresponding to each positioning probe 109.
Reference hole 1 is a positioning means that is slightly larger than the diameter of
10 are respectively provided, and a recess 114 having a larger diameter than the reference hole 110 is provided in the pedestal 113 at a position corresponding to each positioning probe 109.

Next, a description will be given of the operation when testing the mounting state of electronic components using this embodiment.

The tester places the printed circuit board 104 on the pedestal 113 in alignment with each positioning bin 105, and then attaches the contact unit main body 1.
01 downward so that each contact 103 comes into contact with each contact land on the printed circuit board 104, each contact 1 that was not attached to the contact unit main body 101
03 contacts each contact land on the printed circuit board 104 positioned by the positioning pin 5.

On the other hand, each contactor 103 attached to the movable contactor unit 102 is positioned by each positioning probe 109 entering each reference hole 110 provided on the printed circuit board 104, and the electronic components mounted at high density are positioned. Contact each contact land.

After confirming that all the contacts 103 have contacted each contact land, the tester judges the attachment state using the electronic circuit block 106.

FIG. 2 is a block diagram showing the configuration of the electronic circuit block 106.

The electronic circuit block 106 includes a CPU 1 which is a processing determination section.
06. and measurement signal source output section 1062 and measurement system 1063
It is composed of. The CPU 106□ causes the measurement signal source output section 1062, which includes a voltage source and a current source, to output a predetermined test signal for testing the mounting state of the electronic component. The test signal is sent to a predetermined contact land on the printed circuit board 104 via the signal line 1072:t and each contact 103. The signal indicating the passing state of the test signal is passed through each predetermined contactor 103 and signal line 107 again to the measurement system 106 which measures the voltage and current of the input signal.
3 is input. The CPU 1061 determines the attachment state of each electronic component based on the signal indicating the measurement result output by the measurement system 1063, and displays the result on a display section (not shown).

In this embodiment, each contact 103 provided on the contactor unit body 1 is provided on the pedestal 113 for each contact land of the printed circuit board 104 that is positioned by the positioning bin 105 provided on the pedestal 113. Each contactor 103 provided on a movable contactor unit 102 for testing the mounting state of a portion where electronic components are mounted at high density is provided on a printed circuit board 104. Assuming that the contacts 103 were positioned using the reference holes 110, it was possible to bring all the contacts 103 into reliable contact with each contact land on the printed circuit board 104.

FIG. 3(a) is a top view showing the structure of a second embodiment of the present invention, and FIG. 3(b) is a longitudinal sectional view thereof.

In contrast to the first embodiment in which the movable contact unit 102 can be moved slightly in the horizontal direction (XY force direction) using spring force, in this embodiment, the movable contact unit 102 is moved slightly through a drive device such as a motor. It is.

In the figure, a contactor unit main body 301, a movable contactor unit 302, a contactor 303, a printed circuit board 304, a positioning pin 305, a guide pin 311, and a pedestal 313 are shown in FIG. 1(a).

The contactor unit main body 101, movable contactor unit 102, contactor 103, printed circuit board 104, positioning bin 105, guide pin 111, and pedestal 113 in (b) are substantially the same, so their explanation will be omitted.

In this embodiment, the movable contactor unit 302 has drive devices 314 + ,
Connected to the contactor unit body 30 by 3142,
It is connected to the contact unit main body 301 by horizontal driving kites 319□, 319□ near the approximate center of each side facing this. Drive device 314. drives the movable contact unit 302 in the Y direction, and the drive device 3142 drives the movable contact unit 302 in the X direction. Each horizontal drive chi)"319 provided opposite each of these drive devices 314□, 314□
1.319□ forms a guide shaft that communicates in the x and Y directions, so the movable contact unit 302 is connected to each drive device 314. , 314□ moves in the XY force direction.

The respective driving devices 314+ and 3142 are driven by a horizontal driving electronic circuit block 316 connected to these devices via a signal line 307.

A reference mark 318 serving as a positioning means is provided on a portion of the printed circuit board 304 where electronic components are mounted in high density.
A CCD camera 315 for detecting a reference mark 318 is provided at a portion roughly corresponding to . Electronic circuit block 316 connects each drive device 314 . .

314□ and a CCD camera 315, and uses image information obtained from the CCD camera 315 to drive each of the drive devices 314° and 3142.
The position of the movable contact unit 302 is controlled.

FIG. 4 is a block diagram showing the configuration of the horizontal drive electronic circuit block 316.

Horizontal drive electronics 316 determine the position and position of each drive device 314 . , 3142 to control
An image signal capture unit 3 captures image signals from the PU 31s and the CCD camera 315 and sends them to the CPO 316°.
16□ and a drive system control section 3163 that outputs drive signals to each of the drive devices 314+ and 3142 in response to control signals from the CPU 3161.

A reference mark 318 provided on the printed circuit board 304 is captured by a CCD camera 315 and sent to the CPU 316° via an image signal acquisition section 3162. CPU
316. Then, the current position of the movable contact unit 302 is measured and calculated from the imaging position, and the position of the movable contact unit 302 is calculated.
Each drive device 314 . , 314°. As a result, each contact 302 provided in the movable contact unit 302 is positioned by the reference mark 318 provided on the printed circuit board 304.
Even in areas where electronic components are mounted at high density, each contact land can be reliably contacted. After this, although not shown in FIGS. 3(a) and 3(b), an electronic circuit block is connected to each contactor 303 similar to the first embodiment to determine the mounting state of the electronic component. An exam will be conducted.

In each of the embodiments described above, the vertical movement of the contactor unit body was not explained in detail, or in the first embodiment, as the contactor unit body 101 lowers, the positioning probe 109 enters the reference hole. Therefore, it can be either manual or automatic. In the second embodiment, since the movable contactor unit 302 moves in the horizontal direction, it is preferable that it be automated.

In the case of automation in any of the above embodiments,
By detecting the pressure when each contactor contacts each contact land and stopping the drop, it is possible to perform tests at appropriate pressures, improving test reliability. can be configured in this way.

In addition, in each embodiment, the positioning means provided on the movable contact unit and the printed circuit board are provided one each on the contact unit body, but these may be arranged in multiple positions depending on the mounting state of the printed circuit board to be tested. Of course it's good as a thing.

[Effects of the Invention] Since the present invention is configured as described above, it has the following effects.

By providing a movable contact unit that is movable independently of the contact unit body and positioned by positioning means provided on the printed circuit board, a large number of contact lands are provided on the top surface, and each Even if the printed circuit board is difficult to position because there is a positional error between the contact and each contact land, it is possible to divide the printed circuit board into blocks and position each block using the optimal standard. Each contact land can be brought into reliable contact with the contact land, and automatic positioning can be facilitated.

[Brief explanation of the drawing]

1(a) and 1(b) are a perspective view and a vertical sectional view showing the configuration of a first embodiment of the present invention, respectively, and FIG. 2 is an electronic circuit in FIG. 1(a). A block diagram showing the configuration of the block 106, FIGS. 3(a) and 3(b) are a top view and a vertical sectional view showing the configuration of the second embodiment of the present invention, and FIG. 4 is a block diagram showing the configuration of the second embodiment of the present invention. A block diagram showing the configuration of the horizontal drive electronic circuit block 316 in FIGS. 3(a) and 3(b),
FIG. 5 is a longitudinal sectional view showing the structure of a conventional example. 101.301...Contact unit body, 102.3
02...Movable contact unit, 103.303--Contact, 104.304--Printed circuit board, 105.305--Positioning bin, 106--Electronic circuit block, 106,. 316--CPU, 1062--Measurement signal source output section, 1063--Measurement system, 107.317--Signal line, 108--Spring, 109--Positioning probe, io-- -Reference hole, 111311--Guide bin, 112--Press plate, 3.313--Scraper, 4--Concave portion, 4,. 3142--Drive device, 5-CCD camera, 6-Horizontal drive electronic circuit block, 8-Reference mark, 9, . 3192...Horizontal drive guide. Patent applicant Canon Co., Ltd. Representative Patent attorney Tadashi Wakabu Figure 2

Claims (1)

[Scope of Claims] 1. The mounting state of the electronic components mounted on the printed circuit board is determined by arranging contacts at a plurality of predetermined positions corresponding to the mounting positions of the electronic components mounted on the printed circuit board. In the mounting state testing device for electronic components that tests using a contactor unit, the upper surface of the printed circuit board is provided with a positioning means serving as a predetermined reference, and the contactor unit has a common reference with the printed circuit board. and a movable contact unit that is movable independently of the contact unit body and is positioned by a positioning means provided on the printed circuit board. Equipment for testing the installation condition of electronic components.