JPH03145110A - Manufacture of chip component - Google Patents

Abstract

PURPOSE:To obtain a chip capacitor in which inexpensible Ag is used as an inner electrode by a method wherein a green sheet is formed by the mixture of ceramic powder and glass powder, and the temperature of firing is lowered to 950 deg.C or lower. CONSTITUTION:A plasticizer, an organic binder ingredient and an organic solvent are added to glass-added alumina powder, and after they have been mixed, a slurry is obtained, and then a ceramic green sheet 5 is manufactured using a reverse roll coater. Ag paste 6a, which becomes an inner electrode, is printed on the above-mentioned ceramic green sheet 5, the ceramic green sheet 5 is adhered to the printed sheet, inner electrodes are printed, laminated and pressed in such a manner that they are alternately opposing with each other, and a laminated body 7, having the prescribed inner electrode layer, is obtained. Subsequently, green chips are obtained by cutting the above-mentioned laminated body 7, and a sintered element is obtained by firing. After this sintered element has been chamfered, both exposed end faces of the inner electrode 6 are coated with Ag paste, the paste is baked, an external electrode 8 is formed, and a chip capacitor is obtained.

Description

[Detailed Description of the Invention] Industrial Application Fields Recently, electronic devices have become rapidly miniaturized, and the electronic components used therein are also required to be packaged in high density, leading to a shift to ultra-miniaturization. It is being done.

The present invention relates to a method of manufacturing these chip cities for high-density packaging.

Conventional technology Taking a chip capacitor as an example of the conventional technology, Figs.
This will be explained with a diagram.

First, a binder, a plasticizer, and a solvent are added and mixed to ceramic raw materials to create a slurry, and a ceramic green sheet 1 shown in FIG. 6 is formed using a reverse roll coater or the like. After that, the internal electrodes 2 were stacked and pressed so that they faced each other alternately, and the laminate 3 shown in FIG. 6 was obtained. After cutting into side elements,
The chip capacitor shown in FIG. 7 is manufactured by firing at 0° C. and forming external electrodes 4 as shown in FIG.

Problems to be Solved by the Invention Conventional chip capacitors use expensive P(1) for internal electrodes, and require high-temperature firing, which requires a huge amount of power and results in However, it was difficult to reduce production costs, which posed the problem of not being able to adequately meet the price demands of the market.

The present invention solves these problems and aims to provide a method for manufacturing inexpensive and high-quality chip components such as chip capacitors.

Means for Solving the Problem In order to solve this problem, the present invention fabricates a green sheet from a mixture of ceramic powder and glass powder and lowers the firing temperature to 950°C or less, thereby using inexpensive Ag as an internal electrode. This made it possible to obtain a chip capacitor with the following characteristics.

According to this invention, since it is possible to bake at medium temperature, it is possible to manufacture a low-cost, high-quality chip capacitor using low electric power, low cost, and the adoption of A[, which has the smallest specific resistance value. .

Example An embodiment of the present invention will be described using FIGS. 1 to 3.

After mixing, a binder, an organic binder component, and an organic solvent were added to 6 wt % glass-added alumina powder (MLS-1e) manufactured by Nippon Electric Glass Co., Ltd. After mixing, a slurry was obtained, and the first layer was coated with a reverse roll coater. A ceramic green sheet 5 shown in the figure was produced. On this ceramic green sheet 5, print an Ag paste 6a that will become an internal electrode, paste the ceramic green sheet 5 on this printed sheet, print, laminate, and press so that each internal electrode faces alternately, A laminate 7 shown in FIG. 2 having predetermined internal electrode layers is obtained. Thereafter, the green chips were cut into individual green chips, which were fired in a firing furnace at 850'C for 2 hours to produce sintered elements. After chamfering this sintered element, Ag paste is applied to both exposed end faces of the internal electrode 6 and baked, and then the surface of the baked paste g is plated with Ni and an/Pd in this order, and the external electrode 8 was formed, and the chip capacitor shown in FIG. 3 was manufactured.

Table 1 below shows characteristic comparison data of the chip capacitor obtained according to the present invention with a conventional product.

It goes without saying that the alumina used in this example can be replaced with other ceramic materials, and furthermore, the glass components and mixing ratio to be mixed with the blank material can be changed arbitrarily depending on the application. You can choose. In this embodiment, a chip capacitor has been described, but it goes without saying that the present invention can also be applied to other chip components, such as the jumper chip 9 shown in FIG. 4. In FIG. 4, 10 is A (internal electrode) and 11 is external electrode.

Effects of the Invention As described above, according to the present invention, it is possible to sinter the ceramic material at medium temperature, so it is possible to manufacture inexpensive, high-quality chip parts by using inexpensive mug with the lowest specific resistance value. becomes.

[Brief explanation of the drawing]

Figures 1 to 3 are diagrams showing one embodiment of the present invention. Figure 1 is a perspective view showing the process of printing internal electrodes on a green sheet, and Figure 2 is a laminate of printed sheets. 3 is a cross-sectional view of the chip capacitor obtained in this example, FIG. 4 is a cross-sectional view of a jumper chip according to another example, and FIGS. 6 to 8 explain the conventional technology. FIG. 7 is a cross-sectional view of a chip capacitor. 6 daddy electrode, 7... laminate, 8... external electrode.

Claims (1)

[Claims] Green sheets made of a mixture of ceramic powder and glass powder are stacked, conductive paste for internal electrodes is applied on top of them, and green sheets are stacked on top of that.
A laminate having at least one layer of internal electrodes is obtained, pressed, and then cut and fired to obtain a sintered body element. After chamfering, conductive paste is applied to the end surface where the internal electrodes are exposed. A method for manufacturing chip components obtained by forming external electrodes.