JPH0244106B2 - DENKYOSETSUTEN - Google Patents
DENKYOSETSUTENInfo
- Publication number
- JPH0244106B2 JPH0244106B2 JP12992885A JP12992885A JPH0244106B2 JP H0244106 B2 JPH0244106 B2 JP H0244106B2 JP 12992885 A JP12992885 A JP 12992885A JP 12992885 A JP12992885 A JP 12992885A JP H0244106 B2 JPH0244106 B2 JP H0244106B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- gold
- nickel
- alloy
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 19
- 229910052737 gold Inorganic materials 0.000 claims description 19
- 239000010931 gold Substances 0.000 claims description 19
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910001020 Au alloy Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000003353 gold alloy Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はコネクタ端子等の電気的接触部を構成
する接点の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a contact that constitutes an electrical contact portion such as a connector terminal.
従来、コネクタ端子は黄銅、リン青銅などで形
成されており、摩耗や接触抵抗の劣化などを改良
するための表面に貴金属のメツキ層を設けること
が行われていた。
Conventionally, connector terminals have been made of brass, phosphor bronze, etc., and a plating layer of precious metal has been provided on the surface to improve wear and contact resistance deterioration.
このような従来技術としては、たとえば前記の
ような銅合金の基体の上に下地として厚さ1〜
10μmのニツケルメツキ層を設け、その上に厚さ
0.5〜2μmの金メツキ層を施すことにより電気的
接点を構成することが知られている。しかし、こ
のような接点は表面の金層の厚さを小さくすると
耐食性が乏しくなり、特に後加工を行う場合には
欠陥が増加するため、金層を厚くすることによつ
て耐食性を改善しようとするとどうしてもコスト
高となることを避けられなかつた。 In such a conventional technique, for example, a layer of 1 to 100 ml thick is coated as a base on a copper alloy base as described above.
A nickel plating layer of 10μm is provided, and a thickness of
It is known to construct electrical contacts by applying a gold plating layer of 0.5 to 2 μm. However, if the thickness of the gold layer on the surface of such contacts is reduced, the corrosion resistance will be poor, and defects will increase especially when post-processing is performed, so attempts have been made to improve the corrosion resistance by increasing the thickness of the gold layer. This inevitably led to higher costs.
また、特開昭58−218783号には、銅合金の上に
第1層としてニツケルなど、第2層として白金や
パラジウムなど、第3層として金や銀などを被覆
した摺動接点用刷子材料が開示されているが、ニ
ツケル層と金層の間に白金やパラジウムなどの層
を設けることにより化学的安定性と摺動時の耐摩
耗性を改良すると共に電気的浸蝕を防止しようと
しているものである。しかし、このような中間層
は薄くては効果が少く、厚いとコスト高となる上
に硬度が低下し耐摩耗性が悪化するほか、特にパ
ラジウムでは水素を吸蔵して脆化し使用寿命が短
くなる欠点がある。 JP-A-58-218783 discloses a brush material for sliding contacts in which a copper alloy is coated with nickel as the first layer, platinum or palladium as the second layer, and gold or silver as the third layer. has been disclosed, but attempts are made to improve chemical stability and wear resistance during sliding and prevent electrical corrosion by providing a layer of platinum, palladium, etc. between the nickel layer and the gold layer. It is. However, if such an intermediate layer is thin, it is less effective; if it is thick, it increases cost, reduces hardness, and deteriorates wear resistance. In particular, palladium absorbs hydrogen and becomes brittle, shortening its service life. There are drawbacks.
さらに、H.Grossmannら(METALL38、
Heft7(1984)、631)は銅合金基体上にパラジウ
ムまたはパラジウム・ニツケル合金のメツキを施
し、またその上に金・コバルト合金を薄くメツキ
する技術を開示している。しかし、このような材
料は一応良好な性能を示すものの悪環境に於ては
脆化が進行し、メツキ層の剥離等によつて寿命が
短くなるという欠点があることを判明した。 Furthermore, H. Grossmann et al. (METALL 38 ,
Heft7 (1984), 631) discloses a technique in which palladium or palladium-nickel alloy is plated on a copper alloy substrate, and a gold-cobalt alloy is thinly plated thereon. However, it has been found that although such materials exhibit good performance, they tend to become brittle in adverse environments and have shortened lifespans due to peeling of the plating layer, etc.
上記のような事情の下で、従来技術では実現で
きなかつたような耐摩耗性とくに悪環境下におい
ても剥離等の欠陥が発生しないで長寿命が達成で
きるような電気接点が望まれており、本発明の目
的は、そのような電気接点の提供にある。
Under the above circumstances, there is a need for electrical contacts that have a level of wear resistance that could not be achieved with conventional technology, and in particular can achieve a long life without peeling or other defects even under adverse environments. The object of the invention is to provide such an electrical contact.
以上の目的を達するために鋭意研究した結果、
銅合金基体上に、第1層にはニツケル層、第2層
にはニツケル含有パラジウム合金層、そして最上
層には金を主成分とする合金または金の層を順次
メツキすることによりすぐれた耐摩耗性および長
期に渉つて欠陥の発生しない電気用接点が得ら
れ、また製造コストを低減するために中層および
上層の厚さを極めて薄くしてもそのすぐれた性能
が維持できることを見出したものである。
As a result of intensive research to achieve the above objectives,
Excellent durability is achieved by sequentially plating a copper alloy substrate with a nickel layer as the first layer, a nickel-containing palladium alloy layer as the second layer, and a gold-based alloy or gold layer as the top layer. It has been discovered that electrical contacts that are resistant to wear and free from defects over long periods of time can be obtained, and that their excellent performance can be maintained even when the thickness of the middle and upper layers is made extremely thin to reduce manufacturing costs. be.
すなわち、本発明の電気用接点は、導電基体上
に下層としてニツケル層と中層としてニツケル含
有パラジウム合金層と上層として金を主成分とす
る合金または金の層とを積層してなるものであ
る。 That is, the electrical contact of the present invention is formed by laminating, on a conductive substrate, a nickel layer as a lower layer, a nickel-containing palladium alloy layer as an intermediate layer, and an alloy containing gold as a main component or a gold layer as an upper layer.
本発明の導電基体は、普通黄銅やリン青銅等端
子として用いられる導電材料であればどのような
ものであつてもよい。 The conductive substrate of the present invention may be made of any conductive material commonly used as a terminal, such as brass or phosphor bronze.
下層のニツケル層は、前記の導電基体の上に公
知のメツキ手段を用いてニツケルをメツキするこ
とによつて得られるが、電気メツキによつて厚さ
10μm以下、好ましくは5μm以下のニツケル層と
するのが適当である。 The lower nickel layer is obtained by plating nickel on the conductive substrate using a known plating method.
Suitably, the nickel layer has a thickness of 10 μm or less, preferably 5 μm or less.
中層のニツケル含有パラジウム合金層は、公知
のメツキ手段を用いて、前記のニツケル層の上に
メツキすることによつて得られるが、そのニツケ
ル含有量は15%乃至40%程度のものが、硬度が高
くて耐摩耗性が良好であり、また耐環境性が改善
され、腐蝕や剥離等の発生が抑制されて接点寿命
を長くするのに効果がある。また、この合金層の
厚さは0.6μm程度で充分であり、厚くすることは
性能の向上の程度を考慮しても経済的でない。 The intermediate nickel-containing palladium alloy layer is obtained by plating the above-mentioned nickel layer using a known plating method. It has high wear resistance and improved environmental resistance, suppressing corrosion and peeling, and is effective in extending contact life. Further, a thickness of about 0.6 μm is sufficient for this alloy layer, and increasing the thickness is not economical even considering the degree of performance improvement.
上層の金合金または金の層は、公知のメツキ手
段により前記のパラジウム合金層の上にメツキす
ることによつて得られる。金合金としては金に白
金や銀あるいはニツケルやコバルトなどの少量が
添加された合金など接触抵抗が低くて安定であり
かつ固くて摩耗し難いものであれば使用可能であ
る。また、金合金または金の層の厚さは0.3μm程
度で充分であり、それ以上厚くすることは経済的
でない。 The upper gold alloy or gold layer is obtained by plating the palladium alloy layer by known plating means. As the gold alloy, any alloy that has low contact resistance, is stable, and is hard and hard to wear, such as an alloy in which a small amount of platinum, silver, nickel, or cobalt is added to gold, can be used. Further, the thickness of the gold alloy or gold layer is approximately 0.3 μm, and it is not economical to make it thicker than that.
黄銅板上にニツケルを3μmの厚さに電着し、
その上に20%ニツケル含有パラジウムを0.6μmの
厚さに電着し、さらにその上に、金を0.1μmの厚
さに電着して、コネクタ端子形成用材料を得た。
Electrodeposit nickel to a thickness of 3 μm on a brass plate,
Palladium containing 20% nickel was electrodeposited thereon to a thickness of 0.6 μm, and gold was further electrodeposited thereon to a thickness of 0.1 μm to obtain a material for forming connector terminals.
こうして得られたコネクタ端子の接点部分は、
従来技術による接点材料を使用したものに比較し
て高湿度かつ腐蝕性雰囲気中でも腐蝕が起りにく
く、安定した接触抵抗を示し、長寿命であつた。 The contact part of the connector terminal obtained in this way is
Compared to contact materials using conventional technology, corrosion was less likely to occur even in high humidity and corrosive atmospheres, stable contact resistance was exhibited, and the lifespan was long.
また、従来のニツケルメツキ層の上に直接に金
メツキを施した接点では、本実施例と同等の耐食
性を得るためには、厚さ2μm以上の金メツキ層
とすることが必要であつたのに対し、本実施例で
は、パラジウム合金層と金層とを合せても0.7μm
であり、低コストで性能のよい接点の得られるこ
とが明らかである。 In addition, with conventional contacts in which gold plating was applied directly onto the nickel plating layer, in order to obtain the same corrosion resistance as in this example, it was necessary to use a gold plating layer with a thickness of 2 μm or more. On the other hand, in this example, the total thickness of the palladium alloy layer and the gold layer is 0.7 μm.
It is clear that a contact with good performance can be obtained at low cost.
以上、説明したように、本発明の電気用接点は
特定の層状構造となつているもので、悪環境下で
苛酷な使用を行つても腐蝕や剥離が少く、また耐
摩耗性も向上し、長期間安定した接触抵抗を示す
信頼性の高い端子を低コストで実現できるという
特長がある。
As explained above, the electrical contacts of the present invention have a specific layered structure, and even when used under harsh environments, there is little corrosion or peeling, and the wear resistance is improved. It has the advantage of being able to create highly reliable terminals that exhibit stable contact resistance over a long period of time at low cost.
第1図は、本発明の電気用接点の構造を示す断
面図である。
1……導電基体、2……ニツケル層、3……ニ
ツケル含有パラジウム合金層、4……金層。
FIG. 1 is a sectional view showing the structure of the electrical contact of the present invention. DESCRIPTION OF SYMBOLS 1... Conductive base, 2... Nickel layer, 3... Nickel-containing palladium alloy layer, 4... Gold layer.
Claims (1)
してニツケル含有パラジウム合金層と上層として
金を主成分とする合金または金の層とを積層して
なる電気用接点。1. An electrical contact formed by laminating a nickel layer as a lower layer, a nickel-containing palladium alloy layer as an intermediate layer, and an alloy containing gold as a main component or a gold layer as an upper layer on a conductive substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12992885A JPH0244106B2 (en) | 1985-06-17 | 1985-06-17 | DENKYOSETSUTEN |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12992885A JPH0244106B2 (en) | 1985-06-17 | 1985-06-17 | DENKYOSETSUTEN |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61288384A JPS61288384A (en) | 1986-12-18 |
JPH0244106B2 true JPH0244106B2 (en) | 1990-10-02 |
Family
ID=15021881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12992885A Expired - Lifetime JPH0244106B2 (en) | 1985-06-17 | 1985-06-17 | DENKYOSETSUTEN |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0244106B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0770330B2 (en) * | 1987-03-13 | 1995-07-31 | 株式会社日立製作所 | connector |
US5180482A (en) * | 1991-07-22 | 1993-01-19 | At&T Bell Laboratories | Thermal annealing of palladium alloys |
JP5154011B2 (en) * | 2005-11-15 | 2013-02-27 | 株式会社フジクラ | Flexible flat cable |
WO2007083769A1 (en) | 2006-01-19 | 2007-07-26 | Advantest Corporation | Contact device and process for producing the same |
-
1985
- 1985-06-17 JP JP12992885A patent/JPH0244106B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS61288384A (en) | 1986-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |