JPH0222846A - Hybrid integrated circuit in case sealed with resin - Google Patents

Abstract

PURPOSE:To obtain a hybrid integrated circuit which is housed in a case sealed with a resin and whose moistureproofness is excellent by a method wherein an intermediate layer of a resin layer used to coat a pre-coat on a semiconductor pellet and a discrete-type electric component is formed in order to make a hollow between the pre-coat on the semiconductor pellet and the electric component flat. CONSTITUTION:A semiconductor pellet 2, a pre-coat 4 on the semiconductor pellet, a discrete-type electric component 5 and an intermediate resin layer 9 are prepared; a resin layer 7 and a case 8 are prepared. Then, the pre-coat 4 on the semiconductor pellet and the electric component 5 are covered with said intermediate resin layer 9; an intermediate layer is formed. Then, a ceramic substrate 1 covered with the intermediate resin layer 9 is housed in the case 8 and, in addition, resin-sealed with the resin layer 7. Thereby, moistureproofness can be enhanced sufficiently.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a case resin-encapsulated hybrid integrated circuit, and in particular to a case resin that improves moisture resistance by selecting a resin that has good adhesion to a substrate. The present invention relates to encapsulation of hybrid integrated circuits.

[Conventional technology]

Conventionally, for this type of case resin structure, a sealing method in which resin is poured and filled between the case and the substrate is currently widely used. As shown in FIG. 3, this method is easy to manufacture because of the structure in which resin 7 is filled between the precoat 4 on the semiconductor pellet and the discrete electric component 5 and the case 8 for sealing. It was possible.

[Problem to be solved by the invention]

However, in the conventional structure described above, since there is a valley between the precoat on the semiconductor pellet and the discrete electric component, when the semiconductor pellet is placed in a case and filled with case sealing resin, the valley is The air cannot escape completely and remains in the form of bubbles. Therefore, there is a drawback that the resin sealing becomes insufficient and the moisture resistance of the hybrid integrated circuit cannot be fully satisfied.

Furthermore, case sealing resins that are commonly used today have the disadvantage that they do not adhere well to the substrate, and moisture can enter through the interface between the sealing resin and the substrate.

An object of the present invention is to provide a hybrid integrated circuit with a resin-sealed case and excellent moisture resistance.

[Means to solve the problem]

The present invention provides a case resin-sealed hybrid integrated circuit having a structure in which a resin is filled and sealed between a substrate on which a semiconductor pellet and an electrical component are mounted, and a case, in which the semiconductor pellet and the electrical component on the substrate are sealed together. An intermediate resin layer is provided covering the.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a first embodiment of the invention.

In the first embodiment, as shown in FIG. 1, semiconductor pellets 2. Precoating on semiconductor pellets 4. A discrete electrical component 5 and an intermediate resin layer 9 are prepared.

Next, the resin layer 7 and case 8 are prepared.

Next, an intermediate layer is provided by covering the precoat 4 and the electrical component 5 portion on the semiconductor pellet with the intermediate resin layer 9.

Next, the ceramic substrate 1 covered with the intermediate resin layer 9
is housed in a case 8 and further resin-sealed with a resin layer 7.

FIG. 2 is a sectional view of a second embodiment of the invention.

In the second embodiment, as shown in FIG. 2, semiconductor pellets 2. Precoating on semiconductor pellets 4. A discrete electrical component 5.5a and an intermediate resin layer 9 are prepared.

Next, the resin layer 7 and case 8 are prepared.

Next, an intermediate layer is provided by covering the precoat 4 and the electric component 5.5a portion on the semiconductor pellet with the intermediate resin layer 9.

Next, the ceramic substrate 1 covered with the intermediate resin layer 9
is housed in a case 8 and further resin-sealed with a resin layer 7.

In this example, by providing the intermediate resin layer 9,
It has the advantage of being able to sufficiently improve moisture resistance.

〔Effect of the invention〕

As explained above, the present invention provides an intermediate resin layer covering the precoat on the semiconductor pellet and the discrete electrical component, thereby flattening the valley between the precoat on the semiconductor pellet and the electrical component. Can eliminate air bubbles. In addition, by selecting an intermediate layer resin that is compatible with the electrical components and the board, adhesion can be improved and moisture resistance can be improved.

9... Intermediate resin layer.

Claims (1)

[Claims] In a case resin-sealed hybrid integrated circuit having a structure in which a resin is filled and sealed between a substrate on which semiconductor pellets and electrical components are mounted and a case, the semiconductor pellet and the electrical components on the substrate are covered. A case resin-sealed hybrid integrated circuit characterized by providing one intermediate resin layer.