JPH02136759A - Inspecting device for wiring of printed board - Google Patents
Inspecting device for wiring of printed boardInfo
- Publication number
- JPH02136759A JPH02136759A JP28933688A JP28933688A JPH02136759A JP H02136759 A JPH02136759 A JP H02136759A JP 28933688 A JP28933688 A JP 28933688A JP 28933688 A JP28933688 A JP 28933688A JP H02136759 A JPH02136759 A JP H02136759A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- spring
- needle
- pin
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000005259 measurement Methods 0.000 description 3
- 235000012907 honey Nutrition 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器に用いられるプリント基板の布線検査
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wiring inspection device for printed circuit boards used in electronic equipment.
従来の技術
近年、プリント基板布線検査装置はプリント配線板の多
品種少量生産、短納期化が進んでいる中で、ますます重
要視されてきている。BACKGROUND OF THE INVENTION In recent years, printed circuit board wiring inspection equipment has become increasingly important as printed circuit boards are produced in small quantities with a wide variety of products and delivery times are shortened.
以下図面を参照しながら上述した従来のプリント基板布
線検査装置の一例について説明する。An example of the conventional printed circuit board wiring inspection apparatus described above will be described below with reference to the drawings.
第3図は従来の両面プリント基板布線検査装置の断面概
略図である。図中、■はバネ入りピン、2はバネ入りビ
ン1の接触部の針である。4は基板基材、5はその導体
配線である。7は、導通検査機、12はバネ入りビン1
から出ている信号線で、抵抗値を測定するのに用いる。FIG. 3 is a schematic cross-sectional view of a conventional double-sided printed circuit board wiring inspection device. In the figure, ■ is a spring-loaded pin, and 2 is a needle at the contact portion of the spring-loaded bottle 1. 4 is a substrate base material, and 5 is its conductor wiring. 7 is a continuity tester, 12 is a spring bottle 1
This is a signal line coming out from the , and is used to measure resistance.
また、13 (13a、13b )はバネ入りビン支持
治具である。Further, 13 (13a, 13b) is a spring-loaded bottle support jig.
バネ入りピン1は、プリント基板上の配線5の数の2倍
から3倍あり、配線5の両端の位置にバネ入りビンの支
持治具13aに下向きに取付けられる。両面プリント基
板の場合、上記配線5の両端の片側が下面になるときが
あるが、その際は、片側のピンを上向きにバネ入りピン
支持治具13bに取付ける。各バネ入りピン1から信号
線12が導通検査機7へ接続される。The number of spring-loaded pins 1 is two to three times as many as the number of wiring lines 5 on the printed circuit board, and is attached downward to the supporting jig 13a of the spring-loaded pin at both ends of the wiring lines 5. In the case of a double-sided printed circuit board, one side of both ends of the wiring 5 may be the bottom surface, and in that case, the pins on one side are attached to the spring-loaded pin support jig 13b facing upward. A signal line 12 is connected from each spring-loaded pin 1 to a continuity tester 7.
以上のように構成されたプリント基板布線検査装置の作
用について説明する。The operation of the printed circuit board wiring inspection apparatus configured as above will be explained.
下向きバネ入りビン1の支持治具13aと上向きのバネ
入りピン支持治具13bの間にプリント基板を置く。そ
してバネ入りピン1の支持治具13をプリント基板に接
近させる。するとバネ入りピン1の針2が配線5の両端
に接触する。ここで、導通検査機7によって配線5の両
端の電気抵抗値を測定し、その良否(断線か否か)を判
定する。A printed circuit board is placed between the support jig 13a for the downward spring loaded pin 1 and the upward spring loaded pin support jig 13b. Then, the support jig 13 for the spring-loaded pin 1 is brought close to the printed circuit board. Then, the needle 2 of the spring-loaded pin 1 comes into contact with both ends of the wiring 5. Here, the electrical resistance value at both ends of the wiring 5 is measured by the continuity tester 7, and its quality (whether or not it is disconnected) is determined.
発明が解決しようとする課題
しかしながら、上記のような構成では配線数の少なくと
も2倍のバネ入りピンを必要とし、装置の作成に時間が
かかり、短納期化、少ロフト化の進むプリント配線板を
高品質で出荷できないという課題を有していた。Problems to be Solved by the Invention However, the above configuration requires at least twice the number of spring-loaded pins as the number of wires, and it takes time to create the device. The problem was that it could not be shipped due to its high quality.
本発明は上記問題点に鑑み、プリント基板布線検査を短
時間にかつ、高品質にできるプリント基板布線検査装置
を提供するものである。In view of the above-mentioned problems, the present invention provides a printed circuit board wiring inspection device that can perform printed circuit board wiring inspection in a short time and with high quality.
課題を解決するための手段
上記課題を解決するた・めに本発明のプリント基板布線
検査装置は、それぞれ対面する1本ないし複数の針とそ
の針のX軸、Y軸の位置を移動させるための複数個のモ
ーターとガイドレールなどの機構手段と針を上下に移動
させるシリンダー等の機構手段で構成され、それらの制
御装置から送られてくる信号により、針のX軸、Y軸方
向への上下動の制御を行ない、それぞれの針先と接触す
る測定片の電気抵抗値を測定する様にしたものである。Means for Solving the Problems In order to solve the above problems, the printed circuit board wiring inspection device of the present invention moves one or more needles facing each other and the positions of the needles on the X and Y axes. It is composed of mechanical means such as multiple motors and guide rails for moving the needle up and down, and mechanical means such as a cylinder for moving the needle up and down.The needle is moved in the X-axis and Y-axis directions by signals sent from these control devices. The vertical movement of the probe is controlled, and the electrical resistance value of the measurement piece in contact with each needle tip is measured.
作用
本発明は上記した構成により、1台の装置で、様々なプ
リント配線板の布線検査ができ、バネ入すビンの針が2
本または3本で済み、非常に安価となる。Effect of the present invention With the above-described configuration, wiring inspection of various printed wiring boards can be carried out with one device, and the needle of the bottle into which the spring is inserted can be
It only takes one book or three, making it very inexpensive.
また、プリント配線板の配線情報を制御装置から出力す
ることによりバネ入りピンの針の正確な位置を出すこと
ができ、高品質な検査が可能となる。Furthermore, by outputting the wiring information of the printed wiring board from the control device, the accurate position of the needle of the spring-loaded pin can be determined, making it possible to perform high-quality inspection.
実施例
以下本発明の一実施例のプリント基板布線検査装置につ
いて図面を参照しながら説明する。EXAMPLE Hereinafter, a printed circuit board wiring inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例におけるプリント基板布線検
査装置の断面の概略図である。図中、1はバネ入りピン
、2はバネ入りピンlの接触部の針である。3はソルダ
ーレジスト、4は基板基材、5は配線である。6(6a
、6b、6c)はバネ入りピン支持具である。これは、
バネ入りピン1を上下させるシリンダー等の機構部品を
有するものである。7は導通検査機、8はX−Y軸制御
装置である。上記バネ入りピンlは、下向きに設置され
た2本のバネ入りピンfa、ICを有し、それぞれバネ
入すピン支持具6a、6Cに取付けられている。FIG. 1 is a schematic cross-sectional view of a printed circuit board wiring inspection apparatus according to an embodiment of the present invention. In the figure, 1 is a spring-loaded pin, and 2 is a needle in contact with the spring-loaded pin l. 3 is a solder resist, 4 is a substrate base material, and 5 is a wiring. 6 (6a
, 6b, 6c) are spring loaded pin supports. this is,
It has mechanical parts such as a cylinder that moves the spring-loaded pin 1 up and down. 7 is a continuity tester, and 8 is an X-Y axis control device. The spring-loaded pin l has two spring-loaded pins fa and IC installed downward, and is attached to spring-loaded pin supports 6a and 6C, respectively.
もう1本のバネ入りピン1bは上向きに設置され、上記
バネ入りピンla、 lcより下方に同じくバネ入りピ
ン支持具6bに取付けられて設置されている。Another spring-loaded pin 1b is installed facing upward, and is also attached to a spring-loaded pin support 6b below the spring-loaded pins la and lc.
下向きのバネ入りピンla、 lcと上向きのバネ入り
ピン1bの間に両面プリント基板を設置する。上記3本
のバネ入りピン1a、1b、ICはおのおの信号線によ
り導通検査機7に接続されている。A double-sided printed circuit board is installed between the downward spring-loaded pins la and lc and the upward spring-loaded pin 1b. The three spring-loaded pins 1a, 1b, and the IC are each connected to a continuity tester 7 by a signal line.
また、それぞれのバネ入りピン1aSlb、ICのX軸
、Y軸への移動および上下の移動を制御する部分は第2
図にて説明する。In addition, the parts that control each spring-loaded pin 1aSlb, the movement of the IC to the X axis, the Y axis, and the vertical movement are the second parts.
This will be explained with a diagram.
第2図において9はX、Y軸制御部である。10はX軸
ガイドレール、11はY軸ガイドレールである。In FIG. 2, 9 is an X and Y axis control section. 10 is an X-axis guide rail, and 11 is a Y-axis guide rail.
X軸ガイドレール10は固定されており、X、Y制御部
9はモータと機構部品を有し、このX軸ガイドレール1
0の上を移動する。The X-axis guide rail 10 is fixed, and the X and Y control section 9 has a motor and mechanical parts.
Move above 0.
X、Y軸制御部9のY方向の制御は、X−Y軸制御部の
モータと機構部品が動作することによりX、Y軸制御部
9に取付けられているY軸ガイドレール11が移動する
ことによってなされる。The Y-direction control of the X- and Y-axis control section 9 is performed by moving the Y-axis guide rail 11 attached to the X- and Y-axis control section 9 by operating the motor and mechanical parts of the X-Y-axis control section. done by
またY軸ガイドレール11の先端部にはバネ入りピンl
を上下に移動させるシリンダー等の機構部品をもつバネ
入りピンの支持具6がある。In addition, the tip of the Y-axis guide rail 11 has a spring-loaded pin l.
There is a spring-loaded pin support 6 that has mechanical parts such as cylinders that move the pin up and down.
これらのバネ入りピン1のX、Y軸制御部9、上下方向
の移動をさせる支持具6へ送る信号はX−Y軸制御装置
8から出力されている。Signals sent to the X- and Y-axis controllers 9 and the support 6 for vertically moving these spring-loaded pins 1 are output from the X-Y-axis controller 8.
以上のように構成されたプリント基板布線検査装置につ
いてその作用を説明する。The operation of the printed circuit board wiring inspection apparatus configured as described above will be explained.
下向きのバネ入りピン1a、ICと上向きのバネ入りピ
ン1bの間に基板基材4を設置する。A substrate base material 4 is installed between the downward spring-loaded pin 1a and the IC and the upward spring-loaded pin 1b.
X−Y軸制御ll装置8から出される信号により、ハネ
入りビン1はX軸、Y軸方向に移動し、配線5の両端の
位置にくる。次にバネ入りビン支持具6によりバネ入り
ビンlが基板基材4側へ移動し、バネ入りビン1の接触
部の針2は配線5と接触する。The honey bottle 1 moves in the X-axis and Y-axis directions according to a signal output from the X-Y axis control device 8, and comes to the positions at both ends of the wiring 5. Next, the spring-loaded bottle 1 is moved toward the substrate base material 4 side by the spring-loaded bottle support 6, and the needle 2 of the contact portion of the spring-loaded bottle 1 comes into contact with the wiring 5.
導通検査機7により配線両端の抵抗値を測定し、バネ入
りビンが元の位置へ戻り、次に別の配線の位置へバネ入
りビン1が移動する。配線の両端が基板上面にあるとき
は下向きのバネ入りビンの針・2本を用いて制御する。The resistance value at both ends of the wire is measured by the continuity tester 7, the spring-loaded bottle returns to its original position, and then the spring-loaded bottle 1 is moved to another wiring position. When both ends of the wiring are on the top surface of the board, control is performed using two downward-facing spring bottle needles.
配線の両端が基板の両面にある場合、対面するバネ入り
ビンを1本ずつ制御する。When both ends of the wiring are on both sides of the board, the facing spring jars are controlled one by one.
以上のくりかえしにより、全配線についてその良否の検
査をすることができる。実施例において基板の下面に配
線の両端がある場合は基板を裏がえす。By repeating the above steps, all wiring can be inspected for quality. In the embodiment, if both ends of the wiring are on the bottom surface of the board, turn the board over.
以上のように本実施例によれば、それぞれ対面する1本
ないし複数の針2とその針のX軸、Y軸位置を移動させ
る為の複数個のモーターとガイドレール等の機構部品と
、針を上下に移動させるシリンダー等の機構部品で構成
され、それらの制御装置から送られてくる信号により、
針のX軸、Y軸の針の移動と針の」−下動を行ない、そ
れぞれの針先と接触する測定片の電気抵抗値を測定する
ことにより、1台の装置で様々な基板に対して検査する
ことができ、安価で早く出荷することができ、制御装置
から出力される電気信号によりバネ入りビンの針の位置
制御をするので検査品質も高い。As described above, according to this embodiment, one or more needles 2 facing each other, mechanical components such as a plurality of motors and guide rails for moving the X-axis and Y-axis positions of the needles, and the needles are provided. It consists of mechanical parts such as cylinders that move up and down, and the signals sent from those control devices
By moving the needle on the X and Y axes and moving the needle downward, and measuring the electrical resistance of the measurement piece that comes into contact with each needle tip, one device can be used for various substrates. It can be inspected at low cost and shipped quickly, and the inspection quality is also high because the position of the needle of the spring bottle is controlled by the electric signal output from the control device.
なお、実施例では両面基板を例にして説明したが片面基
板、多層基板でも良い。また、バネ入りビンの針は3本
としたが対面する針は1本以上であっても良い。In the embodiment, a double-sided board was used as an example, but a single-sided board or a multilayer board may also be used. Further, although the spring-loaded bottle has three needles, the number of facing needles may be one or more.
発明の効果
以上のように本発明によれば、それぞれ対面する1本な
いし複数の針と、その針先のX軸・Y軸位置を移動させ
るための複数個のモーターとガイドレール等の機構部品
と、針を上下に移動させるシリンダー等の機構部品で構
成され、それらの制御装置から送られてくる信号により
針のX軸、Y軸の移動と針の上下を行ない、それぞれの
針先と接触する測定片の電気抵抗値を測定することによ
り、1台の装置で様々な基板に対して検査することがで
き、プリント基板を安価で早く出荷することができ、ま
た制御装置から出力される信号によりハネ入りビンの針
の位置制御をするので検査品質も高く、実用的効果は極
めて大である。Effects of the Invention As described above, according to the present invention, one or more needles facing each other, and mechanical parts such as a plurality of motors and guide rails for moving the X-axis and Y-axis positions of the tips of the needles, are provided. It consists of mechanical parts such as a cylinder that moves the needle up and down, and the signals sent from these control devices move the needle in the X and Y axes and move the needle up and down, making contact with each needle tip. By measuring the electrical resistance value of the measurement piece, it is possible to test various boards with one device, and the printed circuit board can be shipped cheaply and quickly. Since the position of the needle in the honey bottle is controlled by this method, the inspection quality is high and the practical effect is extremely large.
第1図は本発明の一実施例におけるプリント基板布線検
査装置のシステムの断面概略図、第2図は本発明の一実
施例におけるプリント基板布線検査装置の全体の斜視図
、第3図は従来のプリント基板布線検査装置の一例のシ
ステムの断面図である。
1・・・・・・バネ入りビン、2・・・・・・バネ入す
ピンの接触部、3・・・・・・ソルダーレジスト、4・
・・・・・基板基材、5・・・・・・配線、6・・・・
・・バネ入りピン支持具、7・旧・・導通検査機、8・
・・・・・X−Y軸制御装置、9・・・・・・XY軸制
御部、IO・・・・・・X軸ガイドレール、11・・自
・・Y軸ガイドレール。
代理人の氏名 弁理士 粟野重孝 はか1名lど一−−
,(言号滅FIG. 1 is a schematic cross-sectional view of a system of a printed circuit board wiring inspection apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the entire printed circuit board wiring inspection apparatus according to an embodiment of the present invention, and FIG. 1 is a cross-sectional view of an example system of a conventional printed circuit board wiring inspection device. 1...Bin with spring, 2...Contact part of pin to insert spring, 3...Solder resist, 4...
... Board base material, 5 ... Wiring, 6 ...
・・Spring pin supporter, 7・・Continuity tester, 8・
...X-Y axis control device, 9...XY-axis control unit, IO...X-axis guide rail, 11...Self...Y-axis guide rail. Name of agent: Patent attorney Shigetaka Awano
, (speechless
Claims (1)
軸、Y軸の位置を移動させる為の機構手段と、針を上下
に移動させる機構手段で構成され、それらの制御装置か
ら送られてくる信号により、上記針のX軸、Y軸方向の
移動と針の上下移動を行ない、それぞれの針先と接触す
る測定部の電気抵抗値を測定するようにしたことを特徴
とするプリント基板布線検査装置。One or more needles facing each other and the X of the needles
It consists of mechanical means for moving the position of the axis and Y-axis, and mechanical means for moving the needle up and down, and the movement of the needle in the X-axis and Y-axis directions is controlled by signals sent from these control devices. A printed circuit board wiring inspection device characterized in that the needle is moved up and down to measure the electrical resistance value of a measuring part that comes into contact with each needle tip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28933688A JPH02136759A (en) | 1988-11-16 | 1988-11-16 | Inspecting device for wiring of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28933688A JPH02136759A (en) | 1988-11-16 | 1988-11-16 | Inspecting device for wiring of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02136759A true JPH02136759A (en) | 1990-05-25 |
Family
ID=17741879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28933688A Pending JPH02136759A (en) | 1988-11-16 | 1988-11-16 | Inspecting device for wiring of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02136759A (en) |
-
1988
- 1988-11-16 JP JP28933688A patent/JPH02136759A/en active Pending
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