JPH0954228A - Optical transmission module - Google Patents
Optical transmission moduleInfo
- Publication number
- JPH0954228A JPH0954228A JP20859895A JP20859895A JPH0954228A JP H0954228 A JPH0954228 A JP H0954228A JP 20859895 A JP20859895 A JP 20859895A JP 20859895 A JP20859895 A JP 20859895A JP H0954228 A JPH0954228 A JP H0954228A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- groove
- optical
- light receiving
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、高速光通信用の平
面実装光受信モジュールの構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a planar mount optical receiver module for high speed optical communication.
【0002】[0002]
【従来の技術】従来、このような分野の光受信モジュー
ルの技術としては、「AT&T“131−Type w
ith Integrated Pre−Amp”」の
技術資料に開示されるものがある。図3は上記文献に開
示された従来の光受信モジュールの構成例を示す説明図
で、図3(a)は分解斜視図、図3(b)は受光部分の
側断面図、図3(c)は光ファイバを固定する部分の正
面断面図である。2. Description of the Related Art Conventionally, as a technique of an optical receiver module in such a field, there is "AT &T" 131-Type w ".
Some of them are disclosed in the technical data of "it Integrated Pre-Amp". 3A and 3B are explanatory views showing a configuration example of the conventional optical receiving module disclosed in the above document, FIG. 3A is an exploded perspective view, FIG. 3B is a side sectional view of a light receiving portion, and FIG. 4) is a front sectional view of a portion for fixing an optical fiber.
【0003】図において、51は光受信モジュールで、
この光受信モジュール51は半導体受光素子52、光フ
ァイバ53を搭載するV溝54が形成されたSi基板5
5、このSi基板55と前置増幅器56を収納するパッ
ケージ57および電気信号を出力する出力端子と前記半
導体受光素子52と前置増幅器56に電源を供給する電
源供給端子とを備えた端子58より構成される。In the figure, 51 is an optical receiver module,
The light receiving module 51 includes a semiconductor light receiving element 52 and a Si substrate 5 on which a V groove 54 for mounting an optical fiber 53 is formed.
5. From a terminal 58 having a package 57 for accommodating the Si substrate 55 and the preamplifier 56, an output terminal for outputting an electric signal, a power supply terminal for supplying power to the semiconductor light receiving element 52 and the preamplifier 56. Composed.
【0004】前記V溝54は、図3(c)に示すように
前記光ファイバ53全体が入り込む深さがあり、このV
溝の先端の斜面に光ファイバ53の先端を付き当てて位
置決めが行えるようになっている。また、この斜面を反
射面として、光ファイバ53から放射した光を反射し、
その光をSi基板55上に実装した半導体受光素子52
に入光するようになっている。ここで、光ファイバ53
の先端から半導体受光素子52までの距離を短くするた
め、該光ファイバ53の先端は半導体受光素子52の下
に入り込む位置で固定される。As shown in FIG. 3 (c), the V groove 54 has a depth into which the entire optical fiber 53 is inserted.
Positioning can be performed by abutting the tip of the optical fiber 53 on the inclined surface of the tip of the groove. Also, with this slope as a reflecting surface, the light emitted from the optical fiber 53 is reflected,
Semiconductor light receiving element 52 in which the light is mounted on a Si substrate 55
It is designed to enter. Here, the optical fiber 53
In order to shorten the distance from the tip to the semiconductor light receiving element 52, the tip of the optical fiber 53 is fixed at a position where it enters below the semiconductor light receiving element 52.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、上述し
た従来の光受信モジュールでは、光ファイバの先端が半
導体受光素子の下に入り込む構造のため、半導体受光素
子をSi基板に実装した後に光ファイバを実装しようと
すると、光ファイバの先端の位置を確認できないため、
光ファイバの先端で半導体受光素子を破損したり、光フ
ァイバの先端を破損したりするという問題がある。However, in the above-mentioned conventional optical receiving module, since the tip of the optical fiber enters under the semiconductor light receiving element, the semiconductor optical element is mounted on the Si substrate and then the optical fiber is mounted. If you try, you cannot confirm the position of the tip of the optical fiber.
There is a problem that the semiconductor light receiving element is damaged at the tip of the optical fiber or the tip of the optical fiber is damaged.
【0006】また、光ファイバの先端の位置が確認でき
ないので、正規の位置に光ファイバが固定されず、結合
効率が低下するという問題がある。さらに、光ファイバ
を先に実装すると、半導体受光素子実装時に加えられる
熱で光ファイバの固定の信頼性が劣化するという問題が
ある。Further, since the position of the tip of the optical fiber cannot be confirmed, there is a problem that the optical fiber is not fixed at the proper position and the coupling efficiency is lowered. Further, if the optical fiber is first mounted, there is a problem that the reliability of fixing the optical fiber is deteriorated by the heat applied when mounting the semiconductor light receiving element.
【0007】[0007]
【課題を解決するための手段】上述した課題を解決する
ため、本発明は、基板に形成されたV溝に光ファイバを
固定し、V溝の先端に反射面を形成して光ファイバの光
軸を変換し、前記基板に実装される半導体受光素子に光
を入力する光受信モジュールにおいて、前記V溝を形状
の異なる2つの部分から構成し、形状の異なる境界部分
に前記光ファイバ先端の固定面を形成し、V溝のこの固
定面より先端側の部分に光ファイバの光軸を変換する反
射面を設けたもので、前記固定面の位置が半導体受光素
子の下に入り込まない位置とし、かつ、前記V溝の光フ
ァイバの固定される部分の深さは、光ファイバ全体がV
溝に入り込まない深さとしたものである。In order to solve the above-mentioned problems, the present invention fixes an optical fiber in a V groove formed in a substrate and forms a reflecting surface at the tip of the V groove to form an optical fiber. In an optical receiving module for converting an axis and inputting light to a semiconductor light receiving element mounted on the substrate, the V groove is composed of two parts having different shapes, and the tip of the optical fiber is fixed to a boundary part having different shapes. A surface is formed, and a reflection surface for converting the optical axis of the optical fiber is provided in a portion of the V-groove on the tip side of the fixed surface, and the fixed surface is positioned so as not to go under the semiconductor light receiving element. In addition, the depth of the portion of the V groove where the optical fiber is fixed is V for the entire optical fiber.
It is a depth that does not enter the groove.
【0008】[0008]
【発明の実施の形態】図1は本発明の光受信モジュール
の第1の発明の形態を示す説明図で、図1(a)は分解
斜視図、図1(c)は受光部分の側断面図である。図に
おいて、1は光受信モジュールで、光受信モジュール1
は以下に示す構成よりなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view showing a first embodiment of an optical receiving module of the present invention, FIG. 1 (a) is an exploded perspective view, and FIG. 1 (c) is a side cross section of a light receiving portion. It is a figure. In the figure, reference numeral 1 denotes an optical receiving module, which is an optical receiving module 1.
Has the following configuration.
【0009】2はSi基板で、このSi基板2には光フ
ァイバ3を固定するためのV溝4が設けられている。5
は半導体受光素子で、裏面には光の入射面が設けられ、
この入射面が前記V溝4上の所定の位置ににくるように
前記Si基板2上に実装される。6は前置増幅器で、こ
の前置増幅器6と前記Si基板2はパッケージ7に収納
される。このパッケージ7には、電気信号を出力する出
力端子と前記半導体受光素子5と前置増幅器6に電源を
供給する電源供給端子とよりなる端子8が備えられてい
る。Reference numeral 2 is a Si substrate, and a V groove 4 for fixing the optical fiber 3 is provided on the Si substrate 2. 5
Is a semiconductor light receiving element, and a light incident surface is provided on the back surface,
It is mounted on the Si substrate 2 so that the incident surface is located at a predetermined position on the V groove 4. 6 is a preamplifier, and the preamplifier 6 and the Si substrate 2 are housed in a package 7. The package 7 is provided with a terminal 8 including an output terminal for outputting an electric signal, and a power supply terminal for supplying power to the semiconductor light receiving element 5 and the preamplifier 6.
【0010】次に、前記V溝4の形状について説明す
る。図2はV溝の第1の実施の形態を示す説明図で、図
2(a)は平面図、図2(b)は側断面図、図2(c)
は正面断面図である。図2に示すように、V溝4は幅お
よび深さの異なる2つの部分から構成される。Next, the shape of the V groove 4 will be described. 2A and 2B are explanatory views showing the first embodiment of the V groove, FIG. 2A is a plan view, FIG. 2B is a side sectional view, and FIG.
Is a front sectional view. As shown in FIG. 2, the V groove 4 is composed of two portions having different widths and depths.
【0011】すなわち、V溝4の幅が広く深さの深い部
分は光ファイバ3の固定部9となり、V溝4のこの固定
部9より先端側は幅を狭く深さを浅くした光軸変換部1
0となり、固定部9と光軸変換部10との境界部分に光
ファイバ3の先端の位置を決める固定面11が形成され
る。この固定面11の位置は、半導体受光素子5の下に
入り込まない位置とする。That is, the wide and deep portion of the V-groove 4 serves as the fixing portion 9 of the optical fiber 3, and the tip end side of the V-groove 4 has a narrower width and a shallower optical axis conversion. Part 1
0, and a fixed surface 11 that determines the position of the tip of the optical fiber 3 is formed at the boundary between the fixed portion 9 and the optical axis conversion portion 10. The position of the fixed surface 11 is set so as not to go under the semiconductor light receiving element 5.
【0012】ここで、V溝4の固定部9の幅は、光ファ
イバ3全体がV溝4の中に入り込む深さでなく、光ファ
イバ3のコア3aまでがV溝4に入り込む深さとなるよ
うな幅としている。例えば、光ファイバ3がコア径10
μm、クラッド径125μmのシングルモード光ファイ
バの場合、V溝4の固定部9の幅を180μmとする
と、光ファイバ3がV溝4に入り込む深さは81μmと
なって、光ファイバ3全体がV溝4に入り込まない。Here, the width of the fixing portion 9 of the V-groove 4 is not such a depth that the entire optical fiber 3 enters the V-groove 4, but the depth that the core 3a of the optical fiber 3 extends into the V-groove 4. It has such a width. For example, the optical fiber 3 has a core diameter of 10
In the case of a single mode optical fiber having a μm and a cladding diameter of 125 μm, if the width of the fixed portion 9 of the V groove 4 is 180 μm, the depth of the optical fiber 3 entering the V groove 4 is 81 μm, and the entire optical fiber 3 is V Does not enter groove 4.
【0013】また、光軸変換部10の幅は、前記固定部
9の半分程度とすることで、光軸変換部10と固定部9
の境界の斜面に光ファイバ3が突き当たり、これにより
光ファイバ3の固定面11が形成できるとともに、光フ
ァイバ3から放射される光は光軸変換部10を通過する
ことができる。そして、光軸変換部10の先端には斜面
を形成し、この斜面を反射面12として、光ファイバ3
から放射される光の光軸をSi基板2の表面方向に変換
する。前記半導体受光素子5は、その裏面に設けられた
図示しない光の入射面がV溝4の反射面12の上にくる
ようにSi基板2に実装される。The width of the optical axis converter 10 is about half that of the fixed portion 9, so that the optical axis converter 10 and the fixed portion 9 are separated.
The optical fiber 3 abuts on the slope of the boundary of the optical fiber 3, whereby the fixing surface 11 of the optical fiber 3 can be formed, and the light emitted from the optical fiber 3 can pass through the optical axis converter 10. Then, an inclined surface is formed at the tip of the optical axis conversion unit 10, and this inclined surface is used as the reflection surface 12 to form the optical fiber 3
The optical axis of the light radiated from is converted to the surface direction of the Si substrate 2. The semiconductor light receiving element 5 is mounted on the Si substrate 2 so that a light incident surface (not shown) provided on the back surface of the semiconductor light receiving element 5 is on the reflecting surface 12 of the V groove 4.
【0014】以下に、上述した第1の実施の形態の光受
信モジュールの動作を説明する。光ファイバ3の端面か
ら放射される光はV溝4の先端に設けられた反射面12
で反射し、その光をSi基板2のV溝4の光軸変換部1
0上に設けた半導体受光素子5で受光する。そして、半
導体受光素子5にて光電変換を行って光信号を電気信号
に変換し、この電気信号を前置増幅器6で増幅して、端
子8から出力する。The operation of the optical receiving module according to the first embodiment described above will be described below. The light emitted from the end surface of the optical fiber 3 is reflected by the reflecting surface 12 provided at the tip of the V groove 4.
Reflected by the optical axis conversion unit 1 of the V groove 4 of the Si substrate 2
The light is received by the semiconductor light receiving element 5 provided on the surface 0. Then, the semiconductor light receiving element 5 performs photoelectric conversion to convert the optical signal into an electric signal, which is amplified by the preamplifier 6 and output from the terminal 8.
【0015】以上の構成によると、光ファイバ3はV溝
4の固定部9で固定され、さらに光ファイバ3の先端は
V溝4の固定部9と光軸変換部10の境界部分に形成し
た固定面11に付き当てて固定されるので、無調整で光
ファイバ3と半導体受光素子5との結合ができる。ま
た、レンズを用いずV溝4の先端の斜面を反射面12と
して光軸変換する平面実装とし、光ファイバ3の端面か
ら放射した光を前記反射面12で反射し、その光をV溝
4が設けられているSi基板2上の半導体受光素子5で
受光する構造であるため、光受信モジュールは小型で薄
型にすることができる。According to the above construction, the optical fiber 3 is fixed by the fixing portion 9 of the V groove 4, and the tip of the optical fiber 3 is formed at the boundary portion between the fixing portion 9 of the V groove 4 and the optical axis converting portion 10. Since the optical fiber 3 and the semiconductor light receiving element 5 can be coupled to each other without adjustment, the optical fiber 3 and the semiconductor light receiving element 5 can be coupled to each other without adjustment. Further, without using a lens, the inclined surface at the tip of the V groove 4 is used as a reflecting surface 12 for optical axis conversion, and the light emitted from the end surface of the optical fiber 3 is reflected by the reflecting surface 12, and the light is V groove 4. Since the structure is such that light is received by the semiconductor light receiving element 5 on the Si substrate 2 provided with, the light receiving module can be made small and thin.
【0016】ここで、本発明第1の実施の形態の光受信
モジュールにおいては、光ファイバ3の全体がV溝4に
入り込まないように該V溝4の固定部9の幅を決めてお
り、このとき、光ファイバ3のコア3a全体が半導体受
光素子5の底面の入射表面よりも低い位置にあって、光
ファイバ3からの放射パターンが反射面12に当たるよ
うにすればよいので、反射面12から半導体受光素子5
の入射面までの距離が短くなり、このため、光ファイバ
3の先端を半導体受光素子5の下に入り込ませない位置
まで後退させても光ファイバ3の先端から半導体受光素
子5の入射面までの距離が延びることはなく、光ファイ
バ3がコア径10μm、クラッド径125μmのシング
ルモードの光ファイバの場合、光ファイバ3の端面から
半導体受光素子5の入射面までの距離は140〜170
μmとなり、この距離は、光ファイバの先端を半導体受
光素子5の下に入り込ませていた従来のものと変わらな
い。Here, in the optical receiver module of the first embodiment of the present invention, the width of the fixing portion 9 of the V groove 4 is determined so that the entire optical fiber 3 does not enter the V groove 4. At this time, since the entire core 3a of the optical fiber 3 is located at a position lower than the incident surface of the bottom surface of the semiconductor light receiving element 5 and the radiation pattern from the optical fiber 3 hits the reflecting surface 12, the reflecting surface 12 To semiconductor light receiving element 5
The distance from the tip of the optical fiber 3 to the incident surface of the semiconductor light receiving element 5 is reduced even if the tip of the optical fiber 3 is retracted to a position where it does not enter under the semiconductor light receiving element 5. If the optical fiber 3 is a single-mode optical fiber having a core diameter of 10 μm and a cladding diameter of 125 μm, the distance from the end surface of the optical fiber 3 to the incident surface of the semiconductor light receiving element 5 is 140 to 170.
μm, which is the same as the conventional one in which the tip of the optical fiber is inserted under the semiconductor light receiving element 5.
【0017】また、光ファイバ3の先端を半導体受光素
子5の下に入り込ませずに露出した位置で固定するの
で、組み立てが容易となる。すなわち、半導体受光素子
5をSi基板2に実装した後、光ファイバ3の先端の位
置を確認して該光ファイバを固定するため、光ファイバ
3の先端で半導体受光素子5を破損したり、正規の位置
に光ファイバ3が固定されず結合効率が低下するという
ことはない。さらに、光ファイバ3の先端の位置を確認
してから該光ファイバ3を固定するので、組み立て精度
が向上し、組み立て許容範囲が向上する。Further, since the tip of the optical fiber 3 is fixed at the exposed position without entering under the semiconductor light receiving element 5, the assembly becomes easy. That is, after mounting the semiconductor light receiving element 5 on the Si substrate 2, the position of the tip of the optical fiber 3 is confirmed and the optical fiber is fixed. The optical fiber 3 is not fixed at the position of and the coupling efficiency does not decrease. Furthermore, since the optical fiber 3 is fixed after the position of the tip of the optical fiber 3 is confirmed, the assembly accuracy is improved and the allowable assembly range is improved.
【0018】[0018]
【発明の効果】以上説明したように、本発明は、光ファ
イバを固定するために基板に形成されるV溝を形状の異
なる2つの部分から構成し、形状の異なる境界部分に前
記光ファイバ先端の固定面を形成し、V溝のこの固定面
より先端側の部分に光ファイバの光軸を変換する反射面
を設けるとともに、前記固定面の位置が半導体受光素子
の下に入り込まない位置としたので、半導体受光素子を
基板に実装した後、光ファイバの先端の位置を確認して
該光ファイバを固定することができるため、光ファイバ
の先端で半導体受光素子を破損したり、正規の位置に光
ファイバが固定されず結合効率が低下するということは
ない。さらに、光ファイバの先端の位置を確認してから
該光ファイバを固定するので、組み立て精度が向上し、
組み立て許容範囲が向上して、これにより、組み立て工
数、組み立て歩留りの向上が期待できる。As described above, according to the present invention, the V groove formed on the substrate for fixing the optical fiber is composed of two portions having different shapes, and the optical fiber tip is provided at the boundary portion having the different shape. And a reflecting surface for converting the optical axis of the optical fiber is provided in the portion of the V groove on the tip side of this fixing surface, and the position of the fixing surface is set so as not to go under the semiconductor light receiving element. Therefore, after mounting the semiconductor light receiving element on the substrate, the position of the tip of the optical fiber can be confirmed and the optical fiber can be fixed. The optical fiber is not fixed and the coupling efficiency does not decrease. Furthermore, since the optical fiber is fixed after the position of the tip of the optical fiber is confirmed, the assembly accuracy is improved,
The allowable assembly range is improved, which can be expected to improve the assembly man-hour and the assembly yield.
【0019】また、V溝の深さを光ファイバ全体が入り
込まない深さとしたので、V溝先端の反射面から半導体
受光素子までの距離を短くでき、これにより、光ファイ
バの先端を半導体受光素子の下に入り込ませない位置ま
で後退させても、光ファイバの端面から半導体受光素子
までの距離は短くでき、結合効率が低下することはな
い。Further, since the depth of the V groove is set so that the entire optical fiber does not enter, the distance from the reflecting surface at the tip of the V groove to the semiconductor light receiving element can be shortened, whereby the tip of the optical fiber is placed at the semiconductor light receiving element. Even if it is retracted to a position where it does not enter below, the distance from the end face of the optical fiber to the semiconductor light receiving element can be shortened, and the coupling efficiency does not decrease.
【図1】本発明の光受信モジュールの第1の発明の形態
を示す説明図FIG. 1 is an explanatory view showing an embodiment of a first invention of an optical receiver module of the present invention.
【図2】V溝の第1の実施の形態を示す説明図FIG. 2 is an explanatory view showing a first embodiment of a V groove.
【図3】従来の光受信モジュールの説明図FIG. 3 is an explanatory diagram of a conventional optical receiver module.
1 光受信モジュール 2 Si基板 3 光ファイバ 4 V溝 5 半導体受光素子 9 固定部 10 光軸変換部 11 固定面 12 反射面 DESCRIPTION OF SYMBOLS 1 Optical receiving module 2 Si substrate 3 Optical fiber 4 V groove 5 Semiconductor light receiving element 9 Fixed part 10 Optical axis conversion part 11 Fixed surface 12 Reflective surface
Claims (2)
定し、V溝の先端に反射面を形成して光ファイバの光軸
を変換し、前記基板に実装される半導体受光素子に光を
入力する光受信モジュールにおいて、 前記V溝を形状の異なる2つの部分から構成し、形状の
異なる境界部分に前記光ファイバ先端の固定面を形成
し、V溝のこの固定面より先端側の部分に光ファイバの
光軸を変換する反射面を設けるとともに、前記固定面の
位置が半導体受光素子の下に入り込まない位置とするこ
とを特徴とする光受信モジュール。1. An optical fiber is fixed to a V groove formed on a substrate, a reflecting surface is formed at the tip of the V groove to convert the optical axis of the optical fiber, and the semiconductor light receiving element mounted on the substrate receives an optical signal. In the optical receiving module for inputting, the V groove is composed of two parts having different shapes, the fixing surface of the optical fiber tip is formed at a boundary portion having a different shape, and the portion of the V groove on the tip side of the fixing surface. An optical receiving module, characterized in that a reflecting surface for converting the optical axis of the optical fiber is provided on the optical fiber, and the fixed surface is positioned so as not to go under the semiconductor light receiving element.
て、 前記V溝の光ファイバの固定される部分の深さは、光フ
ァイバ全体がV溝に入り込まない深さとすることを特徴
とする光受信モジュール。2. The optical receiving module according to claim 1, wherein the depth of the portion of the V-groove where the optical fiber is fixed is such that the entire optical fiber does not enter the V-groove. module.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20859895A JPH0954228A (en) | 1995-08-16 | 1995-08-16 | Optical transmission module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20859895A JPH0954228A (en) | 1995-08-16 | 1995-08-16 | Optical transmission module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0954228A true JPH0954228A (en) | 1997-02-25 |
Family
ID=16558863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20859895A Pending JPH0954228A (en) | 1995-08-16 | 1995-08-16 | Optical transmission module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0954228A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0987769A2 (en) * | 1998-09-18 | 2000-03-22 | Sumitomo Electric Industries, Ltd. | Photodiode module |
US6333392B1 (en) | 1998-11-12 | 2001-12-25 | Sumitomo Bakelite And Co. Ltd. | Thermosetting amic acid microfine particles, thermosetting imide microfine particles, crosslinked imide microfine particles, and processes for their production |
US6335418B1 (en) | 1999-02-26 | 2002-01-01 | Osaka Prefectural Government | Functional polyamic acid microfine particles, functional polyimide microfine particles, and processes for their production |
EP1180705A2 (en) * | 2000-08-18 | 2002-02-20 | Sumitomo Electric Industries, Ltd. | Light receiving module |
US6360041B1 (en) | 1999-03-30 | 2002-03-19 | Nippon Sheet Glass Co., Ltd. | Optical demultiplexer and method of assembling optical demultiplexer in optical axis alignment |
WO2002065172A3 (en) * | 2001-02-10 | 2003-04-24 | Bookham Technology Plc | Alignment of an optical component |
JP2003177287A (en) * | 2001-12-12 | 2003-06-27 | Sumitomo Electric Ind Ltd | Light receiving module |
US6824313B2 (en) | 2002-02-07 | 2004-11-30 | Sumitomo Electric Industries, Ltd. | Optical receiver module |
WO2011105078A1 (en) | 2010-02-23 | 2011-09-01 | パナソニック電工株式会社 | Optical module |
CN102890317A (en) * | 2011-07-21 | 2013-01-23 | 西铁城控股株式会社 | Optical module |
CN103401136A (en) * | 2013-07-29 | 2013-11-20 | 武汉锐科光纤激光器技术有限责任公司 | Optical fiber fixing device coupled with high-power semiconductor laser |
CN103620893A (en) * | 2011-06-22 | 2014-03-05 | 松下电器产业株式会社 | Optical module |
-
1995
- 1995-08-16 JP JP20859895A patent/JPH0954228A/en active Pending
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0987769A2 (en) * | 1998-09-18 | 2000-03-22 | Sumitomo Electric Industries, Ltd. | Photodiode module |
EP0987769A3 (en) * | 1998-09-18 | 2001-03-07 | Sumitomo Electric Industries, Ltd. | Photodiode module |
US6257772B1 (en) | 1998-09-18 | 2001-07-10 | Sumitomo Electric Industries, Ltd. | Photodiode module |
US6333392B1 (en) | 1998-11-12 | 2001-12-25 | Sumitomo Bakelite And Co. Ltd. | Thermosetting amic acid microfine particles, thermosetting imide microfine particles, crosslinked imide microfine particles, and processes for their production |
US6335418B1 (en) | 1999-02-26 | 2002-01-01 | Osaka Prefectural Government | Functional polyamic acid microfine particles, functional polyimide microfine particles, and processes for their production |
US6360041B1 (en) | 1999-03-30 | 2002-03-19 | Nippon Sheet Glass Co., Ltd. | Optical demultiplexer and method of assembling optical demultiplexer in optical axis alignment |
EP1180705A2 (en) * | 2000-08-18 | 2002-02-20 | Sumitomo Electric Industries, Ltd. | Light receiving module |
JP2002064212A (en) * | 2000-08-18 | 2002-02-28 | Sumitomo Electric Ind Ltd | Light receiving module |
EP1180705A3 (en) * | 2000-08-18 | 2004-04-21 | Sumitomo Electric Industries, Ltd. | Light receiving module |
WO2002065172A3 (en) * | 2001-02-10 | 2003-04-24 | Bookham Technology Plc | Alignment of an optical component |
JP2003177287A (en) * | 2001-12-12 | 2003-06-27 | Sumitomo Electric Ind Ltd | Light receiving module |
US6824313B2 (en) | 2002-02-07 | 2004-11-30 | Sumitomo Electric Industries, Ltd. | Optical receiver module |
WO2011105078A1 (en) | 2010-02-23 | 2011-09-01 | パナソニック電工株式会社 | Optical module |
CN102834754A (en) * | 2010-02-23 | 2012-12-19 | 松下电器产业株式会社 | Optical module |
US8768122B2 (en) | 2010-02-23 | 2014-07-01 | Panasonic Corporation | Optical module |
JP5690324B2 (en) * | 2010-02-23 | 2015-03-25 | パナソニックIpマネジメント株式会社 | Optical module |
CN102834754B (en) * | 2010-02-23 | 2015-11-25 | 松下知识产权经营株式会社 | Optical module |
CN103620893A (en) * | 2011-06-22 | 2014-03-05 | 松下电器产业株式会社 | Optical module |
US20140119690A1 (en) * | 2011-06-22 | 2014-05-01 | Panasonic Corporation | Optical module |
US9046668B2 (en) | 2011-06-22 | 2015-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Optical module |
TWI491944B (en) * | 2011-06-22 | 2015-07-11 | Panasonic Corp | Light module |
CN102890317A (en) * | 2011-07-21 | 2013-01-23 | 西铁城控股株式会社 | Optical module |
US8920047B2 (en) | 2011-07-21 | 2014-12-30 | Citizen Holdings Co., Ltd. | Optical module |
CN102890317B (en) * | 2011-07-21 | 2015-04-22 | 西铁城控股株式会社 | Optical module |
CN103401136A (en) * | 2013-07-29 | 2013-11-20 | 武汉锐科光纤激光器技术有限责任公司 | Optical fiber fixing device coupled with high-power semiconductor laser |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5163113A (en) | Laser-to-fiber coupling apparatus | |
KR100770853B1 (en) | Optical module | |
US6374021B1 (en) | Light transmitting/receiving module | |
US5909523A (en) | Optical module and method of fabricating optical module | |
US6547451B1 (en) | Optical communications module and method for mounting optical communications module | |
JP2665784B2 (en) | Mounting device for multiple optical fibers and lasers | |
JPH0954228A (en) | Optical transmission module | |
US8090228B2 (en) | Photoelectric conversion device, photoelectric conversion module and method of manufacturing photoelectric conversion device | |
JP2700010B2 (en) | Photoelectric device package and method of forming the same | |
US6792178B1 (en) | Fiber optic header with integrated power monitor | |
JP2000249875A (en) | Optical communication module | |
US5243671A (en) | Laser-to-fiber coupling apparatus | |
US6282006B1 (en) | Optical communications apparatus and method | |
US20060215726A1 (en) | Integrated optical detector in semiconductor reflector | |
JPH07234345A (en) | Photodetecting structure of waveguide type optical device | |
JPH05333251A (en) | Optical array module and optical array link | |
JP2000156510A (en) | Optical semiconductor device, manufacture thereof, and optical electronic device | |
JPH0595123A (en) | Light receiving module | |
JP3032376B2 (en) | Semiconductor laser device | |
JP3003324B2 (en) | Optical receiving module | |
JP2001221933A (en) | Optical fiber and its manufacturing method | |
US5252823A (en) | Combined light source and readout for fiber-optic sensors with reduced back-reflections | |
JPH0230192A (en) | Semiconductor laser device | |
JP3266376B2 (en) | Optical package | |
JP3429329B2 (en) | Prism coupling device |