JPH0945249A - Plasma display panel and manufacture of it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel for restraining the reflection of an ultraviolet ray from a discharge electrode, and having a barrier rib high in accuracy and adhesive strength, in forming the barrier rib by using photosensitive material, by providing a light transmission restraining layer between the barrier rib and a back surface base board. SOLUTION: This plasma display panel is provided with a front surface transparent base board 11 having discharge electrodes 12 and 22, and a back surface base board 21; a luminous gas 4 enclosed between front surface transparent and back surface base boards 11 and 21, emitting light by electric discharge; a barrier rib 3 grid-like or stripe-like demarcating luminescence by the gas 4 as a display picture element, and provided in a gap; and a dielectric layer 23 provided between the rib 3 and the board 21, and having a function for accumulating a discharged electric charge and a light transmission restraining effect for restraining the transmission of light (e.g. 23a and 23b: a dielectric layer, 23c: a light transmission restraining layer having a function for restraining the transmission of an ultraviolet ray).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (hereinafter abbreviated as PDP) used as a display device for various information devices and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as a man-machine interface in the multimedia age, image information and character information of various control devices such as computers, information communication systems and / or terminals, display guide boards of public facilities or building management systems are highly accurate, Attention has been paid to PDPs that can be displayed with high brightness and have a large screen and a thin profile.

FIG. 10 is a partial sectional view showing a part of the structure of a conventional AC type PDP. In FIG. 10, 11 is a front transparent substrate made of a glass plate or the like, 12
Is a first discharge electrode composed of a plurality of so-called stripe-shaped transparent electrodes which are spaced from each other on the inner surface of the front transparent substrate 11, and 13 is a discharge charge formed on the first discharge electrode. Is a dielectric layer for accumulating, a rear substrate facing the front transparent substrate 11 with a minute gap, which is a rear plate made of a glass plate or the like, 22 is an inner surface of the rear substrate, and the first discharge electrode 12 and The second discharge electrodes 23 are formed in a stripe shape so as to intersect each other and form a matrix arrangement for both discharge electrodes. Reference numeral 23 is a dielectric layer formed on the second discharge electrodes for accumulating discharge charges. Reference numeral 3 is In order to evenly separate the front transparent substrate 11 and the rear substrate 21, barrier ribs are formed on both substrates in a planar manner. The detailed structure of the barrier ribs is the emission of emission gas due to discharge at the intersection of the discharge electrodes. For partitioning the pixel for display, parallel to the second discharge electrode 22 is for example one having a lattice shape or a stripe shape. Note that the detailed structure may have the opposite relationship to the above description for both discharge electrodes. Further, as is well known, in the sealed space between the two substrates 11 and 21, a luminescent gas 4 such as neon, helium, xenon, etc.
Is enclosed.

Next, the operation of the AC type PDP shown in FIG. 10 will be described. Although not shown, a driving power source selectively applies a voltage to each of the first and second discharge electrodes 12 and 22 in a scanning manner via a drive control circuit. When the potential difference at the intersection of the discharge electrodes 12 and 22 exceeds the discharge start voltage, the discharge is started at the intersection p. When discharged, the luminescent gas 4 enclosed in the sealed space between the electrodes 12 and 22 emits light, and the light is emitted from the dielectric layer 1 as indicated by an arrow in the figure.
3, output to the outside via the discharge electrode 12 and the front transparent substrate 11. That is, the intersection between the discharge electrodes 12 and 22, that is, the discharge emission point p becomes a pixel, and a desired display is performed by selectively emitting light. Although not shown, in the case of a color PDP, the ultraviolet rays generated by the discharge are applied to the surface of the dielectric layer 13 or 23 or the barrier rib 3.
The phosphor provided on the side wall of the is irradiated with visible light that is excited at that time. In that case, the phosphor is formed to be transmissive or reflective with respect to the discharge light emission point p.

Next, after the start of discharge, positive and negative charges are respectively attracted to both dielectric layers 13 and 23, and the charges are accumulated in the dielectric layers to generate a wall voltage, so that the dielectric layers 13 and 23 at the intersections. The effective discharge potential difference between the surfaces of the electrodes decreases, and the discharge cannot be maintained. However, since the driving power source is an alternating current, when the voltage phase shifts to the opposite polarity, the wall voltage of the dielectric layers 13 and 23 and the applied voltage are added, and the effective discharge between the surfaces of the dielectric layers 13 and 23 at the intersection is performed. Since the potential difference exceeds the discharge start voltage, the discharge state is restored. Then, similarly to the above, the dielectric layers 13 and 2
Discharge is stopped by the accumulation of electric charge in 3. Hereinafter, the blinking operation is repeated until the applied voltage is removed. Since the AC frequency of the driving power supply is set higher than the response characteristics of human eyes, the blinking operation does not appear as flicker.

In the conventional example described above, an AC type PDP in which the driving power source having a dielectric layer is an alternating current is described. However, in the case of a DC type PDP in which the driving power source is a direct current, as shown in FIG. In comparison with the AC type PDP, the dielectric layer is not provided, so there is no accumulation process of electric charges in the dielectric layer in the case of the AC driving described above, and the discharge electrodes 12 at the intersections,
Discharge is continued when the potential difference due to the DC applied voltage between 22 exceeds the discharge start voltage, and discharge is stopped when the potential difference drops below a certain level.

Next, a conventional PDP manufacturing method will be described. The step of forming the barrier rib 3, which is one of the manufacturing steps of the PDP, is roughly classified into a photoengraving method and a thick film screen printing method which is a non-photographic printing method. Generally, the photolithography method is used when the pattern of the barrier rib 3 is fine and high precision is required, and the thick film screen printing method is used when the pattern is relatively rough. First, a conventional method for manufacturing a PDP using the photoengraving method will be described. FIG. 12 shows JP-A-6-139922.
In the process of forming the barrier rib 3 related to the present invention in the PDP manufacturing process shown in Japanese Patent Publication No.
This is an example of using a photoengraving method to form the pattern of the mold. Note that FIG. 12 is an example of an AC type PDP.

As shown in FIG. 12 (a), first and second discharge electrodes 12 and 22 are formed on a front transparent substrate 11 and a rear substrate 21, which are generally made of a glass material such as soda lime glass. Form. The discharge electrodes 12 and 22 are formed by a thick film screen printing method or a photolithography method. When the thick film screen printing method is used, a thick film screen of a discharge electrode pattern formed of an emulsion on a stainless mesh is used, and a powder of metal such as silver (Ag) to be a conductor and an organic binder as a fixing agent are pasted. The discharge electrode pattern is printed on the front transparent substrate 11 and the rear substrate 21 with the conductor paste having the shape. After this, a temperature below the softening point at which the shape of the substrate can be maintained, for example, 55 in the case of a combination of the conductive paste of silver and the main composition of the substrate of soda glass
Firing is performed at a temperature of about 0 to 600 ° C. to decompose and scatter organic components in the conductor paste to form the discharge electrodes 12 and 22.

When the photoengraving method is used, chromium (Cr) is formed on the entire surfaces of the front transparent substrate 11 and the rear substrate 21.
After forming a conductor film such as aluminum or aluminum (Al) by a thick film screen printing method or a sputtering method and coating a photoresist film on it, a photoresist film is formed in a desired discharge electrode pattern shape. Is irradiated with ultraviolet rays through a photomask, and in the example of the negative type photoresist film, a portion other than the discharge electrode pattern portion where the photoresist film is not exposed is removed with a developing solution. Next, after the conductor film other than the discharge electrode pattern portion is dissolved and removed by using an etching solution, the exposed photoresist film on the discharge electrode pattern is finally removed, as shown in FIG. The discharge electrodes 12 and 22 are formed on the surface of the front substrate 11 or the rear substrate 21.

Next, as shown in FIG. 12B, dielectric layers 13 and 23 are formed on the substrates 11 and 21 on which the discharge electrodes 12 and 22 are formed. The dielectric layers 13 and 23 are formed by a thick film screen printing method. Similar to the case of using the thick film screen printing method to form the discharge electrodes 12 and 22, the dielectric layer 13 is formed by using a stainless mesh screen plate on which a desired dielectric layer pattern is formed.
The front transparent substrate 1 on which the discharge electrode is formed is a dielectric paste prepared by kneading an inorganic material powder such as a glass material, which has a main composition of 23, and an organic component that is a vehicle into a paste form.
1 and printed on the surface of the rear substrate 21 on which the discharge electrodes are formed, and baked at a temperature not lower than the softening point of the inorganic material that is the composition of the dielectric layers 13 and 23 and not higher than the softening point of the substrate material, for example, a temperature of 500 to 600 ° C. Then, the organic components in the dielectric paste are decomposed and scattered to form homogeneous dielectric layers 13 and 23. AC type PD
The above operation is repeated several times in order to obtain a desired thickness of the dielectric layer as P.

Next, the process of forming the barrier rib 3 on the rear substrate 21 on which the dielectric layer 23 is formed will be described with reference to FIG. The barrier rib 3 is the front transparent substrate 11
Although it may be formed on the upper surface, the case of forming on the rear substrate 21 will be described here. First, the photosensitive organic film 5 is attached to the surface of the dielectric layer 23 on the back substrate 21 so as to be in close contact with it by applying heat of about 100 ° C. and a pressure of 3 to 4 kg / cm 2 with a heating roller. The thickness of the photosensitive organic film 5 is selected according to the intended height of the barrier rib 3.

Next, as shown in FIG. 12 (c), ultraviolet rays are radiated through a photomask 6 in which the pattern shape of the frame of the barrier ribs formed in a later step is made into the ultraviolet transparent pattern shape, and the negative is In the example of the mold, the pattern portion to be left on the photosensitive organic film 5, that is, the pattern shape of the frame of the barrier rib is exposed and cured. As a result of this, FIG.
As shown in (d), the portion 5b other than the barrier rib formation corresponding portion 5a is exposed and cured as a frame used for forming the barrier rib. At this time, the ultraviolet rays used for the exposure faithfully expose and cure the pattern shape of the frame of the barrier rib, so that the rays are made parallel rays.

Next, as shown in FIG. 12 (e), the uncured portion 5a of the photosensitive organic film 5 is eluted and developed with a developing solution of about 1% sodium carbonate (Na2CO3) or the like. By this step, the UV-cured exposed portion 5b of the photosensitive organic film 5 is formed on the surface of the dielectric layer 23 as the frame 7 of the barrier rib.

Next, as shown in FIG. 12 (f), an inorganic paste 8 containing a glass material or the like as a main composition of the barrier ribs is used in the frame 7 of the barrier ribs obtained in the developing step, using a spatula or the like. After pouring in, it is heated at a temperature of about 100 to 150 ° C. to be dried and cured.

Next, ca. several percent caustic soda (NaOH)
A solvent such as an aqueous solution peels and dissolves only the mold 7 portion of the barrier rib which is the ultraviolet-cured exposed portion 5b of the photosensitive organic film 5 formed in the steps of FIGS. 12C and 12D. Thereafter, the dried and hardened inorganic paste 8 to be the barrier ribs is baked and fixed at a temperature of 500 to 600 ° C., whereby the formation of the barrier ribs 3 is completed as shown in FIG.

The rear substrate 21 having the barrier ribs 3 and the front transparent substrate 11 having the discharge electrode 12 and the dielectric layer 13 shown in FIG.
By overlapping the discharge ribs 2 and 22 so that both discharge electrodes are aligned in a matrix arrangement, a discharge space that becomes a pixel in which the barrier ribs 3 are arranged between the dielectric layers 13 and 23 on both substrates 11 and 21 is formed. Reserved. In this state, after sealing the peripheries of both substrates 11 and 21 hermetically, the emission gas 4 is filled in the discharge space and re-sealed, so that A shown in FIG.
C-type PDP is completed. In the case of the DC type, there is no step of forming the dielectric layers 13 and 23 shown in FIG. 12B in the manufacturing process, and the barrier rib 3 is formed on the front surface on which the discharge electrodes 12 and 22 shown in FIG. 12A are formed. The surface of the transparent substrate 11 or the rear substrate 21 is completed through the steps after FIG. As an example of forming the barrier rib 3 using the photoengraving method, in addition to the above, the photosensitive inorganic paste 10 is used.
There is a manufacturing method in which the barrier ribs 3 are directly formed without using the mold 7 for forming the barrier ribs 3.

Next, a conventional example in which the barrier rib 3 is formed by using the thick film screen printing method using the inorganic paste 8 will be described with reference to FIG. As shown in FIG. 13 (a), the dielectric layer 2 obtained by the same process as the conventional example of the photoengraving method.
Inorganic paste 8 which is the raw material of the barrier rib is
After printing using a thick film screen plate of stainless mesh, a drying process is performed to form one layer of barrier ribs. Since the film thickness of several tens of μm is obtained in one cycle of forming one layer, the cycle necessary to obtain the required barrier rib height is repeated.

Next, when the desired barrier rib height is reached,
By firing at a temperature of 500 ° C. to 600 ° C. to decompose and scatter the organic component, the barrier rib 3 is formed as shown in FIG.

[0019]

Since the conventional PDP is constructed as described above and manufactured as described above,
The photoengraving method has the problem described with reference to FIG. Since an inorganic material such as a transparent or translucent glass material is used as the main composition of the dielectric layer 23, the dielectric layer 23 is formed by photolithography using the photosensitive organic film 5 as the barrier rib 3.
In the case of forming on the surface of, the discharge electrode 22 is generally made of a metal material having a high reflectance such as silver or aluminum in the exposure process with ultraviolet rays, and therefore, as shown in FIG. The ultraviolet light that has passed through the organic film 5 and the dielectric layer 23 is diffusely reflected by the discharge electrode 22, passes through the dielectric layer 23 again, and returns to the photosensitive organic film 5. This return ultraviolet ray is generated even if the irradiation ultraviolet ray is a parallel ray, and the photosensitive organic film 5
Of these, the region protected by the photomask 6 so as not to be exposed is also exposed, so that the shape of the bottom portion of the barrier rib frame 7 cannot be accurately manufactured as shown in FIG. 14B. It was

When the mold 7 of the barrier rib in such a state is advanced to the next barrier rib forming step, as shown in FIG. 14C, the inorganic paste 8 made of a material such as a glass material, which is the main composition of the barrier rib, is formed. When is poured into the mold 7 of the barrier rib, the shape of the bottom surface of the mold 7 is not stable and becomes irregular, so that bubbles are trapped and the lifting of the bottom surface of the pattern is further promoted.

Further, when the inorganic paste 8 is finished in the firing step in such a state, as shown in FIG. 14 (d), the bottom surface of the pattern cannot withstand the stress at the time of heating and cooling, and it is completed. The barrier rib 3 of the back substrate 21
Problems such as peeling from the surface occur and the accurate barrier rib 3 cannot be obtained.

In order to avoid the above-mentioned problems, when the exposure dose is reduced and the exposure is carried out, as shown in FIG. 15 (a), contrary to the above, the frame 7 of the barrier rib of the photosensitive organic film 5 is reversed.
Inadequate curing of the pattern bottom surface of the barrier rib makes it impossible to secure the adhesion strength between the pattern bottom surface of the barrier rib frame 7 and the dielectric layer 23, and the pattern of the barrier rib frame 7 meanders in the developing process, or the pattern bottom surface Sometimes comes up.

Further, when the barrier rib mold 7 in such a state is advanced to the next step of forming the barrier rib 3, the inorganic paste 8 made of a material such as a glass material, which is the main composition of the barrier rib 3, is applied to the barrier rib mold 7. Form 7 when pouring into
Since the shape of the bottom surface of the pattern is not stable and becomes irregular, air bubbles may be trapped or the inorganic paste 8 may be added to the bottom of the mold 7.
Will enter and the hem of the barrier rib 3 will spread. When the inorganic paste 8 is to be finished in the firing step in such a state, the barrier rib 3 is formed in an irregular shape as shown in FIG. 15B, and the barrier rib 3 adheres to the substrate with high accuracy. Are not formed, and uniform discharge characteristics cannot be obtained.

Also in the thick film screen printing method shown in FIG. 13A, when the inorganic paste 8 is to be finished in the firing step, the inorganic paste 8 and the substrates 11 and 21 as the bases are formed.
Even if the materials are the same, the difference in heat capacity is large, and it was difficult to form the barrier rib 3 with good adhesion and high accuracy. That is, if the heating amount is small, the adhesion between the barrier ribs 3 and the substrates 11 and 21 cannot be secured, and on the contrary, if the heating amount is large, the barrier ribs 3 may lose their shape, and thus the barrier ribs 3 with high precision are formed. It was difficult to do.

An object of the present invention is to solve the above-mentioned problems in forming the barrier ribs of the PDP in close contact with the substrate with high accuracy.

[0026]

The PDP of the first invention is
A light transmission suppressing layer that suppresses light transmission is provided between the barrier rib and the rear substrate.

Further, the PDP of the second invention is the means related to the PDP of the first invention, wherein a dielectric layer for accumulating discharge charges is provided between the rear substrate and the light transmission suppressing layer.

The PDP of the third aspect of the present invention is the PDP of the first aspect of the present invention, wherein a dielectric layer is provided between the barrier rib and the light transmission suppressing layer.

Further, the PDP of the fourth invention is provided with a dielectric layer having a function of accumulating discharge charges between the barrier rib and the rear substrate and having a light transmission suppressing effect for suppressing light transmission.

In the PDP of the fifth invention, an adhesive layer having a lower softening point temperature than the material of the barrier rib is provided between the barrier rib and the front transparent substrate or the rear substrate.

In the PDP of the sixth invention, in the means related to the PDP of the fifth invention, a dielectric layer is provided between the front transparent substrate or the rear substrate and the adhesive layer.

Further, in the PDP of the seventh invention, in the means related to the PDP of the fifth or sixth invention, the adhesive layer is made to have a light transmission suppressing effect of suppressing the light transmission.

In addition, the PDP of the eighth invention has a function of accumulating discharge charges between the barrier rib and the front transparent substrate or the rear substrate, and includes a dielectric layer having a softening point temperature lower than that of the material of the barrier rib. I chose

Further, in the PDP of the ninth invention, in the means related to the PDP of the eighth invention, the dielectric layer is made to have a light transmission suppressing effect for suppressing the light transmission.

Further, in the PDP manufacturing method of the tenth invention, the step of forming a light transmission suppressing layer for suppressing the transmission of light on the surface of the rear substrate on which the discharge electrodes are formed, and the frame for forming the barrier rib are formed. A step of forming a barrier rib using the mold, a step of forming a barrier rib using the mold, a step of removing the mold, and a step of firing the barrier rib. .

In the PDP manufacturing method of the eleventh invention, a step of forming a light transmission suppressing layer having a light transmission suppressing effect for suppressing the transmission of light on the surface of the dielectric layer formed on the rear substrate, and a barrier rib are provided. Forming a mold for forming on the surface of the light transmission suppressing layer using a photosensitive material, forming barrier ribs using the mold, removing the mold, firing the barrier ribs It was equipped with the process of doing.

The twelfth aspect of the present invention is the PDP production method according to the tenth or eleventh aspect of the present invention, wherein a photosensitive material is used as the barrier rib material.

In the PDP manufacturing method of the thirteenth invention, a step of forming a light transmission suppressing layer for suppressing light transmission on the surface of the rear substrate on which the discharge electrodes are formed, and a barrier rib made of a photosensitive material are used. A step of forming on the surface of the permeation suppression layer and a step of firing the barrier rib were provided.

Further, in the PDP manufacturing method of the fourteenth invention, a step of forming a light transmission suppressing layer having a light transmission suppressing effect for suppressing light transmission on the surface of the dielectric layer formed on the rear substrate, and a barrier rib are provided. The method includes a step of forming a photosensitive material on the surface of the light transmission suppressing layer and a step of firing the barrier rib.

In the PDP manufacturing method of the fifteenth invention, a step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the front transparent substrate or the rear substrate on which the discharge electrode is formed, and the barrier rib are formed. A step of forming a mold on the surface of the adhesive layer, a step of forming a barrier rib with a thermosetting material using the mold, a step of removing the mold, and a step of firing the barrier rib. did.

In the PDP manufacturing method of the sixteenth invention, a step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the dielectric layer formed on the substrate, and forming the barrier rib. A step of forming a mold on the surface of the adhesive layer, a step of forming barrier ribs with a thermosetting material using the mold, a step of removing the mold, and a step of firing the barrier ribs were performed.

The PDP manufacturing method of the seventeenth invention is the manufacturing method of the PDP of the fifteenth or sixteenth invention, wherein a photosensitive material is used as the material of the barrier rib instead of the thermosetting material.

In the PDP manufacturing method of the eighteenth invention, a step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the front transparent substrate or the rear substrate on which the discharge electrode is formed, and the barrier rib is heated. A step of forming on the surface of the adhesive layer using a curable material and a step of firing the barrier rib are provided.

In the PDP manufacturing method of the nineteenth invention, a step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the dielectric layer formed on the substrate, and the barrier rib is made of a thermosetting material. A step of forming the adhesive layer on the surface of the adhesive layer and a step of firing the barrier rib are provided.

Further, the manufacturing method of the PDP of the twentieth invention is the manufacturing method according to the PDP of the eighteenth or nineteenth invention, wherein a photosensitive material is used as the material of the barrier rib instead of the thermosetting material.

[0046]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 An embodiment of the present invention will be described below with reference to FIG.
FIG. 1 is a partial cross-sectional view showing a part of the structure of the AC PDP of this embodiment. In FIG. 1, 23 is the second discharge electrode 2
2 is a dielectric layer for accumulating discharge charges, which is formed on the second layer 2. In this embodiment, for example, three layers 23a, 23b, and 23 are provided for manufacturing.
c, of which the layer 23c is a light transmission suppressing layer having a property of suppressing the transmission of ultraviolet rays,
An inorganic material having a softening point temperature lower than that of the material of the barrier rib 3 is used, and when the barrier rib 3 is formed, it functions as an adhesive layer that promotes the adhesion strength between the barrier rib 3 and the dielectric layer 23.

Here, the three dielectric layers 23 have a capacitance required for AC discharge plasma discharge in combination of the three layers.
c has a dark pigment mixed therein to suppress the transmission of ultraviolet rays, and has a softening point temperature higher than that of the barrier rib 3.
For example, an inorganic material having a low temperature of about 10 ° C to 50 ° C is used. Others are the same as the conventional example shown in FIG.

In this embodiment, the layer 23c for suppressing the transmission of ultraviolet rays is 23c, but one of 23a and 23b is used.
A layer or any two layers, or all three layers, that is, the dielectric layer and the light transmission suppressing layer may be combined. Also,
The adhesive layer formed of a material having a low softening point temperature may be formed not only on 23c but also on 23b and 23c. Furthermore, the layer division of the dielectric layer 23 is not limited to three layers. Furthermore, any two or more layers of the light transmission suppressing layer, the adhesive layer, and the dielectric layer are separately formed, and the dielectric layer, the light transmission suppressing layer, the light transmission suppressing layer, Any of a dielectric layer, a dielectric layer / adhesive layer, a dielectric layer / light transmission suppressing layer / adhesive layer, a light transmission suppressing layer / dielectric layer / adhesive layer may be used.

In the AC type PDP according to the present invention having the dark-colored dielectric layer 23c which suppresses the transmission of light such as ultraviolet rays constructed as described above, when the barrier rib 3 is formed by the photoengraving method, the photosensitive organic film is used. Since ultraviolet rays that have passed through the photosensitive organic film 5 are absorbed when the patterning of the photosensitive organic film 5 is performed, even if the discharge electrode 22 is made of a material that is easily reflected, the exposed portion of the photosensitive organic film 5 is not exposed. Return light is suppressed.

Therefore, since the patterning can be performed without reducing the exposure amount of the photosensitive organic film 5, a highly accurate film pattern of the barrier rib 3 having sufficient adhesion strength can be formed.

In particular, when forming a high-definition pattern with a narrow pitch (for example, pattern width / pattern interval = 100 μm or less / 100 μm or less), the aspect ratio is high, so that the adhesion strength by exposure and the accuracy of the pattern shape can be further ensured. However, even in such a case, the film pattern of the barrier rib 3 having a high aspect ratio can be formed without being affected by the ultraviolet rays reflected and returned from the discharge electrode.

The film pattern thus formed with high precision is obtained by pouring the inorganic paste 8 containing a glass material or the like as a main composition into the mold 7 of the barrier rib 3 to form the barrier rib 3 and heating and drying the paste. Since the floating of the bottom portion of the film pattern and the spread of the hem are suppressed, the pattern of the barrier rib 3 made of the inorganic paste 8 can be formed with good adhesion on the bottom surface.

Further, the pattern of the barrier ribs 3 made of the inorganic paste 8 has a good adhesion surface on the bottom surface of the barrier ribs 3, and therefore can withstand the stress such as thermal expansion of the rear substrate 21 at the time of firing and is accurate. A good barrier rib 3 is formed.
Further, since the light transmission suppressing layer suppresses diffused reflection from the first discharge electrode formed on the rear substrate 21 at the light emitting point due to discharge during the display operation of the PDP, unnecessary extension of the light emitting point is prevented. Also, the effect of making pixels with high precision is brought about.

The dielectric layer 23c has a softening point temperature of, for example, 10 compared with the inorganic paste 8 which is the material of the barrier rib 3.
Since the glass composition has a low temperature of about 50 ° C. to 50 ° C., the barrier rib 3 serves as an adhesive at the joint surface between the dielectric layer 23c and the barrier rib 3 when the barrier rib 3 is fired, and the barrier rib 3 having higher adhesion strength can be formed.

Further, when the barrier rib 3 is formed, when the photosensitive inorganic paste 10 is used instead of the photosensitive organic film 5, the dark-colored dielectric layer 23c absorbs the ultraviolet rays passing through the photosensitive inorganic paste 10. Since the reflection from the discharge electrode 22 is prevented, the same effect can be obtained. Furthermore, the dielectric layer 23c may function as either the light transmission suppressing layer or the adhesive layer. The above is AC
Although an example of the type PDP is shown, in FIG. 1, the dielectric layer 13,
If 23 is omitted and a light transmission suppressing layer and / or an adhesive layer made of a material having a low dielectric constant is provided between the rear substrate 21 and the barrier rib 3 instead of the dielectric layer 23c, DC
It goes without saying that a type PDP can be obtained.

Embodiment 2 FIG. 2 is a partial sectional view showing a part of the structure of a DC type PDP which is a second embodiment of the present invention. 2 is different from that of FIG. 1 in that the dielectric layers 13 and 23 are not provided and that the softening point temperature is lower by, for example, about 10 ° C. to 50 ° C. than the material of the barrier rib 3 formed on the surface of the rear substrate 21. That is, the discharge electrode 22 and the barrier rib 3 are formed on the surface of the adhesive layer 9. In addition,
The main composition of the adhesive layer 9 is a glass frit (glassy material).
And other inorganic materials.

Embodiment 3 FIG. 3 is a partial sectional view showing a part of the structure of a DC type PDP which is a third embodiment of the present invention. In FIG. 3, the configuration different from that of FIG. 2 has a softening point temperature of, for example, 10 ° C. to 50 ° C. as compared with the material of the barrier ribs 3 formed on the surface of the back substrate 21.
That is, the adhesive layer 9 which is lowered to some extent is formed so as to avoid the discharge electrode pattern so that a layer is not formed on the second discharge electrode 22, and the barrier rib 3 has the adhesive layer 9 formed thereon.
Formed on top.

In the first, second and third embodiments, the barrier rib 3 is formed in parallel with the second discharge electrode 22, but it may be formed in parallel with the first discharge electrode 12, and the barrier rib 3 has a stripe shape. Needless to say, it may be formed in a grid shape or a dot matrix frame shape.

Embodiment 4 Next, a method of manufacturing an AC PDP according to the present invention will be described. FIG. 4 shows an example in which a photolithography method is used for forming the pattern of the frame of the barrier rib 3 in the step of forming the barrier rib 3 related to the present invention in the manufacturing process of the AC type PDP.

First, as shown in FIG. 4A, the discharge electrodes 12 and 22 are formed on the surfaces of the substrates 11 and 21 by a method similar to the conventional one.

Next, as shown in FIG. 4B, a dielectric layer 23 is formed on the rear substrate 21 on which the discharge electrodes 22 are formed. The dielectric layer 23 is formed by the thick film screen printing method as in the conventional case. That is, a paste-like dielectric paste is printed on the surface of the rear substrate 21 on which the discharge electrodes are formed, and then fired to decompose and scatter the organic components in the dielectric paste to form a uniform dielectric. Form layer 23. The above operation is repeated several times in order to obtain a desired thickness of the dielectric layer as the AC PDP.

In the present embodiment, the dielectric paste used in the above step is mixed with a dark pigment and has a softening point temperature of, for example, a composition material such as a glass material as a base material as compared with the material of the barrier rib 3. 10 ° C to 50
Select an inorganic material that is about ℃ low. When selecting the inorganic material, it is desirable to select one having a small variation in electric characteristics such as dielectric constant. In the present embodiment, the dielectric layer 23 is composed of, for example, three layers 23a, 23b, and 23c. Of these, the layer 23c is a light transmission suppressing layer having a performance of suppressing the transmission of ultraviolet rays, and the barrier rib 3 is made of a material. Select an inorganic material with a lower softening point temperature.
It is to be noted that the dielectric layer 23c that suppresses the transmission of ultraviolet rays by mixing a dark color pigment is 23c.
A layer or arbitrary two layers, or all three layers, that is, the dielectric layer and the light transmission suppressing layer may be combined. Furthermore, the layer division of the dielectric layer is not limited to three layers. Further, the inorganic material may be applied not only to 23c but also to 23a and 23b. After that, the barrier rib 3 is formed through the same steps as the conventional steps shown in FIGS.

Further, in the present embodiment, the function of suppressing light transmission and the function of lowering the softening point temperature are provided together in the dielectric layer, but it goes without saying that each function may be provided independently.

By the way, in the present embodiment, the dielectric layer 23
Is a composition material such as a glass material as a base material and has a softening point temperature of, for example, 10 ° C. to 50 ° C. as compared with the material of the barrier rib 3.
Since a low inorganic material is used, the barrier ribs 3 are formed so as to slightly sink into the dielectric layer 23 softened by the heat during firing, as highlighted in FIG. Therefore, it contributes to the improvement of the adhesion strength of the barrier rib 3 to the substrate.

The rear substrate 21 having the barrier ribs 3 and the front transparent substrate 11 having the discharge electrodes 12 and the dielectric layer 13 intersect the discharge electrodes 12 and 22 of both substrates, and the discharge electrodes 12 and 22 are arranged in a matrix. By stacking the barrier ribs 3 so that the barrier ribs 3 are arranged between the dielectric layers 13 and 23 on both the substrates 11 and 21, a discharge space to be a pixel is secured. In this state, the periphery of both the substrates 11 and 21 is hermetically sealed, and then the discharge space is filled with the luminescent gas 4 and resealed to complete the AC PDP shown in FIG.
It goes without saying that a DC type PDP can be obtained by omitting the step of forming the dielectric layer 23 in the manufacturing method. Further, in the step of forming the barrier rib, it is possible to use the photosensitive inorganic paste 10 shown in Embodiment 5 instead of the inorganic paste 8 shown in FIG.

Embodiment 5 FIG. 5 shows an example in which a thick film screen printing method using a photosensitive inorganic paste 10 is used for forming the barrier rib 3. The discharge electrodes 12 and 22 and the dielectric layers 13 and 23 are formed by the same method as in the conventional example or the fourth embodiment.

Next, as shown in FIG. 5A, the barrier rib 3 is formed on the rear substrate 21 on which the dielectric layer 23 is formed.
A photosensitive inorganic paste 10 that is a raw material of is formed. This photosensitive inorganic paste is a negative-type photosensitive material that is cured when exposed to ultraviolet rays as disclosed in Japanese Patent Application Laid-Open No. 2-99585, and is composed of a glass frit as an inorganic component, an acrylic resin or a cellulosic resin as a vehicle. The derivative is an organic polymer binder, and the photosensitive inorganic paste 10 is formed on the surface of the dielectric layer 23 in which ultraviolet ray transmission is suppressed by a thick film screen printing method. In thick film screen printing, a stainless mesh screen plate is used to print the photosensitive inorganic paste 10 on the surface of the dielectric layer 23, and then dried at a temperature of 80 ° C. for 30 minutes to form one layer. Since the film thickness of several tens of μm is obtained in one cycle of forming one layer, the cycle necessary to obtain the required barrier rib height is repeated.

Next, as shown in FIGS. 5 (b) and 5 (c),
Ultraviolet rays are radiated through a photomask 6 in which a desired barrier rib 3 pattern shape is an ultraviolet transmission pattern,
The pattern portion to be left, that is, the pattern shape of the barrier rib 3 of the photosensitive inorganic paste 10 made of the photosensitive curable resin and the glass material is exposed and cured to obtain the exposed portion 10b. Then, the non-exposed portion 10a of the photosensitive inorganic paste that becomes unnecessary
Are removed using a developing solution.

Further, after the exposed portion 10b is subjected to a drying process, it is baked at a temperature of 500 ° C. to 600 ° C. to decompose and scatter the organic components, so that the barrier rib 3 is formed as shown in FIG. 5 (d). Is formed. Even in the barrier rib manufacturing method by the thick film screen printing method using the photosensitive inorganic paste 10, when the dielectric layer 23 is transparent or translucent as usual, diffuse reflection of ultraviolet rays from the discharge electrode 22 causes the pattern of the barrier rib 3. Since the formation accuracy is greatly affected, the effect of making the dielectric layer 23c dark is great. In this example, the photosensitive inorganic paste 10 has been described as a negative photosensitive material that is cured by irradiation with ultraviolet rays. However, in the case of a positive photosensitive material in which an ultraviolet irradiated portion is easily dissolved in a developing solution, the photomask 6 of Since the ultraviolet ray transmission pattern is reversed, the amount of diffused reflection of the ultraviolet ray irradiation light by the second discharge electrode 22 increases, so that the dielectric layer 23
The effect of darkening c is even greater. If the step of forming the dielectric layer 23 in the manufacturing method is omitted, DC
It goes without saying that a type PDP can be obtained.

Embodiment 6 FIG. 6 shows an example of forming the barrier rib 3 by pouring the photosensitive inorganic paste 10 into the barrier rib mold 7 after forming the barrier rib mold frame pattern. As shown in FIG. 6A, the barrier rib mold 7 obtained in the same process as the conventional example.
In addition, the photosensitive inorganic paste 10 as a raw material for the barrier ribs
After pouring with a spatula, 100-150 ℃
It is heated at about a temperature to dry and cure.

Next, as shown in FIG. 6B, the entire surface is irradiated with ultraviolet light to expose and cure the photosensitive inorganic paste 10. In this state, the mold 7 of the barrier rib formed of the photosensitive organic film becomes soluble and the photosensitive inorganic paste 10 becomes insoluble in the developer shown in FIG.
Barrier ribs 3 are formed as shown in FIG.

Also in this embodiment, in the process of forming the barrier rib 3 using the photosensitive material, the irregular reflection of the ultraviolet rays from the discharge electrode 22 has a great influence on the accuracy of the pattern formation of the barrier rib 3, so that the dielectric layer 23c is colored dark. It has a great effect. The dielectric layer 23 in the manufacturing method
It goes without saying that a DC type PDP can be obtained by omitting the step of forming.

Embodiment 7 FIG. 7 shows an example in which the barrier rib 3 is formed by using the thick film screen printing method using the inorganic paste 8.

As shown in FIGS. 7A and 7B, the barrier rib 3 is formed on the dielectric layer 23 obtained by the same process as in the fourth embodiment by the thick film screen printing method as shown in the conventional example. To form. In this embodiment, the dielectric layer 23c may be an inorganic material having a low softening point temperature, and does not necessarily have a dark color.

Also in the barrier rib manufacturing method using the thick film screen printing method using the inorganic paste 8, the softening point temperature of the dielectric layer 23c is set lower than that of the inorganic paste 8 having the composition of the barrier rib 3. Since the adhesion strength of the bottom surface of the barrier rib to the dielectric layer 23 which is the base at the time of firing is increased, the effect of improving the productivity of the barrier rib 3 is great. Further, the adhesive layer formed of a material having a low softening point temperature may be formed not only on 23c but also on 23a and 23b. Furthermore, the layer division of the dielectric layer 23 is not limited to three layers. Although the example of the AC type PDP has been described above, if the dielectric layer 23 is omitted in FIG. 7 and the adhesive layer 9 is provided between the rear substrate 21 and the barrier rib 3, a DC type PDP is obtained. It goes without saying that it will be done.

Embodiment 8 FIG. 8 shows the step of forming the barrier rib 3 related to the present invention in the manufacturing process of the DC type PDP, in which the adhesive layer 9 is formed on the substrates 11 and 21 which are the bases for forming the barrier rib 3. At this time, this is an example of using a photoengraving method using the photosensitive inorganic paste 10. This manufacturing method is generally used when the pattern of the barrier ribs 3 is relatively dense.

In this embodiment, the conventional DC type PD
In the manufacturing process of P, the barrier rib 3 is formed on the front transparent substrate 11 or the rear substrate 21 on which the discharge electrodes 12 and 22 are formed.
The step of forming the adhesive layer 9 having a lower softening point temperature than that of the composition material is added. The photosensitive inorganic paste 10 as a raw material of the adhesive layer 9 has a softening point temperature of, for example, 10 as compared with the material of the barrier rib 3 as a composition material such as a glass material as a base material.
An inorganic material having a low temperature of about 50 ° C to 50 ° C is selected.

As shown in FIG. 8A, in view of the discharge performance of the DC type PDP, it is necessary not to form the adhesive layer 9 which becomes the dielectric layer on the discharge electrode. The photosensitive inorganic paste 10 is used to form the barrier ribs 3 shown.
In the same procedure as the photoengraving method using, the ultraviolet rays are radiated through the photomask 6 in which the pattern forming the barrier ribs 3 or the pattern avoiding the discharge electrodes 12 and 22 is used as the ultraviolet transmitting pattern, and the photosensitive cured resin is irradiated. A pattern portion to be left of the photosensitive inorganic paste 10 made of a glass material, that is, a desired adhesive layer pattern is exposed and cured. After that, as shown in FIG. 8B, after removing the unexposed portion of the photosensitive inorganic paste 10 that is no longer needed by using a developing solution, the exposed portion is baked and fixed. The thickness of the adhesive layer 9 is preferably 20 μm or less. Subsequently, as shown in FIG. 8 (d), the barrier rib 3 is formed on the adhesive layer 9 by the same method as that shown in FIGS. 7 (a) and 7 (b), via the step of FIG. 8 (c). Is formed. In the above example, the photosensitive inorganic paste 10 is used as the raw material of the adhesive layer 9.
It is also possible to use the inorganic paste 8 instead of the same as in the seventh embodiment.

In the above description of the embodiment using the photosensitive material, the negative type which is exposed and cured by ultraviolet irradiation is used.
It goes without saying that there is no problem even if a positive type is used, in which the exposed portion is easily dissolved and removed in the developing solution.

Further, in each of the above-mentioned embodiments, the discharge electrodes are arranged in a matrix, and the discharge electrodes are opposed to each other.
The case where the present invention is similarly applied to FIG. 9 has been described.
The present invention can be similarly applied to the surface discharge type PDP shown in FIG. Figure 9 shows a surface discharge type PDP.
FIG. 3A is a partial cross-sectional view showing a part of the structure of FIG.
Is a relationship obtained by rotating the PDP surface by 90 °, (a) shows a surface cut at right angles to the barrier ribs formed in stripes, and (b) shows a surface cut parallel to the barrier ribs. The structural difference between the facing discharge PDP and the surface discharge PDP is that the first discharge electrode 12a, 1 is formed on the front transparent substrate 11.
2b is formed as a pair of parallel electrodes insulated from each other by the dielectric layer 13, and a second discharge electrode 22 serving as an address electrode for controlling the discharge position is formed on the rear substrate 21. That is, the first discharge electrode 12a,
Discharge light emission is performed at the intersection point p between the second discharge electrode 22 and between 12b. The adhesive layer 9 formed on the back substrate 21 is made of a material having a softening point temperature lower than that of the barrier rib 3 as in the above-described embodiments. Further, the adhesive layer 9 may have a function of suppressing light transmission. Further, a light transmission suppressing layer may be provided instead of the adhesive layer 9.
As described above, by applying the present invention to the surface discharge type PDP, it is possible to obtain the same effect as when applied to the opposed discharge type PDP when forming the barrier rib.

[0081]

According to the first aspect of the present invention, since the light transmission suppressing layer is provided between the barrier rib and the rear substrate, when the barrier rib is formed using a photosensitive material, the reflection of ultraviolet rays from the discharge electrode is prevented. It is possible to obtain a PDP having barrier ribs that are suppressed and have high accuracy and high adhesion strength.

Further, according to the second invention, in the means relating to the PDP of the first invention, the dielectric layer for accumulating the discharge charge is provided between the rear substrate and the light transmission suppressing layer. Even in such a case, when the barrier rib is formed using a photosensitive material by the function of the light transmission suppressing layer, reflection of ultraviolet rays from the discharge electrode is suppressed, and a PDP having a barrier rib with high accuracy and high adhesion strength can be obtained. .

Further, according to the third invention, in the means relating to the PDP of the first invention, since the dielectric layer for accumulating the discharge charge is provided between the barrier rib and the light transmission suppressing layer, in this case, Also, due to the function of the light transmission suppressing layer, when a barrier rib is formed using a photosensitive material, reflection of ultraviolet rays from the discharge electrode is suppressed, and a PDP having a barrier rib with high accuracy and high adhesion strength can be obtained.

According to the fourth aspect of the invention, since the dielectric layer is provided between the barrier rib and the rear substrate, the dielectric layer has a function of accumulating discharge charges and a light transmission suppressing effect of suppressing light transmission. When forming a barrier rib using a photosensitive material, reflection of ultraviolet rays from the discharge electrode is suppressed, and a PDP having a barrier rib with high accuracy and high adhesion strength can be obtained.

Further, according to the fifth invention, since the adhesive layer having a lower softening point temperature than that of the material of the barrier rib is provided between the barrier rib and the front transparent substrate or the rear substrate, the barrier rib and Adhesion with the substrate is promoted, and a PDP having barrier ribs with high adhesion strength can be obtained.

Further, according to the sixth invention, in the means relating to the PDP of the fifth invention, the dielectric layer is provided between the front transparent substrate or the rear substrate and the adhesive layer. By the function of the layer, when the barrier rib is fired, the adhesion between the barrier rib and the substrate is promoted, and a PDP having the barrier rib with high adhesion strength can be obtained.

According to the seventh aspect of the invention, in the means relating to the PDP of the fifth or sixth aspect of the invention, the adhesive layer is made to have a light transmission suppressing effect for suppressing the transmission of light. When forming a barrier rib using a material, the reflection of ultraviolet rays from the discharge electrode is suppressed, and when the barrier rib is fired, the adhesion between the barrier rib and the substrate is promoted, and the barrier rib has a high accuracy and a higher adhesion strength. A PDP can be obtained.

Further, according to the eighth aspect of the present invention, a dielectric layer having a function of accumulating discharge charges between the barrier rib and the front transparent substrate or the rear substrate and having a softening point temperature lower than that of the material of the barrier rib is provided. Therefore, when the barrier ribs are fired, the adhesion between the barrier ribs and the substrate is promoted, and a PDP having the barrier ribs with high adhesion strength can be obtained.

According to the ninth invention, in the means relating to the PDP of the eighth invention, the dielectric layer is made to have the light transmission suppressing effect for suppressing the light transmission, so that the photosensitive material is used. When forming a barrier rib using the PDP, reflection of ultraviolet rays from the discharge electrode is suppressed, and when the barrier rib is fired, the adhesion between the barrier rib and the substrate is promoted, and a PDP having a barrier rib with high accuracy and higher adhesion strength is obtained. Obtainable.

According to the manufacturing method of the tenth invention,
Forming a light transmission suppressing layer that suppresses light transmission on the surface of the rear substrate on which the discharge electrodes are formed, and forming a mold for forming barrier ribs on the surface of the light transmission suppressing layer using a photosensitive material. The step of forming a barrier rib using the mold, the step of removing the mold, and the step of baking the barrier rib are performed. Therefore, the mold for forming the barrier rib is made of a photosensitive material. When it is used to form on the surface of the light transmission suppressing layer, reflection of ultraviolet rays from the discharge electrode is suppressed, and a PDP having a barrier rib with high accuracy and high adhesion strength can be manufactured.

According to the eleventh aspect of the invention, the step of forming a light transmission suppressing layer having a light transmission suppressing effect for suppressing the transmission of light on the surface of the dielectric layer formed on the rear substrate, and the barrier rib are formed. A step of forming a mold for the surface of the light transmission suppressing layer using a photosensitive material, a step of forming barrier ribs using the mold, a step of removing the mold,
Since the step of firing the barrier ribs is provided, when a mold for forming the barrier ribs is formed on the surface of the light transmission suppressing layer using a photosensitive material, ultraviolet rays from the discharge electrode are suppressed, It is possible to manufacture a PDP having a barrier rib with high accuracy and high adhesion strength.

According to the twelfth invention, the tenth invention is provided.
Alternatively, in the method for manufacturing a PDP of the eleventh invention, since the photosensitive material is used as the material of the barrier rib, the light transmission suppressing layer also functions as a mold or barrier rib for forming the barrier rib in this case. When formed on the surface of the light transmission suppressing layer, reflection of ultraviolet rays from the discharge electrode is suppressed, and a PDP having a barrier rib with high accuracy and high adhesion strength can be manufactured.

Further, according to the thirteenth invention, a step of forming a light transmission suppressing layer for suppressing light transmission on the surface of the rear substrate on which the discharge electrodes are formed, and the barrier rib is made of a photosensitive material to suppress the light transmission. Since the step of forming on the surface of the layer and the step of baking the barrier rib are provided, when the barrier rib is formed on the surface of the light transmission suppressing layer using a photosensitive material, reflection of ultraviolet rays from the discharge electrode is suppressed. It is possible to manufacture a PDP having a barrier rib with high precision and high adhesion strength.

According to the fourteenth aspect of the invention, the step of forming a light transmission suppressing layer having a light transmission suppressing effect for suppressing light transmission on the surface of the dielectric layer formed on the rear substrate, and the barrier rib being made of a photosensitive material Since the step of forming the barrier rib on the surface of the light transmission suppressing layer using a material and the step of firing the barrier rib are provided, when forming the barrier rib on the surface of the light transmission suppressing layer using a photosensitive material, the discharge electrode It is possible to manufacture a PDP having barrier ribs with high precision and high adhesion strength, in which reflection of ultraviolet rays from the substrate is suppressed.

Further, according to the fifteenth invention, a step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the front transparent substrate or the rear substrate on which the discharge electrode is formed, the barrier rib is formed. Since the mold is formed on the surface of the adhesive layer, the step of forming barrier ribs with a thermosetting material using the mold, the step of removing the mold, and the step of firing the barrier ribs are performed. When the barrier rib is fired with the thermosetting material using the frame of the barrier rib, the adhesion between the barrier rib and the substrate is promoted, and the PDP having the barrier rib with high adhesion strength can be manufactured.

According to the sixteenth invention, the step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the dielectric layer formed on the substrate, and the mold for forming the barrier rib. Is formed on the surface of the adhesive layer, a step of forming barrier ribs with a thermosetting material using the mold, a step of removing the mold, and a step of firing the barrier ribs. When the barrier ribs are baked with a thermosetting material using a mold, the adhesion between the barrier ribs and the substrate is promoted, and a PDP having barrier ribs with high adhesion strength can be manufactured.

According to the seventeenth invention, the fifteenth invention
Alternatively, in the manufacturing method of the PDP of the sixteenth invention, the photosensitive material is used instead of the thermosetting material as the material of the barrier rib. Therefore, even in this case, the barrier rib is used when the barrier rib is fired by the function of the adhesive layer. Adhesion between the substrate and the substrate is promoted, and a PDP having barrier ribs with high adhesion strength can be manufactured.

According to the eighteenth invention, the step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the front transparent substrate or the rear substrate on which the discharge electrode is formed, the barrier rib being a thermosetting material. Since it is provided with a step of forming on the surface of the adhesive layer by using, and a step of baking the barrier rib, when the barrier rib is baked using a thermosetting material, the adhesion between the barrier rib and the substrate is promoted, resulting in high accuracy. Thus, a PDP having a barrier rib with high adhesion strength can be manufactured.

According to the nineteenth invention, the step of forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the dielectric layer formed on the substrate, and the barrier rib is made of a thermosetting material. Since the step of forming on the surface of the adhesive layer and the step of baking the barrier rib are provided, when the barrier rib is baked using a thermosetting material, the adhesion between the barrier rib and the substrate is promoted, and the adhesion strength is highly accurate. A PDP having a high barrier rib can be manufactured.

Further, according to the twentieth invention, the first
In the method for manufacturing a PDP of the 8th or 19th invention, a photosensitive material is used as the material of the barrier rib instead of the thermosetting material. Therefore, even in this case, when the barrier rib is baked by the action of the adhesive layer, Adhesion between the barrier rib and the substrate is promoted, and a PDP having a barrier rib with high accuracy and high adhesion strength can be manufactured.

[Brief description of drawings]

FIG. 1 is a partial sectional view showing an embodiment of an AC type PDP according to the present invention.

FIG. 2 is a partial cross-sectional view showing an embodiment of a DC PDP according to the present invention.

FIG. 3 is a partial cross-sectional view showing another embodiment of the DC PDP according to the present invention.

FIG. 4 is a manufacturing process diagram showing an embodiment of a method for manufacturing an AC PDP according to the present invention.

FIG. 5 is a manufacturing process diagram showing another embodiment of the method for manufacturing an AC PDP according to the present invention.

FIG. 6 is a manufacturing process diagram showing another embodiment of the method for manufacturing an AC PDP according to the present invention.

FIG. 7 is a manufacturing process diagram showing still another embodiment of the method for manufacturing an AC PDP according to the present invention.

FIG. 8 is a manufacturing process diagram showing an embodiment of a method for manufacturing a DC PDP according to the present invention.

FIG. 9 is an AC type P that performs surface discharge operation according to the present invention.
It is a fragmentary sectional view showing one embodiment of DP.

FIG. 10 is a partial cross-sectional view showing a conventional AC PDP.

FIG. 11 is a partial cross-sectional view showing a conventional DC PDP.

FIG. 12 is a manufacturing process diagram showing a conventional method for manufacturing an AC PDP.

FIG. 13 is a manufacturing process diagram showing a conventional method for manufacturing an AC PDP.

FIG. 14 is a manufacturing process diagram for explaining a defect of a conventional PDP.

FIG. 15 is a manufacturing process diagram for explaining a defect of the conventional PDP.

[Explanation of symbols]

 11 Front Transparent Substrate 12 First Discharge Electrode 13 and 23 Dielectric Layer 21 Back Substrate 22 Second Discharge Electrode 3 Barrier Rib 4 Luminescent Gas 5 Photosensitive Organic Film 6 Photomask 7 Barrier Rib Frame 8 Inorganic Paste 9 Adhesive Layer 10 Photosensitive inorganic paste

Claims (20)

[Claims] 1. A front transparent substrate and a back substrate having discharge electrodes, a luminescent gas which emits light by a discharge enclosed between the front transparent substrate and the back substrate, and the luminescence by the luminescent gas is divided into display pixels. A plasma display panel, comprising: a lattice-shaped or striped barrier rib provided in a gap; and a light transmission suppressing layer provided between the barrier rib and the back substrate to suppress light transmission. 2. The plasma display panel according to claim 1, further comprising a dielectric layer for accumulating discharge charges between the rear substrate and the light transmission suppressing layer. 3. A dielectric layer for accumulating discharge charges is provided between the barrier rib and the light transmission suppressing layer.
The plasma display panel according to item 1. 4. A front transparent substrate and a back substrate having discharge electrodes, a luminescent gas which emits light due to a discharge enclosed between the front transparent substrate and the back substrate, and the luminescence by the luminescent gas is partitioned as display pixels. Lattice-shaped or stripe-shaped barrier ribs provided in the gap, a dielectric layer provided between the barrier ribs and the back substrate and having a function of accumulating discharge charges and having a light transmission suppressing effect of suppressing light transmission. A plasma display panel characterized by having. 5. A front transparent substrate and a rear substrate having discharge electrodes, a luminescent gas which emits light due to a discharge enclosed between the front transparent substrate and the rear substrate, and the luminescence by the luminescent gas is divided into display pixels. It is characterized in that it is provided with a lattice-shaped or stripe-shaped barrier rib provided in a gap, and an adhesive layer having a softening point temperature lower than that of a material of the barrier rib provided between the barrier rib and the front transparent substrate or the back substrate. Plasma display panel. 6. The plasma display panel according to claim 5, further comprising a dielectric layer for accumulating discharge charges between the front transparent substrate or the rear substrate and the adhesive layer. 7. The plasma display panel according to claim 5, wherein an adhesive layer provided between the barrier rib and the rear substrate has a light transmission suppressing effect for suppressing light transmission. 8. A front transparent substrate and a rear substrate having discharge electrodes, a luminescent gas which emits light by a discharge enclosed between the front transparent substrate and the rear substrate, and the luminescence by the luminescent gas is divided into display pixels. Lattice-shaped or stripe-shaped barrier ribs provided in the gap, having a function of accumulating discharge charges provided between the barrier ribs and the front transparent substrate or the rear substrate, and having a softening point temperature lower than that of the material of the barrier ribs. A plasma display panel comprising a dielectric layer. 9. The plasma display panel according to claim 8, wherein the dielectric layer provided between the barrier rib and the rear substrate has a light transmission suppressing effect for suppressing light transmission. 10. A step of forming discharge electrodes on the front transparent substrate and the rear substrate, a step of forming a light transmission suppressing layer for suppressing light transmission on the surface of the rear substrate on which the discharge electrodes are formed, the front transparent substrate and the back surface. A mold for forming a lattice-shaped or stripe-shaped barrier rib provided in the gap that divides light emitted by discharge of a light-emitting gas enclosed between substrates as a pixel for display is formed by using a photosensitive material to A step of forming on the surface of the permeation suppression layer, a step of forming a barrier rib using the mold, a step of removing the mold, a step of firing the barrier rib, a front surface on the barrier rib of the rear substrate on which the barrier rib is formed. A method of manufacturing a plasma display panel, comprising the step of stacking transparent substrates so that their discharge electrodes face each other. 11. A step of forming discharge electrodes on a front transparent substrate and a rear substrate, a step of forming a dielectric layer for accumulating charges on the surface of the rear substrate on which the discharge electrodes are formed,
A step of forming a light transmission suppressing layer having a light transmission suppressing effect for suppressing light transmission on the surface of the dielectric layer, a pixel for displaying light emission due to discharge of light emitting gas enclosed between the front transparent substrate and the rear substrate Forming a frame for forming a lattice-shaped or striped barrier rib on the surface of the light transmission suppressing layer using a photosensitive material, the barrier rib is formed using the frame. A step of forming, a step of removing the mold, a step of firing the barrier ribs, and a step of superposing the front transparent substrate on the barrier ribs of the rear substrate on which the barrier ribs are formed so that their discharge electrodes face each other. A method for manufacturing a characteristic plasma display panel. 12. The method of manufacturing a plasma display panel according to claim 10, wherein a photosensitive material is used as a material for the barrier ribs. 13. A step of forming discharge electrodes on the front transparent substrate and the rear substrate, a step of forming a light transmission suppressing layer for suppressing light transmission on the surface of the rear substrate on which the discharge electrodes are formed, the front transparent substrate and the back surface. Formed on the surface of the light transmission suppressing layer, using a photosensitive material, is a lattice-shaped or stripe-shaped barrier rib provided in the gap that divides light emitted by discharge of a light-emitting gas enclosed between the substrates into pixels for display. And a step of firing the barrier ribs, and a step of superposing a front transparent substrate on the barrier ribs of the rear substrate on which the barrier ribs are formed so that their discharge electrodes face each other. . 14. A step of forming discharge electrodes on the front transparent substrate and the rear substrate, a step of forming a dielectric layer for accumulating charges on the surface of the rear substrate on which the discharge electrodes are formed,
A step of forming a light transmission suppressing layer having a light transmission suppressing effect for suppressing light transmission on the surface of the dielectric layer, a pixel for displaying light emission due to discharge of light emitting gas enclosed between the front transparent substrate and the rear substrate Forming a lattice-shaped or stripe-shaped barrier rib on the surface of the light transmission suppressing layer using a photosensitive material, a step of firing the barrier rib, and a back substrate on which the barrier rib is formed. 2. A method for manufacturing a plasma display panel, which comprises the step of stacking a front transparent substrate on the barrier rib so that the discharge electrodes face each other. 15. A step of forming discharge electrodes on the front transparent substrate and the rear substrate, and forming an adhesive layer having a softening point temperature lower than that of the material of the barrier rib on the surface of the front transparent substrate or the rear substrate on which the discharge electrodes are formed. Step, the mold for forming the grid-like or stripe-like barrier ribs provided in the gap for partitioning the light emission due to the discharge of the light-emitting gas enclosed between the front transparent substrate and the back substrate as the pixels for display is adhered. Forming on the surface of the layer, forming barrier ribs with a thermosetting material using the mold, removing the mold, firing the barrier ribs, front transparent substrate or back surface on which the barrier ribs are formed Plasma comprising a step of stacking a rear substrate or a front transparent substrate on the barrier ribs of the substrate so that their discharge electrodes face each other. Manufacturing method of I spray panel. 16. A step of forming discharge electrodes on the front transparent substrate and the rear substrate, a step of forming a dielectric layer for accumulating charges on the surface of the front transparent substrate or the rear substrate on which the discharge electrodes are formed, The step of forming an adhesive layer having a lower softening point temperature than the material of the barrier rib on the surface of the dielectric layer, and partitioning the light emission due to the discharge of the light emitting gas enclosed between the front transparent substrate and the rear substrate as display pixels Forming a mold for forming a grid-shaped or stripe-shaped barrier rib provided in the gap on the surface of the adhesive layer; forming a barrier rib with a thermosetting material using the mold; Removing the barrier ribs, firing the barrier ribs, discharging the rear substrate or the front transparent substrate on the barrier ribs of the front transparent substrate or the rear substrate on which the barrier ribs are formed. Method of manufacturing a plasma display panel, comprising the steps of superimposing as pole faces. 17. The method of manufacturing a plasma display panel according to claim 15, wherein a photosensitive material is used as the material of the barrier rib instead of the thermosetting material. 18. A step of forming a discharge electrode on a front transparent substrate and a rear substrate, and forming an adhesive layer having a softening point temperature lower than that of a material of a barrier rib on the surface of the front transparent substrate or the rear substrate on which the discharge electrode is formed. Step, the barrier ribs in the form of grids or stripes, which are provided in the gaps and partition the light emission due to the discharge of the light emitting gas enclosed between the front transparent substrate and the rear substrate as display pixels, are bonded by using a thermosetting material. From the step of forming on the surface of the layer, the step of firing the barrier ribs, and the step of superposing the rear substrate or the front transparent substrate on the barrier ribs of the front transparent substrate or the rear substrate on which the barrier ribs are formed so that their discharge electrodes face each other. A method of manufacturing a plasma display panel, comprising: 19. A step of forming discharge electrodes on a front transparent substrate and a rear substrate, a step of forming a dielectric layer for accumulating charges on the surface of the front transparent substrate or the rear substrate on which the discharge electrodes are formed, The step of forming an adhesive layer having a lower softening point temperature than the material of the barrier rib on the surface of the dielectric layer, and partitioning the light emission due to the discharge of the light emitting gas enclosed between the front transparent substrate and the rear substrate as display pixels A step of forming a lattice-shaped or stripe-shaped barrier rib provided on the gap on the surface of the adhesive layer using a thermosetting material, a step of firing the barrier rib, and a front transparent substrate or a rear substrate on which the barrier rib is formed. A plasma display comprising a step of stacking a rear substrate or a front transparent substrate on barrier ribs so that their discharge electrodes face each other. Method of manufacturing a panel. 20. The method of manufacturing a plasma display panel according to claim 18, wherein a photosensitive material is used as the material of the barrier ribs instead of the thermosetting material.