JPH09232734A - Flexible printed circuit with bump and manufacturing method thereof - Google Patents
Flexible printed circuit with bump and manufacturing method thereofInfo
- Publication number
- JPH09232734A JPH09232734A JP3467196A JP3467196A JPH09232734A JP H09232734 A JPH09232734 A JP H09232734A JP 3467196 A JP3467196 A JP 3467196A JP 3467196 A JP3467196 A JP 3467196A JP H09232734 A JPH09232734 A JP H09232734A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed circuit
- layer
- bump
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 10
- 239000010931 gold Substances 0.000 claims abstract description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910001431 copper ion Inorganic materials 0.000 claims abstract 2
- 238000005282 brightening Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【課題】 ＩＣ等の回路部品との接続の信頼性の高いフ
レキシブルプリント回路を得ることを目的とする。
【解決手段】 バンプ表面がハンダ層よりなり、そのハ
ンダ層はニッケル層又は金層の上に形成されていること
を特徴とする球状バンプを設けたフレキシブルプリント
回路及び銅メッキによりバンプを形成させる方法であっ
て、銅メッキの際、高濃度の光沢剤を使用し、銅イオン
濃度を２００〜２５０ｇ／リットル、電流密度を３０〜
５０Ａ／ｄｍ2として、球状バンプを形成させることを
特徴とするバンプ付きフレキシブルプリント回路の製造
方法。
(57) Abstract: It is an object of the present invention to obtain a flexible printed circuit with high reliability of connection with a circuit component such as an IC. SOLUTION: A bump is formed by a flexible printed circuit provided with a spherical bump, wherein the bump surface is composed of a solder layer, and the solder layer is formed on a nickel layer or a gold layer. At the time of copper plating, a high-concentration brightener is used, the copper ion concentration is 200 to 250 g / liter, and the current density is 30 to
A method of manufacturing a flexible printed circuit with bumps, characterized in that spherical bumps are formed at 50 A / dm 2 .
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板（以下、単にＦＰＣと略称する）にＩＣ等の
回路部品接続用球形バンプを設けたもの及びその製造方
法に関するものである。特に、接続の信頼性の高いバン
プを有するＦＰＣ及びその製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board (hereinafter simply referred to as FPC) provided with spherical bumps for connecting circuit components such as ICs and a method for manufacturing the same. In particular, the present invention relates to an FPC having bumps with high connection reliability and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】ＩＣ等の回路部品接続用のバンプは、従
来よりＦＰＣ表面に設けられたレジスト層の所定の位置
に回路が露出するような開口部を設け、これに銅メッキ
を施し、更にハンダメッキを施して形成してきた。2. Description of the Related Art Conventionally, bumps for connecting circuit components such as ICs are provided with an opening for exposing a circuit at a predetermined position of a resist layer provided on the surface of an FPC, and copper is plated on the opening. It has been formed by applying solder plating.
【０００３】[0003]
【発明が解決しようとする課題】従来のメッキ方法で
は、メッキ表面が平坦になったり、変形してくぼみが出
来たりして、うまく球状にならず接続の信頼性が充分で
はなかった。また、銅メッキとハンダメッキとが直接触
れているため、加熱等によりもろい銅、錫化合物が出
来、これも接続の信頼性を阻害していた。In the conventional plating method, the plating surface was flat or was deformed to form a recess, which did not form a spherical shape properly and the connection reliability was not sufficient. Further, since the copper plating and the solder plating are in direct contact with each other, brittle copper and tin compounds are formed by heating or the like, which also hinders the reliability of connection.
【０００４】[0004]
【課題を解決するための手段】銅メッキを施こすにあた
り、銅濃度、光沢剤濃度を高くし、電流密度を高くする
ことにより球状のバンプを形成させた。また、銅と錫と
を直接触れないようにするため、銅メッキの上にニッケ
ルメッキ層を設けて、その上にハンダ層を設けた。また
ニッケル層の上に金メッキ層を設けて、その上にハンダ
層を設けたもの、銅メッキのかわりにニッケルメッキで
バンプを形成させ、その上にハンダ層を設けた。こうし
て得られた球状のバンプにより、ＩＣ等の回路部品とＦ
ＰＣとの接続の信頼性が向上した。特に、ハンダメッキ
層を銅と直接触れないように金層又はニッケル層の上に
設けたものは、熱をかけてももろい銅、錫化合物が出来
ないため、接続の信頼性がより向上した。[Means for Solving the Problems] When copper plating is applied, spherical bumps are formed by increasing the copper concentration and the brightener concentration and increasing the current density. Further, in order to prevent direct contact between copper and tin, a nickel plating layer was provided on the copper plating, and a solder layer was provided thereon. In addition, a gold plating layer was provided on the nickel layer and a solder layer was provided on the nickel layer, and bumps were formed by nickel plating instead of copper plating, and the solder layer was provided thereon. With the spherical bumps thus obtained, circuit parts such as IC and F
The reliability of the connection with the PC has improved. In particular, the solder plating layer provided on the gold layer or the nickel layer so as not to come into direct contact with copper did not produce brittle copper and tin compounds even when heat was applied, so that the connection reliability was further improved.
【０００５】[0005]
【実施例】本発明を実施例により説明する。回路形成し
たフレキシブルプリント基板上にアクリル、エポキシ系
の感光性の印刷レジスト層を設け、所定の位置に回路が
露出するように０．１４ｍｍφの開口部を形成した。こ
の開口部に銅メッキによりバンプを形成させた。EXAMPLES The present invention will be described with reference to examples. An acrylic or epoxy photosensitive printing resist layer was provided on the circuit-formed flexible printed circuit board, and an opening of 0.14 mmφ was formed so that the circuit was exposed at a predetermined position. Bumps were formed in the openings by copper plating.
【０００６】銅メッキの条件 ・メッキ液の組成 ＣｕＳＯ4 ：２００±５ｇ／リットル 光沢剤Ａ* ：２５±５ｃｃ／リットル 光沢剤Ｂ** ：１０±１ｃｃ／リットル Ｈ2ＳＯ4 ：１１０±５ｇ／リットル Ｃｌ- ：５０±１０ｐｐｍ* 光沢剤Ａ ：「カッパークリームＡ」（リーロナール社
商品名）** 光沢剤Ｂ：「カッパークリームＢ」（リーロナール社
商品名） ・通電条件 浴温 ：３０〜３５℃ 電流密度 ：３０〜５０Ａ／ｄｍ2 通電時間 ：１０〜１５分Conditions for Copper Plating Composition of Plating Solution CuSO 4 : 200 ± 5 g / liter Brightening agent A * : 25 ± 5 cc / liter Brightening agent B ** : 10 ± 1 cc / liter H 2 SO 4 : 110 ± 5 g / liter l Cl -: 50 ± 10ppm * brightener A: "Copper Cream A" (Rironaru trade name) ** brightener B: "Copper Cream B" (Rironaru trade name) energizing conditions bath temperature: 30 to 35 ° C. Current density: 30 to 50 A / dm 2 Energization time: 10 to 15 minutes
【０００７】前記のメッキ条件により図に示したよう
に、下径１８０〜２２０μｍφで高さ５０〜７０μｍの
球状バンプを形成することが出来た。エッジ効果により
開口部周辺からメッキがはじまるが光沢剤によりメッキ
速度が調整され、かつ、Ｃｕイオンが多く、電流密度が
高いのでメッキが上へ上へと成長し、球状バンプとなっ
た。Under the above plating conditions, as shown in the figure, a spherical bump having a lower diameter of 180 to 220 μmφ and a height of 50 to 70 μm could be formed. The plating started from the periphery of the opening due to the edge effect, but the plating speed was adjusted by the brightening agent, and since the Cu ions were large and the current density was high, the plating grew upward and became a spherical bump.
【０００８】こうして得られた銅バンプに更にメッキを
施して次のバンプを形成させた。 銅バンプ上に直接２０±５μｍのハンダ層を設けたも
の 銅バンプ上に３〜６μｍのニッケル層を設け、その上
に２０±５μｍのハンダ層を設けたもの 銅バンプ上に３〜６μｍのニッケル層を設け、続いて
０．０２５〜０．１μｍの金メッキ層を設け、その上に
２０±５μｍのハンダ層を設けたものThe copper bumps thus obtained were further plated to form the next bump. 20 ± 5 μm solder layer provided directly on copper bumps 3-6 μm nickel layer provided on copper bumps, 20 ± 5 μm solder layer provided on it 3-6 μm nickel on copper bumps Layer, followed by a 0.025 to 0.1 μm gold plated layer, and a solder layer of 20 ± 5 μm on it
【０００９】[0009]
【発明の効果】本願の如く、光沢剤の濃度を高め、Ｃｕ
イオン濃度及び電流密度を高くすることで得られた球形
バンプによれば、ＦＰＣの回路とＩＣ等の回路部品との
確実な接続が可能となり、接続の信頼性が向上した。As described in the present application, the concentration of the brightening agent is increased and Cu
With the spherical bumps obtained by increasing the ion concentration and the current density, the FPC circuit and circuit components such as ICs can be reliably connected, and the connection reliability is improved.
【００１０】バンプ表面のハンダ層を加熱溶融させるこ
とで、ＩＣ等回路部品とＦＰＣの回路との接続が容易に
確実に実施することが出来た。これは本願の方法によ
り、ほぼ球状のバンプが形成されたことの効果である。By heating and melting the solder layer on the bump surface, the circuit components such as IC and the FPC circuit can be connected easily and surely. This is an effect of forming substantially spherical bumps by the method of the present application.
【００１１】前記のバンプ夫々同様に接続が容易
で確実であったが、は長期信頼性の上で特にすぐれ
ていた。すなわち、長期使用の加速テストとしての加熱
試験（例えば１００℃，２週間加熱）を行っても、接合
強度の低下が全くといっていいほど認められなかった。
これは硬くて脆い金属間化合物の成長が極めて遅いこと
によると思われる。Similar to each of the bumps described above, connection was easy and reliable, but was particularly excellent in terms of long-term reliability. That is, even when a heating test (eg, heating at 100 ° C. for 2 weeks) as an accelerated test for long-term use was performed, no decrease in bonding strength was observed at all.
This is probably due to the extremely slow growth of the hard and brittle intermetallic compound.
【００１２】銅とハンダとの間にニッケル層又はニッケ
ルと金の層があることにより、金属間化合物の成長がお
さえられる。特にニッケル層の上に金をごく薄くメッキ
したが最も有効であった。但し、金の層が厚すぎるの
は有効ではなかった。また、銅メッキによるバンプ形成
のかわりに、ニッケルメッキによるバンプ形成によって
も、同様に容易で信頼性の高い接続を確保することが出
来た。The presence of the nickel layer or the nickel and gold layer between the copper and the solder suppresses the growth of intermetallic compounds. In particular, gold was plated very thinly on the nickel layer, which was most effective. However, it was not effective for the gold layer to be too thick. Also, instead of forming bumps by copper plating, forming bumps by nickel plating also made it possible to secure an easy and highly reliable connection.
【図１】本発明のバンプを示す断面模式図である。FIG. 1 is a schematic sectional view showing a bump of the present invention.
【図２】銅バンプに直接ハンダ層を設けた場合を示す。FIG. 2 shows a case where a solder layer is directly provided on a copper bump.
【図３】銅バンプにニッケル層を設けて、その上にハン
ダ層を設けた場合を示す。FIG. 3 shows a case where a nickel layer is provided on a copper bump and a solder layer is provided thereon.
【図４】銅バンプにニッケル層、続いて金メッキ層を設
けて、その上にハンダ層を設けた場合を示す。FIG. 4 shows a case where a nickel layer and then a gold plating layer are provided on a copper bump and a solder layer is provided thereon.
１・・・基板 ２・・・回路 ３・・・レジスト層 ４・・・銅バンプ ５・・・ハンダ層 ６・・・ニッケル層 ７・・・金メッキ層 1 ... Substrate 2 ... Circuit 3 ... Resist layer 4 ... Copper bump 5 ... Solder layer 6 ... Nickel layer 7 ... Gold plating layer
Claims (3)
れたレジスト開口部に、ほぼ球状の接続信頼性の高いバ
ンプを形成させたことを特徴とするフレキシブルプリン
ト回路。1. A flexible printed circuit, wherein substantially spherical bumps having high connection reliability are formed in a resist opening provided on the surface of the flexible printed circuit.
ンダ層はニッケル層又は金層の上に形成されていること
を特徴とする請求項１に記載のフレキシブルプリント回
路。2. The flexible printed circuit according to claim 1, wherein the bump surface is made of a solder layer, and the solder layer is formed on the nickel layer or the gold layer.
れたレジスト開口部に、銅メッキによりバンプを形成さ
せる方法であって、銅メッキの際、高濃度の光沢剤を使
用し、銅イオン濃度を２００〜２５０ｇ／リットル、電
流密度を３０〜５０Ａ／ｄｍ2として、球状バンプを形
成させることを特徴とするバンプ付きフレキシブルプリ
ント回路の製造方法。3. A method of forming a bump by copper plating in a resist opening provided on the surface of a flexible printed circuit, wherein a high-concentration brightening agent is used during copper plating, and a copper ion concentration of 200 to A method of manufacturing a flexible printed circuit with bumps, comprising forming spherical bumps at 250 g / liter and a current density of 30 to 50 A / dm 2 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3467196A JPH09232734A (en) | 1996-02-22 | 1996-02-22 | Flexible printed circuit with bump and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3467196A JPH09232734A (en) | 1996-02-22 | 1996-02-22 | Flexible printed circuit with bump and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09232734A true JPH09232734A (en) | 1997-09-05 |
Family
ID=12420902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3467196A Pending JPH09232734A (en) | 1996-02-22 | 1996-02-22 | Flexible printed circuit with bump and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09232734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036165A (en) * | 2012-08-09 | 2014-02-24 | Shinko Electric Ind Co Ltd | Semiconductor device |
-
1996
- 1996-02-22 JP JP3467196A patent/JPH09232734A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036165A (en) * | 2012-08-09 | 2014-02-24 | Shinko Electric Ind Co Ltd | Semiconductor device |
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