JPH09159981A - Film forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the efficiency of film forming treatments by making it possible to execute a series of treatments to substrates even in the event of the occurrence of a fault in any of process modules. SOLUTION: This device has the plural process modules R1 to R7 for executing the same treatments and is so constituted that the substrates are transported by transfer modules T1 to T4 between these process modules R1 to R7. In such a case, if a detecting means S detects the occurrence of the fault in the certain process module R3, a control means C instructs a transfer module T2 to transport the substrates according thereto in such a manner that the treatments are executed by the normal process module R4 to execute the same treatment in place of the process module R3 where the fault arise. A series of the treatments to the substrates are thus continued.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus for automatically controlling a substrate transfer process between modules in a film forming process, and particularly when a failure occurs in a process module, another similar film forming apparatus can be used. The present invention relates to a film forming apparatus that automatically conveys a substrate to a process module that performs processing.

[0002]

2. Description of the Related Art For example, L for performing a film forming process on a glass substrate
The CD (liquid crystal display element) manufacturing apparatus is connected with a module for accommodating a substrate for loading and unloading, a process module for performing a film forming process, and a transfer module for transporting the substrate between the modules. In some cases, the processing and the transfer of the substrate are automatically and continuously performed.

FIG. 3 shows L as an example of a conventional film forming apparatus.
Single wafer plasma CVD (Che-mical Vapor Deposi) for CD
tion) shows the configuration of the device. This single-wafer CVD apparatus for LCD has a carry-in module IN for carrying in a substrate to be processed, a carry-out module OUT for carrying out a processed substrate, and a process for carrying out a film forming process on a substrate to be processed. Modules R1 to R7, buffer modules B1 and B2 for temporarily containing the substrate, and a transfer module T1 for carrying out the substrate carrying process by a carrying robot or the like.
To T4 are connected to each other. That is, the transfer module T1 is connected to the carry-in module IN, the process modules R1 and R2 and the buffer module B1 are connected to the transfer module T1, the transfer module T2 is connected to the buffer module B1, and the transfer module T2 is connected to the transfer module T2.
Is connected to the process modules R3 and R4 and the buffer module B2, the buffer module B2 is connected to the transfer module T3, and the transfer module T3 is connected to the process modules 5, R6 and R7.
Is connected to the process module R7, and the transfer module T4 is connected to the process module R7.
Is connected to the carry-out module OUT.
In the apparatus, a film forming process consisting of three steps is performed,
Three types of films are formed on the substrate to be processed. That is, in the first step, the first film is formed in either one of the process modules R1 and R2 performing the same processing, and in the second step, any one of the process modules R3 to R6 performing the same processing. The second film is formed in one process module, the third film is formed in the process module R7 in the third step, and three types of films are formed on the substrate.

The above film forming process is continuously and automatically performed by transferring the substrate by the transfer modules T1 to T4, and, for example, it is transferred in accordance with a plurality of preset routes as follows. Processing is performed. (1) IN → R1 → B1 → R3 → B2 → R7 → OUT (2) IN → R2 → B1 → R4 → B2 → R7 → OUT (3) IN → R1 → B1 → B2 → R5 → R7 → OUT (4 ) IN → R2 → B1 → B2 → R6 → R7 → OUT

Here, for example, the substrate set to be processed by the route (1) is the loading module IN.
Is transferred to the process module R1 by the transfer module T1 and the processing of the first step is performed, and after the processing is completed, the transfer module T1 transfers and stores it in the buffer module B1. Next, this substrate is transferred to the process module R3 by the transfer module T2 and subjected to the processing of the second step, and after the processing is completed, transferred to the buffer module B2 by the transfer module T2 and stored therein. Finally, the substrate is transferred to the process module R7 by the transfer module T3 and subjected to the process of the third step,
After the processing is completed, the transfer module T4 conveys it to the carry-out module OUT. Further, also in the routes (2) to (4), the same process as the series of processes performed in the route (1) is performed by the module set in each route.

Among the preset routes as described above, which route is used to perform the film forming process is determined for each substrate at the time when the film forming process is started (that is, the transfer from the carry-in module IN. The route assigned to each substrate is not changed during the film formation process. For example, one of the routes (1) to (4) is sequentially selected for each substrate to be processed, and a series of processes is performed on the substrate according to the selected route.

[0007]

Here, the LCD described above is used.
In the manufacturing apparatus, for example, when the film forming process is performed on the substrate according to the route of (1) and the process of the first step is performed in the process module R1, the process module R3 performing the next step fails. If the processing is stopped due to the occurrence of
Therefore, it becomes impossible to continue the film forming process on the substrate. Also,
Among the substrates to be subsequently processed, the substrate determined to be processed according to the route of (1) cannot continue the series of processes, and the series of processes is continued according to the route of (1). Can't do it.

Further, there is a case where the substrate for which the processing cannot be continued as described above remains in the module (buffer module B1) or the like before the process of the process module R3. In this case, since the buffer module B1 is shared with other routes (2) to (4),
The substrates to be processed according to the other routes (2) to (4) are transferred from the buffer module B1 to the transfer module T2.
Cannot be carried to other modules by using, and it becomes impossible to continue the processing performed according to these routes (2) to (4), which in turn stops the processing of the entire device. Will end up.

As described above, in the conventional film forming apparatus, when a failure occurs in any of the process modules, it becomes impossible to continue the process on the substrate having the process module as the route of the series of processes. Furthermore, since the substrate for which the processing cannot be continued remains inside the apparatus, it becomes impossible to continue the series of processing on other routes that do not use the above process module. Therefore, there is a situation in which the film forming process is significantly delayed. Further, when the substrate remains inside the apparatus, the failure cannot be recovered unless the substrate is removed, so that it takes a long time for the recovery and a large delay of the film forming process occurs. The present invention has been made in view of the above-mentioned conventional circumstances, and it is possible to continue a series of processes for a substrate even when a failure occurs in any of the modules, and improve the production efficiency of the film forming process. It is an object of the present invention to provide a film forming apparatus capable of performing the above.

[0010]

In order to achieve the above object, a film forming apparatus according to the present invention has a plurality of process modules for performing the same processing step on a substrate, and the process module for each step is provided. In a film forming apparatus connected through a transfer module that carries out a substrate transfer process, a detection unit that detects a failure of each process module during the execution of the above processing step and a failure by the detection unit of each process module in a subsequent step. Control means for selecting a usable process module that carries out the next step at the time of transfer processing between process modules of each step based on detection of occurrence and causing the transfer module to carry out the transfer processing. And

According to the present invention, when the detecting means detects the occurrence of a failure in the process module of the subsequent step during the execution of a series of film forming processes, the control means normalizes the step following the transfer module based on the detection. The substrate is transferred to a process module that can be used for As a result, even if a failure occurs in any of the process modules, the normal process module can be used as a substitute to perform the subsequent steps without trouble, and the substrate can be subjected to a series of processes.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The structure of a single-wafer CVD apparatus for an LCD according to an embodiment of the present invention will be described with reference to FIG. The same parts as those of the conventional CVD apparatus shown in FIG. 3 are designated by the same reference numerals. This CVD apparatus includes a carry-in module IN, a carry-out module OUT, and a process module R1.
To R7, buffer modules B1 and B2, transfer modules T1 to T4, and process module R
1 to R7, the detecting means S for detecting the operating state, and the transfer modules T1 to T1 based on the detection result of the detecting means S.
And a control means C for controlling the transport operation of T4.

Carry-in module IN and carry-out module O
The UT is a module that accommodates a plurality of (for example, 10) substrates, the carry-in module IN accommodates an unused substrate for processing, and the carry-out module OUT is an LCD.
A substrate that has been subjected to a series of processes by the manufacturing apparatus is housed.

The process modules R1 to R7 are modules that perform a predetermined process on each substrate to be processed, and the process modules R1 and R2 are modules that perform similar processes and form the first film, which is the first step. Then, the process modules R3 to R6 are modules that perform the same processing, respectively, and form the second film which is the second step, and the process module R7 forms the third film which is the third step. The substrate is subjected to a series of processes by performing the above three steps.

The buffer modules B1 and B2 are modules capable of temporarily accommodating a plurality of substrates (for example, five substrates). The buffer modules B1 and B2 accommodate the substrates which are being transferred between the transfer modules and are used for the next step. Adjust the transport time of. The buffer modules B1 and B2
Therefore, the order of unloading the substrates is determined, for example, to unload the first entered substrate first.

Each of the transfer modules T1 to T4 contains a transfer means (not shown) such as a robot arm, and transfers substrates one by one between the modules adjacent to the transfer module. For example, the transfer module T1 is provided between the carry-in module IN and the process module R1, between the carry-in module IN and the process module R2, between the process module R1 and the buffer module B1, and between the process module R2 and the buffer module B1. Then, the substrate is transported by. The carrying process is performed under the control of the control means C described later. The detection means S is provided in each of the process modules R1 to R7, and the operating state of the process module is always in operation when the apparatus is operating (for example, during module use, during module non-use, failure occurrence, etc.). Is being detected.

The control means C has information about a route as shown in FIG. 2 and information about a process and a process module that executes the process (in the embodiment, the first process is the process modules R1 and R2, and the second process is the process module). R3 ~ R
6, the third process (information called process module R7) is held, and the information on the position in the route for each substrate is grasped. Here, in FIG. 2, a route that can be taken when performing a series of film forming processes is set in advance, and one transfer is defined as one step, and subsequent steps that can be used from the previous module at each transfer step are performed. 2 shows a transportation route of a substrate to a module to be processed. In addition, the arrow in the drawing indicates the carrying process by any of the transfer modules T1 to T4.

Then, the control means C determines a usable process module for carrying out the next step based on the information on the module in which the substrate is located and the transfer step, the detection result of the detection means S, and the route information. Select and determine the process module that can process the substrate in the route information,
The transfer module is controlled to transfer the substrate according to the route including the process module.

When carrying out the step 3 of the second step from the state where the substrate has been stored in the buffer module B1 after the completion of the first step, the detecting means S can be used (that is, a failure has occurred). When the control module C selects, for example, the process module R3 as a process module capable of performing the next processing step among the process modules detected as (No), the buffer module B1 where the substrate is located in the route indicated in the route information. Is determined from the process module R3. Then, the control means C controls the transfer module T2 to convey the substrate. If there are not multiple process modules that perform the next process, or if the last process is completed, only one route is determined from the module where the board is located, so one route is included in the route information. After being set, the control means C causes the transfer module to carry out the transfer process according to this route.

Next, the operation in a series of processes of the single-wafer CVD apparatus for LCD according to one embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. When the processing of the substrate carried into the carry-in module IN is started, the control means C carries out the first step based on the information from the detection means S and the process module R.
1 or R2 is selected, and the substrate is transferred to the transfer module T1 (step 1). For example, when the process in the process module R1 is selected, the substrate is transferred to the process module R1 by the transfer module T1, and the substrate is transferred to the process module R1.
The substrate transferred to No. 1 is subjected to the first process.

When the processing of the first step is completed, the control means C
Causes the transfer module T1 to transfer the substrate.
In this case, there is only one route up to the buffer module B1 regardless of which process module is selected, and the substrate is transferred to the buffer module B1 by the transfer module T1 (step 2). Then, when the transfer is started from the buffer module B1, the control means C selects which of the process modules R3 to R6 can execute the process of the second step based on the information from the detection means S, and transfers the substrate. (Step 3). For example, if process module R3 or R4 is selected, the substrate is transferred by transfer module T2 to process module R3 or R4, or if process module R5 or R6 is selected, the substrate is transfer module T2. For the time being, it is transported to the buffer module B2.

Next, for the substrate transferred to the process module R3 or R4 in step 3, the control means C determines the route to the third process based on the route information after the completion of the processing of the second process, and the transfer module T2 It is transported to the buffer module B2 for the time being.
Further, for the substrate transferred to the buffer module B2 for performing the second step in the process module R5 or R6, the control means C selects which of the process modules R5 or R6 can execute the second step, Buffer module B2 by transfer module T3
It is conveyed to the process module R5 or R6 selected from (step 4).

Further, the control means C determines the route from the route information by the control means C for the substrate which has been subjected to the second process in the process module R3 or R4 and transferred to the buffer module B2, and the transfer module T3. To the process module R7, and to perform the process of the second step, the process module R7
For the substrate transferred to 5 or R6, the route is determined from the route information after the completion of the processing in the second step, and the transfer module T3 determines the process module R5 or R5.
6 to the process module R7 (step 5). Then, when the processing of the third step is completed in the process module R7, the control means C carries the substrate to the carry-out module OUT by the transfer module T4 (step 6). In this way, by selecting the route to the next module for each step and performing the process according to the route, as a result, one of the eight routes for performing the series of processes shown in FIG. 2 is executed. A series of film forming processes can be performed on the above.

When a failure occurs in, for example, the process module R3 among a plurality of process modules during the above-described series of film forming processes, the following operation is performed. Buffer module B1
The substrate accommodated in the first step starts step 3 of the second step, but when the control means C selects the process module for the next step, the detection means S detects the occurrence of a failure in the process module R3. Based on what has been done, the process module R3 is not selected, and any one of the normal process modules R4 to R6 that performs other similar processing is selected.

In this way, another normal process module that performs the same processing step is selected instead of the process module in which a failure has occurred, the substrate is transported according to the route based on this selection, and the next step is processed. Is done normally. The processing of the subsequent steps is similarly continued under the control of the control means C. Therefore, even if a failure occurs in any of the process modules, a series of film forming processes can be continued on the substrate.

In the above embodiment, the route is determined for each transport step. However, a series of routes for performing a series of processes is set in advance in a table or the like, and normally, the series of routes is set for each substrate. To execute the process, and only when a failure occurs, change a part of the route through the failed process module to a route through another process module that can be processed normally. The processing can be continued. Further, in the process module described in the above embodiment, only the film forming process is performed, but the process module may perform another process (for example, etching, ashing, etc.). Further, although the buffer module is provided in the above embodiment, the buffer module may be omitted depending on the procedure of the transfer process by the transfer module.

The present invention is not limited to an LCD manufacturing apparatus having a plurality of process modules for performing the same processing step, but may be a film forming apparatus having a plurality of process modules for performing the same processing step. It can be widely applied regardless of its format.

[0028]

As described above, according to the film forming apparatus of the present invention, when a failure in the process module of the subsequent process is detected during the execution of a series of film forming processes, the subsequent process is normally performed. Since the substrate is transferred to the process module that performs the process, the subsequent process can be performed in a normal process module without any problems, and a series of film forming processes can be continued. Efficiency is improved. Moreover, even in the event of a failure,
Since the processing can be continued without leaving the substrate in the apparatus, the time required for the failure recovery work can be shortened and the processing efficiency of the film forming apparatus can be improved.

[Brief description of the drawings]

FIG. 1 is a single-wafer CV for LCD according to an embodiment of the present invention.
It is a block diagram of D apparatus.

FIG. 2 is an explanatory diagram of a route of a film forming process according to an embodiment of the present invention.

FIG. 3 is a block diagram of a conventional single-wafer CVD apparatus for LCD according to a conventional example.

[Explanation of symbols]

T1, T2 ... Transfer module, R1, R2,
R3, R4, R5, R6, R7 ... Process module, S ... Detection means, C ... Control means,

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/68 H01L 21/68 A

Claims (1)

[Claims] 1. A film forming apparatus having a plurality of process modules for performing the same processing step on a substrate, wherein the process module of each step is connected through a transfer module for carrying out the substrate transfer processing. Based on the detection means for detecting a fault of each process module during the execution of the process and the detection of the fault occurrence by the detection means for each process module of the subsequent process, the following process is performed during the transfer process between the process modules of each process. A film forming apparatus comprising: a control unit that selects a usable process module that performs a process and causes a transfer module to perform a transfer process.