JPH0793503B2 - Green sheet punching device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A ceramic green sheet punching apparatus is provided, which is capable of punching with high precision in a state in which an opening end portion of a hole of a punched green sheet does not fall off. A device for pressing a green sheet installed on a mold having a plurality of dies with a punch fitted to the dies and punching holes at predetermined positions of the green sheet. A part of the die to be fitted is projected from the other surface of the die, and a gas supply hole for supplying gas to the space of the die and the green sheet is provided in the die.

[Industrial application field]

 The present invention relates to a green sheet punching device.

A multilayer ceramic print formed by forming via holes in a green sheet containing glass that is fused with ceramics as a main component, and stacking a printed circuit board forming member in which conductor layers are formed in the via holes and on the green sheet into a multilayer structure and then firing the multilayer structure. Since the insulation resistance of the board is higher than that of a conventional printed board using an epoxy resin as a base material, a high-power semiconductor element is mounted to form an electronic circuit of a large-scale computer. Used in printed circuit boards.

As a process for producing such a ceramic multilayer printed circuit board, raw materials such as alumina and borosilicate glass are kneaded with an organic solvent to form a slurry, and the slurry-like material is sandwiched between polyester films and rolled into a sheet. None, this green sheet is cut into a predetermined size. Further, this green sheet is punched at a predetermined position using a punch and a die to open a via hole, and then a via hole conductor is formed in the via hole, and a conductor layer having a predetermined pattern is formed on the green sheet. A circuit pattern is formed, laminated and fired to form a multilayer ceramic printed board.

[Conventional technology]

Conventionally, as a device for opening a via hole at a predetermined position of such a green sheet, the green sheet 3 is installed in a mold 2 provided with a plurality of dies 1 as shown in FIG.
Air pressurized to about 0.1 Kg / cm as shown by arrow A is fed from the hole 41 (gas supply port) opened in the mold to float the green sheet 3 above the mold 2, and the motor and the cam (Fig. The punch 4 is fitted into the die 1 and pressed by using a not-shown or the like to form the via hole 5 by punching at a predetermined position of the green sheet 3.

The reason why the green sheet 3 is floated above the surface of the mold 2 by air is to prevent the surface of the green sheet 3 from being scratched by the contact of the green sheet 3 with the mold 2. Have been to.

[Problems to be Solved by the Invention]

However, in the conventional device as described above, the green sheet 3
Since it has a small hardness and is soft, it is easily deformed and warped, and when it is pressed by the punch 4, it becomes caught in the lower part of the punch 4 and cannot be punched sharply, as shown in FIG. There is a drawback that a part of the green sheet 3 at the opening end portion 6 of the via hole 5 which is opened by fitting the punch 4 and the die 1 is detached and peeled off, and there is a problem that the hole cannot be drilled with high precision. is there.

Therefore, when the pressure of the air floating above the green sheet 3 is reduced and the punch presses the green sheet,
I try not to warp the green sheet. However, when this method is adopted, the scraps of the dropped green sheet are
There is a problem that when the green sheet that has adhered to the surface of the green sheet and is punched out is removed from the die, the punching scraps contact the green sheet and scratch the green sheet.

The present invention eliminates the above-mentioned problems, and prevents the green sheet from falling off at the opening end of the opened hole,
An object of the present invention is to provide a device for punching a printed circuit board, which is capable of punching with high precision.

[Means for Solving the Problems]

As shown in FIG. 1, a printed circuit board perforating apparatus of the present invention that achieves the above-mentioned object causes a die 1 which is fitted with a punch 4 to partially protrude above the other surface of a mold 2, The die 1 is provided with a gas supply hole 13 for supplying a gas to the protruding die 1 and the space 11 of the green sheet 3.

[Work]

In the apparatus of the present invention, as shown in FIG. 1, since the die 1 that fits into the punch 4 partially projects, the green sheet 3
The contact area with the die 1 is small, and the reaction force against the pressing force of the punch at the time of punching is applied to the punch side, so that the force is evenly applied from the front surface and the back surface side of the green sheet, so there is little deflection. Therefore, the punching process of the green sheet 3 is prevented, so that the green sheet 3 is not wound around the punch 4, and the accident such as the dropping of the green sheet at the opening end 6 of the via hole 5 is eliminated, and the precision is high. Holes can be drilled according to dimensions.

Further, by supplying a pressurized gas to the space between the protruding portion of the die and the surface of the die, the scraps adhering to the surface of the green sheet after punching are also discharged by the pressurized gas, There will be no accident of scratches on the surface of the green sheet.

〔Example〕

An embodiment of the present invention will be described in detail below with reference to the drawings.

1 is an explanatory view of hole drilling using the apparatus of the present invention, FIG. 2 is a plan view of a die provided with the die of the present invention, and FIG. 3 is taken along line II-II 'in FIG. FIG.

As shown in FIGS. 1, 2, and 3, the mold 2 in the apparatus of the present invention has a pitch 1 of 2.5 mm and a diameter of 1, for example.
A plurality of dies 1 each having a hole 12 of about 00 μm and having a diameter of 1 mmφ and protruding to a thickness t of 0.2 mm from the surface of the mold 2 are provided on the upper portion.

The mold 2 is also provided with a plurality of gas supply ports 13 for supplying pressurized air to the space 11 between the mold surface and the protruding die 1.

In addition, punch 4 of the quantity corresponding to the die 1 is installed,
A green sheet 3 having a thickness of 0.3 mm is installed on the die 1, and the punch 4 (not shown) is pressed by a cam and a motor to open a via hole 5 at a predetermined position.

Thus, in the device, the green sheet 3 is the die 1
When the green sheet 3 is pressed by the punch 4, the pressing force of the green sheet 3 prevents the green sheet 3 from warping and bending, and the opening end 6 of the opened via hole 5 is green. There is no accident that part of the seat 3 falls off.

Further, even if sufficient pressurized air is supplied to the space between the die 1 and the surface of the mold 2, the partially protruding reaction force of the die acts against the pressing force of the punch, so that the green sheet 3 is placed above. Since it is less likely to be lifted up, the compressed air can be sufficiently supplied, and the scrap 14 can be sufficiently removed. Therefore, the green sheet 3 after punching with the scrap 14 is die 1
Further, at the time of removal, the scraps rub against the surface of the green sheet 3 so that the surface of the green sheet is not scratched. As a result, the precision of punching the green sheet is improved, and a high-quality multilayer ceramic printed circuit board without scratches on the surface can be obtained.

〔The invention's effect〕

As is clear from the above description, according to the present invention, since the green sheet is less likely to bend on the die during the punching process, the green sheet is less likely to fall off at the opening end of the punched hole. There is an effect that the hole can be drilled with high accuracy.

[Brief description of drawings]

FIG. 1 is an explanatory view of hole drilling using the apparatus of the present invention, FIG. 2 is a plan view of a die provided with a die of the present invention, and FIG. 3 is taken along line II-II ′ of FIG. A cross-sectional view, FIG. 4 is an explanatory view of hole processing in a conventional apparatus, and FIG. 5 is an inconvenient state diagram of a green sheet processed by a conventional apparatus. In the figure, 1 is a die, 2 is a mold, 3 is a green sheet, 4 is a punch, 5 is a via hole, 11 is a space portion, 12 is a vent hole, 13 is a gas supply port, and 14 is a scrap.

Claims (1)

[Claims] 1. A green sheet (3) set on a mold (2) having a plurality of dies (1) is pressed by a punch (4) fitted to the dies (1) to obtain the green sheet. A device for making a hole at a predetermined position in (3), wherein a die (1) part fitted with the punch (4) is made to project from the other surface of the mold (2), and the projected die (1) )
And a green sheet perforating apparatus characterized in that a gas supply hole (13) for supplying gas to the space of the green sheet (3) is provided in the mold (2).