JPH06252557A - Manufacture of multilayered substrate of ceramics and jig for green sheet carrier - Google Patents

Abstract

PURPOSE:To improve handling property when a green sheet is fluidized and to improve position determining accuracy. CONSTITUTION:A reniforcing sheet 7 is stuck to the outer surface part of a green sheet 1. A first positioning hole H1 is formed at the outer surface part. A second positioning hole H2 is formed at the inner side of the first positioning hole H1. Then, a fluidizing sheet 8 is coupled to the lower surface sides of the green sheet 1 and the reinforcing sheet 7. The fluidizing sheet 8 has a protruding part 8a having the approximately same high height as the thickness of the reinforcing sheet 7. The first positioning hole H1 is utilized, and the printing of conductor circuits 3a and 3b and the cutting of the outer surface part are performed. Then, after the fluidizing sheet 8 is removed from the green sheet 1, lamination is performed by utilizing the second positioning hole H2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic multilayer substrate and a jig for a green sheet carrier.

[0002]

2. Description of the Related Art Conventionally, there has been generally known a method of manufacturing a ceramic multilayer substrate in which a conductor circuit printing process and an outer peripheral portion cutting process are performed on a green sheet, and then a laminating process and a firing process are performed.

In such a manufacturing method, the green sheet is manually flowed by an operator into a different device for each process, and a predetermined treatment or processing is performed on the green sheet. Normally, each device is provided with a plurality of guide pins, and the positioning accuracy of the green sheet is obtained by inserting and fixing the pins in the positioning holes of the green sheet.

[0004]

However, the above-mentioned conventional method for manufacturing a ceramic multilayer substrate has the following problems.

For example, in the conventional manufacturing method, since a common positioning hole is used when positioning is performed in each step, the positioning hole is often deformed or damaged after each step. For this reason, the positioning accuracy deteriorates in the later processes, and as a result, the amount of misalignment is ±
It was difficult to achieve highly accurate positioning of 0.01 mm or less.

Further, since the green sheet before firing is soft and fragile, careless handling during flow may cause deformation of the green sheet itself or damage such as cracks. It was

The present invention has been made in view of the above circumstances, and an object thereof is to improve the handling property when flowing a green sheet and to improve the positioning accuracy of the green sheet in each process. An object of the present invention is to provide a possible ceramic multilayer substrate manufacturing method and a green sheet carrier jig.

[0008]

In order to solve the above problems, according to the invention of claim 1, after performing a positioning hole forming step for the green sheet, a conductor circuit printing step and an outer peripheral portion cutting step, In a method for manufacturing a ceramic multilayer substrate, which comprises a step of laminating green sheets and a step of firing laminated green sheets, a conductor circuit printing step and the outer periphery are performed after a reinforcing sheet is attached to an outer peripheral portion of the green sheet. The first positioning hole used in the part cutting step is formed in both the green sheet and the reinforcing sheet, and the second positioning hole used in the laminating step is formed in the first positioning hole. On the lower surface side of the green sheet and the reinforcing sheet that have been formed through the positioning hole forming step, and the thickness of the reinforcing sheet and A flow sheet having projections of the same height and having through holes formed in the outer peripheral portion thereof that are substantially similar to the first positioning holes is fitted, and in this state, the first positioning holes are formed. The gist of the present invention is that after the conductor circuit printing step and the outer peripheral portion cutting step are performed using the flow sheet, the flow sheet is removed from the green sheet, and then the laminating step is performed using the second positioning hole.

Further, the invention according to claim 2 has a reinforcing sheet having an opening portion at a central portion thereof, having a height substantially the same as the thickness of the reinforcing sheet and being capable of being fitted into and removed from the opening portion. The gist is a jig for a green sheet carrier, which comprises a flow sheet having a convex portion.

[0010]

According to the present invention, different positioning holes are used in the conductor circuit printing step and the outer peripheral portion cutting step and in the laminating step. Is less likely to occur. Moreover, since the first positioning hole is formed on the outer peripheral portion of the green sheet to which the reinforcing sheet is attached, it is not deformed or damaged even after several times of flow. Further, since the green sheet is supported by the reinforcing sheet and the flow sheet while being supported from the lower surface side, the green sheet itself is less likely to be deformed or damaged.

According to the structure of the green sheet carrier jig of the second aspect, the lower surface side of the green sheet is formed by the reinforcing sheet and the flow sheet in which the openings and the protrusions are fitted. It is flowed in the state of being supported by. For this reason, it becomes difficult to apply a force that causes deformation or the like to the green sheet, and the handling property during flow is improved.

[0012]

EXAMPLES The present invention will now be described with reference to aluminum nitride (AlN).
An embodiment embodied in a method for manufacturing a multilayer substrate will be described in detail with reference to FIGS.

First, sheet forming is performed by a doctor blade method using a slurry obtained by adding a sintering aid and a binder to AlN powder, and a green sheet (outer shape 250) is formed.
mm × 250 mm, thickness 0.4 mm) 1. afterwards,
The green sheet 1 was dried as specified.

Next, as shown in FIG. 1 (a), a reinforcing sheet 7 constituting a jig 6 for a green sheet carrier was attached to the outer peripheral portion of the lower surface of the green sheet 1. Also,
A substantially square opening 7a is provided at the center of the reinforcing sheet 7. In this embodiment, a resin film having a thickness of 0.180 mm is used as a material for forming the reinforcing sheet 7. An adhesive 7b is previously applied to one surface of the resin film, and the green sheet 1 and the resin film are adhered to each other via the adhesive 7b (see FIG. 2).

Next, as shown in FIG. 1B, both the green sheet 1 and the reinforcing sheet 7 were punched. Then, the first positioning hole H1 is formed in the outer peripheral portion of the green sheet 1, that is, the portion to which the reinforcing sheet 7 is attached, and the second positioning hole H2 is formed in the inner portion thereof. . At the same time, many through-hole forming holes 2 were formed in the green sheet 1. The first positioning hole H1 is used in the subsequent conductor circuit printing process and outer peripheral portion cutting process, and the second positioning hole H1 is used.
2 will be used in the lamination process.

After the positioning holes H1 and H2 are formed, as shown in FIG. 1 (c), the flow forming the green sheet carrier jig 6 is formed on the lower surface side of the green sheet 1 and the reinforcing sheet 7. The sheet 8 was placed. As shown in FIG. 2, a convex portion 8a having substantially the same height as the thickness of the reinforcing sheet 7 is formed in the central portion of the upper surface of the flow sheet 8. Therefore, the convex portion 8a of the flow sheet 8 is
It is possible to fit the opening 7a of the reinforcing sheet 7 in and out.

Further, a through hole H3 having substantially the same size as the above-mentioned first positioning hole H1 is formed on the outer peripheral portion of the flow sheet 8 on the same axis as the first positioning hole H1. . In this embodiment, the same resin film as the reinforcing sheet 7 is used as the material for forming the flow sheet 8. And, on the upper surface of this resin film,
As a means for improving the releasability from the green sheet 1 and the reinforcing sheet 7, a release agent 8b is applied in advance (see FIG. 2).

Next, the flow sheet 8 is fitted to the reinforcing sheet 7 in the state of FIG.
Flows to 0, and the jig 11 of the screen printing machine 10
The guide pin 11a was inserted into the first positioning hole H1 and the through hole H3.

Here, the conductive metal paste P was printed after performing the predetermined positioning by the guide pin 11a, the first positioning hole H1 and the through hole H3. Then, as shown in FIG. 1D, a through-hole conductor circuit 3a as a conductor circuit and a wiring pattern 3b were formed on the green sheet 1. In this example, a conventionally known tungsten paste containing tungsten powder as a main component was used for printing.

Similarly, the flow sheet 8 and the reinforcing sheet 7 are
The flow up to the cutting machine 12 was carried out in the state of being fitted to, and the guide pin 13a of the jig 13 of the cutting machine 12 was inserted into the first positioning hole H1 and the through hole H3. Then, after performing predetermined positioning by the guide pin 13a and the first positioning hole H1 and the through hole H3, the outer peripheral portion of the green sheet 1 was cut (see FIG. 1 (e)).

After that, the flow sheet 8 is removed from the green sheet 1 that has flowed to the laminating apparatus 14, and a plurality of sheets (in this embodiment, 5 sheets) are placed on the jig 15 of the laminating apparatus 14.
One sheet of green sheet 1 was placed on top of another. Then, after the predetermined positioning is performed by the guide pin 15a and the second positioning hole H2, the green sheet 1 is thermocompression bonded by applying a pressing pressure to obtain a laminated body 4 (FIG. 1).
(See (f)). Then, the laminate 4 was subjected to pre-baking and main baking according to a conventional method to obtain a desired AlN multilayer substrate.

Several such AlN multi-layered substrates were manufactured, and the lateral displacement of the conductor circuits 3a and 3b (±
mm) was investigated. Also, before the lamination process, the green sheet 1
And the presence or absence of deformation / damage of the first and second positioning holes H1 and H2 and deformation / damage of the green sheet 1 were examined. The results are shown in Table 1.

Further, in the method of the comparative example, the green sheet was made to flow manually by an operator as in the conventional case without using the jig 6 for the green sheet carrier as in the above-mentioned embodiment. Further, the positioning in each step was performed using only one type of positioning hole (that is, the hole corresponding to the first positioning hole in the example). The same investigation was carried out for the green sheet and the AlN multilayer substrate thus obtained.

[0024]

[Table 1]

When the amount of positional deviation was investigated, it was found that the embodiment showed a very small value of ± 0.005 mm, and the positioning accuracy was extremely excellent. On the other hand, in the comparative example, the value was ± 0.030 mm, which was higher than that in the example.

In the embodiment, the positioning holes H1 and H2 are also provided.
In addition, no particular deformation or the like was observed in the green sheet 1, whereas in the comparative examples, the deformation or the like was observed in any of them.

In the method of this embodiment as described above, the first positioning hole H1 and the through hole H3 are used in the printing process and the cutting process, and the second positioning hole H2 is used in the laminating process. It is characterized by being used. In this case, the positioning holes H1 and H2 are less likely to be deformed or damaged than in the conventional case. Moreover, since the first positioning hole H1 is reinforced by the reinforcing sheet 7, the first positioning hole H1 is not deformed or damaged even after several times of flow. Therefore, the positioning accuracy of the green sheet 1 in each step is surely improved, and as a result, the AlN multilayer substrate having excellent dimensional accuracy can be efficiently obtained.

The green sheet 1 is also a reinforcing sheet 7.
Since the flow sheet 8 and the flow sheet 8 support the flow from the lower surface side, the green sheet 1 itself can be prevented from being deformed or damaged. Further, since the opening portion 7a and the convex portion 8a are fitted to each other during the flow of the green sheet 1, it is difficult to apply a force that causes deformation or the like to the green sheet 1, and the handling property at the time of flow is improved. Also improves.

In addition, by using the carrier jig 6 as described above, it is possible to reliably prevent the deformation of the green sheet even when handling a large green sheet for so-called multiple picking. There is. Further, the use of the carrier jig 6 is extremely convenient when flowing a thin green sheet (for example, 0.2 mm thick).

The present invention is not limited to the above embodiment, but can be modified as follows. For example, (a) the present invention is not limited to the method of manufacturing an AlN multilayer substrate as in the embodiments, but may be embodied in a method of manufacturing an alumina multilayer substrate, a boron nitride multilayer substrate, or the like.

(B) The green sheet carrier jig 6 of the present invention is not limited to use only when manufacturing a multi-layer substrate, and can of course be used when manufacturing a single-sided plate or a double-sided plate. is there.

(C) Green sheet 1 and reinforcing sheet 7
The means for adhering and is not limited to the method using the adhesive as in the embodiment, and it is of course possible to substitute other conventionally known means. Further, it is not always essential that the both 1 and 7 are brought into surface contact with each other to be completely fixed.

(D) Reinforcing sheet 7 and flow sheet 8
Is not limited to the resin film as in the examples. For example, a metal plate, a wood plate, or the like may be used as long as it has a predetermined rigidity and can be punched.

(E) With the reinforcing sheet 7 and the flow sheet 8 fitted in advance, the first and second positioning holes H1 and H2, the through hole forming hole 2, and the through hole H3.
May be formed.

(F) The flow sheet 8 may be thrown away each time, or may be used repeatedly. (G) The reinforcing sheet 7 is not necessarily integrated as in the embodiment, and may be replaced by, for example, attaching four tapes or the like having the same thickness to the outer peripheral portion of the green sheet 1. At that time, it is desirable to form a portion corresponding to the opening 7a.

(H) First and second positioning holes H1,
The number of H2 formed and the manner of arrangement thereof are not limited to those shown in the examples. Further, the diameter of the through hole H3 of the flow sheet 8 is set to the first and second positioning holes H1.
, H2 diameter may be set smaller. That is, since only the through hole H3 substantially participates in the positioning during the printing process and the cutting process, it is possible to further prevent the deformation of the first positioning hole H1.

[0037]

As described in detail above, according to the method for manufacturing a ceramic multilayer substrate and the jig for a green sheet carrier of the present invention, the handling property when flowing the green sheet can be improved and each step can be performed. It has an excellent effect that the positioning accuracy of the green sheet can be improved.

[Brief description of drawings]

1A to 1F are schematic front cross-sectional views for explaining a process of manufacturing an AlN multilayer substrate of an example.

FIG. 2 is a perspective view showing a green sheet and a green sheet carrier jig.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Green sheet, 3a ... Conductor circuit in through hole as conductor circuit, 3b ... Wiring pattern as conductor circuit, 6 ... Jig for green sheet carrier, 7 ... Reinforcing sheet, 7a ... Opening part, 8 ... Flowing Sheet, 8a ...
H1 ... First positioning hole, H2 ... Second positioning hole, H3 ... Through hole.

Claims (2)

[Claims] 1. A green sheet (1) is laminated after a positioning hole (H1, H2) forming step, a conductor circuit (3a, 3b) printing step and an outer peripheral cutting step are performed on the green sheet (1). In the method for manufacturing a ceramic multilayer substrate, which comprises a step and a step of firing the laminated green sheet (4), a reinforcing sheet (7) is attached to an outer peripheral portion of the green sheet (1), and then the conductor circuit ( 3a, 3b) The first positioning hole (H1) used in the printing process and the outer peripheral portion cutting process is formed in both the green sheet (1) and the reinforcing sheet (7), and the lamination process is performed. A second positioning hole (H2) to be used as a green sheet which is formed inside the first positioning hole (H1) and further subjected to the positioning hole (H1, H2) forming step. 1) and the reinforcing sheet (7), the lower surface side of the reinforcing sheet (7) has a convex portion (8a) having substantially the same height as the thickness of the reinforcing sheet (7), and the first positioning hole (H1) is provided on the outer peripheral portion thereof. ), A flow sheet (8) having through holes (H3) almost similar to the above is fitted, and in this state, the conductor circuit (3a, 3b) is printed by using the first positioning hole (H2). After performing the process and the outer peripheral cutting process, the flow sheet (8) is removed from the green sheet (1), and then the laminating process is performed using the second positioning hole (H2). Manufacturing method of ceramic multilayer substrate. 2. A reinforcing sheet (7) having an opening (7a) in a central portion, and having a height substantially the same as the thickness of the reinforcing sheet (7) and with respect to the opening (7a). A jig for a green sheet carrier, which comprises a flow sheet (8) having a protrusion (8a) that can be fitted and removed.