JPH0644139U - Wafer holding jig - Google Patents

Abstract

(57) [Abstract] [Purpose] Properly guide the gas flow around the supporting groove in the holding jig that holds and holds a large number of semiconductor wafers in the heat treatment apparatus, and deposits on the contact surface between the wafer and the supporting groove. (EN) Provided is a wafer holding jig capable of preventing accumulation of substances and capable of processing a high-quality support groove. A wafer holding jig having a supporting member having a plurality of supporting grooves extending in parallel so that a wafer can be held in parallel, and a holding space for holding and holding the wafer therebetween is formed between the supporting members. A deep groove that can communicate with the plurality of support grooves is formed at the bottom of the groove so that the gas flow flowing along the deep groove can be guided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor accommodating jig for aligning and holding a large number of semiconductor wafers, and is particularly suitable for mounting a semiconductor wafer and for allowing a gas flow to be brought into contact with the surface of the wafer to flow smoothly in a wafer heat treatment apparatus. Wafer holding jig.

[0002]

[Prior art]

 Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter referred to as “wafer”) is placed in a heating furnace surrounded by a heater and a raw material gas is allowed to flow along with a predetermined carrier gas, and a high temperature atmosphere in the range of 400 to 1400 degrees Celsius is used. A drive-in process is performed below to infiltrate impurities into the wafer. At this time, a semiconductor holding jig (hereinafter referred to as a holding jig) called a paddle, a cassette boat, a mother boat carrying a plurality of the cassette boats or a wafer support boat, which holds and holds a large number of wafers in an aligned manner, is used. It is used. Generally, quartz glass, silicon, or their compounds having high chemical stability is used for the holding jig. This holding jig is suitable for handling a large number of wafers to be stored as one unit during each process. It is processed into tube material, plate material and solid bar, and supports single or multiple points capable of supporting the wafer. A support rod or support member (hereinafter referred to as a support rod) having a support groove for holding the peripheral edge of the wafer is manufactured, and these are arranged by arranging them for the number of wafers to be stored, and manually transferring tweezers or the like thereto. Wafers are stored one by one by using a replacement tool, and usually the wafer is processed together with the holding jig. In order to obtain a uniform film thickness distribution by crystallization of gas raw materials such as silane and phosgene on the surface of the wafer, each wafer in this holding jig is not allowed to stay in the gas flow or back-doped, By properly guiding the gas to be supplied from upstream to downstream, the processing area for forming an effective film thickness can be made as large as possible, and the effective product yield of the wafer can be improved. Proposal of improvement for supporting grooves such as supporting rods of holding jigs in order to have the exposed area as wide as possible, or to prevent the occurrence of slip lines and damage to the held parts of the wafer. No. 54-152863). In those proposals, the supporting groove is a V-shaped groove, a Y-shaped groove, a taper groove, a U-shaped groove, or a deformed groove that fulfills a predetermined purpose, and a wafer is brought into contact with the bottom and side portions of the groove, and its posture is maintained. There is also a shape that allows gas to enter inside the groove while stabilizing and maintaining the stability. The above-mentioned support groove is provided on the inner surface side using a support plate having a semi-circular cross section. Especially, the cutting process of the wafer support groove requires an advanced manufacturing technique for the concave shape of the groove shape and its length. I needed it.

[0003]

[Problems to be solved by the device]

 However, in the case of a shape such as a V-shaped groove that allows gas to enter the inside of the groove, the wafer is held in point contact with the support groove, and therefore the wafer may be chipped at its contact end when taking it in and out. In the case where a slip line is likely to occur and the posture is stable by abutting against the side of the groove, the dead space tends to become large, and eventually, even with the above-mentioned proposal, the supporting rods of the holding jig and the like can support the wafer. The gas flowability near the groove is poor, and the wafer is apt to stick to the gas dead groove due to the vaporized material that is generated during the manufacturing process due to the particulate gas raw material and other fine particles. In addition, the sticking phenomenon makes it difficult to remove the wafer from the holding jig, which adheres to the support rods, or the adhesion causes the film surface formed on the wafer to contact the contact surface or the wafer surface. Easily detached from Doha end, and such poor growth and crystalline deterioration of the oxide film is likely to occur, it had a problem. These problems have resulted in poor product yields. On the other hand, as a problem in manufacturing the supporting groove, the quartz glass for cutting the supporting groove has a long groove length and a short groove interval between adjacent grooves, so that heat generated during cutting by the blade saw is generated. Also, there was a problem that some grooves were chipped due to cutter vibration and the like.

In view of the above-mentioned drawbacks of the prior art, the object of the present invention is to consider the characteristics of the structure of the wafer heat treatment apparatus and the holding jig, and to guide the gas flow appropriately while providing an effective posture. By means that can be ensured without compromising the maintenance of the deposits, even if deposits were accidentally generated on the contact surface between the wafer and the support grooves, they would rarely deposit there, resulting in an improvement in the product yield rate. An object is to provide a wafer holding jig designed.

[0005]

[Means for Solving the Problems]

 The present invention has a wafer holding jig having a supporting member or a supporting rod having a plurality of supporting grooves extending in parallel so that the wafer can be held in parallel, between which a holding space for mounting and holding the wafer is formed. In the above, the deep groove that can communicate with the plurality of the support grooves is formed at the bottom of the support groove, and the gas flow flowing along the deep grooves can be guided.

[0006]

[Action]

 According to this technical means, unlike the conventional invention, the gas flow flowing into the support groove along the surface of the wafer does not abut against the bottom of the support groove and stay there, and the resistance of the support groove is not increased. Since it is guided by the deep groove provided at the bottom and flows away, the deposits are less likely to be generated and become a sticking element.Therefore, the problem of peeling of the film surface from the wafer surface when the wafer is taken in and out of the support groove is also fixed. It is reduced due to fewer elements. Furthermore, in the manufacturing process of the wafer holding jig, the deep groove machining performed first realizes a favorable machining environment and improves the machining precision of the support groove.

[0007]

【Example】

 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, etc. of the components described in this embodiment are not intended to limit the scope of the present invention to them, unless otherwise specified. It is only an example. 1 and 2 illustrate a support groove of a wafer holding jig according to a first embodiment of the present invention. FIG. 1 is an overall perspective view showing an essential part of the supporting member, and FIG. 2 is an essential part thereof. In a cross-sectional view, the width direction that forms the holding space 5 has a semicircular cross section, and semi-circular handles 6 for transportation are fixedly attached to both upper ends of the support member 3 whose longitudinal axis is the axial direction. The boat 10 is formed, and the inner wall of the support member 3 is axially aligned with a plurality of deep grooves 9 communicating with both ends thereof at a predetermined interval orthogonal to the axial direction, corresponding to the number of stored wafers 1. The support groove 7 is provided by cutting shallower than the deep groove 9. The wafer 1 comes into contact with the support groove bottom portion 7a of the support groove 7 at the contact surface 1a thereof, and the posture thereof is held by the side wall 8 of the support groove 7 as necessary. At appropriate places on both ends of the lower surface of the support member 3, a foot portion not described here is provided for placement, if necessary.

3 and 4 illustrate a supporting groove of a wafer holding jig according to a second embodiment of the present invention. FIG. 3 is an overall perspective view showing a main part of the supporting rod, and FIG. In the cross-sectional view of the main part, a triangular connecting member 4a, 4b is formed by a V-shaped member 4b and a member 4a connecting the top of the V-shaped member 4b, which substantially determines the width of the holding space 5 at both ends, and the left and right sides are opposed to each other. The supporting rods 2a, 2b, 2c connecting the corresponding triangular tops of the connecting members each have a length equal to the number of the wafers 1 that can be stored in a row, and a fixed interval is provided inside the supporting rods 2a, 2b, 2c. A predetermined number of supporting grooves 7 having a required depth are cut out so that the supporting groove bottom portion 7a of the supporting groove 7 abuts against the peripheral edge of the wafer 1 and can be held, corresponding to the size of the wafer 1. Formed so as to be able to communicate with the supporting groove 7, The deep groove 9 having a deep groove depth is formed so as to extend to the length extending to the support grooves arranged at both ends of the connecting members 4a, 4b. A foot 4c for mounting is provided on the connecting members 4a, 4b to form a holding jig 10 together with the supporting rod 2. As a result, the wafer 1 is held by the three support rods 2 through the support grooves 7. Here, graphite and a high-quality heat-resistant ceramic material are used for each member constituting the boat 10 in addition to the quartz glass material and the like, which contributes to uniform heat distribution of the wafer 1.

Next, the operation related to the steps involved in the device of the present invention will be described. In the manufacturing process of the wafer holding jig, which is carried out by means not shown here, after deep groove processing with dimensional accuracy not being precise is performed first, the support groove for holding the wafer is cut to intersect with the deep groove. To manufacture. As a result, the cutting area of the supporting groove is reduced by the amount of the deep groove that was previously machined, and the cooling liquid used during cutting of the supporting groove is improved and the heat generated during cutting is quickly generated. Together with the removal, the deteriorated cooling liquid and cutting debris in the cooling liquid do not stay, so the cutter vibration during cutting is reduced and the load generated on the groove side surface is reduced, resulting in chipping of the groove part, etc. It effectively acts to suppress the above problem and contributes to improving the processing accuracy of the support groove. Here, the deep groove does not necessarily have to be long and formed by forming one groove, but may be formed by a plurality of distributed deep grooves which communicate with each other.

A wafer holding jig, which is manufactured by arranging a support groove having a deep groove processed in this way, and on which a predetermined number of wafers corresponding to the number of stored wafers are mounted, is arranged in a heating furnace (not shown). Then, it undergoes a predetermined heat treatment step of flowing a predetermined processing gas. In this process, the processing gas deposits the gas raw material on the film surface while contacting the wafer surface, a part of it flows around the supporting groove, and abuts on the supporting rod or the bottom of the supporting groove to deposit on the abutting surface. Or, it causes sticking, but since there is a gas flow guideway by a deep groove in front of the contact surface, the gas flows away along the guideway, and no stagnant gas is generated around the support groove. As a result, it contributes to the growth of the oxide film and thus to the prevention of the deterioration of the crystallinity, and at the same time, the above-mentioned cause of collision is weakened or removed, and as a result, the remainder of the processing gas is discharged to the outside of the process. Due to the improvement of the cause of the collision, the cause of sticking to the holding jig of the wafer was removed as a result of the reduction of the area of the fixed part due to the formation of voids, which was provided at the bottom of the support groove by forming the deep groove, and the cause of the film surface peeling was also included. Be improved.

[0011]

[Effect of device]

 As described above, according to the present invention, since the wafer supporting groove is processed after the deep groove is formed, the finishing accuracy of the supporting groove is increased, and the manufacturing technique of the wafer holding jig is improved. In the wafer manufacturing, the function as a holding jig, that is, uniform gas flow distribution without impairing the wafer holding function, removal of the cause of sticking between the wafer and the holding jig, and improvement of product yield are achieved. It is possible to provide a good quality wafer holding jig, and so on. It becomes possible and its practical value is extremely large.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing a main part of a support member for explaining a support groove of a wafer holding jig according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an essential part for explaining a support groove of the wafer holding jig according to the first embodiment of the present invention.

FIG. 3 is an overall perspective view showing a main part of a support rod for explaining a support groove of a wafer holding jig according to a second embodiment of the present invention.

FIG. 4 is a sectional view of an essential part for explaining a support groove of a wafer holding jig according to a second embodiment of the present invention.

[Explanation of symbols]

 1: Wafer 2: Support rod 3: Support member 7: Support groove 7a: Support groove bottom 9: Deep groove

Front page continuation (72) Shinzo Wakaizumi, No. 4, No. 3, Kayoya-cho, Takefu-shi, Fukui Prefecture Fukui Shinetsu Quartz Co., Ltd. (72) Kazuhiko Akaboshi, No. 4, No. 3, Kayoya-cho, Takefu-shi, Fukui Prefecture Company Fukui Shinetsu Quartznai (72) Inventor Koji Uno No. 4 stock No. 3 Kayaya-cho, Takefu-shi, Fukui Prefecture Fukui Shinetsu Quartzuchi Co. Ltd. (72) Inventor Mikio Ueda No. 4 No. 3 Kayutani-cho, Takefu-shi Fukui Prefecture Company Fukui Shinetsu Quartz

Claims (1)

[Scope of utility model registration request] 1. A wafer holding jig having a support member having a plurality of support grooves extending in parallel so that a wafer can be held in parallel and having a holding space between which the wafer can be placed and held, A wafer holding jig, characterized in that a deep groove that can communicate with a plurality of the support grooves is formed in a bottom portion of the support groove, and a gas flow flowing along the deep grooves can be guided.