JPH05267090A - Heat resistant and highly conductive composite strand - Google Patents

Abstract

PURPOSE:To satisfy in all aspects including heat resistance, bending resistance, high conductivity and a cost by forming an inner layer of an electric copper wire, an outer layer of heat resistant copper alloy and specifying its sectional area ratio. CONSTITUTION:An inner layer 1 is formed of an electric hard copper wire, and an outer layer 2 is covered with heat resistant copper alloy. In this case, a sectional ratio of the copper wire of the inner layer to the alloy of the outer layer is set to a range of 1:1-2. The ratio is set to 1:2 because of a limit in manufacture in which adhering amount of the alloy becomes '2' at a maximum for '1' of the wire and compensation of bending resistance by a strength of the alloy of the outer layer. The lower limit of 1:1 of the ratio is set because, if it is lower than 1:1, the bending resistance is reduced due to a thin coating of the alloy, its production efficiency is deteriorated and a high cost is inevitable.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to resistors, capacitors,
It is used as a wire of a terminal lead wire of an electronic device component such as a silicon or germanium semiconductor element.

[0002]

2. Description of the Related Art Pure copper wires, solder-plated copper wires, tin-plated copper wires and the like have been frequently used as lead wires for electronic equipment parts.

Since these lead wires are subjected to various heat treatments and inevitable bending stress in the process of manufacturing electronic equipment parts, the pure copper wires are softened and bent under bending stress.

For example, lead wires used for resistors and capacitors are subjected to heat treatment at 250 ° C. or lower in manufacturing processes such as brazing, molding, painting and stabilizing treatments. Also,
In the case of semiconductor elements, 300
After heat treatment at 400 ° C. for about 10 minutes, the connection part is molded with a synthetic resin material. In particular, in the case of oxygen-free copper wire used as an element wire, it has high electrical conductivity and thermal conductivity, but it is recrystallized by heat treatment at about 200 ° C and is softened to reduce bending strength. The lead wire is bent in the next barrel plating step.

On the other hand, in manufacturing these electronic device parts,
Since the mass production method by automation is adopted, if the terminal lead wire is softened and bent, it will hinder automation, and it is no longer possible to manually select and correct the bend and follow the automation. This is not possible, and causes a trouble when mounting these element parts on the printed circuit board.

[0006] In order to solve such a problem, as an element wire replacing the pure copper wire, a copper covered wire (cp wire or cw wire) or various heat resistant copper alloy wires are used.

However, there is a strong demand for the following comprehensive characteristics as a lead wire suitable for mass production of electronic equipment parts. That is, (1) heat resistance to the heat treatment in the process, (2) strong bending resistance to bending stress, (3) conductivity of 95% or more, and heat Good conductivity, (4) Cheap price.

In response to these requirements, the copper covered wire has a low conductivity and a high product price. Regarding the heat resistant copper alloy wire, Cu-Zr system, Cu-Cr system, Cu-Fe system, Cu
Precipitation hardening type alloy wires such as —Si type and Cu—Sn type require high-temperature heat treatment and aging treatment, and therefore are expensive and their electrical conductivity is significantly lower than that of copper, and the requirements cannot be satisfied.

On the other hand, Cu-Ag (0.02-0.15w
t%), Cu-In (0.02-0.15 wt%), C
u-Sn (0.02-0.15 wt%), Cu-Cd
(0.02-0.2 wt%), Cu-Y (0.05-
A heat-resistant copper alloy wire with a small amount of added elements such as 0.1 wt%) has been put to practical use. However, in the Cu-Cd system, its use is not appropriate due to the toxicity of Cd, and C
In the u-Sn system, heat resistance and bending resistance are satisfied, but the conductivity is low. Cu-Ag-based, Cu-In-based, and Cu-Y-based alloy wires cannot be said to be sufficiently satisfied in terms of overall characteristics including cost.

That is, the noble metal element such as Ag added to these alloys is expensive, and depending on the amount added, the cost of the lead wire is greatly increased. for that reason,
For example, when the amount of Ag added is reduced, the bending resistance is remarkably inferior and it is difficult to put it into practical use.

Therefore, in the copper alloy wire using these noble metal elements, the additive element is added within the range of the characteristics required for the lead wire in the manufacturing process of electronic equipment parts, so that the cost reduction cannot be achieved at the same time.

[0012]

SUMMARY OF THE INVENTION In view of the present circumstances, the present invention has an object of providing a heat-resistant and high-conductivity copper alloy wire having the characteristics of satisfying all of heat resistance, bending resistance, high conductivity and price. It was made as.

[0013]

According to the present invention, the inner layer portion is a hard copper wire for electrical use (JIS
It is a heat resistant and highly conductive composite linear body characterized in that it conforms to the C3101 standard) and has an outer layer portion made of a heat resistant copper alloy.

The composite linear body has a cross-sectional area ratio of the hard copper wire for electrical use in the inner layer portion to the heat resistant copper alloy in the outer layer portion in the range of 1: 1 to 2.

The reason why the cross-sectional area ratio between the inner layer member and the outer layer member is limited to 1: 1 to 2 in the above-described structure of the present invention is as follows.

In order to form a heat-resistant copper alloy on a concentric circle of an electric hard copper wire in an inner layer portion to a uniform and specific thickness to form an outer layer portion, a dip forming apparatus which is one of continuous casting and rolling methods. Is suitable. At this time, the cross-sectional area ratio of the inner layer portion and the outer layer portion is set to 1: 2 when the outer layer portion is formed by pulling the seed copper wire from under the crucible containing the molten copper alloy in the apparatus. The amount of heat resistant copper alloy attached is copper wire 1
This is because the maximum manufacturing limit is 2 and the bending resistance is compensated by the strength of the copper alloy of the outer layer portion, and it is not necessary to make the outer layer portion thicker than this.

The lower limit of the cross-sectional area ratio of 1: 1 can be lowered by the pulling rate of the copper wire, but if the ratio is less than 1: 1, the amount of the additional element coated on the outer layer portion is reduced. The effect of compensating the bending resistance in the strength of the low copper alloy, that is, since the coating thickness of the copper alloy is thin, the bending resistance is reduced, and the production efficiency is deteriorated, resulting in high cost,
This is because it becomes difficult to achieve the object of the present invention.

In such a case, Cu-Ag, Cu- to be coated
In In, Cu-Sn alloy, etc., Ag, In, Sn
When the outer layer portion is covered with the copper alloy by further increasing the amount of additive element such as, and further improving the potential strength of the copper alloy, even if the cross-sectional area of the outer layer portion is smaller than that of the inner layer portion, The bendability can be improved. However, the production efficiency is not improved, resulting in high cost.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a cross section of a heat-resistant and highly conductive composite linear body according to the present invention, in which an inner layer 1 is a hard copper wire for electrical use and an outer layer 2 is a heat-resistant copper alloy. Is coated with.

Embodiments of the present invention will be described below.

In order to compare the examples of the present invention with the comparative examples and the conventional examples, linear bodies each having an alloy composition shown in Table 1 were manufactured.

[0022]

[Table 1]

Here, Example Nos. 1 to 3 and Comparative Example No.
4 and the conventional example No. 8 were manufactured by a deep-foaming device, and the composite linear body was made to have different cross-sectional area ratios of the inner layer portion and the outer layer portion, and each was a rough wire having an outer diameter of 8 mmφ.

On the other hand, in Conventional Examples Nos. 5 to 7, electrolytic copper (99.99%) and a required amount of additional elements were put in a graphite crucible, the surface was further sufficiently covered with charcoal powder, and melted by high-frequency induction heating to obtain gold. It was cast in a mold, and this ingot was hot-rolled at about 800 ° C. and then pickled to obtain an 8 mmφ rough drawn wire.

Each of the wire-drawn wires was subjected to continuous wire-drawing softening at room temperature to finish a wire having a bending resistance of 140 g · cm and a diameter of 0.6 mmφ.

Table 2 shows the results of bending resistance and electrical conductivity of these wire rods having a diameter of 0.6 mm, which were subjected to various annealing treatments.

[0027]

[Table 2]

(Note 1) Bending resistance means that one end of a wire is fixed by sandwiching it between two chuck members, a load is applied to a position apart from the chuck end, and the wire is bent at an angle of 35 °. The required load is indicated by the torque value.

(Note 2) What is electrical conductivity? JISC-3002
The value is measured by the double bridge method according to the above.

As the characteristics required for the lead wire of the semiconductor element of the electronic device part, for example, the bending resistance is required to be 85 g · cm or more with respect to 0.6 mmφ, and the electrical conductivity must be 95% IACS or more.

As can be seen from Table 2, 300-400
In annealing at 10 ° C for 10 minutes, Examples Nos. 1 to 3 satisfy the required characteristics in both bending resistance and conductivity,
No. 8 lacks bending resistance and is not practical. In No6 and 7,
Although it has bending resistance, it does not meet the requirements for conductivity.

In Comparative Example No. 4, the bending resistance decreases with the annealing temperature, and it becomes 76 g · cm at 400 ° C., which is a tendency that the required properties are lacking. The reason for this is that the cross-sectional area ratio of the inner layer portion to the outer layer portion in the structure of the composite linear body is 1: 0.8, and the thickness of the outer layer portion is thin. This is because it is difficult to reinforce.

Next, when the cost of using Ag is compared between Example No. 1 and Conventional Example No. 5, No. 1 can reduce Ag by 0.3 kg per 0.6 mm.phi. Similarly, in the case of In, Example No. 3 has an I of 0.54 kg per 0.6 mmφ1 Ton, compared with Conventional Example No. 7.
n can be reduced.

The reduction of Ag, In, etc. has a great effect on the cost.

Further, Example No. 2 using Sn and the conventional example
Comparing No. 6 with No. 6 alloy composition, even though it has bending resistance, the conductivity is low and there is no room for improvement.

However, by adopting the structure of the No. 2 composite linear body, both the bending resistance and the electrical conductivity are provided with the required characteristics, and it is also advantageous in terms of cost.

As described above, in the composite linear body of the present invention, the inner layer portion is copper and the outer layer portion is Cu-Ag (0.02 to 0.15).
wt%), Cu-In (0.02-0.15 wt%) or Cu-Sn (0.02-0.15 wt%) or Cu-Y (0.05-0.15 wt%) copper alloy However, since the cross-sectional area ratio between the inner layer portion and the outer layer portion is set to 1: 1 to 2, the bending resistance is compensated by the strength of the copper alloy in the outer layer portion, and the conductivity and the cost are reduced. In contrast, since the copper wire in the inner layer portion contributes to the conductivity, and the hard copper wire for electrical use is used in the inner layer portion, the cross-section integration will reduce the additive element and bring about the cost effect. ..

The Cu--Ag and Cu-- shown in the present invention are shown here.
A heat-resistant copper alloy having a small amount of additional elements other than In and Cu-Sn, such as Pb, Bi, Cr, Co, Ni, Fe, and Z.
0.01 to 0.10 wt% of one or more elements such as r, Se, Te, Hf, B, Ti, and P with respect to Cu
Even if the outer layer portion is coated with the copper alloy added in the range of%, the same effect as that of the present invention can be obtained.

Next, the present invention will be described based on examples.

[0040]

[Example 1] By applying low-frequency induction heating to electrolytic copper in a melting furnace,
Melt, send this to the supply furnace, control the pressure of the reducing gas from the supply furnace, and put a certain amount of molten copper in the crucible (Crucible) maintained in the non-oxidizing atmosphere.
The Ag wire of is fed into the molten copper in the crucible to adjust the Ag content to 0.08 wt%.

On the other hand, a 9.65 mmφ glazed copper wire stripped from a bushing provided under the crucible was inserted and pulled upward through the crucible to coat the Cu—Ag alloy on the outer layer portion to have an outer diameter of 15.7 mmφ. To form a rod of the composite linear body of.

For consumption of the Cu-Ag alloy in the crucible, the molten copper held in the feeding furnace is replenished in the crucible and sent to the Ag wire to keep the Ag content always 0.08.
Adjust to wt%.

In the meantime, the rod of the composite linear body which was pulled up and cooled was continuously rolled in an non-oxidizing atmosphere to have an outer diameter of 8 mmφ.
And the rough line. This rough wire is drawn at room temperature and then with a continuous wire softening machine at 0.6 mmφ bending resistance 140 g · cm
So that

[0044]

[Example 2] In order to reduce the depth of molten copper in the crucible from that in Example 1, molten copper was poured into the crucible from a supply furnace, and at the same time, a fixed amount of Sn was poured into the molten copper to reduce the Sn content. Adjust to 0.1 wt%.

On the other hand, a 9.65 mmφ glazed copper wire stripped from a bushing provided under the crucible was inserted and pulled up through the crucible to cover the outer layer portion with a Cu--Sn alloy to have an outer diameter of 14. A 32 mmφ composite linear rod is formed.

Thereafter, the same operation as in Example 1 was performed to obtain 0.6
It is tempered so that it has a bending resistance of 140 g · cm at mmφ.

[0047]

[Example 3] In order to reduce the depth of molten copper in the crucible from that in Example 1, molten copper was poured into the crucible from a supply furnace, and simultaneously an In wire of 3 mmφ was fed into the molten copper in the crucible I
The n content is adjusted to 0.13 wt%.

On the other hand, a 9.65 mmφ glazed copper wire peeled from the brass provided under the crucible was inserted and pulled up through the crucible to cover the outer layer portion with the Cu—In alloy to give an outer diameter of 14.95 mmφ. To form a rod of a composite linear body.

Thereafter, the same operation as in Embodiment 1 is performed to obtain 0.6
It is tempered so that it has a bending resistance of 140 g · cm at mmφ.

[0050]

As described above, Cu-Ag, Cu
In binary linear alloy linear bodies such as -In, the precious metal elements added to these alloys are expensive, so
High cost as a lead wire is inevitable. Moreover, if the addition amount of these is reduced in order to reduce the cost, the electrical conductivity is improved, but the bending resistance is reduced, which causes a problem in practicality.

Further, the solid linear body of the Cu-Sn binary alloy has bending resistance, but the electric conductivity is greatly lowered, and no room for improvement can be expected.

In the composite linear body of the present invention, the inner layer portion is a hard copper wire for electrical use, and the outer layer portion is Cu-Ag, Cu-In, Cu-Sn.
Covered with a heat-resistant copper alloy such as an alloy, the bending resistance is compensated by the strength of the copper alloy in the outer layer part, and the electric hard copper wire is used in the inner layer part for conductivity and cost. By doing so, the conductivity can be improved and the amount of the noble metal additive element can be reduced, and further, the heat resistance, bending resistance, high conductivity, and price reduction required for this type of lead wire can be greatly reduced. It has obtained the effect, and of course it is used as a lead wire for a semiconductor element of an electronic device part, and also has a remarkable effect as a lead wire for a resistor and a capacitor of a similar device part.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a heat-resistant and highly conductive composite linear body according to the present invention, in which 1 is a hard copper wire for electrical use in an inner layer portion, and 2 is a heat-resistant copper alloy in an outer layer portion.

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[Procedure amendment]

[Submission date] June 27, 1991

[Procedure Amendment 1]

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[0013]

According to the present invention, a hard copper wire for electrical use (JI
Complies with SC3101 standard) , the outer layer part is made of heat resistant copper alloy, and the cross-sectional area ratio of both is as follows : inner layer part: outer layer part = 1: 1 to 2
The present invention provides a heat-resistant and highly conductive composite linear body characterized by the following.

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[0022]

[Table 1]

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Here, Example Nos. 1 to 5 , Comparative Example No. 6 and Conventional Example No. 10 are manufactured by a deep-foaming device, and the composite linear body has different cross-sectional area ratios between the inner layer portion and the outer layer portion. And each has an outer diameter of 8 mm
A rough wire of φ was used.

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On the other hand, in Conventional Examples Nos. 7 to 9 , graphite graphite crucibles were filled with electrolytic copper (99.99%) and a required amount of additional elements, and the surfaces thereof were sufficiently covered with charcoal powder and melted by high frequency induction heating. It was cast in a mold, and this ingot was hot-rolled at about 800 ° C. and then pickled to obtain an 8 mmφ rough wire.

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[0027]

[Table 2]

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As can be seen from Table 2, 300-40
In 0 ° C. × 10 minutes / annealing, Examples Nos. 1 to 5 satisfy the required characteristics in both bending resistance and electrical conductivity, but Conventional Example No. 10 lacks bending resistance and is not practical. No
Nos. 8 and 9 have bending resistance, but do not satisfy the requirement in electric conductivity.

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In Comparative Example No. 6 , the bending resistance decreases with the annealing temperature, and becomes 76 g · cm at 400 ° C., which is a tendency that the required properties are lacking. The reason for this is that the cross-sectional area ratio of the inner layer portion to the outer layer portion in the structure of the composite linear body is 1: 0.8, and the thickness of the outer layer portion is thin. This is because it is difficult to reinforce.

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Next, regarding the cost of using Ag,
When Example No. 1 and Conventional Example No. 7 are compared, No. 1 is N
0.3mm Ag per 0.6mmφ1Ton from o 7
Can be reduced. Similarly, in the case of In, Example No. 3 can reduce In of 0.54 Kg per 0.6 mmφ 1 Ton, compared with Conventional Example No 9 .

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Further, comparing Example No. 2 using Sn and Conventional Example No. 8 , the alloy composition of No. 8 has a bending resistance, but has low electrical conductivity, and there is no room for improvement.

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[Brief description of drawings]

[1] Ru sectional view der of heat-resistant high-conductive composite linear body according to the present invention.

[ Explanation of reference symbols ] 1 hard copper wire for electrical use in the inner layer 2 heat-resistant copper alloy in the outer layer

Claims (2)

[Claims] 1. A heat-resistant and highly conductive composite linear body, wherein an inner layer portion is a hard copper wire for electrical use and an outer layer portion is composed of a heat-resistant copper alloy. 2. The cross-sectional area ratio of the hard copper wire for electrical use of the inner layer portion to the heat resistant copper alloy coated on the outer layer portion is set to 1: 1 to 2 as set forth in claim 1. Heat resistant and highly conductive composite linear body.