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JPH05235117A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPH05235117A
JPH05235117A JP4036377A JP3637792A JPH05235117A JP H05235117 A JPH05235117 A JP H05235117A JP 4036377 A JP4036377 A JP 4036377A JP 3637792 A JP3637792 A JP 3637792A JP H05235117 A JPH05235117 A JP H05235117A
Authority
JP
Japan
Prior art keywords
ultrasonic
terminal
connection
tool
ultrasonic waves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4036377A
Other languages
Japanese (ja)
Inventor
Muneisa Yamada
宗勇 山田
Toshiyuki Yamaguchi
敏行 山口
Toshimasa Kitagawa
利正 北川
Shuichi Furuichi
修一 古市
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4036377A priority Critical patent/JPH05235117A/en
Publication of JPH05235117A publication Critical patent/JPH05235117A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enhance the connection reliability of the title manufacture, to use low-output ultrasonic waves, to shorten the oscillation time of the ultrasonic waves and to enhance the productivity of the title manufacture by a method wherein protruding and recessed parts are formed in a terminal for connection use and in the contact face of a tool for ultrasonic vibration use. CONSTITUTION:A terminal 4 for connection use to a printed-circuit board is provided with small holes 6 as recessed parts. A tool 8 for ultrasonic-vibration transmission use is provided with small protrusions 7 so as to correspond to the small holes 6. The tool 8 for ultrasonic-vibration transmission use is brought into contact with the terminal 4 for connection use in such a way that the small protrusions 7 are inserted in the small holes 6, and ultrasonic vibraitons are applied. Thereby, the terminal 4 for connection use can be bonded surely to the printed-circuit board 3. Even, by means of low-output ultrasonic waves, it can be bonded. Also the oscillation time of the ultrasonic waves can be shortened, and the productivity of the title manufacture is enhanced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、半導体装置の製造方
法に関するものである。さらに詳しくは、この発明は、
プリント回路と接続用端子との確実な接合と、生産性の
向上を可能とする半導体装置の製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method. More specifically, the present invention is
The present invention relates to a method for manufacturing a semiconductor device, which enables reliable joining of a printed circuit and a connection terminal and improvement of productivity.

【０００２】[0002]

【従来の技術】近年のマイクロエレクトロニクスの飛躍
的発展を促す半導体装置においては、その高集積化およ
び高密度化の進展とともに、回路の接続信頼性の向上が
重要な課題になってきている。たとえば図７に示した半
導体装置においても、プリント配線板（ア）に半導体素
子のＩＣチップ（イ）を搭載し、表面プリント回路
（ウ）に接続用端子（エ）を接合して樹脂封止（オ）し
た構造をとる場合に、プリント回路（ウ）と接続用端子
（エ）との接合信頼性の向上が強く求められている。2. Description of the Related Art In recent years, in semiconductor devices that promote the rapid development of microelectronics, with the progress of higher integration and higher density, improvement of circuit connection reliability has become an important issue. For example, also in the semiconductor device shown in FIG. 7, the IC chip (a) of the semiconductor element is mounted on the printed wiring board (a), the connection terminal (d) is joined to the surface printed circuit (c), and the resin sealing is performed. In the case of adopting the structure (e), there is a strong demand for improvement in the joint reliability between the printed circuit (c) and the connecting terminal (d).

【０００３】そこで、従来では、この接合をより確実
に、信頼性の高いものとして可能とするために、接続用
端子（エ）に超音波振動を加えながら金属拡散接合させ
る方法が採用されていた。Therefore, conventionally, in order to make this joining more reliable and highly reliable, a method of applying metal diffusion joining while applying ultrasonic vibration to the connecting terminal (d) has been adopted. ..

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、この超
音波振動を加えながら拡散接合する従来の方法の場合に
は、接続信頼性の向上は図られるものの、超音波による
振動を効率良く接続用端子（エ）に伝えられないため、
どうしても高出力の超音波の付加が必要になり、超音波
の発信時間も長いものになるという欠点があった。この
ため、従来方法の場合には、この接合を行う半導体装置
の生産性の向上には制約があった。However, in the case of the conventional method of diffusion bonding while applying ultrasonic vibration, although the connection reliability can be improved, the vibration of the ultrasonic wave effectively causes the connection terminal ( D) I can't tell
There is a drawback that it is necessary to add high-power ultrasonic waves, and the ultrasonic wave transmission time is long. Therefore, in the case of the conventional method, there is a limitation in improving the productivity of the semiconductor device that performs this bonding.

【０００５】この発明は、以上の通りの事情に鑑みてな
されたものであり、従来の半導体装置の製造におけるプ
リント回路と接続用端子との接合の欠点を解消し、接続
信頼性に優れるとともに、より低出力の超音波の使用が
可能で、その発信時間も短縮でき、結果として生産性の
向上を図ることのできる。改良された製造方法を提供す
ることを目的としている。The present invention has been made in view of the above circumstances, and eliminates the drawbacks of the conventional method of joining a printed circuit and a connecting terminal in the manufacture of a semiconductor device, and has excellent connection reliability. It is possible to use a lower power ultrasonic wave, the transmission time can be shortened, and as a result, productivity can be improved. The object is to provide an improved manufacturing method.

【０００６】[0006]

【課題を解決するための手段】この発明は、上記の課題
を解決するものとして、半導体素子を搭載するプリント
配線板のプリント回路に接続用端子を超音波振動を加え
ながら接合するにあたり、接続用端子および／または超
音波振動伝達用ツールの当接面に凹凸部を設けておくこ
とを特徴とする半導体装置の製造方法を提供する。The present invention is intended to solve the above problems by connecting a connecting terminal to a printed circuit of a printed wiring board on which a semiconductor element is mounted while applying ultrasonic vibration. Provided is a method for manufacturing a semiconductor device, which is characterized in that an uneven portion is provided on a contact surface of a terminal and / or an ultrasonic vibration transmitting tool.

【０００７】[0007]

【作用】この発明においては、接続用端子および超音波
振動伝達用ツールの両者、あるいはそのいずれか一方の
相互当接面に、物理的に、または化学的に凹凸を設けて
おくことにより、接続用端子への超音波の伝達を極めて
効率化することができる。According to the present invention, both the connecting terminal and the ultrasonic vibration transmitting tool, or the mutual contact surface of either one of them is provided with physical or chemical unevenness so that the connection is achieved. It is possible to make the transmission of ultrasonic waves to the terminal for use extremely efficient.

【０００８】このため、より低出力の超音波が使用で
き、その発信時間も従来に比べて短縮化できる。Therefore, ultrasonic waves of lower output can be used, and the transmission time can be shortened as compared with the conventional case.

【０００９】[0009]

【実施例】以下、添付した図面に沿って、この発明の半
導体装置の製造についてさらに詳しく説明する。実施例１ 図１に示したように、プリント配線板（１）に半導体素
子ＩＣチップ（２）を搭載し、プリント回路（３）に接
続用端子（４）を接合して樹脂封止（５）し、半導体パ
ッケージ装置を製造した。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Manufacturing of a semiconductor device of the present invention will be described below in more detail with reference to the accompanying drawings. Example 1 As shown in FIG. 1, a semiconductor element IC chip (2) is mounted on a printed wiring board (1), a connecting terminal (4) is joined to a printed circuit (3), and a resin sealing (5) is performed. ) And manufactured the semiconductor package device.

【００１０】プリント回路（３）への接続用端子（４）
接合は、の超音波振動を加えながらの拡散接合させた
が、この際には、図２に例示した通りの、小穴（６）を
凹凸部として有する接続用端子（４）と、図３に例示し
た通りの、小穴（６）に対応する小突起（７）を有する
超音波振動伝達用ツール（８）を用意し、この小突起
（７）を有する超音波振動伝達用ツール（８）を、小突
起（７）が小穴（６）に挿入されるように接続用端子
（４）に当接させ、超音波振動を加えた。Terminals (4) for connection to the printed circuit (3)
The bonding was performed by diffusion bonding while applying ultrasonic vibration. In this case, as shown in FIG. 2, the connection terminal (4) having the small hole (6) as an uneven portion and the connection terminal (4) shown in FIG. As illustrated, an ultrasonic vibration transmission tool (8) having small projections (7) corresponding to the small holes (6) is prepared, and the ultrasonic vibration transmission tool (8) having this small projection (7) is provided. , The small protrusions (7) were brought into contact with the connecting terminals (4) so that the small protrusions (7) were inserted into the small holes (6), and ultrasonic vibration was applied.

【００１１】プリント回路（３）への接続用端子（４）
の接合はしつかりと行われ、信頼性の高い接合が得られ
た。また印加した超音波は従来に比べてより低出力でよ
く、その発信時間を従来の約１／２程度にまで短縮化さ
れた。このため、生産性は大きく向上した。なおこの例
においては、接続用端子（４）を形成するパンチング加
工時に、その接合部に相当する部分の金型に所定の凹凸
の形状を設けてパンチング時に転写するようにした。こ
れによって上記の小穴（６）を形成した。Terminals (4) for connection to the printed circuit (3)
The joining was performed satisfactorily, and a highly reliable joining was obtained. Further, the applied ultrasonic wave may have a lower output than the conventional one, and the transmission time thereof has been shortened to about half that of the conventional one. Therefore, the productivity is greatly improved. In this example, when punching the connection terminal (4), a predetermined concave and convex shape is provided on the die corresponding to the joint portion, and the pattern is transferred during punching. This formed the small hole (6).

【００１２】実施例２ 図４に例示したように、接続用端子（４）を形成するエ
ッチング時にハーフエッチングして、所定の凹凸部とし
て溝（９）を設けた。この溝（９）に対応する突起（１
０）を有する超音波振動伝達用ツール（８）を用いて接
続用端子（４）に当接し、実施例１と同様にして超音波
振動を加えながら接続用端子（４）を図１の通りプリン
ト回路（３）に拡散接合させた。 Example 2 As illustrated in FIG. 4, half-etching was performed at the time of etching for forming the connection terminal (4) to form a groove (9) as a predetermined uneven portion. The protrusion (1 corresponding to this groove (9)
0) having an ultrasonic vibration transmission tool (8) is used to abut the connection terminal (4), and the connection terminal (4) is connected as shown in FIG. Diffusion bonded to printed circuit (3).

【００１３】より低出力の超音波によって、短かい発信
時間で優れた接続信頼性が得られた。実施例３ 図５に例示したように、超音波振動伝達用ツール（８）
の端面に、機械的加工によって凹凸突起（１０）を設
け、これを平板状の接続用端子（４）に当接（２）実施
例１と同様にして接合を行った。The lower output ultrasonic waves provided excellent connection reliability in a short transmission time. Embodiment 3 As illustrated in FIG. 5, an ultrasonic vibration transmission tool (8)
An uneven projection (10) was provided on the end face of the plate by mechanical processing, and this was brought into contact with a flat plate-shaped connecting terminal (4) (2).

【００１４】同様にして優れた接合と生産性が得られ
た。実施例４ 図６に例示したように、バフ研磨もしくはショットブラ
スト処理により、接続用端子（４）に粗面部（１１）を
形成し、これに超音波振動伝達用ツール（８）の端面を
当接して実施例１と同様にして接合した。Similarly, excellent joining and productivity were obtained. Example 4 As illustrated in FIG. 6, a rough surface portion (11) is formed on the connecting terminal (4) by buffing or shot blasting, and the end surface of the ultrasonic vibration transmitting tool (8) is abutted against this. Then, they were joined together in the same manner as in Example 1.

【００１５】同様に優れた接合と生産性が得られる。Similarly, excellent bonding and productivity can be obtained.

【００１６】[0016]

【発明の効果】この発明により、以上詳しく説明した通
り、低出力の超音波による高い信頼性の接合が得られ、
また発信時間も短縮される。このため生産性は向上す
る。As described in detail above, according to the present invention, it is possible to obtain a highly reliable joint using ultrasonic waves of low output.
Also, the calling time is shortened. Therefore, productivity is improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】半導体装置を例示した断面図である。FIG. 1 is a cross-sectional view illustrating a semiconductor device.

【図２】この発明の接続用端子を例示した平面・側面図
である。FIG. 2 is a plan view / side view illustrating the connection terminal of the present invention.

【図３】図２の端子に対応する超音波振動伝達用ツール
の側面図である。FIG. 3 is a side view of an ultrasonic vibration transmission tool corresponding to the terminal of FIG.

【図４】別の例としての接続用端子と超音波振動伝達用
ツールを示した平面・断面図である。FIG. 4 is a plan view and a sectional view showing a connection terminal and an ultrasonic vibration transmission tool as another example.

【図５】この発明のさらに別の例を示した側面図であ
る。FIG. 5 is a side view showing still another example of the present invention.

【図６】また別の例を示した側面図である。FIG. 6 is a side view showing another example.

【図７】従来からの半導体装置を示した断面図である。FIG. 7 is a cross-sectional view showing a conventional semiconductor device.

【符号の説明】[Explanation of symbols]

１ プリント配線板 ２ ＩＣチップ ３ プリント回路 ４ 接続用端子 ５ 樹脂封止 ６ 小穴 ７ 小突起 ８ 超音波振動伝達用ツール ９ 溝 １０ 突起 １１ 粗面部 1 Printed Wiring Board 2 IC Chip 3 Printed Circuit 4 Connection Terminal 5 Resin Sealing 6 Small Hole 7 Small Protrusion 8 Ultrasonic Vibration Transmission Tool 9 Groove 10 Protrusion 11 Rough Surface

───────────────────────────────────────────────────── フロントページの続き (72)発明者 古市 修一 大阪府門真市大字門真1048番地 松下電工 株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuichi Furuichi 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 半導体素子を搭載するプリント配線板の
プリント回路に接続用端子を超音波振動を加えながら接
合するにあたり、接続用端子および／または超音波振動
伝達用ツールの当接面に凹凸部を設けておくことを特徴
とする半導体装置の製造方法。1. When a connecting terminal is joined to a printed circuit of a printed wiring board on which a semiconductor element is mounted while applying ultrasonic vibration, an uneven portion is formed on the contact surface of the connecting terminal and / or the ultrasonic vibration transmitting tool. A method for manufacturing a semiconductor device, comprising:
JP4036377A 1992-02-24 1992-02-24 Manufacture of semiconductor device Pending JPH05235117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4036377A JPH05235117A (en) 1992-02-24 1992-02-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4036377A JPH05235117A (en) 1992-02-24 1992-02-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPH05235117A true JPH05235117A (en) 1993-09-10

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JP4036377A Pending JPH05235117A (en) 1992-02-24 1992-02-24 Manufacture of semiconductor device

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Cited By (3)

* Cited by examiner, † Cited by third party
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WO2006081106A1 (en) * 2005-01-27 2006-08-03 Orthodyne Electronics Corporation Ribbon bonding tool and process
US7134588B2 (en) * 2004-09-29 2006-11-14 Fujitsu Limited Bonding tool for ultrasonic bonding and method of ultrasonic bonding
WO2022172767A1 (en) * 2021-02-12 2022-08-18 日本発條株式会社 Circuit board and manufacturing method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7134588B2 (en) * 2004-09-29 2006-11-14 Fujitsu Limited Bonding tool for ultrasonic bonding and method of ultrasonic bonding
WO2006081106A1 (en) * 2005-01-27 2006-08-03 Orthodyne Electronics Corporation Ribbon bonding tool and process
JP2008529303A (en) * 2005-01-27 2008-07-31 オーソダイン エレクトロニクス コーポレイション Ribbon bonding tool and rebonding method
US7838101B2 (en) 2005-01-27 2010-11-23 Orthodyne Electronics, Inc. Ribbon bonding tool and process
US7909228B2 (en) 2005-01-27 2011-03-22 Orthodyne Electronics Corporation Ribbon bonding tool and process
JP4662497B2 (en) * 2005-01-27 2011-03-30 オーソダイン エレクトロニクス コーポレイション Ribbon bonding tool and rebonding method
US7934633B2 (en) 2005-01-27 2011-05-03 Orthodyne Electronics Corporation Ribbon bonding tool and process
WO2022172767A1 (en) * 2021-02-12 2022-08-18 日本発條株式会社 Circuit board and manufacturing method
JPWO2022172767A1 (en) * 2021-02-12 2022-08-18

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