JP7393977B2 - 微調整ネジおよび加工装置 - Google Patents
微調整ネジおよび加工装置 Download PDFInfo
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- 230000007246 mechanism Effects 0.000 claims description 86
- 238000000034 method Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
- B24B7/075—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table using a reciprocating grinding head mounted on a movable carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0038—Other grinding machines or devices with the grinding tool mounted at the end of a set of bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Description
これに関し、荷重を測定するために、特許文献1に開示のように、装置ベースとチャック軸ユニットとの間、または、スピンドル支持ケースとスピンドルユニットとの間(部材間)に、荷重センサが挟まれている。
また、第1加工装置および第2加工装置では、本微調整ネジにおける内部の荷重センサによって、第2部品である保持手段あるいは加工手段にかかる荷重を測定することができる。これに関し、本微調整ネジは、第1部品と第2部品との双方に螺合されるため、傾き調整の際、これらの部品から離れ難い。このため、本微調整ネジに荷重がかかりにくくなることを抑制することができる。このため、第1加工装置および第2加工装置では、傾きの調整後であっても、保持手段あるいは加工手段かかる荷重を、適切に測定することができる。
なお、水平移動手段は、保持手段30を複数配置したターンテーブルであってもよい。
このように、研削手段70は、スピンドル72を有しており、スピンドル72は、加工具としての研削砥石77を装着し、研削砥石77を回転させるように構成されている。
図3に示すように、保持手段傾き調整機構35は、円柱状のネジ本体81、および、ネジ本体内に収納される荷重センサ(力センサ)89を有している。
なお、第1雄ネジ83に螺入可能なナットを備え、第1部品のテーブル雌ネジ452に螺入した第1雄ネジ83をナットで締結させてもよい。
なお、第2雄ネジ85に螺入可能なナットを備え、第2部品の保持手段雌ネジ302に螺入した第2雄ネジ85をナットで締結させてもよい。
なお、第1雄ネジ83に螺入可能なナットを備え、第1部品の支持ケース雌ネジ562に螺入した第1雄ネジ83をナットで締結させてもよい。
なお、第2雄ネジ85に螺入可能なナットを備え、研削手段雌ネジ712に螺入した第2雄ネジ85をナットで締結させてもよい。
なお、荷重センサ89は、荷重センサ89が伸びることにより測定されるマイナス荷重と、荷重センサ89がさらに圧縮されることにより測定されるプラス荷重とを測定可能とする。
また、荷重センサ89は、加工荷重によって調整ネジが圧縮または加工荷重が直接かからないことによって調整ネジが引き伸ばされるという、調整ネジの伸縮に応じて測定可能である。
また、保持手段傾き調整機構35および加工手段傾き調整機構78は、内部の荷重センサ89によって、それぞれ、保持手段30および研削手段70にかかる荷重を測定することができる。
したがって、本実施形態では、研削加工を一時停止して保持手段30と研削手段70との間の傾きを調整するとともに、その傾き調整の際に、保持手段30あるいは研削手段70にかかる荷重を測定することで、傾き調整前の荷重と傾き調整後の荷重とを同じ荷重にして、傾き調整後の厚み不良を抑制することが容易となる。
これに代えて、研削装置1は、環状に配置された研削砥石77を装着した研削手段70によって、保持手段30の保持面32に保持された被加工物をクリープフィード研削するものであってもよい。
あるいは、研削装置1は、加工具としての円盤状または円環状の研磨パッドを装着した研磨手段を加工手段として備え、保持手段傾き調整機構35および/または加工手段傾き調整機構78によって、研磨手段と保持手段30との間の傾きを変更するとともに、保持手段30および/または研磨手段にかかる荷重を測定するように構成されていてもよい。
これに関し、この微調整ネジに関する第1部品はY軸移動テーブル45および支持ケース56に限られないとともに、第2部品は、保持手段30および研削手段70に限られない。第1部品および第2部品がどのような部品であっても、この微調整ネジは、第1部品と第2部品とを間隔を開けて連結することによって、第1部品と該第2部品との間の距離を調整可能とするとともに、第2部品にかかる荷重を検知することが可能である。
30:保持手段、31:チャックテーブル、
32:保持面、302:保持手段雌ネジ、
33:支持部材、34:回転手段、301:テーブル中心軸、303:開口部、
40:Y軸方向移動手段、
45;Y軸移動テーブル、452:テーブル雌ネジ、453:開口部、
50:研削送り手段、
56:支持ケース、561:底板、562:支持ケース雌ネジ、
70:研削手段、71:スピンドルハウジング、72:スピンドル、
73:回転モータ、74:ホイールマウント、
75:研削ホイール、76:ホイール基台、77:研削砥石、
701:スピンドル回転軸、712:研削手段雌ネジ
35:保持手段傾き調整機構、78:加工手段傾き調整機構、
81:ネジ本体、82:開口部、83:第1雄ネジ、
84:荷重センサ収容部、89:荷重センサ、85:第2雄ネジ、87:連結部、
100:ウェーハ、101:表面、104:裏面、105:保護テープ
Claims (3)
- 第1部品と第2部品とを間隔を開けて連結するように設けられ、該第1部品と該第2部品との間の距離を調整可能とするとともに、該第2部品にかかる荷重を検知可能な微調整ネジであって、
該第1部品に形成されている第1雌ネジに螺入可能な第1雄ネジと、
該第1雄ネジの軸方向の延長線上で該第1雄ネジと離間して配置され、該第1雌ネジのネジピッチとは異なるネジピッチを有する該第2部品に形成されている第2雌ネジに螺入可能な第2雄ネジと、
互いに離間している該第1雄ネジと該第2雄ネジとを連結する連結部と、
該連結部の内部に圧縮荷重をかけて収容される荷重センサと、
を備えた微調整ネジ。 - 保持面によって被加工物を保持する保持手段と、加工具を装着し該加工具を回転させるスピンドルを有する加工手段と、該加工手段を支持する支持ケースを該保持面に垂直な上下方向に移動させる上下移動手段と、該保持手段に対する該加工手段の傾きを調整する加工手段傾き調整機構と、を備える加工装置であって、
該加工手段傾き調整機構が、請求項1記載の微調整ネジであり、
該第1部品が該支持ケースであり、該第2部品が該加工手段である、
加工装置。 - 保持面によって被加工物を保持する保持手段と、該保持手段を支持する基台と、加工具を装着し該加工具を回転させるスピンドルを有する加工手段と、該加工手段を支持する支持ケースを該保持面に垂直な上下方向に移動させる上下移動手段と、該加工手段に対する該保持手段の傾きを調整する保持手段傾き調整機構と、を備える加工装置であって、
該保持手段傾き調整機構が、請求項1記載の微調整ネジであり、
該第1部品が該基台であり、該第2部品が該保持手段である、
加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2020034780A JP7393977B2 (ja) | 2020-03-02 | 2020-03-02 | 微調整ネジおよび加工装置 |
US17/181,104 US11992916B2 (en) | 2020-03-02 | 2021-02-22 | Fine adjustment thread assembly and processing apparatus |
TW110106348A TWI865728B (zh) | 2020-03-02 | 2021-02-23 | 微調整螺絲組合件及加工裝置 |
KR1020210026586A KR102758277B1 (ko) | 2020-03-02 | 2021-02-26 | 미조정 나사 어셈블리 및 가공 장치 |
CN202110223840.4A CN113334196A (zh) | 2020-03-02 | 2021-03-01 | 微调螺钉装配体和加工装置 |
DE102021201916.1A DE102021201916A1 (de) | 2020-03-02 | 2021-03-01 | Feineinstellungsgewindeanordnung und bearbeitungsvorrichtung |
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JP2020034780A JP7393977B2 (ja) | 2020-03-02 | 2020-03-02 | 微調整ネジおよび加工装置 |
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JP7393977B2 true JP7393977B2 (ja) | 2023-12-07 |
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US (1) | US11992916B2 (ja) |
JP (1) | JP7393977B2 (ja) |
KR (1) | KR102758277B1 (ja) |
CN (1) | CN113334196A (ja) |
DE (1) | DE102021201916A1 (ja) |
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CN113910051B (zh) * | 2021-11-09 | 2022-09-23 | 重庆川仪调节阀有限公司 | 球体磨削机 |
CN115383572B (zh) * | 2022-08-30 | 2024-07-16 | 廊坊世强密封材料有限公司 | 一种聚四氟乙烯板件开槽装置及方法 |
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