JP7347578B2 - Exposure equipment, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus, and more particularly to an exposure apparatus that forms a predetermined pattern on an object via a projection optical system.

Conventionally, in the lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements (liquid crystal panels) and semiconductor elements, a mask or reticle (hereinafter collectively referred to as "mask") and a glass plate or wafer (hereinafter referred to as A step-and-scan exposure device (generally referred to as a "substrate") transfers a pattern formed on a mask onto a substrate using an energy beam while synchronously moving the substrate along a predetermined scanning direction. A scanning stepper (also called a scanner) is used.

A method for forming patterns on a substrate using this type of exposure equipment is so-called splicing exposure, in which the periodicity of the pattern formed on the mask (mask pattern) is used to join the mask patterns on the substrate. known (see Patent Document 1).

When performing the splicing exposure using a conventional exposure apparatus, the degree of freedom in the splicing was not sufficient.

Japanese Patent Application Publication No. 2004-335864

In a first embodiment, an exposure apparatus exposes a predetermined pattern by moving the object in a first direction relative to a projection optical system that projects a predetermined pattern onto the object. a light shielding section that shields a predetermined region in which the amount of illumination on the object changes along the second direction intersecting the first direction, depending on the position in the first direction, of the projection area projected on the object; An exposure apparatus is provided, comprising: a drive section that drives the light shielding section so as to change the amount of illumination.

In a second embodiment, a method for manufacturing a flat panel display includes exposing the substrate to light using the exposure apparatus according to the first embodiment and developing the exposed substrate. is provided.

A third embodiment provides a device manufacturing method including exposing the substrate to light using the exposure apparatus according to the first embodiment and developing the exposed substrate.

In a fourth embodiment, a light shielding device is provided for use in an exposure apparatus that scans and exposes an object by moving the object in a first direction relative to a projection optical system that projects a predetermined pattern onto an object, A predetermined region in which the amount of illumination on the object changes along the second direction intersecting the first direction, according to the position in the first direction, of the projection region projected onto the object through the A light blocking device is provided that includes a light blocking section that blocks light and a driving section that drives the light blocking section so as to change the amount of illumination.

In a fifth embodiment, there is provided an exposure method in which the object is scanned and exposed by moving the object in a first direction relative to a projection optical system that projects a predetermined pattern onto the object. out of the projection area projected on the object, a predetermined area in which the amount of illumination on the object changes along the second direction intersecting the first direction, depending on the position in the first direction, is shielded from light by a light shielding part. An exposure method is provided that includes: and driving the light shielding section so as to change the amount of illumination.

The sixth embodiment is an exposure method in which the object is scanned and exposed by moving the object in a first direction relative to a projection optical system that projects a predetermined pattern onto the object, out of the projection area projected on the object, a predetermined area in which the amount of illumination on the object changes along the second direction intersecting the first direction, depending on the position in the first direction, is shielded from light by a light shielding part. An exposure method is provided that includes: and driving the light shielding section so as to change the amount of illumination.

In a seventh embodiment, a method for manufacturing a flat panel display is provided, which includes exposing the substrate using the exposure method according to the sixth embodiment and developing the exposed substrate. Ru.

The eighth embodiment provides a device manufacturing method that includes exposing the substrate using the exposure method according to the sixth embodiment and developing the exposed substrate.

1 is a diagram schematically showing the configuration of an exposure apparatus according to an embodiment. 2 is a diagram for explaining the structure of an illumination optical system and a projection optical system included in the exposure apparatus of FIG. 1. FIG. FIG. 3(a) is a plan view showing the arrangement of a field stop and a light shielding plate included in the projection optical system, and FIG. 3(b) is a diagram showing the positional relationship between the field stop and the light shielding plate in the optical axis direction. FIG. 4(a) is a diagram showing a first inclined arrangement of the light shielding plate, and FIG. 4(b) is a diagram showing a second inclined arrangement of the light shielding plate. FIG. 5(a) is a diagram showing a case where a joint is formed in the center of the projection area using a light shielding plate, and FIG. 5(b) is a diagram showing a case where a joint is formed near the edge of the projection area using a light shielding plate. It is a figure which shows the case where it forms. FIG. 6(a) is a diagram showing a case where a joint is formed using two light-shielding plates, and FIG. 6(b) is a diagram showing a joint formed using one light-shielding plate. It is a figure which shows the case where it forms. FIG. 7(a) is a diagram showing a conventional light-shielding plate, FIG. 7(b) is a diagram showing a light-shielding plate according to an embodiment, and FIG. 7(c) is a diagram showing a light-shielding plate according to an embodiment. It is a figure showing a case. FIGS. 8(a) to 8(d) are diagrams for explaining modes (first mode to fourth mode) of the aperture formed by the field stop and the light shielding plate. FIG. 3 is a plan view showing a projection area generated on a substrate. FIG. 3 is a conceptual diagram of continuous exposure. FIG. 11(a) is a diagram showing the relationship between the substrate and the mask according to the first exposure method, and FIG. 11(b) is a diagram when scanning and exposing area A with the first exposure method. , FIG. 11(c) is a diagram when area B is scanned and exposed using the first exposure method. FIG. 12(a) is a diagram showing the relationship between the substrate and the mask according to the second exposure method, and FIG. 12(b) is a diagram when scanning and exposing area A with the second exposure method. , FIG. 12(c) is a diagram when area B is scanned and exposed using the second exposure method. FIG. 13(a) is a diagram showing the relationship between the substrate and the mask according to the third exposure method, and FIG. 13(b) is a diagram when scanning and exposing area A with the third exposure method. . FIG. 14(a) is a diagram when area B is scanned and exposed using the third exposure method, and FIG. 14(b) is a diagram when area C is scanned and exposed using the third exposure method. FIG. 15(a) is a diagram showing the relationship between the substrate and the mask according to the fourth exposure method, and FIG. 15(b) is a diagram when scanning and exposing area A with the fourth exposure method. . It is a figure when scanning exposure of B area by the 4th exposure method. FIG. 17(a) is a diagram showing the relationship between the substrate and the mask according to the fifth exposure method, and FIG. 17(b) is a diagram when scanning and exposing the A1 area with the fifth exposure method. . FIG. 18(a) is a diagram when area B1 is scanned and exposed using the fifth exposure method, and FIG. 18(b) is a diagram when area A2 is scanned and exposed using the fifth exposure method. It is a figure when scanning exposure of B2 area by the 5th exposure method. It is a flowchart when performing continuous exposure. It is a figure which shows the modification (1) of the drive mechanism of a light-shielding plate. It is a figure which shows the modification (part 2) of the drive mechanism of a light-shielding plate. FIGS. 23(a) and 23(b) are diagrams (parts 1 and 2) showing a modification (part 3) of the drive mechanism for the light shielding plate. 24(a) is a diagram showing a modified example of the light shielding plate, and FIGS. 24(b) to 24(e) are diagrams (parts 1 to 4) showing the operation of the light shielding plate in FIG. 24(a). ). It is a figure showing the details of the drive mechanism of a light shielding plate. FIG. 3 is a diagram for explaining continuous exposure using an optical filter.

One embodiment will be described below using FIGS. 1 to 20. FIG. 1 is a perspective view showing the configuration of an exposure apparatus EX according to an embodiment. In FIG. 1, the exposure apparatus EX illuminates a mask stage MST that supports a mask M, a substrate stage PST that supports a photosensitive substrate P (hereinafter simply referred to as "substrate P"), and a mask M with exposure light EL. The illumination optical system IL and the projection image of the pattern formed on the mask M (hereinafter referred to as a pattern image) are transferred onto the substrate P, and a transfer pattern as a latent image corresponding to this pattern image is formed on the substrate P. It includes a projection optical system PL and a control device CONT (not shown in FIG. 1; see FIG. 2) that centrally controls the operation of the exposure apparatus EX. The substrate P is a glass substrate coated with a photosensitive agent (photoresist), and the transfer pattern is formed in this photosensitive agent. The projection optical system PL is composed of a plurality of (seven in FIG. 1) projection optical modules PLa to PLg arranged in parallel, and the exposure apparatus EX in this embodiment has a mask M and a substrate P for this projection optical system PL. The pattern image of the mask M is transferred onto the substrate P by illuminating the mask M with the exposure light EL while synchronously moving (synchronizing scanning).

Here, in the following explanation, the synchronous movement direction (scanning direction) of the mask M and the substrate P is the X-axis direction, and the direction perpendicular to the scanning direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis direction and The direction perpendicular to the Y-axis direction is the Z-axis direction. Further, directions around the axes of the X-axis, Y-axis, and Z-axis are defined as θX, θY, and θZ directions, respectively.

The mask stage device of this embodiment includes a mask stage MST that supports a mask M, a linear guide (not shown) having a long stroke in the X-axis direction, a linear motor, a voice coil motor (VCM), etc. A stage drive unit MSTD is provided. The mask stage drive unit MSTD is capable of driving the mask stage MST having the mask M with a long stroke in the X-axis direction when moving the mask M and the substrate P synchronously under the control of the control device CONT (see FIG. 2). In addition, in order to finely adjust the position of the mask M in the horizontal plane including the X-axis direction and the Y-axis direction, the mask stage MST can be driven in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction. . Further, the position of mask stage MST in the horizontal plane is measured using a laser interferometer, and is constantly detected with a resolution of, for example, about 0.5 to 1 nm. Measured values from this laser interferometer are sent to control device CONT, which controls the positions of mask stage MST in the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

The exposure light EL transmitted through the mask M enters the projection optical modules PLa to PLg, respectively. The projection optical modules PLa to PLg are supported by a surface plate 150 and form a pattern image on the substrate P corresponding to the irradiation area on the mask M by the exposure light EL. The projection optical modules PLa, PLc, PLe, and PLg and the projection optical modules PLb, PLd, and PLf are arranged at predetermined intervals in the Y-axis direction, respectively. Furthermore, the rows of projection optical modules PLa, PLc, PLe, and PLg and the rows of projection optical modules PLb, PLd, and PLf are arranged apart from each other in the X-axis direction, and are arranged in a staggered manner as a whole along the Y-axis direction. It is located in Each of the projection optical modules PLa to PLg has a plurality of optical elements (lenses, etc.). The exposure light EL transmitted through each of the projection optical modules PLa to PLg forms a pattern image corresponding to the irradiation area on the mask M for each different projection area 50a to 50g on the substrate P.

Substrate stage PST has a substrate holder PH, and holds the substrate P via this substrate holder PH. Like mask stage MST, substrate stage PST is movable in the X-axis direction, Y-axis direction, and Z-axis direction, and is also movable in the θX, θY, and θZ directions. The substrate stage PST is driven by a substrate stage drive section PSTD configured by a linear motor or the like under the control of a control device CONT (see FIG. 2).

Furthermore, between the row of projection optical modules PLa, PLc, PLe, and PLg on the −X side and the row of projection optical modules PLb, PLd, and PLf on the +X side, there is a pattern surface of the mask M and an exposure surface of the substrate P. A focus detection system 110 is arranged to detect the position of the lens in the Z-axis direction. The focus detection system 110 is configured by arranging a plurality of oblique incidence type focus detection systems. The detection result of the focus detection system 110 is output to the control device CONT (see FIG. 2), and the control device CONT determines whether the pattern surface of the mask M and the exposure surface of the substrate P are aligned based on the detection result of the focus detection system 110. Control to achieve predetermined spacing and parallelism.

The control device CONT is connected to the storage section 120 (see FIG. 2, respectively), and controls the substrate while monitoring the positions of the mask stage MST and the substrate stage PST based on the recipe information stored in the storage section 120. By controlling the stage drive unit PSTD and the mask stage drive unit MSTD, the mask M and the substrate P are synchronously moved in the X-axis direction.

FIG. 2 is a diagram showing the configuration of the illumination optical system IL and the projection optical system PL. As shown in FIG. 2, the illumination optical system IL includes a light source 1 made of an ultra-high pressure mercury lamp or the like, an elliptical mirror 1a that collects light emitted from the light source 1, and a light source 1 that collects light emitted from the light source 1. A dichroic mirror 2 reflects light of a wavelength necessary for exposure and transmits light of other wavelengths; A wavelength selection filter 3 that passes light containing only at least one band of the i-line as exposure light, and a wavelength selection filter 3 that branches the exposure light from the wavelength selection filter 3 into a plurality of lights (seven in this embodiment) and reflects the light. It includes a light guide 4 that allows the light to enter each of the illumination system modules IMa to IMg via a mirror 5. Here, as the illumination system modules IM constituting the illumination optical system IL, in this embodiment, seven illumination system modules IMa to IMg are provided corresponding to the seven projection optical modules PLa to PLg. However, in FIG. 2, for convenience, only the illumination system module IMf corresponding to the projection optical module PLf is shown. Each of the illumination system modules IMa to IMg is arranged at a predetermined interval in the X-axis direction and the Y-axis direction, corresponding to each of the projection optical modules PLa to PLg. The exposure light EL emitted from each of the illumination system modules IMa to IMg illuminates different irradiation areas on the mask M in correspondence with the projection optical modules PLa to PLg, respectively.

Each of the illumination system modules IMa to IMg includes an illumination shutter 6, a relay lens 7, a fly's eye lens 8 as an optical integrator, and a condenser lens 9. The illumination shutter 6 is disposed downstream of the light guide 4 in the optical path so as to be freely inserted into and removed from the optical path. The illumination shutter 6 blocks exposure light when placed in the optical path, and releases the blocking when retreated from the optical path. A shutter driving section 6a is connected to the illumination shutter 6. The shutter drive section 6a is controlled by a control device CONT.

Furthermore, each of the illumination system modules IMa to IMg has a light amount adjustment mechanism 10. The light amount adjustment mechanism 10 adjusts the exposure amount by setting the illuminance of the exposure light for each optical path, and includes a half mirror 11, a detector 12, a filter 13, and a filter drive section 14. . The half mirror 11 is placed in the optical path between the filter 13 and the relay lens 7 , and allows a portion of the exposure light that has passed through the filter 13 to enter the detector 12 . The detector 12 independently detects the illuminance of the incident exposure light and outputs the detected illuminance signal to the control device CONT. The filter 13 is formed so that its transmittance gradually changes linearly in a predetermined range along the X-axis direction, and is disposed between the illumination shutter 6 and the half mirror 11 in each optical path. The filter drive unit 14 adjusts the exposure amount for each optical path by moving the filter 13 along the X-axis direction based on instructions from the control device CONT.

The light beam transmitted through the light amount adjustment mechanism 10 reaches the fly's eye lens 8 via the relay lens 7. The fly-eye lens 8 forms a secondary light source on the exit surface side, and the exposure light EL from this secondary light source passes through a condenser lens 9, which includes a right-angle prism 16, a lens system 17, and a concave mirror 18. After passing through the catadioptric optical system 15, the irradiation area on the mask M is uniformly illuminated. Note that the catadioptric optical system 15 may be omitted. That is, the mask M may be directly irradiated with the light beam that has passed through the condenser lens 9. This allows the illumination optical system IL and, by extension, the exposure apparatus EX to be miniaturized.

Each of the projection optical modules PLa to PLg includes an image shift mechanism 19, a focus position adjustment mechanism 31, two catadioptric optical systems 21 and 22, a field stop 20, and a magnification adjustment mechanism 23. . The image shift mechanism 19 shifts the pattern image of the mask M in the X-axis direction or the Y-axis direction by rotating the two parallel plane glass plates in the θY direction or the θX direction, respectively. The focus position adjustment mechanism 31 includes a pair of wedge prisms, changes the image plane position of the pattern image by changing the total thickness of the wedge prisms in the optical path, and moves at least one of the wedge prisms along the optical axis. By rotating the pattern image, the inclination angle of the image plane of the pattern image is changed. The exposure light EL that has passed through the mask M passes through the image shift mechanism 19 and the focus position adjustment mechanism 31, and then enters the first set of catadioptric optical system 21. The catadioptric optical system 21 forms an intermediate image of the pattern of the mask M, and includes a right-angle prism 24, a lens system 25, and a concave mirror 26. The right angle prism 24 is rotatable in the θZ direction, and the pattern image of the mask M can be rotated.

The field stop 20 is arranged at or near the image plane of the intermediate image formed by the catadioptric optical system 21. The field stop 20 sets a projection area on the substrate P. The exposure light EL transmitted through the field stop 20 enters a second catadioptric optical system 22 . Like the catadioptric optical system 21, the catadioptric optical system 22 includes a right-angle prism 27, a lens system 28, and a concave mirror 29. The right angle prism 27 is also rotatable in the θZ direction, so that the pattern image of the mask M can be rotated.

The exposure light EL emitted from the catadioptric optical system 22 passes through the magnification adjustment mechanism 23 and forms a pattern image of the mask M on the substrate P in an erect, same-size image. The magnification adjustment mechanism 23 has a first plano-convex lens, a biconvex lens, and a second plano-convex lens in this order along the Z-axis, and by moving the biconvex lens in the Z-axis direction, the magnification of the pattern image of the mask M can be adjusted. change.

FIG. 3(a) is a diagram showing the field stop 20 provided in each of the projection optical modules PLa to PLg. The field stop 20 is arranged at a position substantially conjugate with respect to the mask M and the substrate P. Each of the projection optical modules PLa to PLg has a field stop 20, and the projection areas 50a to 50g on the substrate P of each of the projection optical modules PLa to PLg are formed by an aperture K formed in the corresponding field stop 20. Set by. In this embodiment, each opening K is formed into an isosceles trapezoid shape having two sides parallel to the Y-axis direction, or a trapezoid shape having two sides parallel to the Y-axis direction and one side parallel to the X-axis direction. The projection areas 50a to 50g are each set to have a trapezoidal shape that is conjugate with the corresponding aperture K.

Note that in FIG. 3(a), the field stop 20 is illustrated as a rectangular plate-like member in plan view in which a trapezoidal aperture is formed, but in reality, it is as shown in FIG. 3(b). , the aperture member 20y including an edge (end) that sets the width of the aperture K in the Y-axis direction, and the aperture member 20x including an edge (end) that sets the width of the aperture K in the X-axis direction are separate members. has been done. Of the diaphragm members 20y and 20x, the diaphragm member 20y is arranged on the conjugate plane CP with respect to the mask M and the substrate P, and the diaphragm member 20x is located on the incident side of the exposure light EL rather than the conjugate plane CP. (+Z side).

Returning to FIG. 3A, among the projection optical modules PLa to PLg, the projection optical module PLf has a light shielding plate 30. The light shielding plate 30 is a substantially rectangular plate member in a plan view (viewed from the Z-axis direction), and as shown in FIG. It is placed on the emission side (-Z side) of the EL.

Returning to FIG. 3(a), the light shielding plate 30 is moved by a drive mechanism 80 (see FIG. 8(a) etc.) to be described later, so that the long side on the +Y side forms the aperture K of the field stop 20. (see FIG. 4(a)), and the long side on the -Y side forms the aperture K of the field stop 20. It is possible to drive between the second inclined arrangement (see FIG. 4(b)) which is substantially parallel to the second inclined arrangement (see FIG. 4(b)). In this way, the light shielding member 30 is generated by the projection optical module PLf by moving between the first inclined arrangement (first inclined angle) and the second inclined arrangement (second inclined angle). It is possible to change the shape of the projection area 50f. Note that the first inclination angle and the second inclination angle are determined by the inclination angle of the trapezoidal projection area. For example, in the first inclination angle shown in FIG. 4A, the inclination angle of the light shielding plate 30 with respect to the Y-axis direction is parallel to the inclination angle of the end side of the trapezoidal projection area 50f in the +Y-axis direction. Further, the second inclination angle shown in FIG. 4(b) is such that the inclination angle of the light shielding plate 30 with respect to the Y-axis direction is parallel to the inclination angle of the end side of the trapezoidal projection area 50f in the −Y-axis direction. . That is, the inclination angle (the first inclination angle and the second inclination angle) of the light shielding plate 30 can be arbitrarily determined based on the shape of the projection area.

Further, the light shielding plate 30 is capable of moving linearly in the Y-axis direction by a drive mechanism 80 (see FIG. 8(a) etc.), and can control the width in the Y-axis direction of the projection area 50f generated by the projection optical module PLf. Settings can be changed. Further, by moving the light shielding plate 30 straight in the Y-axis direction, it is also possible to move the light shielding plate 30 to a position where it does not overlap with the aperture K, that is, a position where the aperture K is set only by the field stop 20.

Here, differences between an example using a conventional light shielding plate and this embodiment using a light shielding plate 30 will be explained.

FIGS. 5(a) to 6(b) are diagrams showing the positional relationship between the projection area and the light shielding portion when performing continuous exposure. On the right side of the paper in FIGS. 5(a) to 6(b), a part of the projection area (projection areas 50e to 50g) projected onto the substrate by the plurality of projection optical modules used in the above embodiment, and the exposure A light shielding plate 30 is shown that defines a projection area by blocking light. Further, on the left side of the paper in FIGS. 5(a) to 6(b), a configuration in which the projection areas are arranged in a line is shown.

As shown in FIG. 5(a), when pattern joining is performed in an area where the projection width in the X-axis direction of the projection area 50e is approximately constant in the Y-axis direction, that is, in the center of the trapezoidal projection area 50e, the light shielding By arranging the plate 30 at the center of the projection area 50e, it is possible to form a sloped portion G (joint portion) of exposure amount in which the projection width changes along the Y-axis direction.

However, as shown in FIG. 5(b), pattern joining is not performed in a region where the projection width in the X-axis direction of the projection region 50e changes along the Y-axis direction, that is, in the end region of the trapezoidal projection region. In this case, if an attempt is made to form the sloped portion G of exposure amount using only the light shielding portion 30 that defines the projection area 50e, the amount of exposure at the sloped portion G becomes too large, making it impossible to perform pattern splicing.

Therefore, as shown in FIG. 6(a), in addition to the light shielding plate 30 in the projection area 50e, if a similar light shielding plate 30A is arranged in the projection area 50f, a slope G of the exposure amount can be formed. , pattern splicing can be performed. The light shielding plate 30A is arranged so that the inclination angle is equal to that of the light shielding plate 30. Note that the light shielding plate 30 and the light shielding plate 30A may be separate members or may be formed of a common member.

Furthermore, as shown in FIG. 6(a), even if the light shielding plate 30A is not disposed, the projection area 50e can be expanded by changing the inclination angle of the light shielding plate 30, as shown in FIG. 6(b). The sloped portion G can be formed using only one defined light shielding plate 30. The inclination angle of the light shielding plate 30 is changed to be parallel to the angle of the end region of the projection area 50e. That is, the inclination angle of the light shielding plate 30 is changed to be parallel to the angle of the end region of the projection area 50f. Thereby, the pattern can be spliced between the end region of the projection region 50e and the end region of the projection region 50f. Pattern splicing is performed as if the end region of the projection region 50f was moved in the +Y direction. As a result, there is no need to increase the number of light shielding plates, and there is no need to synchronize the light shielding plates in the projection area 50e and the light shielding plates in the projection area 50f compared to the case of FIG. 6(a), thereby simplifying the exposure apparatus. can be converted into

Further, the difference between the embodiment using the conventional light shielding plate and this embodiment using the light shielding plate 30 can be explained as follows.

As shown in FIG. 7(a), in the conventional embodiment, a light shielding plate that is inclined in only one direction with respect to the projection area 50f is used. It was possible to set the scan width in the Y-axis direction that could be exposed with only one scan movement. For example, when performing continuous exposure in the T area and β area, the scanning width can be set by moving the light shielding plate in the Y-axis direction, and when performing continuous exposure in the α area or γ area, The scanning width could be set by blocking the exposure light with the illumination shutter 6 (see FIG. 2) of the illumination system module IMf or the illumination system module IMg. However, when a light shielding plate is placed within the area U, the amount of exposure is not uniform, and there is a limit to the area in which continuous exposure can be performed.

In contrast, in the present embodiment using the light shielding plate 30, the light shielding plate 30 can be moved between the first inclined arrangement and the second inclined arrangement, as shown in FIG. 7(b). , even if the light shielding plate 30 is placed within the U area, continuous exposure can be performed with a uniform exposure amount. For example, when performing continuous exposure in the T area, the light shielding plate 30 is used in the first inclined arrangement, and when performing continuous exposure in the U area, the light shielding plate 30 is moved to the second inclined arrangement. It can be used as

Further, as shown in FIG. 7(c), if the light shielding plate 30 is added to the projection area 50f and placed so as to shield the projection area 50e and the projection area 50g, continuous exposure can also be performed in the S area. can. That is, by using the light shielding plate 30 of this embodiment, continuous exposure can be performed in any area in the Y-axis direction.

Next, a method of changing the setting of the aperture K by using the drive mechanism 80 to move the light shielding plate 30 of this embodiment to the first inclined arrangement or the second inclined arrangement will be described.

As shown in FIG. 8(a), the drive mechanism 80 includes a pair of actuators 82 and 84 with an opening K in between (on the −X side and the +X side of the opening K). The actuator 82 is a so-called feed screw device that includes a motor (servo motor) 82a, a screw 82b driven by the motor 82a, and a cylindrical nut 82c that is screwed onto the screw 82b. It is possible to reciprocate with a stroke longer than the opening K in the Y-axis direction. A notch 30a that is U-shaped in plan view is formed near the -X side end of the light shielding plate 30, and a nut 82c is inserted into the notch 30a. The actuator 84 is also a feed screw device with the same configuration as the actuator 82 (motor 84a, screw 84b, nut 84c), but the nut 84c is located near the +X side end of the light shielding plate 30, and is at an angle of θZ with respect to the light shielding plate 30. The difference is that it is attached so that it can rotate freely in any direction. A pair of actuators 82 and 84 included in the drive mechanism 80 are each independently controlled by a control device CONT (see FIG. 2).

As shown in FIG. 8(a), the driving mechanism 80 has an edge (end) on the +Y side of the light shielding plate 30 that connects to the field stop 20 (not shown in FIG. 8(a); see FIG. 3(a)). By positioning the light shielding plate 30 at a position parallel to the edge on the +Y side among the edges (ends) forming the opening K of the substrate, and forming the optical path of the exposure light on the −Y side of the light shielding plate 30, The projection area 50f generated on P (see FIG. 1) can be made into a trapezoid (isosceles trapezoid) in plan view. The position and angle of the light shielding plate 30 are measured based on the output of a measuring device (such as a position measuring device or a light amount measuring device) (not shown) or input signals to the actuators 82 and 84. At this time, a region of the opening K on the +Y side of the light shielding plate 30 is shielded by a movable blind device 60 so that the exposure light does not pass therethrough. Hereinafter, as shown in FIG. 8(a), an optical path of exposure light is formed on the -Y side of the light shielding plate 30, and a projection area 50f having a trapezoidal shape in plan view is formed on the substrate P by the exposure light that has passed through the optical path. The generated state will be referred to as the first mode of the light shielding plate 30 and will be described.

Further, the drive mechanism 80 opens the opening K by driving the nuts 82c and 84c of the pair of actuators 82 and 84 in the Y-axis direction with the same stroke (movement amount) from the state shown in FIG. 8(a). The area, that is, the width (area) of the projection region 50f (trapezoidal in plan view) generated on the substrate P (see FIG. 1) can be changed. At this time, the blind device 60 is also driven in the Y-axis direction according to the position of the light shielding plate 30.

Note that the blind device 60 described above is also provided corresponding to each of the projection optical modules PLa to PLe, PLg (see FIG. 1) that are not equipped with the light shielding plate 30, and The aperture K formed in the field stop 20 (see FIG. 3(a)) can be opened or closed as desired. Note that in this embodiment, the blind device 60 is included in the illumination optical system IL (see FIG. 1), but the blind device 60 is not limited to this, and may be placed in any other position as long as it is on the optical path of the exposure light EL. You can leave it there.

Further, in the drive mechanism 80, the nut 82c of the actuator 82 is on the +Y side more than the nut 84c of the actuator 84, as shown in FIG. By controlling the Y position of each nut 82c, 84c so that the -Y side edge (end) of the light shielding plate 30 is located at the field stop 20 (not shown in FIG. 8(b), FIG. 3( The light shielding plate 30 can be positioned at a position parallel to the edge on the −Y side among the edges (ends) forming the opening K in (see a)). Thereby, the projection area 50f generated on the substrate P (see FIG. 1) can be made into a parallelogram in plan view. Hereinafter, as shown in FIG. 8(b), an optical path of exposure light is formed on the -Y side of the light shielding plate 30, and a projection area of a parallelogram in plan view is formed on the substrate P by the exposure light that has passed through the optical path. The state in which 50f is generated will be described as the second mode of the light shielding plate 30. Also in this second mode, by driving the pair of nuts 82c and 84c synchronously in the Y-axis direction, the area of the opening K, that is, the projection area 50f (in plan view) generated on the substrate P (see FIG. 1) is You can change the width (area) of the parallelogram. Further, a region of the opening K on the +Y side of the light shielding plate 30 is appropriately shielded from light by the blind device 60 depending on the position of the light shielding plate 30.

Further, the drive mechanism 80 moves the position of the blind device 60 from the second mode (see FIG. 8(b) as an example) to the -Y side of the light shielding plate 30, as shown in FIG. 8(c). By doing so, an optical path of exposure light can be formed on the +Y side of the light shielding plate 30. The +Y side edge (end) of the light shielding plate 30 is the −Y side edge (end) of the edge (end) forming the aperture K of the field stop 20 (not shown in FIG. 8(c), see FIG. 3(a)). Since it is parallel to the side edge, the projection area 50f generated on the substrate P by the exposure light that has passed through the optical path becomes a trapezoid (isosceles trapezoid) in plan view. Hereinafter, as shown in FIG. 8(c), an optical path of exposure light is formed on the +Y side of the light shielding plate 30, and a projection area 50f having a trapezoidal shape in plan view is generated on the substrate P by the exposure light that has passed through the optical path. This state will be described as the third mode of the light shielding plate 30. Also in the third mode, by driving the pair of nuts 82c and 84c synchronously in the Y-axis direction, the area of the opening K, that is, the projection area 50f (in plan view) generated on the substrate P (see FIG. 1) is You can change the width (area) of the trapezoid. Further, a region of the opening K on the −Y side with respect to the light shielding plate 30 is appropriately shielded from light by the blind device 60 depending on the position of the light shielding plate 30.

Further, the drive mechanism 80 moves the nut 84c from the third mode (see FIG. 8(c) as an example) so that the nut 84c is located on the +Y side relative to the nut 82c, as shown in FIG. 8(d). By controlling the Y positions of 82c and 84c, the edge (end) on the +Y side of the light shielding plate 30 opens the aperture K of the field stop 20 (not shown in FIG. 8(b), see FIG. 3(a)). The light shielding plate 30 can be positioned at a position parallel to the edge on the +Y side among the edges (ends) to be formed. Thereby, the projection area 50f generated on the substrate P (see FIG. 1) can be made into a parallelogram in plan view. Hereinafter, as shown in FIG. 8(d), an optical path of exposure light is formed on the +Y side of the light shielding plate 30, and the exposure light that has passed through the optical path forms a projection area 50f of a parallelogram in plan view on the substrate P. The state in which this is generated will be referred to as the fourth mode of the light shielding plate 30 and will be described. In the fourth mode as well, by driving the pair of nuts 82c and 84c synchronously in the Y-axis direction, the area of the opening K, that is, the projection area 50f (in plan view) generated on the substrate P (see FIG. 1) is You can change the width (area) of the parallelogram. Further, a region of the opening K on the −Y side with respect to the light shielding plate 30 is appropriately shielded from light by the blind device 60 depending on the position of the light shielding plate 30.

As described above, in this embodiment, the exposure light is directed to the light shielding plate 30 in both the -Y direction (first and second modes) and the +Y direction (third and fourth modes) of the aperture K. An optical path can be formed, and the width of the aperture K can be arbitrarily adjusted in each of the first to fourth modes. That is, the field stop 20, the light shielding plate 30, the drive mechanism 80, and the blind device 60 constitute a variable field stop device that arbitrarily changes the shape and position of the projection area 50f generated on the substrate P by the projection optical module PLf. are doing.

FIG. 9 is a plan view showing the projection areas 50a to 50g generated on the substrate P. The projection areas 50a to 50g are the ends of adjacent projection areas in the Y-axis direction, that is, the ends 51a and 51b, the ends 51c and 51d, the ends 51e and 51f, the ends 51g and 51h, and the ends 51i and 51j. , the end portions 51k and 51l are set to overlap in the Y-axis direction (so that their positions in the Y-axis direction overlap). Therefore, by exposing the projection areas 50a to 50g while scanning the substrate P in the X-axis direction (scanning exposure), overlapping areas 52a to 52f (FIG. 9) are exposed in duplicate (double exposure). A region between two dotted lines) is formed.

Moreover, as shown by the broken line in FIG. 9, the light shielding plate 30 appropriately sets the effective size of the projection area 50f by moving in the first and second positions and in the Y-axis direction. Thereby, when performing scanning exposure by scanning the substrate P in the X-axis direction, the light-shielding plate 30 appropriately sets the width and shape in the Y-axis direction of the pattern image of the mask M transferred via the projection area 50f. The pattern width in the Y-axis direction and the pattern shape of the transfer pattern formed on the substrate P as a latent image corresponding to the pattern image can be set as appropriate.

Next, a description will be given of a splicing exposure method in which scanning exposure is performed a plurality of times using the exposure apparatus EX (see FIG. 1) and a plurality of transfer patterns corresponding to the pattern image of the mask M are spliced onto the substrate P. In the following description, as shown in FIG. 10, of the pattern PPA formed on the mask M, a partial pattern PA having a length LA in the Y-axis direction and a portion having a length LB in the Y-axis direction will be described. The pattern images of the two areas with the pattern PB are sequentially transferred onto the substrate P in two scan exposures (first and second scan exposure), and the transfer patterns MA and MB corresponding to these pattern images are transferred. It is assumed that pattern synthesis is performed by splicing on the substrate P. At this time, the joint portion MC is formed by overlappingly exposing the boundary portions of the transfer patterns MA and MB corresponding to the respective boundary portions 45 and 46 of the partial patterns PA and PB. As a result, the entire transfer pattern MPA on the substrate P is a combination of the transfer pattern MA of the partial pattern PA and the transfer pattern MB of the partial pattern PB.

Here, in the present embodiment, the position and width in the Y-axis direction of the projection area 50f generated on the substrate P by the projection optical module PLf are changed as appropriate using the above four modes. can do. With this, when forming a joint part in the transfer pattern MA in the first scanning exposure using the projection optical module PLf, the length LA in the Y-axis direction of the partial pattern PA and the shape of the end thereof can be arbitrarily set. Alternatively, when forming the joint portion of the transfer pattern MB in the second scanning exposure using the projection optical module PLf, the length LB of the partial pattern PB in the Y-axis direction and the shape of the end thereof are arbitrarily set. be able to.

In reality, when manufacturing multiple liquid crystal panels as products from one mother glass substrate using exposure equipment EX, various types of liquid crystal panels are required in terms of size, number, etc. . For example, it is required to create products (circuit patterns such as liquid crystal panels) of different sizes on a single glass substrate. Therefore, in reality, various aspects are required for the number of joint exposures (the number of joint portions MC), the lengths of the transfer patterns MA and MB, etc., depending on the design. Hereinafter, an exposure method when performing continuous exposure using the light shielding plate 30 of this embodiment will be specifically described. In addition, in the following first exposure method and second exposure method, the case where there are 7 projection optical system modules will be explained, and in the third to fifth exposure methods, the case where there are 11 projection optical system modules will be explained. As will be explained, the number of projection optical system modules can be changed as appropriate, and the concept and method of continuous exposure are the same as the example explained in FIG. 6 regardless of the number of projection optical system modules. .

FIG. 11A shows a substrate P and a mask M according to the first exposure method. In the first exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The sizes of panels PN1 and PN2 are the same, and the mask patterns used are also the same. The first exposure method is similar to the case described in FIG. 10, and the exposure operation for each panel PN1 and PN2 can be completed with two exposure operations (one continuous exposure operation).

In the first exposure method, as shown in FIG. 11(b), the light shielding plate 30 is moved to the second inclined arrangement, and the light shielding plate 30 is moved so that the optical path of the exposure light is formed on the +Y-axis side. move it. In this state, by relatively moving the mask M and the substrate P along the X-axis direction (first direction), a first scanning exposure is performed to form a pattern in area A of the mask pattern on the substrate P. be exposed. Next, step movement is performed to move the substrate P in the Y-axis direction (second direction) by the substrate stage drive unit PSTD. Then, as shown in FIG. 11(c), the light shielding plate 30 is moved to the first inclined arrangement, and the light shielding plate 30 is moved in the Y-axis direction so that the optical path of the exposure light is formed on the -Y-axis direction side. move it along. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a second scanning exposure is performed in which a pattern in area B of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, a panel larger in size than the pattern area PPA of the mask M (see FIG. 10) can be formed on the substrate P.

FIG. 12A shows a substrate P and a mask M according to the second exposure method. In the second exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The sizes of panels PN1 and PN2 are the same, and the mask patterns used are also the same. With the second exposure method, larger panels can be manufactured than with the first exposure method. Further, similarly to the first exposure method, the exposure operation for each panel PN1 and PN2 can be completed with two exposure operations (one continuous exposure operation).

In the second exposure method, as shown in FIG. 12(b), the light shielding plate 30 that defines the projection area 50f generated by the projection optical module PLf (see FIG. 1) is moved to a second inclined arrangement, and , the light shielding plate 30 is moved so that the optical path of the exposure light is formed on the +Y-axis side. In this state, by relatively moving the mask M and the substrate P along the X-axis direction, a first scanning exposure is performed to form a pattern in area A of the mask pattern on the substrate P. Next, step movement is performed to move the substrate P in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 12(c), the light shielding plate 30 that defines the projection area 50b generated by the projection optical module PLb (see FIG. 1) is moved to the first inclined arrangement, and the -Y-axis side The light shielding plate 30 is moved so that an optical path of the exposure light is formed. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a second scanning exposure is performed in which a pattern in area B of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, a panel larger in size than the pattern area PPA of the mask M can be formed on the substrate P.

FIG. 13A shows a substrate P and a mask M according to the third exposure method. In the third exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The sizes of panels PN1 and PN2 are the same, and the mask patterns used are also the same. In the third exposure method, the length of the panels PN1 and PN2 in the Y-axis direction is approximately twice the length of the mask M in the Y-axis direction, and unlike the case described in FIG. 10, two exposure operations are required. (One continuous exposure operation) does not complete the exposure operation for each panel PN1 and PN2. Therefore, areas A, B, and C are set on the mask M, and a total of three exposure operations (two continuous exposure operations) are performed for one panel (product).

In the third exposure method, as shown in FIG. 13(b), the light shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first inclined arrangement, and the +Y axis The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the side. In this state, by relatively moving the mask M and the substrate P along the X-axis direction, a first scanning exposure is performed to form a pattern in area A of the mask pattern on the substrate P. Next, a first step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 14A, the light shielding plate 30 that defines the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the second inclined arrangement, and the exposure light is directed toward the +Y-axis side. The light shielding plate 30 is moved so that an optical path is formed. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a second scanning exposure is performed in which a pattern in area B of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Furthermore, a second step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 14(b), the light shielding plate 30 that defines the projection area ₅₀₄ generated by the projection optical module _PL4 is moved to the first inclined arrangement, and the exposure light is directed toward the −Y-axis side. The light shielding plate 30 is moved so that an optical path of 1 is formed. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the B area and the transfer pattern corresponding to the C area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a third scanning exposure is performed in which a pattern in area C of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, a panel larger in size than the pattern area PPA of the mask M can be formed on the substrate P.

Further, FIG. 15A shows a substrate P and a mask M according to the fourth exposure method. In the fourth exposure method, three panels PN1 to PN3 are manufactured from one substrate P. The sizes of panels PN1 to PN3 are the same, and the mask patterns used are also the same. In the fourth exposure method, the length of the panels PN1 to PN3 in the Y-axis direction is about 1.3 times the length of the mask M in the Y-axis direction, and unlike the third exposure method described above, the length of the panels PN1 to PN3 in the Y-axis direction is The exposure operation for each panel PN1 to PN3 is completed with the exposure operation (one continuous exposure operation). In the fourth exposure method, two areas, A area and B area, are set on the mask M, and a total of two exposure operations (one continuous exposure operation) are performed for one panel (product). I do.

In the fourth exposure method, as shown in FIG. 15(b), the light shielding plate 30 that defines the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first inclined arrangement, and the +Y axis The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the side. In this state, by relatively moving the mask M and the substrate P along the X-axis direction, a first scanning exposure is performed to form a pattern in area A of the mask pattern on the substrate P. Next, step movement is performed to move the substrate P in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 16, the light shielding plate 30 that defines the projection area 50 ₇ generated by the projection optical module PL ₇ is moved to the second inclined arrangement, and the optical path of the exposure light is directed to the -Y axis side. The light shielding plate 30 is moved so that the light shielding plate 30 is formed. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a second scanning exposure is performed in which a pattern in area B of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, a panel larger in size than the pattern area PPA of the mask M (see FIG. 10) can be formed on the substrate P.

Further, FIG. 17(a) shows a substrate P and a mask M according to the fifth exposure method. In the fifth exposure method, three panels PN1 to PN3 are manufactured from one substrate P. Panel PN1 is smaller in size and shorter in length in the Y-axis direction than panels PN2 and PN3. Furthermore, a mask pattern MP1 formed on the mask M is used for exposing the panel PN1, and a mask pattern MP2 different from the mask pattern MP1 is used for exposing the panels PN2 and PN3.

In the fifth exposure method, as shown in FIG. 17(b), the light shielding plate 30 that defines the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the second inclined arrangement, and the +Y axis The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the side. In this state, by relatively moving the mask M and the substrate P along the X-axis direction, first scanning exposure is performed to form a pattern in the A1 area of the mask pattern on the substrate P. Next, a first step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 18(a), the light shielding plate 30 that defines the projection area ₅₀₇ generated by the projection optical module _PL7 is moved to the second inclined arrangement, and the exposure light is directed toward the −Y-axis side. The light shielding plate 30 is moved so that an optical path of 1 is formed. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A1 area and the transfer pattern corresponding to the B1 area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, by relatively moving the mask M and the substrate P along the X-axis direction, a second scanning exposure is performed to form a pattern in the B1 region of the mask pattern on the substrate P. Thereby, the mask pattern MP1 can be transferred to the substrate P, and the panel PN1 can be formed on the substrate P.

Furthermore, in order to form the panel PN2 on the substrate P, a second step movement is performed in which the substrate P is moved in the X-axis direction and the Y-axis direction by the substrate stage drive unit PSTD. Furthermore, in the second step movement, in order to transfer the mask pattern MP2 onto the substrate P, the mask M is moved by the mask stage drive unit MSTD. Then, as shown in FIG. 18(b), the light shielding plate 30 that defines the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first inclined arrangement, and the exposure light is directed toward the +Y-axis side. The light shielding plate 30 is moved so that an optical path is formed. In this state, by relatively moving the mask M and the substrate P along the X-axis direction, third scanning exposure is performed to form a pattern in the A2 area of the mask pattern on the substrate P. Next, a third step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 19, the light shielding plate 30 that defines the projection area ₅₀₇ generated by the projection optical module PL ₇ is moved to the second inclined arrangement, and the optical path of the exposure light is directed to the −Y-axis side. The light shielding plate 30 is moved so that the light shielding plate 30 is formed. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A2 area and the transfer pattern corresponding to the B2 area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a fourth scanning exposure is performed in which a pattern in area B2 of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, the mask pattern MP2 can be transferred to the substrate P, and the panel PN2 can be formed on the substrate P.

Hereinafter, although not shown, in order to form the panel PN3 on the substrate P, a fourth step movement is performed in which the substrate P is moved in the X-axis direction and the Y-axis direction by the substrate stage drive unit PSTD. . Then, the light shielding plate 30 that defines the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first inclined arrangement, and the light shielding plate 30 is moved so that the optical path of the exposure light is formed on the +Y-axis side. move it. In this state, by relatively moving the mask M and the substrate P along the X-axis direction, a fifth scanning exposure is performed to form a pattern in the A2 area of the mask pattern on the substrate P. Next, a fifth step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, the light shielding plate 30 that defines the projection area ₅₀₇ generated by the projection optical module _PL7 is moved to the second inclined arrangement, and the light shielding plate 30 is moved so that the optical path of the exposure light is formed on the −Y-axis side. move. At this time, in each panel area on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A2 area and the transfer pattern corresponding to the B2 area. At this joint, the light shielding plate 30 and the blind device 60 are positioned so that the amount of exposure becomes uniform. Thereafter, a sixth scanning exposure is performed in which a pattern in area B2 of the mask pattern is formed on the substrate P by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, the mask pattern MP3 can be transferred to the substrate P, and the panel PN3 can be formed on the substrate P. Through the above steps, panel PN1, panel PN2, and panel PN3 can be formed on substrate P.

Note that the first to fifth exposure methods described above are just examples, and in addition to these, various modes can be considered for the continuous exposure performed in the exposure apparatus EX. Therefore, depending on the required panel size, it is necessary to design each time how to divide the mask pattern into a plurality of regions and connect them for exposure.

However, there are various restrictions in designing the division locations of the mask pattern. That is, in exposure apparatus EX, since the relative position of mask stage MST (mask M) and each projection optical system module in the step (Y-axis) direction remains unchanged, the length of each transfer pattern in the Y-axis direction is The base is an integral multiple of the length of the projection area formed by each projection optical system module, and the total length is adjusted by the light shielding plate 30. On the other hand, only a part of the projection optical module (in this embodiment, the projection optical system module PLf) has the light shielding plate 30, which is a constraint in designing the total length of the projection area in the Y-axis direction. . In addition, in the panel manufacturing process, in addition to the liquid crystal display surface on which a repeated pattern is formed, each panel has lead lines (referred to as tab areas) in the periphery for connecting each panel and the drive circuit. is formed. Since the lead line formed in this tab area is not a repeating pattern, it becomes a constraint when performing continuous exposure. Further, from the viewpoint of throughput, it is preferable that the number of continuous exposures be small, and this point also becomes a constraint when dividing the mask pattern into a plurality of regions. Furthermore, since there is a physical limit to the mask size due to the size of mask stage MST, this point also becomes a constraint when dividing the mask pattern into a plurality of regions.

On the other hand, in the exposure apparatus EX of the present embodiment, a variable diaphragm device constituted by the field stop 20, a light shielding plate 30, a drive mechanism 80, and a blind device 60 forms a joint part when performing a joint exposure. The length and end shape of one of the pair of projection areas (in this embodiment, the projection area 50f) can be adjusted by using the light shielding plate 30 in any of the first to fourth modes. , can be adjusted arbitrarily. Therefore, when manufacturing products using continuous exposure, the design (which part of the circuit pattern formed on the mask is to be formed on the glass substrate using continuous exposure, and the part of the circuit pattern to be subjected to the continuous exposure process) This improves the degree of freedom (e.g., positioning and arrangement of multiple types of circuit patterns on a mask used when exposing multiple types of circuit patterns with different sizes on a glass substrate), and eliminates the various constraints mentioned above. It becomes possible to alleviate the To give an example, if the inclination direction of the light shielding plate 30 is fixed, the light shielding plate 30 is arranged such that a trapezoidal opening K as shown in FIG. 4(a) or FIG. 4(c) can be formed. 4(b) or 4(d), it is not possible to form a parallelogram-shaped and slit-shaped opening K (the oblique side of the light shielding plate 30 and the end forming the opening K cannot be formed). However, in this embodiment, the above-mentioned degree of freedom in design is improved.

When performing continuous exposure using the exposure apparatus EX of this embodiment, the position of the light shielding plate 30 and The slope (any of the first to fourth modes) is determined. For example, as shown in FIG. 20, in step S10, the panel (product) size, the mask size, the width (position) of the tab area, the position of the light shielding plate 30 (in this embodiment, the position corresponding to the projection area 50f) , multiple areas are set on the mask M (areas A and B in the first exposure method, areas A to C in the third exposure method, etc.) on the mask M according to various conditions such as the optimal number of scanning exposures. . Further, in step S12, the position of the light shielding plate 30 in the Y-axis direction is determined according to the length of the region on the mask M in the Y-axis direction determined in step S10.

Then, in step S14, it is determined whether the position of the light shielding plate 30 determined in step S12 satisfies the desired continuous exposure conditions. For example, when joint exposure is performed in the current direction of inclination of the light shielding plate 30, it is determined whether the total exposure amount of the joint portion MC (see FIG. 10) formed on the substrate P satisfies the desired exposure condition. do. If the determination in step S14 is YES, the process advances to step S16 and continuous exposure is performed. In addition, in the case of No determination in step S14, the process proceeds to step S18, where the mode switching of the light shielding plate 30 (switching between the first mode and the second mode, or switching between the third mode and the fourth mode) is connected and exposed. After addition to the step S16 (the mode switching of the light shielding plate 30 is actually performed during the Y step operation of the substrate P), the process advances to step S16 to perform continuous exposure.

Note that if the exposure conditions for continuous exposure are known in advance, taking into account the panel (product) size, mask size, width (position) of the tab area, number of scanning exposures, etc., the position of the light shielding plate 30 can be determined. The first scanning exposure and the second scanning exposure may be configured to be switchable. As a result, the above-mentioned steps (steps S14 and S18) can be omitted, so that the exposure process can be simplified.

As explained above, in this embodiment, one of the pair of edges (+Y side or −Y side) of the pair of edges that form the opening K and spaced apart in the Y-axis direction, and the pair of edges of the light shielding plate 30 in the Y-axis direction An optical path of exposure light is formed on one side or the other side (+Y side or -Y side) of the light shielding plate 30 by one side (+Y side or -Y side), and the exposure light passing through the optical path , on the substrate P, a trapezoidal or parallelogram-shaped projection area 50f in plan view is generated. The width of the trapezoidal or parallelogram-shaped projection area 50f in the Y-axis direction can be changed as appropriate depending on the Y position of the light shielding plate 30.

In this way, by switching the mode of the light shielding plate 30, the position and shape of the projection area 50f can be changed, so that the projection area formed on the substrate P by the plurality of projection optical modules including the projection area 50f can be changed. The length in the Y-axis direction and the end shape (inclination direction) can be set arbitrarily. Therefore, the degree of freedom in designing the width of the transfer pattern MPA or MPB (see FIG. 10) formed on the substrate P by continuous exposure is improved, and a liquid crystal panel of any width can be formed on a single mother glass substrate. It becomes possible to do so.

Note that the configuration of the embodiment described above is an example, and can be modified as appropriate. That is, in the above embodiment, only one light shielding plate 30 (variable field diaphragm device) is provided, but the invention is not limited to this, and a plurality of light shielding plates 30 may be provided. Further, the number and position of the projection optical modules in which the light shielding plate 30 (variable field diaphragm device) is provided are not particularly limited. In this case, the degree of freedom in designing the width of the transfer pattern MPA or MPB (see FIG. 10) formed on the substrate P by continuous exposure is further improved.

Further, the mechanism for driving the light shielding plate 30 can also be changed as appropriate. That is, as in the modification shown in FIG. 21, two light shielding plates 30 may be provided for one aperture K (field stop 20 (see FIG. 3)). The drive mechanism 80A for independently driving the two light shielding plates 30 has a pair of actuators 82A and 84B as in the above embodiment, and nuts 82c and 84c of the pair of actuators 82A and 84A are connected to each other. A light shielding plate 30 is fixed. In the above embodiment, the angle is changed by rotationally driving one light shielding plate 30, but in this modification, the ends of each of the two light shielding plates 30 are aligned in the Y-axis direction forming the opening K. The mounting angle is set in advance so as to be parallel to a pair of spaced apart edges, and one of the pair of ends of the field stop 20 and one of the four ends of the two light shielding plates 30 are connected in advance. By combining them, the first to fourth modes can be realized similarly to the above embodiment. Note that FIG. 21 is a schematic diagram, and FIG. 25 shows details of this modification. In the drive mechanism shown in FIG. 25, each light shielding plate 30 is independently reciprocated within a predetermined movable range (see broken line arrows in FIG. 25) along a pair of arms 88 extending in the Y-axis direction. Such a drive mechanism that reciprocates the arm 88 can also be used as a drive mechanism for the light shielding plate 30 of the above embodiment.

Furthermore, as in a modified drive mechanism 80B shown in FIG. 22, the nut 84c of the actuator 84B may include a rotation motor 84d for rotationally driving the light shielding plate 30. The rotary motor 84d rotates the light shielding plate 30, and positions the light shielding plate 30 by bringing it into contact with a pair of stoppers 84e fixed to a nut 84c. In this modification, whereas the drive mechanism 80 of the above embodiment (see FIG. 4A, etc.) had a pair of linear actuators, only one linear actuator is required, and the configuration is simple.

Further, as in a modified drive mechanism 80C shown in FIG. 23(a), the light shielding plate 30 may be rotatably supported with respect to a nut 84c of an actuator 84C via a shaft 84f. The drive mechanism 80C has a pair of pins 84h whose positions relative to the opening K are fixed, and moves the nut 84c in the Y-axis direction with the light shielding plate 30 in contact with one of the pair of pins 84h. to rotate the light shielding plate 30 (see FIG. 23(b)). Further, the nut 84c has a leaf spring 84g that presses the light shielding plate 30 against either of the pair of stoppers 84e, so that the light shielding plate 30 is always kept in contact with either of the pair of stoppers 84e. It will be done. In this modification, an actuator for rotationally driving the light shielding plate 30 is not required, and the configuration of the drive mechanism 80C is simple.

Further, although the light shielding plate 30 of the above embodiment is formed in a rectangular shape in plan view, and the angle is changed by rotation, the shape of the light shielding plate is not limited to this. That is, like the modified light shielding plate 130 shown in FIG. 24(a), it may be formed in a U-shape (inverted C-shape) in plan view that opens on the +X side. The light shielding plate 130 is made of a plate-shaped member extending in the Y-axis direction, and the +Y side end is formed parallel to the +Y side end of the ends forming the aperture K of the field stop 20 (see FIG. 3). has been done. The light shielding plate 130 has an end on the −Y side parallel to an end on the −Y side of the ends forming the aperture K of the field stop 20. Furthermore, among the pair of ends spaced apart in the Y-axis direction that form the notch 132 opened on the +X side of the light shielding plate 130, the end on the +Y side is one of the ends forming the aperture K of the field stop 20. , parallel to the +Y side end (that is, parallel to the +Y side end of the light shielding plate 130). Also, of the pair of ends that form the notch 132 and are spaced apart in the Y-axis direction, the end on the -Y side is the same as the end on the -Y side of the end that forms the aperture K of the field stop 20. They are formed parallel to each other (that is, parallel to the -Y side end of the light shielding plate 130).

The light shielding plate 130 according to the modification shown in FIG. 24(a) is driven in the Y-axis direction by the actuator 86. As a result, as shown in FIGS. 24(b) to 24(e), the first to fourth modes can be realized similarly to the above embodiment. Note that, similarly to the above embodiment, a portion of the aperture K that does not form the optical path of the exposure light is blocked by a movable blind device 60. According to this modification, the first to fourth modes can be achieved by simply driving the light shielding plate 130 in a straight line using one actuator 86, so the configuration is simple.

Further, in the above embodiment, the optical path (aperture K) of the exposure light is formed by the cooperation of the field stop 20 and the light shielding plate 30 made of a plate-like member. The member forming the optical path is not limited to this. That is, as shown in FIG. 26, a part of the aperture K may be shielded from light using optical filters 230a and 230b. The optical filter 230a is set so that the light transmittance decreases from the end on the +Y side toward the -Y side. The optical filter 230b is configured symmetrically with respect to the optical filter 230a in the drawing. The optical filters 230a and 230b can be driven independently in the Y-axis direction, so that the exposure light shielding range and the position of the exposure light optical path can be set arbitrarily. Also in this modification, continuous exposure similar to the above embodiment can be performed. Note that the optical filters 230a, 230b are arranged in the optical axis direction from the conjugate plane with respect to the mask M and the substrate P so that the minute dots forming the light shielding part (filter part) in the optical filters 230a, 230b are not transferred onto the substrate P. It is best to place it in a slightly shifted position.

Further, in the above embodiment (and variations thereof), a case has been described in which a feed screw device is used as a drive mechanism for driving the light shielding plate 30, but the configuration of the drive mechanism is not limited to this. That is, a known shaft motor or the like may be used as an actuator for driving the light shielding plate 30. Since the shaft motor can independently drive a plurality of movers with respect to one stator, it is suitable for a type in which the position of a pair of light shielding plates 30 is controlled independently, as in the modification shown in FIG. 21. It is. Further, as the actuator, an electromagnetic motor such as a linear motor, or a mechanical actuator such as an ultrasonic motor or an air cylinder may be used.

Further, in the modification shown in FIG. 21, each of the pair of light shielding plates 30 is driven by an independent actuator, but some of the actuators may be common. That is, a pair of light shielding plates 30 are placed on a common first stage (coarse movement stage), and a second stage (fine movement stage) is mounted on the first stage that can independently control the position of each of the pair of light shielding plates 30. It may also be configured such that a stage) is placed thereon.

Further, although the actuator for driving the light shielding plate 30 is arranged along the Y-axis direction in the above embodiment, the actuator is not limited thereto, and may be arranged along other directions (such as the X-axis direction and the Z-axis direction). It may be placed.

Further, the light shielding plate 30 and its drive mechanism 80 are provided to define a projection area (exposure area) generated on the substrate P, but the invention is not limited to this, and the above-mentioned light shielding plate 30 and its driving mechanism 80 are A light shielding plate having the same configuration as the embodiment and its driving mechanism may be provided.

Furthermore, although the light shielding plate 30 is provided in the projection optical module that constitutes the projection optical system PL, its placement position is not particularly limited as long as it is on the optical path of the exposure light EL, and it may be provided in the illumination optical system IL or the like. .

Further, in the above embodiment, the light shielding plate 30 and its driving mechanism 80 are devices that constitute a part of the exposure apparatus EX, but the invention is not limited to this. It is also possible to additionally provide a light shielding device (including software) to an existing exposure device as a light shielding device (variable field diaphragm device).

Further, in the above embodiment, the position and shape of the projection area formed on the substrate P are changed by the variable field diaphragm device including the light shielding plate 30, but the present invention is not limited to this, and the mask M and the projection optical system PL are changed. The mask M may be configured to be relatively movable in the Y-axis direction, and the position and shape of the projection area may be changed by relative movement of the mask M and the projection optical system PL in the Y-axis direction.

Further, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as _F2 laser light (wavelength 157 nm). In addition, as illumination light, for example, single wavelength laser light in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). However, harmonics whose wavelength is converted into ultraviolet light using a nonlinear optical crystal may also be used. Alternatively, a solid-state laser (wavelength: 355 nm, 266 nm) or the like may be used.

Further, although the case has been described in which the projection optical system PL is a multi-lens type projection optical system including a plurality of projection optical modules, the number of projection optical modules is not limited to this, and it is sufficient if there is one or more. Furthermore, the projection optical system PL may be an enlargement system or a reduction system.

In addition, the application of the exposure device is not limited to a liquid crystal exposure device that transfers a liquid crystal display element pattern onto a rectangular glass plate; for example, an exposure device for manufacturing organic EL (Electro-Luminescence) panels, and semiconductor manufacturing. The present invention can also be widely applied to exposure devices for manufacturing thin film magnetic heads, micromachines, DNA chips, etc. In addition, in order to manufacture masks or reticles used not only in microdevices such as semiconductor elements, but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc., glass substrates or silicon wafers, etc. It can also be applied to exposure equipment that transfers circuit patterns to images.

Further, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or a mask blank. Furthermore, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). Note that the exposure apparatus of this embodiment is particularly effective when the exposure target is a substrate having a side length or diagonal length of 500 mm or more.

Electronic devices such as liquid crystal display elements (or semiconductor elements) are manufactured through the steps of designing the functions and performance of the device, manufacturing a mask (or reticle) based on this design step, and manufacturing a glass substrate (or wafer). , a lithography step of transferring a pattern of a mask (reticle) onto a glass substrate using the exposure apparatus of each embodiment described above and its exposure method; a development step of developing the exposed glass substrate; The device is manufactured through an etching step in which exposed parts are removed by etching, a resist removal step in which unnecessary resist is removed after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is performed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate, so that highly integrated devices can be manufactured with high productivity. .

Note that the disclosures of all publications (including international publications) regarding exposure apparatuses and the like cited in the description up to now are incorporated into the description of this specification.

As explained above, the exposure apparatus of the present invention is suitable for exposing a mask pattern onto a substrate.

20... Field stop, 30... Light shielding plate, 50... Projection area, 80... Drive mechanism, CONT... Control device, EX... Exposure device, K... Aperture, P... Substrate, PLa to PLg... Projection optical module.

Claims (17)

An exposure apparatus that exposes an object by moving the object in a first direction relative to a projection optical system that projects a predetermined pattern onto the object,
a field stop provided in the projection optical system and having an aperture that sets the shape of a projection area on the object;
a light shielding part that is provided in the projection optical system independently of the field stop and changes the shape of the projection area by overlapping with the aperture;
a drive unit that drives the light shielding unit in a second direction intersecting the first direction,
The opening has a trapezoidal shape having two sides parallel to the second direction in plan view,
The drive unit rotates the light shielding part about a third direction that intersects the first direction and the second direction as a rotation axis , and aligns one of the trapezoidal legs of the opening and one side of the light shielding part in parallel. , or an exposure apparatus in which the other trapezoidal leg of the opening and one side of the light shielding part are made parallel . The exposure apparatus according to claim 1,
When the driving unit makes one of the trapezoidal legs of the opening parallel to one side of the light shielding part, one of the legs of the opening and the one side of the light shielding part do not intersect,
When the drive unit makes the other trapezoidal leg of the opening parallel to one side of the light shielding part, the other leg of the opening and the one side of the light shielding part do not intersect. The exposure apparatus according to claim 1,
An exposure apparatus comprising: a light source, a mask stage, the projection optical system, and a stage on which the object is placed in order along an optical axis of light emitted from the light source. The exposure apparatus according to claim 1,
The projection optical system includes a plurality of the field stops,
The driving section is an exposure apparatus that moves the light shielding section so that the light shielding section overlaps with any of the apertures of the field stop arranged at predetermined intervals in the second direction. The exposure apparatus according to claim 1,
The drive unit includes a first actuator and a second actuator that extend in the second direction across the two parallel sides of the opening in plan view ,
the first actuator and the second actuator are connected to the light shielding part,
In the exposure apparatus, the drive section drives the light shielding section using the first actuator and the second actuator. The exposure apparatus according to claim 5 ,
The driving section is an exposure apparatus that moves the light shielding section in the second direction by driving the first actuator and the second actuator in the second direction by the same amount of movement. The exposure apparatus according to claim 5 or 6 ,
The driving section is an exposure apparatus that rotates the light shielding section by driving the first actuator and the second actuator in the second direction by different moving amounts. The exposure apparatus according to any one of claims 5 to 7 ,
The exposure apparatus is characterized in that the first actuator and the second actuator are feed screw devices including a motor, a screw driven by the motor, and a nut screwed onto the screw. The exposure apparatus according to any one of claims 1 to 8 ,
The driving section is an exposure apparatus that drives the light shielding section so that an end of the projection area in the second direction is shielded from light. The exposure apparatus according to any one of claims 1 to 9 ,
The field stop is arranged near a conjugate plane of the object and a mask having a predetermined pattern projected onto the object. The exposure apparatus according to claim 10 ,
In the exposure apparatus, the light shielding portion is provided closer to the object than the field stop provided on the conjugate plane with respect to the third direction. The exposure apparatus according to any one of claims 1 to 11 ,
A plurality of the projection optical systems are provided in the first direction,
The light shielding section is an exposure device provided in each of the projection optical systems provided apart from each other in the first direction. The exposure apparatus according to any one of claims 1 to 12 ,
In the exposure apparatus, the projection optical systems provided at different positions in the first direction have partially different projection areas with respect to the second direction. The exposure apparatus according to any one of claims 1 to 13 ,
The object is an exposure apparatus that is a substrate used for manufacturing a flat panel display. The exposure apparatus according to any one of claims 1 to 14 ,
The exposure apparatus is characterized in that the object is a substrate having at least one side length or diagonal length of 500 mm or more. exposing the substrate using the exposure apparatus according to claim 14 or 15 ;
Developing the exposed substrate. A method for manufacturing a flat panel display. exposing the object using the exposure apparatus according to any one of claims 1 to 15 ;
Developing the exposed object.

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