JP7126906B2 - Transfer device, transfer method, die bonder, and bonding method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a conveying device, a conveying method, a die bonder, and a bonding method.

In the manufacture of semiconductor devices, a chip bonding method is used in which a wafer on which a large number of elements are collectively built is diced to separate individual semiconductor chips, which are then bonded one by one to predetermined positions on a lead frame or the like. is adopted. A die bonder (bonding device) is used for this chip bonding.

As shown in FIG. 11, the bonding apparatus includes a bonding arm (not shown) having a collet 3 for sucking the semiconductor chip 1 of the supply unit 2 and a confirmation camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. and a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

The supply unit 2 has a semiconductor wafer 6 (see FIG. 12), which is divided into a large number of semiconductor chips 1 . That is, the wafer 6 is attached to an adhesive sheet (dicing sheet), and this dicing sheet is held by an annular frame. Then, the wafer 6 on the dicing sheet is separated into individual chips 1 using a circular blade (dicing saw) or the like. Also, the bonding arm holding the collet 3 can be moved between the pick-up position and the bonding position via a transfer mechanism.

Also, the chip 1 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 3 , and the chip 1 is attracted to the lower end surface of the collet 3 . Note that the chip 1 is removed from the collet 3 when this vacuum suction (vacuum drawing) is released.

Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed by a camera for confirmation placed above the supply unit 2, and after the collet 3 is positioned above the chip 1 to be picked up, the collet 3 is moved as shown by an arrow B. to pick up this chip 1. After that, the collet 3 is raised as indicated by arrow A.

Next, the island portion 5 of the lead frame 4 to be bonded is observed by a confirmation camera placed above the bonding position, and the collet 3 is moved in the direction of arrow E to move the collet 3 above the island portion 5. After positioning, the collet 3 is moved downward in the direction of arrow D to supply the chips 1 to the island portion 5 . After the chips are supplied to the island portion 5, the collet 3 is lifted as indicated by arrow C, and then returned to the waiting position above the pick-up position as indicated by arrow F.

The collet 3 moves up in the direction of arrow A above the pick-up position P, moves down in the direction of arrow B, moves up in the direction of arrow C above the bonding position Q, and moves up in the direction of arrow D. Downward direction and reciprocating movement in the directions of arrows E and F between pick-up position P and bonding position Q are allowed. The movement of the arrows A, B, C, D, E, and F of the moving mechanism is controlled by control means (not shown). As the movement mechanism, various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism can be used, and an XYZ axis stage (stage device) can be used.

By the way, dies (chips) on a wafer to be picked up come in a plurality of grades depending on their electrical characteristics. When mounting such dies having a plurality of grades on a substrate, a die bonder is used for each grade. As a result, the working time is long and the productivity is poor.

Therefore, conventionally, a classified die classification map is created in which dies having different electrical characteristics on a wafer are classified into a plurality of grades, and a die is picked up from the wafer and bonded onto a substrate or die by a bonding head. , a die bonder has been proposed which transports sorted substrates corresponding to the sorted dies by transport lanes in units of the sorted substrates, and has a single transport lane and a single bonding head (Patent Document 1).

That is, two transport units having a function of transporting a plurality of substrates are installed in the apparatus, and the substrates are transported onto heating stages provided at fixed positions on the respective transport units, and the wafers are transferred from the wafer to the first substrate. A grade (top grade) chip is picked up and bonded to a substrate supplied onto one transfer unit (first lane) with a dedicated bonding head. Chips other than the 1st grade on the same wafer are bonded to multiple substrates supplied on another transfer unit (second lane) by the same dedicated bonding head while exchanging substrates for each grade. .

Japanese Patent No. 6124969

In Patent Document 1, it is necessary to equip two bonding elements (head, arm, recognition mechanism, transport mechanism) each. As a result, the cost increases, and it is necessary to adjust and unify the two bonding elements, which may deteriorate the accuracy. Also, the production is low relative to the cost. Furthermore, if there are only top grade chips on the wafer, there will be losses in substrate transport for other grade chips.

In view of the above problems, the present invention is capable of simplifying the entire apparatus, avoiding complication of adjustment, and utilizing information on the number of remaining chips for each grade on the wafer and the remaining number of bonding on the substrate. Provided are a transfer device, a transfer method, a die bonder, and a bonding method that can perform bonding work and are excellent in productivity.

The conveying device of the present invention is a conveying device that sequentially conveys each of the supplied members to a supply position in order to supply a plurality of types of workpieces of different grades to the supplied portions of the supplied members for each grade. a plurality of shuttles that reciprocate along rails corresponding to the grades; a lift mechanism that lifts and lowers each shuttle; and a transport mechanism that transports each supplied member to the shuttle along the transport rail, The shuttle has a suction mechanism for sucking the supplied member, and when the supplied member is supplied to the shuttle from the upstream side, the shuttle or the supplied member on the upstream side of the supplied shuttle is lowered. When the supplied member is carried out of the device on the downstream side, the shuttle or the supplied member on the downstream side of the supplied member to be carried out is lowered to prevent the supply from being hindered. is prevented.

According to the conveying apparatus of the present invention, for example, when a member to be supplied to which work of the highest grade is supplied is conveyed to the supply position, the work of the highest grade is sequentially supplied to the portion to be supplied of the member to be supplied. be. Then, when the workpieces have been completely loaded onto all of the supplied parts of the supplied member, the supplied member on which the workpieces have been loaded is carried out to the downstream side, and the empty supply position is loaded with the highest grade (hereinafter referred to as the first grade). 1 grade) is supplied, and a new supplied member is supplied. At this time, the shuttle or the supplied member on the upstream side of the supply position is in a lowered state, so that the transportation of the new supplied member to the supply position is not hindered.

Then, the workpieces of the first grade are sequentially supplied to the supplied portion of the new supplied member transported to the supply position. For this reason, when the workpieces are completely loaded onto all of the supplied portions of the supplied member, the supplied member is carried out to the downstream side. When there is no first grade work in the work aggregate) and other grade works (second grade and third grade) remain in this work aggregate, the supplied member for the first grade work is One end is conveyed downstream, and the supplied member for the next grade (for example, the second grade) is conveyed to the supply position. After that, the second grade work in the work aggregate is supplied to the second grade supplied member.

Then, when the loading of the second grade workpiece on the second grade supplied member is completed, this supplied member is carried out downstream. At this time, the shuttle or the member to be supplied, which is arranged downstream of the supply position, is in a lowered state, and does not hinder the downstream delivery of the member to be supplied for the second grade. Also, if there are no second grade workpieces in the workpiece supply source (workpiece assembly) and third grade workpieces remain in the workpiece assembly before the completion of loading all second grade workpieces, are also conveyed to the downstream side of the supply position, and the material to be supplied for the third grade is conveyed to the supply position.

Then, the workpieces of the third grade are sequentially supplied to the supplied member for the third grade, and when the mounting of the third grade workpiece on the supplied member for the third grade is completed, the supplied member is carried out downstream. At this time, the shuttle or the member to be supplied, which is arranged downstream of the supply position, is in a lowered state, which does not hinder the downstream delivery of the member to be supplied for the third grade. Also, if there is no third grade workpiece in the workpiece supply source (work aggregate) before the loading of the third grade workpiece is completed, there is no workpiece in the workpiece aggregate, and a new workpiece aggregate is installed. will be supplemented.

Therefore, the first grade supplied member is returned to the supply position, and the first grade workpiece is supplied to the first grade supplied member. After that, when the mounting of the workpiece is completed, the supplied member is carried out downstream. In the same way, second grade and third grade workpieces can be sequentially supplied to second grade and third grade workpieces, and can be sequentially carried out to the downstream side.

Therefore, in the present invention, it is possible to utilize information on the remaining number of workpieces for each grade in the workpiece supply source (work aggregate) and the remaining number of supplied portions of the supplied members. It is possible to handle even if the grade of work is one type or multiple types. In addition, a single lane can be used as the transport mechanism, and a plurality of shuttles can be used.

The transport rail may comprise a pair of opposing guide rails, and each guide rail may have a member receiver for receiving the supplied member when the shuttle descends. Thus, by having the member receiver, it is possible to stably arrange the member to be supplied on the conveying rail.

The gap between the guide rails can be expanded and contracted between the pair of guide rails. When the gap is widened, the material to be supplied or the shuttle can be raised and lowered between the guide rails. It is preferable to have In this way, if the guide rail interval can be expanded or reduced, the shuttle or the supplied member can be raised and lowered without being hindered by the guide rail by increasing the guide rail interval. Moreover, if the distance between the guide rails is reduced, it becomes possible to receive the supplied member by the guide rails.

It is preferable that the transport mechanism performs supply transport for supplying the supplied member from the upstream side to the shuttle, and carry-out transport for transporting the supplied member on which the workpiece has been mounted to the downstream side.

The shuttle may have a heating mechanism for heating the supplied member. With such a heating mechanism, the substrate can be heated, and when the work is to be adhered to the supplied member via the back adhesive, the work can be adhered quickly and stably.

In the die bonder of the present invention, the workpiece is a chip of a wafer, and the member to be supplied is a substrate serving as an island portion, which is a portion to be supplied, and is transported to a bonding position, which is a supply position, by using the transport device. Chips are sequentially bonded to the island portion of the substrate.

According to the die bonder of the present invention, the substrate is transported to the bonding position using the transport device. In this case, even if there are a plurality of grades of chips as workpieces, the chips of each grade can be sequentially bonded to the substrate to which the chips of that grade are to be bonded.

A conveying method of the present invention is a conveying method for sequentially conveying each supply target member to a supply position in order to supply a plurality of types of workpieces having different grades to supply target portions of the supply target member for each grade. Supplies supplied materials from the upstream side to a plurality of shuttles of a number corresponding to the grade, and supplies chips of grades to be mounted on the supplied materials to the supplied materials on the shuttles arranged at the supply position. After all the workpieces have been mounted on the supplied member, the loaded member is conveyed downstream and out of the apparatus, and is held by the shuttle upstream of the supply position. A new supplied member is supplied to the empty shuttle by carrying out the supplied member out of the apparatus as a retracted state in which the supplied member is lowered.

According to the conveying method of the present invention, it is possible to supply the workpiece of the grade to be supplied to the supplied member, and after all the workpieces have been mounted on the supplied member, the workpiece that has been completely mounted can be transferred to the supplied member. It can be carried out to the outside of the device on the downstream side. At this time, the supplied member or shuttle for another clade on the downstream side of the supply position is in a retracted state in which the loaded member is stably carried out of the apparatus on the downstream side. be able to. Further, after the unloading, the supplied members or shuttles for other clades on the upstream side of the supply position are in a retracted state in which they descend, and new supplied members can be supplied to the empty shuttle. can.

In the bonding method of the present invention, the workpiece is a chip of a wafer, and the member to be supplied is a substrate serving as an island portion, which is a portion to be supplied. Chips are successively bonded to the island portion of the substrate.

According to the bonding method of the present invention, the substrate is transported to the bonding position using the transport method. In this case, even if there are a plurality of grades of chips as workpieces, the chips of each grade can be sequentially bonded to the substrate to which the chips of that grade are to be bonded.

According to the present invention, it is possible to utilize information on the number of remaining workpieces for each grade in a workpiece supply source (work aggregate) and the remaining number of supplied portions of supplied members, thereby reducing transport loss. It can handle a single type of workpiece or a plurality of types of workpieces, and can improve production efficiency. In addition, a simple lane can be used as a transport mechanism, and a plurality of shuttles can be used. Therefore, the single-lane and multi-shuttle systems are adopted, the transport mechanism can be configured simply, and the simplification of the entire apparatus can be achieved.

FIG. 2 is a simplified block diagram of the transport apparatus of the present invention; 1 is a simplified perspective view of a main part of a conveying device of the present invention; FIG. Fig. 2 shows the relationship between a transport rail, a substrate, and a shuttle, (a) being a simplified diagram of a state in which the substrate is placed on the shuttle, and (b) being a simplified diagram of a state in which the substrate is sucked by the shuttle. . Fig. 2 shows the relationship between the transport rail, the substrate and the shuttle, (a) is a simplified diagram of a state in which the guide rail interval of the transport rail is enlarged, and (b) is a simplified diagram of a state in which the shuttle and the substrate are lowered. is. FIG. 4 is a process diagram showing the transfer method of the present invention, from mounting a first grade work to mounting a second grade work. It is a mounting process drawing of the workpiece|work of the 3rd grade which shows the conveyance method of this invention. 1A shows a substrate transfer process, FIG. 1A is a simplified diagram of a state in which a first grade substrate is arranged at a supply position, and FIG. 1B is a simplified diagram of a state in which a first grade substrate is unloaded. (c) is a simplified diagram of a state in which the next substrate is transported to the supply position, and (d) is a simplified diagram of a state in which a first grade chip is bonded to a first grade substrate. 1A is a simplified diagram of a state in which a first grade chip is bonded to a first grade substrate, and FIG. 1B is a second grade substrate to a second grade substrate. It is a simplified diagram of a state in which chips are bonded, (c) is a simplified diagram of a state in which mounting of a second grade chip is completed and the substrate is unloaded from the apparatus, and (d) is the following. It is a simplified diagram of the state in which the substrate has been transported to the supply position, (e) is a simplified diagram of the state in which the second grade chip is bonded to the substrate for the second grade, and (f) is the state for the third grade. (g) is a simplified diagram of a state in which the third grade substrate is unloaded from the apparatus. 1 is a simplified diagram showing a work; FIG. 4 is a simplified diagram showing the operation of the bonding apparatus; FIG. 1 is a simplified diagram showing the operation of a typical bonding device; FIG. 1 is a simplified diagram showing a wafer; FIG.

An embodiment of the present invention will be described below with reference to FIGS. 1 to 10. FIG.

FIG. 1 shows a simplified block diagram of a conveying apparatus according to the present invention, which conveys a plurality of types of workpieces W (see FIG. 9) of different grades onto supplied members S (see FIG. 10) for each grade. In order to supply to the supply site Sa (see FIG. 10), each supplied member S is sequentially conveyed to the supply position Q (see FIG. 10). Here, as shown in FIG. 9, the work W is a chip 21 cut out from a wafer (work aggregate) 26, and the chips 21 of this wafer 26 have a plurality of grades. In this embodiment, there are three types of grades, and these three types of grades are called first grade, second grade and third grade. Also, in one wafer, there are many first grades, and there are few second grades and third grades. In this case, the number of second grades may be greater than that of third grades, the number of third grades may be greater than that of second grades, or the number of second grades and third grades may be the same.

The supplied member S is a substrate 22 such as a lead frame, and the supplied portion Sa is an eyed portion 22a on the substrate 22, and the chip 21 is bonded to each eyed portion 22a. At this time, a bonding apparatus as shown in FIG. 10 is used. In such a bonding apparatus, a chip (semiconductor chip) 21 cut out from a wafer 26 is picked up by a collet (suction collet) 23 at a pickup position P, and transferred (mounted) to a bonding position Q of a substrate 22 such as a lead frame. It is something to do. The wafer 26 is adhered to a wafer sheet (adhesive sheet 25) attached to a metal ring (wafer ring), and is divided (divided) into a large number of chips 21 by a dicing process.

As shown in FIG. 10, the collet 23 rises above the pickup position P in the direction of the arrow A and lowers in the direction of the arrow B, rises above the bonding position Q in the direction of the arrow C and lowers in the direction of the arrow D, and picks up. Reciprocating movement in the directions of arrows E and F between position P and bonding position Q is allowed. The collet 23 is attached to a bonding head (not shown), and this bonding head is attached to a bonding arm (not shown). Therefore, this bonding arm is controlled by control means (not shown), and the movement of the collet 23 along the arrows A, B, C, D, E, and F is controlled. The control means is, for example, a microcomputer in which a CPU (Central Processing Unit) is centered and a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are interconnected via a bus. The ROM stores programs and data executed by the CPU.

As shown in FIG. 2, the transport device includes transport rails 30 for transporting substrates 22 and shuttles 31 for holding substrates. The transport rail 30 has a pair of parallel guide rails 30a, 30a.

As shown in FIG. 1, there are provided a guide rail expansion/reduction mechanism 35 for expanding/contracting the guide rail interval between the guide rails 30a, 30a, a shuttle transport mechanism 36 for transporting the shuttle 31 along the transport rail 30, and a shuttle 31 ascending/descending mechanism. A shuttle elevating mechanism 37 (moving up and down) is provided. A heating mechanism 38 and a suction mechanism 39 are attached to the shuttle 31 .

As shown in FIGS. 3 and 4, the guide rails 30a, 30a are made of strip-shaped bodies, and are provided with receiving pieces 30a1, 30a1 at their upper facing portions. I can receive it. The guide rail expansion/contraction mechanism 35 can use a known/public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, or a linear guide mechanism. In this guide rail expansion/contraction mechanism 35, the pair of guide rails 30a, 30a approach each other as shown in FIG. are separated from each other, and the board 22 and the shuttle 31 between the guide rails 30a, 30a are displaced so that they can move up and down.

The shuttle 31 is placed via an elevating mechanism 37 on a base (not shown). The substrate reciprocates (reciprocates in one axial direction) along the transport rails 30 via the shuttle transport mechanism 36. In this case, three shuttles 31 are provided and arranged at a predetermined pitch along the reciprocating direction. be done. Further, the lifting mechanism 37 can use a known/public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism, or the like.

In FIG. 3(a), the substrate 22 is placed on the receiving pieces 30a1, 30a1 of the guide rails 30a, 30a, and the shuttle 31 facing the substrate 22 is lowered. In FIG. 3B, the shuttle 31 facing the substrate 22 is lifted, and the substrate 22 is received by the shuttle 31 and separated from the receiving pieces 30a1, 30a1.

In FIG. 4(a), the substrate 22 is received by the shuttle 31, and the space between the guide rails 30a, 30a is open. In FIG. 4(b), the shuttle 31 is lowered and the board 22 is positioned below the receiving pieces 30a1, 30a1 of the guide rails 30a, 30a. In addition, in FIG. 4(b), the gap between the guide rails 30a, 30a is in a closed state.

The shuttle 31 is made of a flat plate having a flat upper surface, and the heating mechanism 38 can be composed of, for example, a heating wire built into the shuttle 31 and a power source for heating the heating wire. However, it is not limited to this, and it may be one using steam or one using induction heating. In other words, any method may be used as long as the member S to be supplied requires heating and the heating method does not adversely affect the member S to be supplied or the work W. FIG. The suction mechanism 39 is composed of, for example, a suction passage provided in the shuttle 31 and a vacuum generator connected to the suction passage. It is As the vacuum generator, a vacuum pump may be used, or an ejector system may be used in which high-pressure air is controlled to be opened and closed and released from a nozzle to a diffuser to generate negative pressure in the diffusion chamber.

Further, the substrate 22 is transported along the transport rails 30 by the substrate transport mechanism 40 . The substrate transfer mechanism 40 has a chuck portion that chucks the substrate 22 and a reciprocating mechanism that reciprocates the chuck portion along the transfer rails 30 . For example, the chuck portion can be composed of an openable and closable chuck claw or the like, and as the reciprocating mechanism, a known or public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism, etc. can be used.

By the way, each mechanism 35 , 36 , 37 , 38 , 39 , 40 is controlled by control means 45 . The control means 45 is, for example, a microcomputer in which a CPU (Central Processing Unit) is connected to a ROM (Read Only Memory), a RAM (Random Access Memory), etc. through a bus. be. The ROM stores programs and data executed by the CPU. Therefore, the control means 45 may constitute the control means of the bonding apparatus.

Next, a method of bonding a chip to the island portion 22a of the substrate 22 using the transfer apparatus configured as described above will be described. First, the most downstream shuttle 31 (hereinafter referred to as the shuttle 31A) is positioned at the bonding position (supply position) Q (see FIG. 2, etc.). Then, the substrate transport mechanism 40 transports the substrate 22 (22A) on which the first grade chip is mounted onto the shuttle 31A.

At this time, the substrate 22 is also transported above the other shuttles 31 (the shuttle 31 in the middle is called the shuttle 31B, and the most upstream shuttle 31 is called the shuttle 31C). That is, the substrate 22 (22B) on which the second grade chip 21 is mounted is transported on the middle shuttle 31B by the substrate transport mechanism 40, and the third grade chip is transported on the uppermost shuttle 31C. The substrate 22 ( 22 C) to be mounted is transported by the substrate transport mechanism 40 . That is, the shuttles 31A, 31B, 31C and the substrates 22A, 22B, 22C are in the state shown in FIG. 7(a).

In this state, as shown in FIG. 5, bonding of the first grade chip 21 is started (step S1). After that, the process proceeds to step S2 to determine whether or not the mounting of the first grade chip 21 is completed (in this case, it is determined whether or not the mounting of the chip on the substrate 22A is completed). If completed in step S2, the process proceeds to step S3 to start bonding the second grade chip 21. FIG. At this time, the substrate 22 on which the first grade chips 21 have been mounted is conveyed downstream along the conveying rails 30 and unloaded from the apparatus. In this case, it is carried out as the state shown in FIG. 7(b). After that, the state shown in FIG. 7(c) is reached, and the next substrate 22A is transferred onto the pallet 31A. At this time, the intermediate shuttle 31B and the substrate 22B sucked by it and the most upstream pallet 31C and the substrate 22C sucked by it are lowered, and the next substrate 22A is transferred on the pallet 31A. No hindrance. After that, it returns to the state shown in FIG. 7D, that is, the state shown in FIG.

If not completed in step S2, the process proceeds to step S4. When bonding the chip 21, after bonding to the row of island portions 22a in the direction orthogonal to the transport direction (longitudinal direction) of the transport rail 30 is completed, the shuttle 31 receiving the bonded substrate 22 is mounted. is moved downstream by a predetermined amount to enable bonding to the next row of island portions 22a.

In step S4, it is determined whether or not the first grade chips 21 remain on the wafer 26 (determines whether or not there are remaining chips). If there are remaining, the process returns to step S2 to continue bonding the first grade chips 21 . In step S4, if there is no remaining board 22, the first grade board 22 is transported downstream along the transport rail to put the first grade board 22 in a retracted state. (Step S5) Namely, the state shown in FIG. 8(a) is changed to the state shown in FIG. 8(b). After that, the process proceeds to step S3, and bonding of the second grade chip 21 is started.

Once the bonding of the second grade chip 21 is started, the process moves to step S6, and it is determined whether or not the mounting of the second grade chip 21 is completed. If completed, the process proceeds to step S7 in FIG. At this time, as shown in FIG. 8(c), the substrate 22 on which the second grade chips 21 have been mounted is transported downstream along the transport rails and out of the apparatus. At the time of this unloading, the state shown in FIG. 4(b) is reached, in which the substrate 22A for the first grade on the downstream side is lowered to a retracted state. The substrate 22B on which the second grade chip 21 has been mounted can be transported downstream without being obstructed by the substrate 22A. In this case, as shown in FIG. 8(d), the next substrate 22B is transported onto the shuttle 31B at the bonding position Q, after which the substrate 22B is sucked by the shuttle 31B, and the chip 21 is ready for bonding. do.

If not completed in step S6, the process proceeds to step S8. Also, when bonding the chips 21 to the substrate 22B for the second grade, after the bonding to the row of island portions 22a (see FIG. 10) in the direction orthogonal to the transport direction (longitudinal direction) of the transport rail 30 is completed, , the shuttle 31 receiving the substrate 22 being bonded is moved downstream by a predetermined amount to enable bonding to the next row of island portions 22a.

In step S8, it is determined whether or not the second grade chips 21 remain on the wafer 26 (determines whether or not there are remaining chips). If there are remaining, the process returns to step S6 to continue bonding the second grade chips 21 . In step S8, if there is no remainder, the second grade board 22 is transported downstream along the transport rail 30, and the first grade board 22A is put into a retracted state as shown in FIG. 8(e). do. After step S9, the process proceeds to step S7 shown in FIG. 6, where bonding of the third grade chip 21 is started in the state shown in FIG. 8(f).

After the bonding of the third grade chip 21 is started, the process moves to step S11, and it is determined whether or not the mounting of the third grade chip 21 is completed. If completed, the process proceeds to step S12. At this time, as shown in FIG. 8(g), the substrate 22C on which the chip 21 has been mounted is brought into a state in which it can be transported downstream, and the substrate 22C is transported (discharged) out of the apparatus. In this case, the board 22C on which the third grade chips 21 have been mounted is transported downstream along the transport rails 30 and carried out of the apparatus. The substrate 22A for the first grade and the substrate 22B for the second grade are in a retracted state in which they are lowered. undisturbed.

In the case of bonding the chips 21 of the third grade as well, after the bonding to the row of island portions 22a (see FIG. 10) in the direction orthogonal to the transport direction (longitudinal direction) of the transport rail 30 is completed, this bonding is performed. The shuttle 31C receiving the substrate 22C being held is moved downstream by a predetermined amount to enable bonding to the next row of island portions 22a.

If the mounting is completed in step S11, the process proceeds to step S12 to determine whether or not this work should be completed.

If the mounting is not completed in step S11, the process proceeds to step S13 to determine whether or not the third grade chips 21 remain on the wafer 26 (determines whether or not there are remaining chips). If there is a remainder, the process returns to step S11 to continue the bonding of the third grade chip 21 . In step S13, if there are no remaining chips, the process proceeds to step S14 to determine whether or not all the chips 21 on the wafer 26 have been picked up. When all the chips 21 have been picked up, the process proceeds to step S15, the wafer 26 at the pickup position is replaced, and the process proceeds to step S1 in FIG.

In step S14, if all the chips 21 have not been picked up, the process proceeds to step S16, where the remaining chips 21 are picked up and bonded. In this case, if the first grade chips 21 remain, the first grade chips 21 are bonded, and if the second grade chips 21 remain, the second grade chips 21 are bonded. , and if a third grade chip 21 remains, the third grade chip 21 is bonded. The bonding operation is continued until all chips 21 are picked up.

In this way, the chips 21 of different grades can be successively bonded to the substrates 22A, 22B and 22C to be mounted, and the substrates 22A and 22B that have been mounted are removed from the apparatus on the downstream side. You can carry it out.

In the conveying apparatus of the present invention, when the supplied member S to which the work W of the highest grade is supplied is conveyed to the supply position Q, the highest grade is sequentially supplied to the supplied portion Sa of the supplied member S. be. Then, when the work W has been completely loaded onto all of the supplied portions Sa of the supplied member S, the supplied member S is carried out downstream, and the supplied member S on which the work W has been completely loaded is moved to the downstream side. A new supply target member S to which a work W of the highest grade (first grade) is supplied is supplied to the supply position Q which has been carried out to and emptied. At this time, the shuttle 31 and the supplied member S on the upstream side of the supply position Q are lowered, and the transportation of the new supplied member S to the supply position Q is not hindered.

Then, the workpieces W of the first grade are sequentially supplied to the supply target portion Sa of the new supply target member S transported to the supply position Q. As shown in FIG. By the way, when the work W has been completely loaded onto all the supplied parts Sa of the supplied member S, the supplied member S is carried out to the downstream side. , for first grade workpieces when the first grade workpiece W in the workpiece supply source (workpiece assembly) is exhausted and workpieces of other grades (second grade and third grade) remain in this workpiece assembly is once conveyed to the downstream side, and the next grade (for example, the second grade) of the supplied member S is conveyed to the supply position Q. After that, the second grade work W in the work aggregate is supplied to the second grade supplied member S. As shown in FIG.

Then, when the loading of the second grade work W on the second grade supplied member S is completed, this supplied member S is carried out downstream. At this time, the shuttle 31 or the supplied member S, which are arranged downstream of the supply position Q, are in a lowered state, so that the downstream delivery of the second grade supplied member S is not hindered. In addition, when the second grade work W in the work supply source (work aggregate) is exhausted before the loading of the second grade work W is completed, and the third grade work W remains in the work aggregate, The supplied material S for the second grade is also conveyed to the downstream side of the supply position Q, and the supplied material S for the third grade is conveyed to the supply position Q.

Then, the workpieces W of the third grade are sequentially supplied to the supplied member S for the third grade. The supply member S is carried out downstream. At this time, the shuttle 31 or the supplied member S, which are arranged downstream of the supply position, are in a lowered state, and do not hinder the downstream delivery of the supplied member S for the third grade. In addition, when the third grade work W in the work supply source (work aggregate) runs out before the loading of the third grade work W is completed, in this case, the work W in the work aggregate runs out, A new work set will be replenished.

Therefore, the first grade supplied member S is returned to the supply position, and the first grade workpiece W is supplied to the first grade supplied member S. After that, when the mounting of the work W is completed, the supplied member S is carried out downstream. In the same way, second grade and third grade workpieces S can be sequentially supplied and carried out to the downstream side in sequence.

Therefore, in this conveying apparatus, it is possible to utilize information on the remaining number of works W for each grade in the work supply source (work aggregate) and the remaining number of supplied parts of the supplied member S, thereby reducing the conveying loss. becomes. Moreover, even if the grade of the work W is one type, it can be handled with a plurality of types, and the production efficiency can be improved. In addition, a simple lane can be used as a transport mechanism, and a plurality of shuttles can be used. Therefore, the single-lane and multi-shuttle systems are adopted, the transport mechanism can be configured simply, and the simplification of the entire apparatus can be achieved.

The transport rail 30 is provided with a pair of guide rails 30a, 30a facing each other. Each of the guide rails 30a, 30a has member receivers 30a1, 30a1 for receiving the supplied member S when the shuttle 31 descends. There may be. By having the member receiver 30a1 in this manner, the supplied member S can be stably arranged on the conveying rail 30. As shown in FIG.

It is preferable that the pair of guide rails 30a, 30a be able to expand and contract the distance between the guide rails. In this way, if the guide rail interval can be expanded or reduced, the shuttle or the supplied member can be raised and lowered without being hindered by the guide rails 30a, 30a by increasing the guide rail interval.

In this embodiment, the transport mechanism 36 performs supply transport for supplying the supplied member S from the upstream side to the shuttle 30 and unloading transport for transporting the supplied member S on which the workpiece W has been mounted to the downstream side. is.

Since the shuttle 30 has a heating mechanism 38 for heating the supply target member S, the substrate can be heated, and when the workpiece W is adhered to the supply target member S via an adhesive, it can be quickly and stably heated. can be glued together.

According to the die bonder of the present invention, the substrate is transported to the bonding position Q using the transport device. In this case, even if the chip 21 as the work W has a plurality of grades, the chip 21 of each grade can be sequentially bonded to the substrate 22 to which the chip 21 of that grade is to be bonded.

The present invention is not limited to the above embodiments, and various modifications are possible. good. In the above-described embodiment, the substrate 22 for bonding the chip 21 cut out from the wafer 26 was used as the supplied member S to be conveyed. Alternatively, it may be a flat plate such as sheet metal. For this reason, the workpiece W to be supplied to the supplied member S is not limited to the chip 21, but is a component corresponding to the supplied member S. Further, if the member S to be supplied is not the substrate 22 and does not require heating, the heating mechanism can be omitted. Although the shuttle transport mechanism 36 integrally transports the three shuttles 31, the shuttle transport mechanism 36 may transport the shuttles 31 independently.

21 chip 22 substrate 22a island portion 30 transport rail 30a guide rail 31 shuttle 35 guide rail expansion/contraction mechanism 36 transport mechanism (shuttle transport mechanism)
37 transport mechanism (shuttle lifting mechanism)
38 heating mechanism 39 adsorption mechanism 40 transport mechanism (substrate transport mechanism)
P Pickup position Q Supply position (bonding position)
S Supply target member Sa Supply target region W Work

Claims (8)

A conveying device for sequentially conveying each supplied member to a supply position in order to supply a plurality of types of works having different grades to a supplied portion of the supplied member for each grade,
A plurality of shuttles that reciprocate along a transport rail in a number corresponding to the grade, a lifting mechanism that lifts and lowers each shuttle, and a transport mechanism that transports each supplied member to the shuttle along the transport rail, The shuttle has an adsorption mechanism that adsorbs the supplied member,
When the material to be supplied is supplied from the upstream side to the shuttle, the shuttle or the material to be supplied on the upstream side of the shuttle to be supplied is in a state of being lowered, preventing the supply from being hindered, and the material to be supplied is moved to the downstream side. 2. A conveying apparatus characterized in that, when the material is to be carried out of the apparatus, the shuttle or the member to be supplied located downstream of the member to be carried out is in a state of being lowered, thereby preventing obstruction of the carrying out. 2. The conveying apparatus according to claim 1, wherein the conveying rails comprise a pair of guide rails opposed to each other, and each guide rail has a member receiver for receiving the supplied member when the shuttle descends. The gap between the guide rails can be expanded and contracted between the pair of guide rails. When the gap is widened, the material to be supplied or the shuttle can be raised and lowered between the guide rails. 3. The conveying device according to claim 2, characterized in that there is a The transport mechanism is characterized in that it performs supply transport for supplying the supplied member from the upstream side to the shuttle, and carry-out transport for transporting the supplied member on which the workpiece has been mounted to the downstream side. 4. The conveying device according to any one of 3. 5. The conveying apparatus according to claim 1, wherein the shuttle has a heating mechanism for heating the member to be supplied. The work is a chip of a wafer, the member to be supplied is a substrate that becomes an island portion that is the part to be supplied, and the conveying device according to any one of claims 1 to 5 is used to supply A die bonder that sequentially bonds chips to an island portion of a substrate transported to a bonding position. A conveying method for sequentially conveying each supplied member to a supply position in order to supply a plurality of types of works having different grades to a supplied portion of the supplied member for each grade, comprising:
Feed material is supplied from the upstream side to a plurality of shuttles of a number corresponding to the grade, and chips of a grade to be mounted on the material to be supplied are placed on the material to be supplied on the shuttle arranged at the supply position. After all the workpieces have been mounted on the supplied member, the loaded member is conveyed downstream and out of the apparatus, and is held by a shuttle or shuttles upstream of the supply position. and supplying a new supply target member to the shuttle that has become empty by carrying out the supply target member to the outside of the apparatus as a retracted state in which the supplied target member is lowered. The workpiece is a chip of a wafer, the member to be supplied is a substrate serving as an island portion which is a portion to be supplied, and the island of the substrate is transported to the bonding position by using the transportation method according to claim 7. A bonding method characterized by sequentially bonding chips to a portion.

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