JP7181680B2 - Semiconductor lead frame, method for manufacturing semiconductor lead frame, and semiconductor lead frame manufacturing apparatus - Google Patents

Description

The present invention relates to a semiconductor lead frame, a semiconductor lead frame manufacturing method, and a semiconductor lead frame manufacturing apparatus on which a semiconductor element is arranged.

2. Description of the Related Art In recent years, semiconductor elements have become highly integrated and the size of the elements has increased. On the other hand, in the case of memory ICs, for example, it is desired to make the package as small as possible for high-density mounting.
Therefore, Patent Document 1 proposes a package structure that can efficiently accommodate a large device.

In the technique described in Patent Document 1, by fixing an element holder made of resin to the surface of the lead frame opposite to the surface on which the semiconductor element is mounted, the semiconductor element can be adhered to the element holder. Have been described. In addition, part of the element holder has the function of fixing the internal leads arranged around the semiconductor element, eliminating the need for an island on which the semiconductor element is placed and metal members such as suspension pins for holding the island. There is also the effect of

However, since the element holder is adhered to the surface opposite to the surface on which the semiconductor element is mounted, the semiconductor sealing body after the semiconductor element is resin-sealed becomes thicker by the thickness of the element holder. There is a problem that it is not easy to store and is contrary to miniaturization and thinning.
In addition, since the element holder made of resin has the property of absorbing moisture, when the semiconductor element is bonded by the FCB (Flip Chip Bonding) method, the soldering temperature reaches a high temperature of 235° C. At this time, the moisture is absorbed by the resin. Moisture evaporates and sometimes increases the internal pressure of the semiconductor sealing body (package), and when the package cracks, the yield decreases.

JP-A-4-106941

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor lead frame technique that enables thinning and downsizing of a semiconductor sealing body.

(1) In the invention according to claim 1, an outer frame portion, outer leads extending from the outer frame portion toward the center and having one end connected to the outer frame portion, and one end connected to the outer lead. a plurality of lead portions having inner leads connected to the other ends; and the projection area along the outer periphery of the projection area of the semiconductor element arranged on the surface of the lead portion on the side where the semiconductor element is arranged. a lead supporting member adhered to at least two sides perpendicular to each other of an annular shape surrounding the semiconductor element, wherein the lead supporting member is bonded to the inner side surface of the lead supporting member adhered to the two sides and the semiconductor element To provide a semiconductor lead frame characterized in that it is adhered so that the side surface of the
(2) The semiconductor lead frame according to claim 1, wherein the lead supporting member has a rectangular annular shape surrounding the outside of the semiconductor element to be arranged. I will provide a.
(3) The invention according to claim 3 provides the semiconductor lead frame according to claim 1, characterized in that the lead support member is L-shaped or U-shaped.
(4) According to the fourth aspect of the invention, the thickness s of the lead supporting member is equal to or less than the height h of the semiconductor element after being arranged. provides a semiconductor leadframe.
(5) According to the fifth aspect of the invention, the lead supporting member is formed of a resin film. A semiconductor leadframe is provided.
(6) In the invention according to claim 6, a plurality of unit leads having the outer frame portion, the lead portion, and the lead support member are continuously formed in a predetermined direction. A semiconductor leadframe according to any one of claims 1 to 5 is provided.
(7) According to the seventh aspect of the invention, there is provided a semiconductor lead frame according to the sixth aspect, characterized in that a plurality of the unit leads are formed in the longitudinal direction of a metal foil reel having a predetermined width. do.
(8) The invention according to claim 8 is characterized in that the metal foil reel on which the plurality of unit leads are formed has sprocket receiving portions formed at predetermined intervals on both sides in the width direction thereof. A semiconductor leadframe according to item 6 is provided.
(9) In the ninth aspect of the invention, the unit leads are formed in a plurality of rows in the width direction. A semiconductor leadframe according to claim 1 is provided.
(10) The invention according to claim 10 provides the semiconductor lead frame according to claim 9, wherein the semiconductor element is mounted face down.
(11) In the eleventh aspect of the invention, there is provided a method for manufacturing a semiconductor lead frame, comprising the step of forming sprocket holes at predetermined intervals along the longitudinal direction on both end sides in the width direction of the long metal foil; a step of forming lead portions at predetermined intervals along the longitudinal direction on the elongated metal foil having the sprocket holes; adhering lead support members to at least two mutually orthogonal sides of an annular shape surrounding the projection area along the outer periphery of the projection area of the semiconductor element to be arranged on the surface of A method for manufacturing a semiconductor lead frame, wherein the step of bonding the lead support member includes bonding such that the inner side surface of the lead support member bonded to the two sides and the side surface of the semiconductor element are in contact with each other. I will provide a.
(12) In the 12th aspect of the invention, there is provided an apparatus for manufacturing a semiconductor lead frame, wherein sprocket holes are press-formed at predetermined intervals along the longitudinal direction on both end sides in the width direction of a long metal foil. 1 pressing part, a second pressing part that press-forms lead parts at predetermined intervals along the longitudinal direction on the long metal foil in which the sprocket hole is formed, and the formed lead part, A lead supporting member is adhered to at least two sides perpendicular to each other of an annular shape surrounding the projection area of the semiconductor element along the outer periphery of the projection area of the semiconductor element, on the surface on which the semiconductor element is arranged. and a supporting member bonding portion that adheres to the two sides of the semiconductor element so that the inner side surface of the lead supporting member bonded to the two sides and the side surface of the semiconductor element are in contact with each other. To provide a semiconductor lead frame manufacturing apparatus to
(13) In the thirteenth aspect of the invention, a sprocket is provided to engage with the formed sprocket hole, and the long metal foil is arranged in the longitudinal direction and the metal foil is arranged at a predetermined interval in the first sprocket. 13. The semiconductor lead frame manufacturing apparatus according to claim 12, further comprising a transfer section for transferring from the press section to the second press section.

According to the present invention, the lead support member is provided on at least two sides perpendicular to each other of the annular shape surrounding the outer circumference of the projected area of the semiconductor element, on the surface of the lead portion on which the semiconductor element is arranged. By bonding, it is possible to reduce the thickness and size of the semiconductor sealing body.
Also, the semiconductor element can be arranged using the inner surface of the adhered lead support member as a guide.

1A and 1B are a plan view and a perspective view showing the configuration of a semiconductor lead frame according to the present embodiment; FIG. 1 is an explanatory diagram of a semiconductor lead frame manufacturing apparatus; FIG. It is explanatory drawing showing the state in the manufacturing process of a semiconductor lead frame. FIG. 4 is an explanatory diagram showing a state in which a semiconductor element is arranged in a semiconductor frame; It is explanatory drawing showing the modification of the lead support member in a semiconductor lead frame. It is explanatory drawing showing the modification of the sprocket receiving part in a semiconductor lead frame.

Preferred embodiments of a semiconductor lead frame, a method for manufacturing the same, and a manufacturing apparatus according to the present invention will be described below.
(1) Outline of Embodiment This embodiment is directed to a semiconductor lead frame 1 to which a semiconductor element is joined by the FCB method, and a plurality of lead portions 40 extending from an outer frame portion 30 toward the center are formed. . A lead support member 50 is adhered to the surface of the lead portion 40 to which the semiconductor element is bonded.
By adhering the lead supporting member 50 to the surface on which the semiconductor element is bonded in this manner, the package to which the semiconductor element 100 is bonded can be made thinner and smaller.

Further, by making the shape of the lead supporting member 50 into a square annular shape surrounding the outer periphery of the semiconductor element, all the lead portions 40 can be supported. Moreover, it can function as a guide hole when arranging the semiconductor element, and it becomes easy to align the positions of the electrodes of the semiconductor element and the inner lead electrodes.
However, the lead support member 50 does not need to hold all the lead portions 40, and has a shape consisting of a part of a rectangular annular shape, for example, at least two sides perpendicular to each other (regardless of whether they are continuous or discontinuous). ) is also possible.

Furthermore, in the semiconductor lead frame of the present embodiment, the lead support member 50 uses a resin film having a thickness s equal to or less than the height h when the semiconductor element is arranged, preferably equal to or less than h/2. As a result, the volume of the entire lead support member 50 can be reduced, and cracks in the semiconductor package can be suppressed.

(2) Details of Embodiment FIG. 1 shows a plan view (a) and a perspective view (b) of a semiconductor lead frame 1 according to this embodiment.
As shown in FIG. 1, a semiconductor lead frame 1 has a long metal foil 10 on which a plurality of unit leads 20 are formed along the longitudinal direction.
The metal foil 10 is formed in a long size on the assumption that it is wound around a reel of approximately 20 to 40 cm in diameter, for example. As shown in FIG. 1A, the width W of the metal foil 10 is the same standard as, for example, a 35 mm film for photography, and is formed in a long shape with a total width W=34.975 mm. Moreover, it is formed in various sizes such as 48 mm and 70 mm as a width according to the target product.
The metal foil 10 of the present embodiment is composed of copper foil, but the type is not particularly limited as long as it is another metal that is commonly used as a substrate material. For example, other than copper (Cu), the metal foil 10 may be made of Cu alloy, Fe alloy, or the like, which is used as a general lead frame material.
The thickness of the metal foil 10 is in the range of 5-400 μm. It is preferably in the range from 20 to 300 μm, particularly preferably in the range from 30 to 250 μm.

The metal foil 10 has a plurality of sprocket holes (functioning as sprocket receiving portions) 11 at predetermined intervals P on both sides in the width direction of the metal foil 10. The sprocket holes (functioning as sprocket receiving portions) 11 engage with sprockets of a manufacturing apparatus, which will be described later, to transfer the metal foil 10. formed. Although the shape of the sprocket hole 11 is a circular through hole, it may be formed by a square through hole.
In the present embodiment, the predetermined interval P (perforation pitch) is formed in accordance with the dimensional standard of 4.75 mm, but this predetermined interval P does not conform to the standard of sprockets and the like used in the mechanism for moving the metal foil 10 in the manufacturing apparatus. Since it is a combined value, it is not limited to this value and can be changed according to the manufacturing apparatus or the like.
The sprocket holes 11 in the present embodiment are formed by punching on both end faces in the width direction of the metal foil 10 .

Each unit lead 20 is formed on the metal foil 10 while being sequentially transferred in the longitudinal direction according to the pitch of the sprocket holes 11 .
Each unit lead 20 includes an outer frame portion 30 and a lead portion 40 formed on the metal foil 10 and a lead support member 50 adhered to the lead portion 40 . The outer frame portion 30 and the lead portion 40 of the unit lead 20 are formed by punching out the metal foil 10 . In this embodiment, the outer frame portion 30 and the lead portions 40 can be formed by various known methods such as etching, although they are formed by punching.

The outer frame portion 30 is formed in a square shape.
The lead portion 40 extends from each side of the outer frame portion 30 toward the center. That is, the number of lead portions 40 corresponding to the number of semiconductor elements to be arranged extends toward positions corresponding to the positions of the electrodes of the semiconductor elements. In this embodiment, as an example, five lead portions 40 are formed from each side of the rectangular outer frame portion 30 toward the center.

The lead portion 40 has an outer lead 41 having one end connected to the outer frame portion 30 and an inner lead 42 having one end connected to the other end of the outer lead 41 and the other end being an open end. Here, the portion of the lead portion 40 that protrudes outside the semiconductor sealing body after the semiconductor element is disposed later and is resin-sealed is referred to as an outer lead 41, and the portion that is buried in the semiconductor sealing body. is called inner lead 42 .
In FIG. 1, the shape of the lead portion 40 is entirely linear, but it may be curved in the direction perpendicular to the line. For example, the lead portions 40 (extending in the longitudinal direction) formed on the left and right sides of the drawing are left open and bent 90 degrees from the middle, and the sides extending in the longitudinal direction of the outer frame portion 30 (sides located up and down in the drawing) are bent. ) is also possible. In this case, it may be bent at the boundary between the outer lead 41 and the inner lead 42, or at the outer lead 41 portion or the inner lead 42 portion.

A resin film such as a PI (polyimide) film is used for the lead support member 50, and is formed in a square ring as shown in FIG.
The lead support member 50 is adhered to the lead portion 40 with an adhesive. As the adhesive, acrylic, epoxy, or polyimide thermosetting adhesives can be used in a semi-cured state, or thermoplastic adhesives such as polyether amide imide can be used.
The thickness s of the lead support member 50 is set to be equal to or less than the height h when the semiconductor element is arranged, and preferably a resin film having a thickness equal to or less than h/2 is used.
As a result, the volume of the entire lead support member 50 can be reduced. As a result, the amount of water absorbed by the lead support member 50 (resin film) can be reduced, and in the solder reflow process when arranging the semiconductor element, pressure rise in the semiconductor sealing body (package) is suppressed and cracks are prevented. can be suppressed.
On the other hand, when the thickness of the lead support member 50 is set to h, the lead support member 50 can be used as a sealing frame for resin-sealing the semiconductor element after FCB.

In this embodiment, in order to further reduce the volume of the lead support member 50, the lead support member 50 is formed in a rectangular ring shape (frame shape) that is 0.05 to 0.1 mm larger than each side of the semiconductor device to be arranged.
The width of the annular portion of the lead support member 50 is selected in the range of 0.1 mm to 2 mm in order to reduce the volume, and is set to about 1 mm in this embodiment. This is because if the width of the annular portion is 0.1 mm or less, the function as a supporting portion for supporting the inner lead 42 cannot be fully exhibited. Also, it becomes difficult to apply an adhesive for fixing the lead support member 50 to the inner lead 42 .

Next, the manufacturing apparatus and manufacturing method for the semiconductor lead frame 1 configured as described above will be described.
FIG. 2 shows the configuration of a semiconductor lead frame manufacturing apparatus 500. As shown in FIG.
As shown in FIG. 2, the semiconductor lead frame manufacturing apparatus 500 includes a feed reel 510 around which a long metal foil 10 (before pressing) with a predetermined width W is wound, a rubber roll 520, and sprocket holes 11 on both sides of the metal foil 10. a first press device 530 for forming, a second press device 540 for press forming the outer frame portion 30 and the lead portion 40 on the metal foil 10, a bonding device 560 for bonding the lead support member 50 to the lead portion 40, and the unit lead 20 is provided with a take-up reel 580 for taking up the metal foil 10 on which is formed.

The semiconductor lead frame manufacturing process by this semiconductor lead frame manufacturing apparatus 500 is as follows.
FIG. 3 shows the manufacturing process of the semiconductor lead frame 1. As shown in FIG.
First, as shown in FIG. 2, a feed reel 510 around which a long metal foil 10 with a predetermined width is wound is set, and the metal foil 10 is sequentially supplied to the first press device 530 in the longitudinal direction. That is, by rotating the rubber rolls 520 sandwiching the metal foil 10 from both sides, the metal foil 10 is pulled out from the feed reel 510 and supplied to the first press device 530 . The supplied metal foil 10 is in an elongated state with a width W as shown in FIG. 3(a).

Next, in the first press device 530, as shown in FIG. 3B, sprocket holes 11 are punched in both side surfaces of the metal foil 10 at predetermined intervals to press form.
The sprocket holes 11 formed in the metal foil 10 are engaged with sprockets (not shown) to transfer the metal foil 10 from the first press device 530 to the second press device 540 at predetermined intervals in its longitudinal direction. Note that sprockets (not shown) function as transfer units, and are used between the first press device 530 and the second press device 540, between the second press device 540 and the bonding device 560, and between the bonding device 560 and the take-up reel. 580 at least one or more locations.

The second press device 540 punches out the metal foil portion between the sprocket holes 11 to form the lead portion 40 by press. In the second press device 540 in this embodiment, each unit lead 20 is press-formed, but it is also possible to collectively press-form a plurality of unit leads 20 . In this case, as shown in FIG. 3(c), the width W of the metal foil 10 is not limited to the case where a plurality of unit leads 20 are press-formed simultaneously in the longitudinal direction while the width direction is one. A plurality of unit leads 20 may be press-formed simultaneously in the width direction, or a plurality (4 or more) of unit leads 20 may be simultaneously press-formed in both the length direction and the width direction.

Next, in the bonding device 560, as shown in FIG. 3D, the lead support member 50 is bonded to the lead portion 40 that has been press-formed.
The bonding device 560 includes an adhesive application section and an adhesive application section (not shown).
In the adhesive applying section, the adhesive is applied to the adhesion area of the lead support member 50 in the lead portion 40 to adhere the lead support member 50 thereto. The area where the adhesive is applied is 0.05 mm to 0.1 mm from the inner lead 42 to the outside of each side of the projected area where the semiconductor element is arranged, and 1 mm according to the width of the lead support member 50. Apply in an area ˜2 mm wide.
Here, as the adhesive to be applied, acrylic, epoxy, or polyimide thermosetting adhesives can be used in a semi-cured state, or thermoplastic adhesives such as polyether amide imide can be used.

At the placement portion of the bonding device 560, the lead support member 50 formed in a rectangular ring shape is gripped by suction, placed on the adhesive-applied region of the lead portion 40, and pressed for bonding.
Note that the bonding device 560 does not apply adhesive to the lead portions 40 , but grips and moves the lead supporting member 50 to which the adhesive has been applied in advance by suction, and adheres the lead portions 40 to predetermined regions. may

Through the above steps, the unit leads 20 are sequentially formed on the long metal foil 10 .
The formed unit leads 20 are successively wound around the take-up reel 580 to form the semiconductor lead frame 1 .

FIG. 4 is an explanatory diagram showing a state in which the semiconductor element 100 is arranged on the semiconductor lead frame 1 of this embodiment.
As shown in this figure, a semiconductor element 100 is soldered to each unit lead 20 of the semiconductor lead frame 1 of this embodiment by FCB.
At this time, since the lead support member 50 is adhered to the surface on which the semiconductor element 100 is arranged, the semiconductor element 100 can be mounted face down. can be done reliably.
In addition, since the inner peripheral surface of the lead support member 50 serves as a guide and each inner lead 42 is supported by the lead support member 50, each inner lead 42 and each corresponding electrode of the semiconductor element 100 are prevented from being displaced from each other. can be adjusted without causing

Next, various modifications of the semiconductor lead frame 1 will be described.
FIG. 5 is an explanatory diagram showing a modified example of the lead support member 50 adhered to each unit lead 20. As shown in FIG.
While the lead support member 50 described with reference to FIG. 1 has a square annular shape, as shown in each modification of FIG. Shape.
For example, the lead support member 51 shown in FIG. 5A has an L-shaped shape that is bisected along the diagonal line of the lead support member 50, and all the lead portions formed on one long side of the outer frame portion 30 are 40 and all the lead portions 40 formed on one short side.

The lead support member 52 shown in FIG. 5(b) is an example of a U-shape, in which the lead portion 40 formed on one short side of the outer frame portion 30 is bonded to the vertical rod portion of the U-shape, and the upper and lower horizontal rods are attached. A part of the lead part 40 formed on the long side of the outer frame part 30 is adhered. In this lead support member 52, the U-shaped upper and lower horizontal rod portions are each bonded to one lead portion 40, but by forming the upper and lower horizontal rod portions longer, a plurality of lead portions can be obtained. It may have a shape that adheres to 40 .

The lead support member 53 shown in FIG. 5(c) is formed in an L shape, and two lead support members 53 are arranged diagonally with respect to each unit lead 20. As shown in FIG. The lead support member 53 has both vertical and horizontal bars shorter than those of the lead support member 51 shown in FIG. A part of the lead part 40 is adhered. The number of lead portions 40 to be adhered is arbitrary, and the lengths of the L-shaped vertical and horizontal bars are set according to the number of adhered leads.

According to each of the modifications shown in FIG. 5, the number of lead portions 40 to be supported is reduced compared to the lead support member 50 formed in a rectangular ring shape, but the lead portions 40 that are hard to deform are used. It is useful in some cases (for example, when the length is short and when the width is wide).
Even in the shape of the lead support members 51 to 53 of each modified example, they function as guides for the semiconductor element 100 by forming them into a shape having at least two sides perpendicular to each other (whether continuous or discontinuous). be able to.

FIG. 6 is an explanatory diagram showing a modification of the sprocket receiving portions formed on both sides of the metal foil 10. As shown in FIG.
Since FIG. 6 illustrates the shape of the sprocket receiving portion, the unit leads 20 formed on the metal foil 10 are not shown.
In the embodiment described with reference to FIG. 1, the case where the sprocket hole 11 is formed as the sprocket receiving portion has been described.
On the other hand, in the modification shown in FIG. 6(a), the sprocket receiving portion 11b is notched so that the end portion of the metal foil 10 is not left. According to this sprocket receiving portion 11b, the width W of the metal foil 10 can be narrowed, or for the same width W, the interval between the sprocket receiving portions 11b on both sides is widened, so that the lead pattern formation area can be widened. As shown in FIG. 6(a), the notch shape of the sprocket receiving portion 11b is formed in a rectangular shape. Other shapes are possible.

In the modification shown in FIG. 6B, projecting sprocket receiving portions 11c are formed on both sides of the metal foil 10 in the width direction. Although the sprocket receiving portion 11c is formed on the back side of the metal foil 10 (the side opposite to the side on which the semiconductor element 100 is arranged), it can also be arranged on the front side. Moreover, although the shape of the sprocket receiving portion 11c is a cylindrical projection, it may be a prismatic projection.
Both modifications of the sprocket receiving portion shown in FIGS. 6(a) and 6(b) are formed with a shape and spacing that match the shape of the transfer portion of the semiconductor lead frame manufacturing apparatus 500. FIG.

As described above, according to the semiconductor lead frame, its manufacturing method, and its manufacturing apparatus of this embodiment, the following effects can be obtained.
(1) In the semiconductor lead frame 1, the lead support member 50 is adhered to the surface of the lead portion 40 of each unit lead 20 on which the semiconductor element is arranged. It is possible to reduce the thickness and size of the semiconductor sealing body.
(2) Since the lead support member 50 bonded to each unit lead 20 has a rectangular annular shape, the lead support member 50 functions as a guide when the semiconductor element 100 is arranged, and the inner leads 42 and the semiconductor element are separated from each other. The position of the electrode can be matched.
(3) Since the volume of the lead supporting members 50 to 53 bonded to each unit lead 20 is small, the amount of moisture absorbed can be reduced. The occurrence can be suppressed.
(4) Since the shape of the lead support member 50 is not the entire surface of the semiconductor element to be FCB, but the rectangular annular shape surrounding the semiconductor element, the amount of resin film used can be reduced, resulting in cost reduction.
(5) Since the semiconductor element can be mounted facedown using the inner surface of the lead support member 50 as a guide, FCB can be reliably performed without requiring a high-precision mounter with image recognition.
(6) Since the lead portion 40 and the semiconductor element are supported by the lead support member 50, a metal die pad and suspension pins are not required, thereby achieving weight reduction.

Reference Signs List 1 semiconductor lead frame 10 metal foil 11 sprocket hole 11b, 11c sprocket receiving portion 20 unit lead 30 outer frame portion 40 lead portion 41 outer lead 42 inner lead 50 to 53 lead support member 100 semiconductor element 500 semiconductor lead frame manufacturing apparatus 510 feed reel 520 rubber roll 530 first press device 540 second press device 560 bonding device 580 take-up reel

Claims (13)

an outer frame;
a plurality of lead portions extending from the outer frame portion toward the center and having outer leads one end connected to the outer frame portion and inner leads one end connected to the other end of the outer lead;
On the surface of the lead portion on which the semiconductor element is arranged, it is adhered to at least two mutually orthogonal sides of an annular shape surrounding the projection area along the outer periphery of the projection area of the semiconductor element to be arranged. a lead support member;
The lead support member is adhered so that the inner side surface of the lead support member adhered to the two sides and the side surface of the semiconductor element are in contact with each other,
A semiconductor lead frame characterized by: 2. The semiconductor lead frame according to claim 1, wherein said lead support member has a rectangular annular shape surrounding an outer side of a semiconductor element to be arranged. The lead support member is L-shaped or U-shaped,
2. The semiconductor lead frame according to claim 1, wherein: The thickness s of the lead support member is equal to or less than the height h of the semiconductor element after being disposed.
2. The semiconductor lead frame according to claim 1, wherein: The lead support member is formed of a resin film,
5. The semiconductor lead frame according to any one of claims 1 to 4, characterized in that: A plurality of unit leads having the outer frame portion, the lead portion, and the lead support member are continuously formed in a predetermined direction.
6. The semiconductor lead frame according to any one of claims 1 to 5, characterized in that: A plurality of the unit leads are formed in the longitudinal direction of the metal foil reel having a predetermined width,
7. The semiconductor lead frame according to claim 6, wherein: The metal foil reel on which the plurality of unit leads are formed has sprocket receiving portions formed at predetermined intervals on both sides in the width direction.
7. The semiconductor lead frame according to claim 6, wherein: The unit leads are arranged in a plurality in the width direction,
9. The semiconductor lead frame according to any one of claims 6 to 8, characterized in that: wherein the semiconductor element is mounted facedown;
10. The semiconductor lead frame according to claim 9, wherein: A method for manufacturing a semiconductor lead frame, comprising:
a step of forming sprocket holes at predetermined intervals along the longitudinal direction on both widthwise end sides of a long metal foil;
a step of forming lead portions at predetermined intervals along the longitudinal direction on the long metal foil having the sprocket holes;
On the surface of the formed lead portion on the side where the semiconductor element is arranged, an annular shape surrounding the projected area of the semiconductor element arranged is at least orthogonal to each other along the outer peripheral edge of the projected area. a step of adhering a lead support member to the two sides of the
In the step of adhering the lead support member, the inner side surface of the lead support member adhered to the two sides and the side surface of the semiconductor element are adhered so as to be in contact with each other.
A method of manufacturing a semiconductor lead frame, characterized by: An apparatus for manufacturing a semiconductor lead frame,
a first press section that press-forms sprocket holes at predetermined intervals along the longitudinal direction on both widthwise end sides of the long metal foil;
a second press unit that press-forms lead portions at predetermined intervals along the longitudinal direction on the long metal foil having the sprocket holes;
On the surface of the formed lead portion on the side where the semiconductor element is arranged, an annular shape surrounding the projected area of the semiconductor element arranged is at least orthogonal to each other along the outer peripheral edge of the projected area. a support member bonding portion for bonding the lead support member to the two sides of the
The support member bonding portion is bonded such that the inner side surface of the lead support member bonded to the two sides and the side surface of the semiconductor element are in contact with each other.
A semiconductor lead frame manufacturing apparatus characterized by: a transfer having a sprocket that engages with the formed sprocket hole for transferring the elongate metal foil in its longitudinal direction at predetermined intervals from the first press section to the second press section; Department and
13. The semiconductor lead frame manufacturing apparatus according to claim 12, comprising:

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