JP2001358281A - Method for producing lead frame fixing tape, and method for taping lead frame - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a lead frame fixing tape, and a corresponding method for taping a lead frame, in which the fixing tape is not deformed during punching and an initially punched part is not wasted as it is when it is large. SOLUTION: In the method for forming a frame-like fixing tape being attached to a specified position of the inner lead of a lead frame in order to secure the inner lead, a small size frame-like fixing tape is punched from a stripe fixing tape material stretched substantially horizontally. Subsequently, a large size frame-like fixing tape is punched to include the region of the fixing tape material where the small size frame-like fixing tape is punched.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a fixing tape for fixing an inner lead portion of a lead frame used in a semiconductor device, and a method for taping a lead frame.

[0002]

2. Description of the Related Art In recent years, with the trend toward higher performance of electronic devices and lighter, thinner and smaller electronic devices, LSIs, as typified by ASICs, have been increasingly integrated and functionalized. Multi-terminal ICs, especially ASICs represented by gate arrays and standard cells, microcomputers, DS
P (Digital Signal Processo)
As a package for providing a user with high cost performance such as r), a plastic QFP (Quad Flat Package) using a lead frame has become mainstream, and has now been put to practical use up to 300 pins or more.

[0003] The QFP uses a single-layer lead frame 810 shown in FIG. 9 (b). As shown in FIG. 9 (a), a semiconductor element 820 is mounted on a die pad 811.
Inner lead 812 with surface treatment such as silver plating
A wire 83 is connected to the tip end and the terminal 821 of the semiconductor element 820.
0, and sealing is performed with a sealing resin 840. Thereafter, the dam bar portion 814 is cut, and the outer leads 81 are cut.
3 is formed into a gull-wing shape. As described above, the QFP has been developed as a structure in which the outer leads 813 for electrically connecting to an external circuit are provided in four directions of the package and which can cope with the increase in the number of terminals. still,
FIG. 9C is a cross-sectional view taken along F1-F2 in FIG. 9B. Single layer lead frame 810 used here
Is made of a metal material having a high electric conductivity and a high mechanical strength, such as a 42 alloy (42% nickel-iron alloy) or a copper alloy, and using a photo-etching method or a stamping method as shown in FIG. ).

However, the speed of signal processing of semiconductor devices has been increased,
Higher functionality has required more terminals. In the QFP, the number of terminals has been increased without reducing the package size by reducing the pitch of the inner leads and the pitch of the outer leads. The external processing of the lead frame was performed by an etching method using photolithography technology for relatively high-definition ones, and was performed by stamping method for other parts. As for the process of further narrowing the lead pitch, a method has been adopted in which the thickness of the lead frame material is reduced and etching is performed to achieve finer processing. Then, the lead frame that has been subjected to external processing is subjected to silver plating in a predetermined area, subjected to washing, drying, etc., and then taping the inner lead portion with a polyimide tape with a fixing adhesive, or as necessary. The tab suspension bar was bent by a predetermined amount to set the die pad portion down.

[0005] In such a lead frame, wire bonding is performed to electrically connect the tip of the inner lead to the terminal of the semiconductor element. The narrowing has progressed, the mechanical strength of the tip of the inner lead has been weakened, and the tip has jumped up during wire bonding work, causing poor contact and the like. In order to avoid this bouncing, or to avoid deformation of the inner leads in other processing steps, handling during transportation, etc., there is a method of performing wire bonding work with the tip of the inner leads fixed with insulating tape. Attempts have been made to attach a rectangular tape 265 as shown in FIG. 4C using a tape using a thermosetting resin as an adhesive, and then heat-set the adhesive portion.

[0006] Furthermore, the miniaturization of the inner lead portion has progressed,
Recently, as shown in FIG.
A connecting tape 717 for connecting the inner leads 712 together and connecting the inner leads 712 to each other is formed and processed into an outer shape, and as shown in FIG. 8B, a fixing tape for fixing the ends of the inner leads 712. After attaching 720, FIG.
As shown in (c), a method of removing the connecting portion 717 by pressing has been adopted. The shape of the connecting portion is not particularly limited, and may be a shape in which the connecting portion and the die pad are directly connected.

[0007] Such a fixing tape is conventionally known as shown in FIG.
The lead frame unit 280 shown in FIG.
As shown in (2), a frame-shaped lead frame (hereinafter, also referred to as a continuous lead frame) 2 is fixed to the frame portion 270A by a connecting portion and is connected in plural at a predetermined pitch.
5A, a taping device as shown in FIG. 5A is used to form a frame-shaped lead frame 470 (27 in FIG. 4).
0) is fed at a predetermined pitch, and for each lead frame alone (equivalent to 280 in FIG. 4), the fixing tape material 460 is applied to the upper mold part (punch part) 410 and the lower mold part (die part). ) 420 is punched into a predetermined shape, and a portion punched into a predetermined shape (this is called a fixing tape 465)
Was thermocompression bonded. FIG. 4 (b) shows FIG. 4 (a) as C
It is the figure seen from one side.

Here, a conventional taping device shown in FIG. 5A will be briefly described below. The lead frame taping device shown in FIG. 5A is a combination of a first punch 411 and a first die 421 which are provided with a predetermined gap in a band-shaped (hoop) fixing tape material 460 and are fitted into a predetermined frame. Holes 461A are formed, and a fixing tape material 460 is further formed.
Are transported at a predetermined pitch in the direction of the thin-line arrow D1, and are provided with a predetermined gap and the second punch 412 and the second die 4 are fitted.
A hole 4 of a predetermined shape larger than the hole 461A in the set of 22
65A is opened, and a frame-shaped band (corresponding to the fixing tape 465) is punched, and the punched frame-shaped band (fixing tape 465) is punched by the second set of punches 412 to form a frame-shaped lead frame 470. It is attached to each lead frame alone (corresponding to 280 in FIG. 4) by thermocompression bonding. When this taping device is used, a plan view of the fixing tape material 460 at the time of punching is as shown in FIG. 5B, and a frame-like shape on which the fixing tape material 460 and the fixing tape 465 are stuck. The positional relationship with the lead frame 470 is shown in FIG.
FIG. 5D shows a part of the plan view of the frame-shaped lead frame 470 to which the fixing tape 465 is attached as shown in FIG. In the taping apparatus shown in FIG. 5A, the punches 411 and 412 are fitted to the dies 421 and 422 by pressing down the upper mold part 410 in a direction indicated by a thick arrow, thereby fixing the tape material 460 for fixing. Then, holes 461A and 465A are opened, respectively. The pitch feed width of the fixing material 460 is usually set to an integral fraction of the center distance L1 between the punch 411 and the punch 412. The pitch feed of the fixing material 460 is as follows.
It is preferable that the fixing tape material 460 be conveyed through the space inside the lower mold 420 so as not to touch the upper and lower surfaces. The attachment of the fixing tape shown in FIG. 5 is usually referred to as temporary attachment, and is performed at a low temperature. After the temporary attachment, the heater block and the third mold are further attached. It is necessary to hold the fixing tape 465 on the lead frame 470 by thermocompression bonding at a high temperature while holding it with a punch (not shown). In some cases, a taping device shown in FIG. I will put the book on. In FIG. 5D, the dotted arrows indicate the transport direction of the frame-shaped lead frame 470, which is a direction orthogonal to the transport direction of the fixing tape material 460.

[0009] However, in the above-mentioned conventional attaching method,
After the fixing tape material 460 contacts the punches 411 and 412 (corresponding to FIG. 7A),
1 and 422 until they come into contact with each other.
Even if 0 is deviated from a predetermined position or is pressed accurately against the die, the fixing tape material 460 is pulled by the punches 411 and 412 at the time of punching (corresponding to FIG. There is a problem that the tape material 460 moves and the accuracy of the sticking position is reduced. In particular, the fixing tape material 460 and the punch 411 (4
It is actually difficult to make the contact in a state of being completely parallel with 12), and the fixing tape material 460 is likely to be misaligned. If the fixing tape material 460 is not parallel, it cannot be punched into a desired frame shape. For this reason, in the conventional bonding method using the apparatus shown in FIG. 5A, the bonding position of the fixing tape 465 is likely to be shifted due to a poor adjustment of the apparatus. When the pasting position shifts in the conventional method, for example, it becomes as shown in FIG. FIG.
6B is different from the state in which the fixing tape 465 is normally adhered to a predetermined position of the lead frame alone shown in FIG. 6A, and the width and the position of the fixing tape 465 are larger depending on the location. different. As a result, the inner leads cannot be fixed sufficiently depending on the location. Alternatively, the fixing tape is stuck to unnecessary portions, resulting in a failure.

Further, in the production of the fixing tape by punching as described above, since the portion which is first hollowed out is not used and is discarded, when an expensive polyimide film is used as the tape material, However, there was a lot of waste and cost was required to be met.

[0011]

As described above, the attachment of the fixing tape for fixing the inner lead portion of the conventional lead frame is caused by the positional movement of the fixing tape material accompanying the vertical movement of the punch. There is a displacement in the punching position of the fixing tape material, and deformation of the punching shape of the fixing tape is unavoidable. This causes a displacement in the attaching position of the fixing tape, which is a problem, and a countermeasure has been required. At the same time, there has been a demand for a method that is not wasted as it is when a portion initially hollowed out is large, as in the related art. An object of the present invention is to provide a method for manufacturing a lead frame fixing tape and a method for taping a lead frame, which can cope with these problems.

[0012]

SUMMARY OF THE INVENTION A method of manufacturing a lead frame fixing tape according to the present invention is to form a frame-shaped fixing tape which is attached to a predetermined position of an inner lead of a lead frame to fix the inner lead. The method, in which a band-shaped fixing tape material stretched almost horizontally, a small-sized frame-shaped fixing tape was punched out, and then a small-sized frame-shaped fixing tape of the fixing tape material was punched out. A large-size frame-shaped fixing tape is punched out so as to include the region. And in the above, each frame-shaped fixing tape is
The inside and the outside thereof are cut and molded substantially together by a mold, respectively. Further, in the above, the die is provided with a punch for punching and a die for punching out on the upper side, and a die for punching out and a punch for punching out on the lower side. Die and punch for outside punching are integrated,
It is characterized in that the punching is performed continuously and quickly. Further, in the above, each of the stamped frame-shaped fixing tapes is, for each of the same size, integrated so that its cross section is substantially overlapped on the same guide rod as the inner shape of the fixing tape. It is assumed that.

According to the lead frame taping method of the present invention, a band-shaped fixing tape material stretched substantially horizontally is formed into a frame shape, punched out, and attached to a predetermined position of the inner lead of the lead frame. And a method of taping a lead frame as a fixing tape for fixing inner leads, wherein (a) a band-shaped fixing tape material stretched substantially horizontally is fixed to a small-sized frame-shaped fixing tape. After punching out, a punching step of punching out a large-size frame-shaped fixing tape so as to include the area where the small-sized frame-shaped fixing tape of the fixing tape material is punched out, and (b) punching out Each of the frame-shaped fixing tapes is overlapped for each same size so that the cross section thereof fits on the guide rod which is almost the same as the inner shape of the fixing tape. To an integrated process, it is characterized in that to perform (c) an integrated fixing tape pasted on the lead frame, attaching process. Alternatively, the taping method of the lead frame of the present invention is a method in which a band-shaped fixing tape material stretched substantially horizontally is formed into a frame shape, punched out, and attached to a predetermined position of the inner lead of the lead frame, After punching out a small-sized frame-shaped fixing tape, a band-shaped fixing tape material stretched almost horizontally by a taping method of a lead frame as a fixing tape for fixing the inner lead,
In order to include the area where the small-sized frame-shaped fixing tape of the fixing tape material has been punched out, and further punch out the large-sized frame-shaped fixing tape, the punching process is performed. The present invention is characterized in that an attaching step is carried out in which each of the frame-shaped fixing tapes is transported and attached to a predetermined position of a corresponding lead frame. And, in the above, each of the frame-shaped fixing tapes is characterized in that the inside and outside thereof are cut and molded substantially together with a mold, and the mold is , Equipped with a hollow punch and a hollow die on the upper side, a hollow die and a hollow punch on the lower side, and a hollow die and a hollow punch integrated with one another. , And is characterized in that the outside is continuously and quickly performed.

[0014]

According to the method for manufacturing a lead frame fixing tape of the present invention, by adopting such a structure, deformation of the punching shape of the fixing tape which causes displacement of the fixing tape attaching position can be prevented. It is possible to provide a method for manufacturing a fixing tape which is not wasted as it is and which is advantageous in cost, in a method for manufacturing a fixing tape and when a hollow portion is large. Specifically, a method of forming a frame-shaped fixing tape, which is attached to a predetermined position of an inner lead of a lead frame and fixes the inner lead, wherein a band-shaped fixing tape material stretched substantially horizontally, After punching a small frame-shaped fixing tape,
By including the area punched out of the small-sized frame-shaped fixing tape of the fixing tape material, further, by punching out a large-sized frame-shaped fixing tape,
More specifically, a punch for punching and a die for punching are provided on the upper side, and a die for punching and a punch for punching are provided on the lower side. And a punch for outside punching are integrated, and the inside and outside of each frame-shaped fixing tape are cut almost together with a mold using a mold that performs continuous blanking and punching out quickly. This is achieved by being formed by molding. Then, the punched frame-shaped fixing tapes are accumulated for each same size so as to be overlapped on a guide rod having a cross section substantially the same shape as the inner diameter. It can be used individually when taken out and pasted to a lead frame. In addition, the conveyance for attaching the fixing tape accumulated in the accumulation section to the lead frame is as follows.
By using a suction-type jig whose position is controlled by adjusting its shape to the guide rod, it can be accurately placed at a predetermined position on the target lead frame, and it can be pasted with accurate positional accuracy. it can.

According to the lead frame taping method of the present invention having such a configuration, as described above,
Using a precisely punched frame-shaped fixing tape, it is possible to attach with accurate positioning accuracy, and if the hollow part is large, it will not be wasted as it is, which is also advantageous in cost And

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view for explaining an example of an embodiment of a method for manufacturing a lead frame fixing tape of the present invention, and FIG. 2 is an example of an embodiment of a lead frame taping method of the present invention. FIG.
1 is a schematic sectional view of a punching device (die). The figure
1. In FIG. 2, for simplicity, the dies (punching devices) 120 and 125 are indicated by solid lines and dotted lines, and move between solid lines and dotted lines as indicated by double-pointed double arrows. . The direction of the dotted arrow indicates the transport direction. 1, 2 and 3, 110 is a fixing tape material, 110A is a hollow portion (scratch portion), 111, 1
12 is a fixing tape, 120 and 125 are molds (also called punching devices), 121 and 125 are guides, 150 and 1
55 is an accumulation unit, 151 and 156 are guide rods, 152 and 1
57 is a support part, 153 is a ball screw, 160 and 165 are continuous lead frames, and 161 and 166 (for one)
Lead frame area, 310 is an upper die, 311 is a punch for punching out, 312 is a die for punching out, 313 is a tape receiving portion for fixing, 320 is a lower die, 321 is a punch for die punching and punching out, 322 is a strip section, and 350 is a cradle.

First, an embodiment of a method for manufacturing a lead frame fixing tape according to the present invention will be described with reference to FIGS. In this example, a polyimide tape continuous in a strip shape is used as a raw material of a lead frame fixing tape, and then, two types of fixing tapes of a small rectangular shape and a large size are punched out by a die (punching device). And a method for producing a lead frame fixing tape.
While intermittently transporting the belt-like fixing tape material 110 stretched substantially horizontally, the fixing tape 111 having a small size in the form of a rectangular frame is stuck in a mold (punching device) 12 in a stationary state.
After performing the first inner blanking step of punching and manufacturing according to 0, the fixing tape material 110 includes a region where a small-sized rectangular frame-shaped fixing tape is punched out, and further, a large-sized square frame-shaped fixing is performed. A second inner punching step of punching and manufacturing the tape 112 for use with a die (punching device) 125 is performed. Mold (punching device)
The quadrangular frame-shaped fixing tapes 111 and 126 produced by 120 and 125 are conveyed, respectively, and
At 0 and 155, they are integrated. To be described later (shown in FIG. 3)
Using the punching die, in the state shown in FIG. 3A, only the upper die 310 is moved, and the fixing tape is stacked on the collecting units 150 and 155.

As shown in FIG. 1B, the stacking section 150 places a slip sheet 180 having substantially the same shape as the fixing tape 111 on a guide rod 151 having a cross section inside the square frame-shaped fixing tape 111. In the meantime, fixed tape 111, slip sheet 1
The layers 80 are stacked so as to be fitted with each other. In this example, the die (punching device) 120 punches out the polyimide tape and carries the fixing tape to the stacking unit. Similarly, the stacking section 155 is also stacked so as to fit the fixing tape 112 and the slip sheet, and is stacked.

Next, the dies (punching devices) 120 and 125 used in this embodiment will be briefly described with reference to FIG. The dies (punching devices) 120 and 125 are
In each case, the main part has a structure as shown in FIG. Hereinafter, the operation will be briefly described. The upper die 310 includes a punch 311 for punching, a die 312 for punching,
A fixing tape receiver 313 is provided, and the lower mold 310 is provided with a punch 321 and a strip portion 322 for punching out and punching out, and punching is performed continuously by punching out and punching out. , Quickly and almost together.
Due to the pressure of the press unit (not shown), the punch 311 for punching and the die 312 for punching are lowered together, and the punch 311 for punching is slightly higher than the die 312 for punching. The strip portion 322 is pressed down at the same time as the upper surface of the substantially flat lower mold 320, and at the same time, a punching portion 311 and a punching die 321 for punching out the hollow portion (scratch portion) Punch out).
Next, the outside of the fixing tape is punched with a punch 321 for punching and punching out inside and a die 312 for punching out, and the fixing tape is formed by punching. Then
When the upper mold 310 and the lower mold 320 are released, the fixing tape 11 (112) produced by punching is formed by the punch 311 for punching and the die 312 for punching below the fixing tape receiver 313. Is held so as to fit into the groove. This state is shown in FIG. In this state, only the upper mold 310 can be moved to a predetermined position, the fixing tape receiver 313 can be moved downward, and the fixing tape can be pushed out and placed at the predetermined position. For example, as shown in FIG. 3 (b), it is also possible to use the receiving stand 350 and paste it on a predetermined position of the continuous frame 160 (165). In the case of this method, the punching (inside punching) of the inner part and the punching (outer punching) of the outer side of one fixing tape are cut almost simultaneously with one die, and FIG.
The punching accuracy is not deteriorated unlike the conventional punching device (die) that performs the blanking and the blanking separately as shown in FIG.

Next, an embodiment of a lead frame taping method according to the present invention will be described with reference to FIG. In this example, the die (punching device) shown in FIG. 3 is used as in the method of manufacturing the lead frame fixing tape shown in FIG.
After the fixing tape is punched out using the tapes 120 and 125, as shown in FIG. 3B, the mold 310 is moved to a predetermined position of the continuous lead frames 160 and 165 in the state shown in FIG. Is moved, and at a predetermined position, the fixing tape receiver 313 is lowered, and the fixing tapes 111 and 112 are moved.
(Temporary pasting). In this example, so as to be along the conveying direction of the fixing tape material 110,
The continuous lead frames 160 and 165 are attached while being intermittently transported.
In some cases, the conveying direction of the fixing tape material 110 and the continuous lead frame may be vertically intersected.

As another example of the embodiment of the method of taping a lead frame according to the present invention, as shown in FIG. 1, a fixing tape formed by punching is stacked on stacking sections 150 and 155 and then fixed. Take out the tapes one by one,
A mode in which the fixing tape is attached to a predetermined position of the lead frame can also be given. The transport of the fixing tapes 111 and 112 from the stacking units 150 and 155 has a suction head adapted to the shape of the fixing tapes 111 and 112.
The suction can be performed by the position-controlled suction unit, and the attachment (temporary attachment) of the fixing tape can be performed with high positional accuracy.

[0022]

According to the present invention, as described above, when the fixing tape is punched, its shape is not deformed, and when the portion which is initially hollowed out is large as in the prior art, it is not wasted. Thus, it has become possible to provide a method of manufacturing a lead frame fixing tape and a corresponding method of taping a lead frame. Thereby, the taping work can be made more efficient and cost can be reduced, and the pitch of the inner leads can be reduced and mass production can be supported.

[Brief description of the drawings]

FIG. 1 is a schematic view for explaining an example of an embodiment of a method for manufacturing a lead frame fixing tape of the present invention.

FIG. 2 is a schematic diagram for explaining an example of an embodiment of a lead frame taping method according to the present invention;

FIG. 3 is a schematic sectional view of a punching device (die).

FIG. 4 is a view for explaining a frame-shaped lead frame;

FIG. 5 is a view for explaining a conventional taping device and taping method.

FIG. 6 is a diagram for explaining a displacement of a taping;

FIG. 7 is a view for explaining a cause of occurrence of a positional deviation of taping;

FIG. 8 is a partially enlarged view for explaining taping of a lead frame having a connecting portion.

FIG. 9 is a diagram of a single-layer lead frame and a semiconductor device using the same.

[Explanation of symbols]

110 fixing tape material 110A hollow portion (scratch portion) 111, 112 fixing tape 120, 125 die (also referred to as punching device) 121, 126 guide 150, 155 stacking portion 151, 156 guide rod 152, 157 support portion 153 Ball screw 160, 165 Lead frame 161, 166 (for one) Lead frame area 310 Upper die 311 Punch for punching 312 Die for punching 313 Fixing tape receiving part 320 Lower die 321 Die for punching External punch 322 Strip portion 350 Receiver 265 Fixing tape 270 Frame-shaped lead frame (also referred to as continuous lead frame) 270A frame 280 Lead frame (single unit) 281 Die pad 282 Inner lead 283 Outer lead 2 84 Dam bar 285 Frame 310 Upper die 311 Punch for punching 312 Die for punching 313 Fixing tape receiving part 320 Lower die 321 Die for punching and punching for punching outside 322 Strip part 350 Receptacle 410 Upper die part 411, 412 Punch 420 Lower mold part 421, 422 Die 430 Heater block 460 Fixing tape material 461 Cutout 461A, 465A Hole 465 Fixing tape 470 Frame lead frame (also referred to as continuous lead frame) 481 Die pad 711 die pad 711A tap hanging lead 712 inner lead 717 connecting portion 720 insulating tape 800 semiconductor device 810 (single layer) lead frame 811 die pad 811A tap hanging lead 812 inner lead 813 outer lead 814 Dam bar 815 Frame (frame) 820 Semiconductor element 821 Electrode (pad) 830 Wire 840 Sealing resin

Claims (8)

[Claims] 1. A method for forming a frame-shaped fixing tape which is attached to a predetermined position of an inner lead of a lead frame and fixes the inner lead, wherein the fixing tape material is a belt-like fixing tape stretched substantially horizontally. After punching out the small-sized frame-shaped fixing tape, include the area where the small-sized frame-shaped fixing tape of the fixing tape material has been punched out, and further, fix the large-sized frame-shaped fixing tape. A method for producing a lead frame fixing tape, which is punched. 2. The fixing tape according to claim 1, wherein each of the frame-shaped fixing tapes has an inner side and an outer side formed by a mold.
A method for producing a tape for fixing a lead frame, wherein the tape is cut and molded substantially together. 3. The mold according to claim 2, wherein the die includes a punch for punching and a die for punching on the upper side, and a die for punching and a punch for punching on the lower side. A method for producing a lead frame fixing tape, characterized in that a die for punching and a punch for punching are integrated, and punching and punching are performed continuously and quickly. 4. The fixing tape according to any one of claims 1 to 3, wherein each of the stamped frame-shaped fixing tapes has a cross section substantially the same as the inner shape of the fixing tape for each same size. A method for producing a lead frame fixing tape, wherein the tape is integrated so as to overlap a guide rod. 5. A band-shaped fixing tape material stretched substantially horizontally, formed into a frame shape, punched out, and adhered to a predetermined position of an inner lead of a lead frame to fix the inner lead. A method for taping a lead frame as a fixing tape, comprising: (a) punching out a substantially horizontal band-shaped fixing tape material into a small-sized frame-shaped fixing tape, and then fixing the tape. A punching step of punching out a large-sized frame-shaped fixing tape so as to include an area where a small-sized frame-shaped fixing tape has been punched out of the material; and (b) each of the punched-out frame-shaped fixing tapes For each of the same size,
Stacking and stacking so that the cross section fits on the same guide rod as the inner shape of the fixing tape,
(C) A method for taping a lead frame, comprising: attaching an integrated fixing tape to a lead frame; and performing an attaching step. 6. A strip-shaped fixing tape material stretched substantially horizontally, formed into a frame shape, punched out, and attached to a predetermined position of an inner lead of a lead frame to fix the inner lead. By taping the strip-shaped fixing tape material that is stretched almost horizontally by the taping method of the lead frame used as the fixing tape, the small-sized frame-shaped fixing tape is punched, and then the small-sized frame shape of the fixing tape material is cut out. Including the area punched out of the fixing tape of
Furthermore, it punches out a large-sized frame-shaped fixing tape, and has a punching step.After the punching, each punched frame-shaped fixing tape is conveyed to a corresponding position on the corresponding lead frame. A method for taping a lead frame, comprising: performing a bonding step. 7. The fixing tape according to claim 5, wherein each of the frame-shaped fixing tapes has an inner side and an outer side formed by a mold.
A lead frame taping method characterized by being cut and molded substantially together. 8. The mold according to claim 6, wherein the mold includes a punch for punching and a die for punching on the upper side, and a die for punching and a punch for punching on the lower side. In addition, the die for punching and the punch for punching are integrated,
A taping method for a lead frame, characterized in that punching is performed continuously and quickly.