JP6806753B2 - Cover tape and packaging for electronic components - Google Patents

Description

The present invention relates to cover tapes and packaging for electronic components.

As a method of transporting electronic components, a taping reel method is known in which electronic components are packaged in a packaging material and transported. In this taping reel method, an electronic component is inserted into a carrier tape in which a pocket for storing the electronic component is continuously formed, and a package obtained by heat-sealing the cover tape from above is sealed in a reel. It is transported in a rolled state.

Examples of this type of technology include the technology described in Patent Document 1. In the same document, in a bottom cover tape for transporting electronic components in which a support base material layer, a heat adhesive layer, and an antistatic layer are sequentially laminated, the uneven surface of the antistatic layer derived from fine particles contained in the layer is described. It is described that the surface roughness (Ra) is about 0.1 μm.

JP-A-2015-47817

However, as a result of the examination by the present inventor, it has been found that the cover tape described in Patent Document 1 has room for improvement in terms of adhesion resistance and transparency of electronic components.

As a result of examination by the present inventor, regarding the adhesion resistance and transparency of electronic components in the cover tape, the three-dimensional average surface roughness Sa1 on the sealant layer side and the three-dimensional average surface roughness on the base material layer side constituting the cover tape It was found that it can be appropriately controlled by using Sa2 as a guideline. As a result of further diligent research based on such findings, it was found that by setting Sa1 / Sa2 within an appropriate numerical range, the adhesion resistance and transparency of electronic components in the cover tape are improved, and the present invention is completed. I came to do it.

According to the present invention
A cover tape provided with a base material layer and a sealant layer provided on one surface side of the base material layer, and used for sealing a paper carrier tape.
An antistatic layer provided on the surface of the sealant layer is provided.
When the three-dimensional average surface roughness on the sealing surface on the sealant layer side is Sa1, and the three-dimensional average surface roughness on the surface on the base material layer side located opposite to the sealing surface is Sa2,
Sa1 and Sa2 satisfy the following formula (I), and
When the average length of the roughness curve element on the sealing surface on the sealant layer side is Rsm1 and the average length of the roughness curve element on the surface on the base material layer side is Rsm2,
Rsm1 and Rsm2 satisfy the following equation (II).
Cover tape is provided.
2.7 ≤ Sa1 / Sa2 ≤ 13.1 , 0.45 μm ≤ Sa1 ≤ 0.73 μm ... Equation (I)
0. 3 ≤ Rsm1 / Rsm2 ≤ 1. 5 ... Equation (II)

Further, according to the present invention.
A paper carrier tape in which parts storage parts for storing electronic parts are arranged side by side at predetermined intervals, and
A packaging body for electronic components, comprising: a cover tape formed on the paper carrier tape and provided so as to cover the component storage portion.
As the cover tape, a packaging body for electronic components, which is the cover tape described above, is provided.

According to the present invention, there is provided a cover tape having excellent adhesion resistance and transparency of electronic parts, and a packaging body for electronic parts using the cover tape.

It is a figure which shows an example of the cover tape which concerns on this embodiment. It is a figure which shows an example of the cover tape which concerns on this embodiment. It is a figure which shows an example of the package which concerns on this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by the same reference numerals, and description thereof will be omitted as appropriate.

The outline of the cover tape of this embodiment will be described.

FIG. 1 is a cross-sectional view showing an example of the cover tape 10 according to the present embodiment. FIG. 3 is a diagram showing an example of a package 100 in a state where the paper carrier tape 20 is sealed with the cover tape 10 according to the present embodiment.

As shown in FIG. 1, the cover tape 10 of the present embodiment can include a base material layer 1 and a sealant layer 2 provided on one surface side of the base material layer 1.

As shown in FIG. 3, the cover tape 10 of the present embodiment can be used to seal a paper carrier tape (carrier tape 20) having a recess (pocket 21) capable of accommodating electronic components. Such a cover tape 10 can be used as a cover tape for packaging electronic components that can be heat-sealed to the carrier tape 20.

In the cover tape of the present embodiment, when the three-dimensional average surface roughness on the sealing surface on the sealant layer side is Sa1, and the three-dimensional average surface roughness on the surface on the base material layer side located opposite to the sealing surface is Sa2. , Sa1 and Sa2 have a surface shape characteristic that satisfies the following formula (I).
2.0 ≤ Sa1 / Sa2 ≤ 15.0 ... Equation (I)

According to the findings of the present inventor, the three-dimensional average surface roughness Sa1 on the sealing surface (one surface) on the sealant layer side and the three-dimensional average surface roughness on the surface (other surface) on the base material layer side constituting the cover tape. It has been found that the adhesion resistance and transparency of electronic parts in a cover tape can be appropriately controlled by using Sa2, which is a combination of three-dimensional average surface roughness on both side surfaces, as a guideline. As a result of diligent studies based on such guidelines, Sa1 / Sa2 is an appropriate index, and by setting the upper and lower limits of the index within an appropriate numerical range, the resistance of electronic components in the cover tape Adhesion and transparency were found to be improved. That is, by setting Sa1 / Sa2 to the above lower limit value or more, the adhesion resistance of the electronic component can be improved, and by setting Sa1 / Sa2 to the above upper limit value or less, the transparency of the cover tape can be improved.

In the present embodiment, the lower limit of Sa1 / Sa2 is, for example, 2.0 or more, preferably 2.3 or more, and more preferably 2.5 or more. As a result, it is possible to prevent the electronic components housed in the packaging for the electronic components from erroneously adhering to the sealing surface on the sealant layer side of the cover tape. Therefore, the take-out stability of electronic components after transportation can be improved. On the other hand, the upper limit of Sa1 / Sa2 is, for example, 15.0 or less, preferably 14.0 or less, and more preferably 13.5 or less. As a result, the transparency of the cover tape can be enhanced. Therefore, it is possible to stably perform a visual inspection of the electronic components housed in the packaging body for the electronic components via the cover tape.

Since such a cover tape has good adhesion to the paper carrier tape, it can be suitably used for sealing the paper carrier tape.

Further, the cover tape of the present embodiment has Rsm1 when the average length of the roughness curve element on the sealing surface on the sealant layer side is Rsm1 and the average length of the roughness curve element on the surface on the base material layer side is Rsm2. And Rsm2 can have a surface shape characteristic that satisfies the following formula (II).
0.2 ≤ Rsm1 / Rsm2 ≤ 1.9 ... Equation (II)

According to the findings of the present inventor, it has been found that the production stability and the light reflectivity of the cover tape can be appropriately controlled by using Rsm1 / Rsm2 as an index.

In the present embodiment, the lower limit of Rsm1 / Rsm2 is, for example, 0.2 or more, preferably 0.3 or more, and more preferably 0.4 or more. As a result, the decrease in slipperiness of the cover tape can be suppressed, and the occurrence of wrinkles and the like during film formation can be suppressed. Therefore, the manufacturing stability of the cover tape can be improved. On the other hand, the upper limit of Rsm1 / Rsm2 is, for example, 1.9 or less, preferably 1.7 or less, and more preferably 1.5 or less. As a result, the light reflectivity of the cover tape is suppressed, and the deterioration of the visibility of the electronic component after sealing can be suppressed.

In the present embodiment, the Sa1 / Sa2 and Rsm1 / Rsm2 can be controlled by appropriately selecting, for example, the material constituting each layer in the cover tape, the manufacturing method of the cover tape, and the like. Among these, for example, the surface of the sealant layer is provided with surface irregularities by a metal cooling roll or the like, particles such as an organic filler or an inorganic filler are added to the surface of the base material layer, and particles are added. The use of an anti-blocking agent containing silica or the like as an example of the method for performing the above is mentioned as an element for setting the Sa1 / Sa2 and Rsm1 / Rsm2 in a desired numerical range.

In the present embodiment, the sealing surface on the sealant layer side means a surface that is heat-sealed facing the surface of the paper carrier tape. Examples of the sealing surface include the surface of the sealant layer or the surface of another layer laminated on the surface of the sealant layer. When the other layer is an antistatic layer, since the antistatic layer is a thin layer, it has almost no effect on Sa1 and Rsm1 on the surface of the sealant layer.

According to the cover tape 10 of the present embodiment, it is possible to realize the cover tape 10 having excellent adhesion to the paper carrier tape and adhesion resistance to electronic components.

Hereinafter, the configuration of the cover tape 10 of the present embodiment will be described in detail.

As an example of the cover tape 10 of the present embodiment, as shown in FIG. 1, a base material layer 1 and a sealant layer 2 can be provided. The sealant layer 2 may be provided on one surface side of the base material layer 1.

The material constituting the base material layer 1 is used when the sealant layer 2 and other layers are laminated on the base material layer 1 to prepare a cover tape, and the cover tape 10 is adhered to the carrier tape 20. It has enough mechanical strength to withstand the stress applied from the outside when the cover tape 10 is used, and heat resistance enough to withstand the heat history applied when the cover tape 10 is adhered to the carrier tape 20. Is preferable. The form of the material constituting the base material layer is not particularly limited, but it is preferably processed into a film form from the viewpoint of easy processing.

Specific examples of the material constituting the base material layer 1 include polyester resin, polyamide resin, polyolefin resin, polyacrylate resin, polymethacrylate resin, polyimide resin, polycarbonate resin, and ABS resin. And so on. These may be used alone or in combination of two or more. Among these, a polyester resin can be used from the viewpoint of improving the mechanical strength of the cover tape 10. Further, from the viewpoint of improving the mechanical strength and flexibility of the cover tape 10, nylon 6 may be used as a material constituting the base material layer 1. The material constituting the base material layer 1 may contain a lubricant.

The base material layer 1 may be formed by a single-layer film containing the above-mentioned materials, or may be formed by using a multilayer film containing the above-mentioned materials in each layer. Further, the form of the film used for forming the base material layer 1 may be an unstretched film or a film stretched in the uniaxial direction or the biaxial direction, but the cover tape 10 may be used. From the viewpoint of improving the mechanical strength, a film stretched in the uniaxial direction or the biaxial direction is preferable.

The lower limit of the thickness (D2) of the base material layer 1 is, for example, 5 μm or more, preferably 10 μm or more. As a result, the mechanical strength of the cover tape 10 can be improved, so that even when the cover tape 10 is peeled off from the carrier tape 20 at high speed, the cover tape 10 is prevented from being broken. can do. On the other hand, the upper limit of the thickness (D2) of the base material layer 1 may be, for example, 50 μm or less, preferably 40 μm or less, and more preferably 30 μm or less. As a result, the rigidity of the cover tape 10 does not become too high, and even when a torsional stress is applied to the carrier tape 20 after sealing, the cover tape 10 follows the deformation of the carrier tape 20 and peels off. It is possible to suppress the storage.

The total light transmittance of the base material layer 1 is, for example, 80% or more, preferably 85% or more. By doing so, in the package 100, the base material layer 1 can be provided with the necessary transparency so that it can be inspected whether or not the electronic components are correctly housed in the pocket 21 of the carrier tape 20. it can. Therefore, it is possible to visually confirm the electronic components housed inside the package 100 from the outside of the package 100. The total light transmittance of the base material layer 1 can be measured according to JIS K7105 (1981).

The sealant layer 2 of the present embodiment can contain (A) a polyolefin-based resin.

The sealant layer 2 can be composed of a resin composition for forming a sealant layer. The sealant layer 2 is obtained, for example, by extruding a resin composition for forming a sealant layer into a film. When the sealant layer 2 is laminated on the base material layer 1, for example, a method of extruding and laminating the sealant layer forming resin composition on the base material layer 1 can be used.

The polyolefin-based resin (A) may contain a homopolymer or a copolymer having a structural unit derived from an α-olefin such as ethylene, propylene or butene from the viewpoint of reducing the affinity for potential components. .. Such a polyolefin-based resin (A) can include polyethylene or an ethylene copolymer.

As the polyethylene, for example, low density polyethylene can be used.
Examples of the ethylene copolymer include resins such as ethylene-vinyl acetate copolymer, ethylene-aliphatic unsaturated carboxylic acid copolymer, ethylene-aliphatic unsaturated carboxylic acid ester copolymer, and ionomer. .. By using such a resin, the peel strength against the carrier tape 20 can be made suitable.

The copolymer can contain structural units derived from other monomers. As the other monomer, for example, a carboxylic acid or a carboxylic acid derivative; an acrylic acid ester such as methyl acrylate, ethyl acrylate, or butyl acrylate; a meta (acrylic) acid-based monomer such as acrylic acid or methacrylic acid may be used. it can. These may be used alone or in combination of two or more.

In the present embodiment, the thickness of the sealant layer 2 is preferably, for example, 1 μm or more and 30 μm or less, and more preferably 2 μm or more and 20 μm or less. If the thickness of the sealant layer 2 is not more than the above upper limit value, it becomes easier to control the seepage during heat sealing, and if the thickness of the sealant layer 2 is not more than the above lower limit value, the cover is covered. The peel strength of the tape 10 with respect to the carrier tape 20 tends to be suitable.

The base material layer 1 and the sealant layer 2 may contain, for example, an anti-blocking agent, a slip agent, or the like shown below, depending on the intended use.

Examples of the anti-blocking agent include silica, aluminosilicate (zeolite, etc.) and the like. By containing the anti-blocking agent, blocking of the sealant layer 2 is alleviated.

Examples of the slip agent include palmitate amide, stearate amide, behenic acid amide, oleic acid amide, erucic acid amide, oleyl palmido amide, stearyl palmido amide, methylene bisstearyl amide, methylene bisoleyl amide, and ethylene bis. Examples thereof include various amides such as oleyl amide and ethylene bis-erucic acid amide, polyalkylene glycol such as polyethylene glycol and polypropylene glycol, and hydrogenated castor oil. When the sealant layer 2 contains a slip agent, processability such as extrusion processing, roll release property, film slip property and the like are improved.

In addition, the base material layer 1 and the sealant layer 2 described above are various conductive materials, lubricants, plasticizers, antioxidants, ultraviolet absorbers, colorants, various surfactants, inorganic fillers, etc., as long as their characteristics are not impaired. It may contain any additive of. Further, a coating treatment may be applied.

In the present embodiment, when the surface resistivity on the sealing surface on the sealant layer 2 side is R1 and the surface resistivity on the surface on the base material layer 1 side is R2 at 23 ° C. and 50% RH, R1 and R2 are as follows. Equation (IV) can be satisfied.
1.0 × ^10-8 ≦ R1 / R2 ≦ 1.0 × 10 ³・ ・ Equation (IV)

In the present embodiment, the upper limit of the surface resistivity on the sealant layer 2 side at 23 ° C. and 50% RH is preferably 1.0 × 10 ¹² Ω or less, preferably 1.0 × 10 ¹¹ Ω or less. Is more preferable, and 5.0 × 10 ¹⁰ Ω or less is further preferable. Such surface resistivity can be easily achieved by appropriately setting the type and amount of the antistatic agent.
The lower limit of the surface resistivity on the sealant layer 2 side is not particularly limited, but may be, for example, 1.0 × 10 ⁴ Ω or more.

The surface resistivity can be measured by using a surface resistivity measuring device (manufactured by SIMCO) in an environment of a temperature of 23 ° C. and a relative humidity of 50% based on JIS K6911.

Further, as a modification of the cover tape 10 of the present embodiment, another layer may be formed on the sealant layer 2 or on the surface of the base material layer 1 on the side opposite to the sealant layer 2. As the other layer, for example, the conductive layer 3 shown in FIG. 2 can be used. By using such a cover tape 10 for the package 100, the accumulation of static electricity can be suppressed more effectively.

In the present embodiment, when the method of transporting the package 100 containing the electronic components after the bottom surface 20a of the carrier tape and the surface 10a of the cover tape are brought into close contact with each other in the transporting step is adopted, the above-mentioned. The surface of the conductive layer 3 has a possibility of coming into contact with the bottom surface of the carrier tape 20 and causing friction. Even in such a case, the accumulation of static electricity can be suppressed more effectively.

The conductive layer 3 can include, for example, a binder resin such as an aziridinyl compound or a ring-opening compound thereof.
The aziridineyl compound generally refers to a compound having an aziridineyl group, and specific examples thereof include, for example, N, N'-hexamethylene-1,6-bis (1-aziridicarboxyamide), N, N. '-Diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), trimethylpropan-tri-β-aziridinyl propionate, N, N'-toluene-2,4-bis (1-aziridinecarboxyamide) Amide), Triethylene Melamine, Trimethylol Propane-Tri-β (2-Methyl Aziridine) Propionate, Bisisophthaloyl-2-methyl Aziridine, Tri-1-aziridinylphosphine oxide, Tris-1--2- Examples thereof include methyl aziridine phosphine oxide. Further, as the aziridinyl compound, commercially available products such as Chemitite PZ-33 and DZ-22E manufactured by Nippon Shokubai Co., Ltd. can also be used. The ring-opening compound of the aziridinyl compound refers to a compound in which the aziridinyl group in the aziridinyl compound is in a ring-opened state.

The conductive layer 3 can further contain an ester compound. The ester compound refers to a compound produced by combining an organic acid or an inorganic acid with an alcohol by a dehydration reaction, and specific examples thereof include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and the like. Derivatives of These may be used alone or in combination of two or more.

Further, the conductive layer 3 may contain a conductive polymer from the viewpoint of lowering the surface resistance value of the conductive layer 3 and suppressing the generation of static electricity due to friction. Specific examples of the conductive polymer include polyaniline and polypyrrole, and among them, polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) -based compounds can be preferably used.

The conductive layer 3 may contain other materials depending on the purpose, and may include, for example, a surfactant-type antistatic agent, carbon nanotubes, and carbon nanofibers.

As a modification of the cover tape 10 of the present embodiment, for example, an intermediate layer may be provided between the base material layer 1 and the sealant layer 2. As the intermediate layer, for example, a cushion layer capable of absorbing the impact of the cover tape 10 and relaxing the stress can be used. Thereby, the impact resistance and stress relaxation property of the entire cover tape 10 can be improved.

The intermediate layer may contain, for example, an olefin resin or a styrene resin thermoplastic resin. The thermoplastic resin may have a linear or branched chain structure or a cyclic structure. These may be used alone or in combination of two or more. Among these, an olefin resin can be contained from the viewpoint of improving the cushioning property of the entire cover tape.

From the viewpoint of improving the stress relaxation property of the entire cover tape, the thickness of the intermediate layer may be, for example, 10 μm or more and 30 μm or less, preferably 15 μm or more and 25 μm or less.

Further, as a modification of the cover tape 10 according to the present embodiment, for example, an adhesive layer may be provided between the base material layer 1 and the sealant layer 2 or between the base material layer 1 and the conductive layer 3. By doing so, the mechanical strength of the cover tape 10 can be improved.

As the material for forming the adhesive layer described above, for example, various known solvent-based or water-based anchor coating agents such as isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based are used. be able to. These may be used alone or in combination of two or more.

Further, the surface of the base material layer 1 may be subjected to a surface treatment including one or more selected from the group consisting of corona treatment, plasma treatment, flame treatment and primer treatment. Among these, for example, corona treatment can be used. As a result, the adhesion between the base material layer 1 and the sealant layer 2 can be improved.

The lower limit of the total light transmittance of the cover tape 10 of the present embodiment is preferably 80% or more, and more preferably 85% or more. By doing so, in the package 100 composed of the cover tape 10 and the carrier tape 20, the transparency required to the extent that it can be inspected whether or not the electronic components are correctly housed in the pockets of the carrier tape 20. Can be given. In other words, by setting the total light transmittance of the cover tape 10 to the above lower limit value or more, the electronic components housed inside the package composed of the cover tape and the carrier tape can be visually confirmed from the outside of the package. It becomes possible to do. The upper limit of the total light transmittance of the cover tape 10 is not particularly limited, but can be, for example, 100% or less. The total light transmittance of the cover tape can be measured according to JIS K7105 (1981).

The cover tape 10 of the present embodiment has an upper limit of cloudiness measured according to JIS K7105 (1998) measurement method A, for example, 85% or less, preferably 80% or less, and more preferably 75. % Or less. As a result, the transparency of the cover tape 10 can be maintained to such an extent that electronic components can be sufficiently identified and inspected by a sensor or the like. The lower limit of the cloudiness is not particularly limited, but may be, for example, 0% or more.

As an example, the cover tape 10 includes a roll-shaped core material, and the cover tape 10 is wound with the surface on the base material layer 1 side located on the opposite side of the sealing surface as the core material side. It may be a roll-shaped cover tape 10 formed by turning. As a result, transportability and usability can be improved.

The width of the cover tape 10 (width in the direction orthogonal to the extending direction) is, for example, 1 mm or more and 100 mm or less, preferably 2 mm or more and 80 mm or less, and more preferably 3 mm or more and 50 mm or less. The mechanical strength can be increased by setting it to the above lower limit value or more. By setting the value to the upper limit or less, it can be suitably used for a carrier tape having a high accommodating density of electronic components.

The thickness (D1) of the cover tape 10 is, for example, 25 μm or more and 200 μm or less, preferably 30 μm or more and 150 μm or less. The thickness of the cover tape 10 can be appropriately selected according to the width of the cover tape and the like. By setting the value within the above numerical range, the mechanical strength can be maintained even when the narrow cover tape is rolled.

When the thickness of the entire cover tape 10 is D1 and the thickness of the base material layer 1 is D2, D1 and D2 can satisfy the following formula (III).
0.30 ≤ D2 / D1 ≤ 0.60 ... Equation (III)
The D2 / D1 is, for example, 0.30 or more and 0.60 or less, preferably 0.35 or more and 0.55 or less, and more preferably 0.40 or more and 0.50 or less. By setting it within such a numerical range, it is possible to maintain the mechanical strength as well as the flexibility at the time of winding in a roll shape.

Next, the package 100 of the present embodiment will be described.
The packaging body 100 (packaging body for electronic parts) of the present embodiment includes a paper carrier tape (carrier tape 20) in which parts storage portions (pockets 21) for storing electronic parts are formed side by side at predetermined intervals. It can be composed of a component storage tape composed of the above-mentioned cover tape 10 provided so as to cover the component storage portion (pocket 21) formed on the paper carrier tape. The component storage tape constituting the package 100 of the present embodiment may be rewound in a reel shape.

As shown in FIG. 3, the cover tape 10 of the embodiment serves as a lid material for a band-shaped carrier tape 20 in which concave pockets 21 are continuously provided according to the shape of an electronic component. Specifically, the cover tape 10 is configured so that it can be adhered (for example, heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20.

The package 100 of the present embodiment can be used as follows.
First, the electronic components are housed in the pocket 21 of the carrier tape 20. Next, the cover tape 10 is adhered to the surface of the carrier tape 20 by heat sealing so as to cover the entire opening of the pocket 21 of the carrier tape 20, so that the electronic components are sealed and housed in the package 100. To get.
The structure accommodating such electronic components is conveyed to a work area for surface mounting on an electronic circuit board or the like in a state where the package 100 is wound on a paper or plastic reel.
After the structure is conveyed to the work area, the cover tape 10 is peeled off from the carrier tape 20 and the contained electronic components are taken out.

The cover tape 10 of the present embodiment has excellent adhesion to the paper carrier tape (carrier tape 20). Therefore, since the sealed state can be maintained during the transportation of the package 100, the transportation stability can be improved. Further, the cover tape 10 of the present embodiment has excellent adhesion resistance to electronic components. Therefore, after opening the transported package 100, it is possible to maintain a state in which the electronic components can be easily taken out, so that the efficiency of mounting the taken out electronic components on the substrate can be improved and the productivity can be improved. ..

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted.
Hereinafter, an example of the reference form will be added.
1. 1. A cover tape provided with a base material layer and a sealant layer provided on one surface side of the base material layer, and used for sealing a paper carrier tape.
When the three-dimensional average surface roughness on the sealing surface on the sealant layer side is Sa1, and the three-dimensional average surface roughness on the surface on the base material layer side located opposite to the sealing surface is Sa2,
A cover tape in which Sa1 and Sa2 satisfy the following formula (I).
2.0 ≤ Sa1 / Sa2 ≤ 15.0 ... Equation (I)
2. 2. 1. 1. The cover tape described in
When the average length of the roughness curve element on the sealing surface on the sealant layer side is Rsm1 and the average length of the roughness curve element on the surface on the base material layer side is Rsm2,
A cover tape in which Rsm1 and Rsm2 satisfy the following formula (II).
0.2 ≤ Rsm1 / Rsm2 ≤ 1.9 ... Equation (II)
3. 3. 1. 1. Or 2. The cover tape described in
When the thickness of the entire cover tape is D1 and the thickness of the base material layer is D2,
A cover tape in which D1 and D2 satisfy the following formula (III).
0.30 ≤ D2 / D1 ≤ 0.60 ... Equation (III)
4. 1. 1. ~ 3. The cover tape described in any one of
A cover tape in which the base material layer contains a polyester resin.
5. 1. 1. ~ 4. The cover tape described in any one of
A cover tape in which the sealant layer contains a polyolefin resin.
6. 1. 1. ~ 5. The cover tape described in any one of
A cover tape having a surface resistivity of 1.0 × 10 ⁴ Ω or more and 1.0 × 10 ¹² Ω or less on the sealing surface on the sealant layer side at 23 ° C. and 50% RH .
7. 1. 1. ~ 6. The cover tape described in any one of
It is equipped with a roll-shaped core material.
A roll-shaped cover tape formed by winding the cover tape with the surface on the base material layer side as the core material side.
8. 1. 1. ~ 7. The cover tape described in any one of
A cover tape having a total thickness of 25 μm or more and 200 μm or less.
9. 1. 1. ~ 8. The cover tape described in any one of
A cover tape having a width of 1 mm or more and 100 mm or less.
10. A paper carrier tape in which parts storage parts for storing electronic parts are arranged side by side at predetermined intervals, and
A packaging body for electronic components, comprising: a cover tape formed on the paper carrier tape and provided so as to cover the component storage portion.
The cover tape is 1. ~ 9. A packaging body for electronic components, which is the cover tape according to any one of the above.

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to the description of these Examples.

Each component in Table 1 is shown below.
-PET1: Biaxially stretched polyester film (manufactured by Toyobo Co., Ltd., E7410, antistatic coat)
-PET2: Biaxially stretched polyester film (manufactured by Futamura Chemical Co., Ltd., FE2021, antistatic coat)
-LDPE: Low density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705)
-EVA: Ethylene-vinyl acetate copolymer (manufactured by Tosoh Corporation, Ultrasen 537)
-Surfactant: Nonionic surfactant (Kao Corporation, Electro Stripper TS-7B)
・ CNF: Carbon nanofiber (manufactured by Mitsubishi Materials, CNF-T / Anon)

<Manufacturing of cover tape>
(Example 1)
Low-density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705) as an intermediate layer is extruded to a thickness of 10 μm on a substrate layer of a biaxially stretched polyester film (manufactured by Toyobo Co., Ltd., E7415) having a thickness of 25 μm at an extrusion temperature of 300 ° C. The film was formed in.
Using an extrusion laminator, an ethylene-vinyl acetate copolymer (manufactured by Tosoh Corporation, Ultrasen 537) shown in Table 1 as a sealant layer was further formed on the formed intermediate layer to a thickness of 20 μm at an extrusion temperature of 280 ° C. , A laminated film was obtained.
At that time, the extruded laminated film was sandwiched between a metal cooling roll and a silicon rubber mat roll and taken over. At this time, the metal cooling roll having the surface roughness (Rz) shown in Table 1 was brought into contact with the sealant layer.
Further, a dispersion liquid in which the antistatic agent shown in Table 1 is dispersed with a solid content of 1% by weight (the total amount of the dispersion liquid is 100% by weight) is prepared, and the coating amount after drying with a gravure roll is 0.5 g / m. ^The surface of the sealant layer was coated to form an antistatic layer so as to be No. 2, and the laminated film (cover tape) of Example 1 was obtained.
The surface roughness Rz (μm) of the metal cooling roll was measured according to JIS B 0601.

(Examples 2 to 4)
Examples 2 and 2 are the same as in Example 1 except that the materials and manufacturing conditions shown in Table 1 are adopted for the base material layer, the intermediate layer, the sealant layer, the surface roughness of the metal cooling roll, and the antistatic agent. No. 4 laminated film (cover tape) was obtained.

(Comparative Examples 1 and 2)
Cover tapes of Comparative Examples 1 and 2 were obtained in the same manner as in Example 1 except that the surface roughness (Rz) of the metal cooling roll was changed to the conditions shown in Table 1.

The following evaluations were carried out using the cover tapes of each Example and each Comparative Example obtained as described above.

(Three-dimensional average surface roughness: Sa)
For each cover tape obtained in Examples and Comparative Examples, three-dimensional averaging on the sealing surface on the sealant layer side using an ultra-depth shape measuring microscope (“VK9700” manufactured by KEYENCE CORPORATION) in accordance with JIS B 0601. The surface roughness Sa1 and the three-dimensional average surface roughness Sa2 on the surface on the base material layer side were measured. The unit is μm. The results are shown in Table 1.

(Average length of roughness curve elements: Rsm)
For each cover tape obtained in Examples and Comparative Examples, a roughness curve on the sealing surface on the sealant layer side using an ultra-depth shape measuring microscope (“VK9700” manufactured by Keyence) in accordance with JIS B 0601. The average length Rsm1 of the elements and the average length Rsm2 of the surface roughness curve elements on the base material layer side were measured. The unit is μm. The results are shown in Table 1.

(Surface resistivity)
For each cover tape obtained in Examples and Comparative Examples, the surface on the sealing surface on the sealant layer side using a surface resistivity measuring instrument (manufactured by SIMCO) under an environment of a temperature of 23 ° C. and a relative humidity of 50% based on JIS K6911. The resistivity R1 and the surface resistivity R2 on the surface on the substrate layer side were measured. The unit is Ω. The results are shown in Table 1.

(Cloudiness)
The cloudiness of the cover tapes obtained in Examples and Comparative Examples was measured according to JIS K7105 (1998) measurement method A. The unit is%. The results are shown in Table 1.

(Parts adhesion rate)
The cover tape is attached onto a slide glass so that the sealing surface on the sealant layer side of the cover tapes obtained in Examples and Comparative Examples faces upward, and a metal piece (a metal piece () is placed on the sealing surface on the sealant layer side. A test piece was prepared on which 20 pieces (length: 0.4 mm × width: 0.8 mm × thickness: 0.4 mm) were placed. The obtained test piece was allowed to stand for 24 hours under the conditions of 60 ° C. and 95% RH, and further allowed to stand at room temperature and humidity for 24 hours. Then, with the slide glass inverted, vibration for 20 seconds at 1,500 rpm was applied to the test piece, and then the adhesion ratio was determined from the number of metal pieces adhering to the sealing surface on the sealant layer side of the cover tape. %) Was calculated. The metal piece was obtained by cutting nickel with a precision cutting machine and processing it into a length of 0.4 mm, a width of 0.8 mm, and a thickness of 0.4 mm. The results are shown in Table 1.

(Peeling strength)
Each cover tape obtained in Examples and Comparative Examples was slit to a width of 5.3 mm, and a taping machine (manufactured by Tokyo Wells Co., Ltd .: TWA-6621) was used on the surface of a paper carrier tape (manufactured by Totec). Heat sealing was performed under the conditions of 170 ° C., 4 kg / cm ² , 0.01 seconds, and the peel strength immediately after the heat sealing was measured. The peel strength was measured using a peel tester under the conditions of a peel speed of 300 mm / min and a peel angle of about 180 °. The results are shown in Table 1.
In the case of a paper carrier tape, it can be judged that the adhesiveness is usually good if it is 20 gf or more and 50 gf or less.

In the cover tapes of Examples 1 to 4, it was shown that the component adhesion rate was reduced as compared with Comparative Example 1 and the cloudiness was improved as compared with Comparative Example 2. It was found that the cover tape of No. 4 was excellent in adhesion resistance and transparency of electronic parts. Further, in the cover tapes of Examples 1 to 4, it was shown from the result of the peel strength that the adhesion to the paper carrier tape was good.
Further, the cover tapes of Examples 1 to 4 were heat-sealed on the carrier tape and then wound on a reel to obtain a package for electronic parts wound in a reel shape. In the obtained packaging for electronic parts, good sealing performance has been obtained for excellent adhesion between the paper carrier tape and the cover tape, and while it is possible to inspect the appearance of the internal electronic parts, It was found that the adhesion of electronic components to the cover tape was suppressed by the transport process and the like.

1 Base material layer 2 Sealant layer 3 Conductive layer 10 Cover tape 10a Surface 20 Carrier tape 20a Bottom surface 21 Pocket 100 Package

Claims (9)

A cover tape provided with a base material layer and a sealant layer provided on one surface side of the base material layer, and used for sealing a paper carrier tape.
An antistatic layer provided on the surface of the sealant layer is provided.
When the three-dimensional average surface roughness on the sealing surface on the sealant layer side is Sa1, and the three-dimensional average surface roughness on the surface on the base material layer side located opposite to the sealing surface is Sa2,
Sa1 and Sa2 satisfy the following formula (I), and
When the average length of the roughness curve element on the sealing surface on the sealant layer side is Rsm1 and the average length of the roughness curve element on the surface on the base material layer side is Rsm2,
Rsm1 and Rsm2 satisfy the following equation (II).
Cover tape.
2.7 ≤ Sa1 / Sa2 ≤ 13.1 , 0.45 μm ≤ Sa1 ≤ 0.73 μm ... Equation (I)
0. 3 ≤ Rsm1 / Rsm2 ≤ 1. 5 ... Equation (II) The cover tape according to claim 1.
When the thickness of the entire cover tape is D1 and the thickness of the base material layer is D2,
A cover tape in which D1 and D2 satisfy the following formula (III).
0.30 ≤ D2 / D1 ≤ 0.60 ... Equation (III) The cover tape according to claim 1 or 2.
A cover tape in which the base material layer contains a polyester resin. The cover tape according to any one of claims 1 to 3.
A cover tape in which the sealant layer contains a polyolefin resin. The cover tape according to any one of claims 1 to 4.
A cover tape having a surface resistivity of 1.0 × 10 ⁴ Ω or more and 1.0 × 10 ¹² Ω or less on the sealing surface on the sealant layer side at 23 ° C. and 50% RH. The cover tape according to any one of claims 1 to 5.
It is equipped with a roll-shaped core material.
A roll-shaped cover tape formed by winding the cover tape with the surface on the base material layer side as the core material side. The cover tape according to any one of claims 1 to 6.
A cover tape having a total thickness of 25 μm or more and 200 μm or less. The cover tape according to any one of claims 1 to 7.
A cover tape having a width of 1 mm or more and 100 mm or less. A paper carrier tape in which parts storage parts for storing electronic parts are arranged side by side at predetermined intervals, and
A packaging body for electronic components, comprising: a cover tape formed on the paper carrier tape and provided so as to cover the component storage portion.
The cover tape is a package for electronic parts, which is the cover tape according to any one of claims 1 to 8.

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