JP6872450B2 - レーザ変位計と、それを用いたレーザ超音波検査装置 - Google Patents
レーザ変位計と、それを用いたレーザ超音波検査装置 Download PDFInfo
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- JP6872450B2 JP6872450B2 JP2017143145A JP2017143145A JP6872450B2 JP 6872450 B2 JP6872450 B2 JP 6872450B2 JP 2017143145 A JP2017143145 A JP 2017143145A JP 2017143145 A JP2017143145 A JP 2017143145A JP 6872450 B2 JP6872450 B2 JP 6872450B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
- G01H9/004—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means using fibre optic sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
- G01H9/008—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0078—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for frequency filtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/069—Supply of sources
- G01N2201/0696—Pulsed
- G01N2201/0697—Pulsed lasers
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- Analytical Chemistry (AREA)
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- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Acoustics & Sound (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
(1)図7に示した、多波長レーザ用電源ユニット36から供給する電流を制御し、各多波長レーザの光出力を調整することで感度を補正する。
(2)各光学フィルタ21の透過率を調整することで感度を補正する。
(3)図7に示した、ナイフエッジ型光検出器12の電気信号増幅器38の増幅度を調整することで感度を補正する方法がある。感度を補正することで、各検出器からの真の信号強度レベルを得ることができる。
Claims (5)
- 対象物からのレーザ光の反射光を検出することで前記対象物に生じる変位を計測するレーザ変位計であって、
複数の異なる波長の光を出射する複数のレーザを備えたレーザアレイ光源部と、
レーザ光を集光する複数のレンズを備えたレンズアレイ部と、
前記レーザ光が前記対象物で反射して得られる反射光を集光する複数の集光レンズを備えた反射光用レンズアレイ部と、
集光された反射光を選択して透過する複数の光学フィルタを備えた光学フィルタアレイ部と、
前記光学フィルタを透過した光を検出する複数の光検出器を備えた光検出器アレイ部とを有し、
前記レーザアレイ光源部は、半導体レーザであり、
前記レーザアレイ光源部は、ガイド光として用いるため複数のレーザの波長を可視域としたことを特徴とするレーザ変位計。 - 対象物からのレーザ光の反射光を検出することで前記対象物に生じる変位を計測するレーザ変位計であって、
複数の異なる波長の光を出射する複数のレーザを備えたレーザアレイ光源部と、
レーザ光を集光する複数のレンズを備えたレンズアレイ部と、
前記レーザ光が前記対象物で反射して得られる反射光を集光する複数の集光レンズを備えた反射光用レンズアレイ部と、
集光された反射光を選択して透過する複数の光学フィルタを備えた光学フィルタアレイ部と、
前記光学フィルタを透過した光を検出する複数の光検出器を備えた光検出器アレイ部とを有し、
前記レーザアレイ光源部は、半導体レーザであり、
ガイド光として用いるため、前記レーザアレイ光源部の両端に配置された2つのレーザの波長は可視域としたことを特徴とするレーザ変位計。 - 請求項1又は請求項2に記載のレーザ変位計において、前記光検出器の感度を補正する手段を有することを特徴とするレーザ変位計。
- 請求項1又は請求項2に記載のレーザ変位計において、前記半導体レーザからの光を、導波する光伝送媒体を有することを特徴とするレーザ変位計。
- 請求項1又は請求項2に記載のレーザ変位計と、超音波を励起する超音波発生部と、前記超音波発生部と前記レーザ変位計との同期を取る制御部と、前記レーザ変位計からの信号に基づいて、画像を作成する画像化装置とを有することを特徴とするレーザ超音波検査装置。
Priority Applications (2)
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JP2017143145A JP6872450B2 (ja) | 2017-07-25 | 2017-07-25 | レーザ変位計と、それを用いたレーザ超音波検査装置 |
US16/005,058 US10247660B2 (en) | 2017-07-25 | 2018-06-11 | Laser displacement meter and laser ultrasonic inspection apparatus using the same |
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JP2017143145A JP6872450B2 (ja) | 2017-07-25 | 2017-07-25 | レーザ変位計と、それを用いたレーザ超音波検査装置 |
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JP2019023593A JP2019023593A (ja) | 2019-02-14 |
JP6872450B2 true JP6872450B2 (ja) | 2021-05-19 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112748113B (zh) * | 2020-12-21 | 2022-08-05 | 杭州电子科技大学 | 一种集成激光测量与超声探伤的测头装置及其测量方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH074909A (ja) * | 1993-06-14 | 1995-01-10 | Fanuc Ltd | レーザセンサ装置 |
US5526338A (en) * | 1995-03-10 | 1996-06-11 | Yeda Research & Development Co. Ltd. | Method and apparatus for storage and retrieval with multilayer optical disks |
JP3735650B2 (ja) * | 1998-12-10 | 2006-01-18 | 株式会社東芝 | 表面検査装置 |
JP2003215111A (ja) * | 2002-01-17 | 2003-07-30 | Mitsubishi Heavy Ind Ltd | レーザ計測用プローブおよびレーザ計測装置 |
US7360853B2 (en) * | 2004-03-04 | 2008-04-22 | Fujifilm Dimatix, Inc. | Morphology-corrected printing |
EP2148197B1 (en) * | 2005-07-07 | 2012-11-28 | Kabushiki Kaisha Toshiba | Ultrasonic laser-based maintenance apparatus |
US7800762B2 (en) * | 2006-09-20 | 2010-09-21 | Lockheed Martin Corporation | Fiber-based mid-infrared generation laser for laser ultrasound inspection |
JP2011017552A (ja) * | 2009-07-07 | 2011-01-27 | Oputouea Kk | 多点変位検出装置 |
US9217731B2 (en) * | 2010-05-21 | 2015-12-22 | Kabushiki Kaisha Toshiba | Welding inspection method and apparatus thereof |
GB2497135A (en) | 2011-12-02 | 2013-06-05 | Univ Nottingham | Optical detector with a plurality of pixel pairs for laser ultrasonic surface inspection |
KR20150027543A (ko) * | 2013-09-04 | 2015-03-12 | 현대모비스 주식회사 | 라이다 센서 시스템 |
US9689740B2 (en) * | 2014-10-15 | 2017-06-27 | The Boeing Company | Diagnostic for spectrally combined laser |
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- 2017-07-25 JP JP2017143145A patent/JP6872450B2/ja active Active
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US20190033201A1 (en) | 2019-01-31 |
US10247660B2 (en) | 2019-04-02 |
JP2019023593A (ja) | 2019-02-14 |
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