JP6865200B2 - Holding device - Google Patents

Description

The techniques disclosed herein relate to holding devices that hold objects.

For example, an electrostatic chuck is used as a holding device for holding a semiconductor wafer in a vacuum chamber of a semiconductor manufacturing device. The electrostatic chuck includes, for example, a ceramic plate-shaped member, for example, a metal base member, a joint portion for joining the plate-shaped member and the base member, and a chuck electrode provided inside the plate-shaped member. The wafer is attracted and held on the surface (adsorption surface) of the plate-shaped member by utilizing the electrostatic attraction generated by applying a voltage to the chuck electrode.

Conventionally, it is known that an elastomer O-ring is arranged on the side surface (outer peripheral surface) of the joint portion that joins the plate-shaped member and the base member as a protective member for protecting the joint portion from plasma. (See, for example, Patent Document 1).

JP-A-2017-208562

In the above-mentioned conventional configuration, since the O-ring constituting the protective member is made of an elastomer, the durability against plasma is not sufficiently high. Further, in the above-mentioned conventional configuration, the O-ring constituting the protective member is not joined to the side surface of the joint portion, but is only pressed against the side surface of the joint portion by the tension of the O-ring. There is a risk that a gap will be created between the side surface of the joint and plasma will enter the gap. Further, in the above-mentioned conventional configuration, since the cross section of the O-ring constituting the protective member is substantially circular, the contact area between the O-ring and the side surface of the joint portion is small, and the side surface of the joint portion is effectively formed by the O-ring. It cannot be covered and the joint may be exposed to plasma. From the above, in the above-mentioned conventional configuration, there is a problem that the joint portion cannot be effectively protected from the plasma existing around the holding device by the protective member.

It should be noted that such a problem is not limited to the electrostatic chuck that holds the wafer by utilizing electrostatic attraction, and includes a plate-shaped member, a base member, and a joint portion, and an object is provided on the surface of the plate-shaped member. It is a common problem in general.

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The holding device disclosed in the present specification includes a plate-shaped member having a first surface substantially orthogonal to the first direction and a second surface opposite to the first surface. , The third surface is arranged so as to be located on the second surface side of the plate-shaped member, and has a coefficient of thermal expansion different from the coefficient of thermal expansion of the plate-shaped member. A joint portion arranged between the base member, the second surface of the plate-shaped member, and the third surface of the base member to join the plate-shaped member and the base member, and the joint portion. In a holding device comprising a first protective member covering the side surface of the plate-like member and holding an object on the first surface of the plate-shaped member, the first protective member is composed of inorganic fibers. It is a first non-woven fabric, and includes the first non-woven fabric bonded to the side surface of the joint portion. In this holding device, the first protective member covering the side surface of the joint includes a first non-woven fabric composed of inorganic fibers. The first non-woven fabric composed of inorganic fibers has high durability against plasma as compared with an elastomer O-ring. Further, since the first non-woven fabric composed of inorganic fibers has high flexibility, it can be bent into a shape that covers the side surface of the joint, and thermal expansion between the plate-shaped member and the base member. It can be placed near the side surface of the joint where the stress due to the difference tends to increase. In this regard, for example, a ceramic sintered plate has high durability against plasma like the first non-woven fabric, but because of its low flexibility, it can be bent into a shape that covers the side surface of the joint. Moreover, it cannot be arranged near the side surface of the joint where the stress due to the difference in thermal expansion between the plate-shaped member and the base member tends to be large. Further, since the first non-woven fabric is a cloth-like member, the side surface of the joint can be effectively covered as compared with the case where an O-ring having a substantially circular cross section is used. Further, in this holding device, since the first non-woven fabric constituting the first protective member is joined to the side surface of the joint portion, a gap through which plasma enters between the first non-woven fabric and the side surface of the joint portion. Can be suppressed from being formed. From the above, according to the present holding device, the joint portion can be effectively protected from the plasma existing around the holding device by the first protective member including the first non-woven fabric.

(2) In the holding device, a first hole penetrating the joint portion in the first direction is opened to the first surface and the second surface of the plate-shaped member. A second protective member for covering the inner peripheral surface of the first hole communicating with the second hole is provided, and the second protective member is a second non-woven fabric composed of inorganic fibers. The configuration may include a second non-woven fabric bonded to the inner peripheral surface of the first hole of the joint portion. The second non-woven fabric composed of inorganic fibers has high durability against plasma. Further, since the second non-woven fabric composed of inorganic fibers has high flexibility, it can be bent into a shape that covers the inner peripheral surface of the hole of the joint portion. Further, since the second non-woven fabric is a cloth-like member, it can effectively cover the inner peripheral surface of the hole of the joint portion. Further, since the second non-woven fabric is bonded to the inner peripheral surface of the hole of the joint portion, a gap through which plasma enters is formed between the second non-woven fabric and the inner peripheral surface of the hole of the joint portion. Can be suppressed. From the above, according to the present holding device, the joint portion can be effectively protected from the plasma that has entered the holes of the joint portion by the second protective member provided with the second non-woven fabric.

(3) In the holding device, the first nonwoven fabric may be arranged between the plate-shaped member and the base member in the first direction. According to this holding device, the first protective member provided with the first non-woven fabric can effectively prevent the joint from being exposed to plasma, and the joint can be separated from the plasma existing around the holding device. Can be effectively protected. Further, since the first non-woven fabric has sufficient flexibility, even if the first non-woven fabric is arranged between the plate-shaped member and the base member, the reaction force of the first non-woven fabric causes the plate-shaped member and the base member. It is possible to suppress the inhibition of the bonding of the non-woven fabric.

(4) In the holding device, the joint portion contains a first resin material, and at least a part of the joint portion on the side surface side of the first non-woven fabric is impregnated with the first resin material. It may be configured. According to this holding device, the presence of the resin material impregnated in at least a part of the first non-woven fabric allows the first protective member including the first non-woven fabric to be satisfactorily adhered to the side surface of the joint, and the holding device. The junction can be more effectively protected from the plasma present around the.

(5) In the holding device, the joint portion may be configured to include a material that is discolored by plasma. According to this holding device, the degree of deterioration of the joint due to the influence of plasma can be easily detected.

(6) In the holding device, the first nonwoven fabric is arranged outside the side surface of the plate-shaped member, and the first protective member is further formed on the side surface of the joint portion and the first one. It may be configured to include a protective joint portion that is located between the non-woven fabric and the first non-woven fabric to be bonded to the side surface of the joint portion. According to this holding device, since the first non-woven fabric is arranged outside the side surface of the plate-shaped member, the first non-woven fabric can be used without affecting the bondability between the plate-shaped member and the base member. The first protective member provided can protect the junction from the plasma present around the holding device.

(7) In the holding device, the protective joint contains a second resin material, and at least a part of the side surface side of the joint in the first nonwoven fabric is impregnated with the second resin material. It may be configured as such. According to this holding device, the presence of the resin material impregnated in at least a part of the first non-woven fabric allows the first protective member including the first non-woven fabric to be satisfactorily adhered to the side surface of the joint, and the holding device. The junction can be more effectively protected from the plasma present around the.

(8) In the holding device, the protective joint may be configured to include a heat-shrinkable resin material. According to this holding device, the protective joint is shrunk by heat, so that the first protective member provided with the first non-woven fabric can be better adhered to the side surface of the joint, and can be placed around the holding device. The junction can be very effectively protected from the existing plasma.

(9) In the holding device, the protective joint may be configured to include a material that is discolored by plasma. According to this holding device, the degree of deterioration of the protective joint due to the influence of plasma can be easily detected.

(10) In the holding device, the elongation of the first nonwoven fabric may be 8% or more. According to this holding device, since the first non-woven fabric has a certain degree of stretchability or more, the first protective member including the first non-woven fabric is provided by the stress due to the difference in thermal expansion between the plate-shaped member and the base member. Can be prevented from peeling from the side surface of the joint, and the joint can be effectively protected from the plasma existing around the holding device for a long period of time.

(11) In the holding device, the Young's modulus of the first nonwoven fabric may be 10 MPa or less. According to this holding device, since the first non-woven fabric has a certain degree of flexibility or more, the stress due to the difference in thermal expansion between the plate-shaped member and the base member causes the first protective member including the first non-woven fabric to have a certain degree of flexibility. The peeling from the side surface of the joint can be suppressed, and the joint can be effectively protected from the plasma existing around the holding device for a long period of time.

The technique disclosed in the present specification can be realized in various forms, for example, a holding device, an electrostatic chuck, a vacuum chuck, a manufacturing method thereof, and the like. is there.

It is a perspective view which shows schematic appearance structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows typically the XZ cross-sectional structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows typically the XY cross-sectional structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows the detailed structure around the side surface 31 of a joint part 30. It is explanatory drawing which shows the detailed structure around the inner peripheral surface 32 of the hole 36 formed in the joint part 30. It is explanatory drawing which shows the state in which the joint portion 30 and the side surface protection member 110 are strained. It is explanatory drawing which shows typically the XZ cross-sectional structure of the electrostatic chuck 100a of 2nd Embodiment.

A. First Embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 3 is an explanatory view schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the positions III-III of FIG. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the electrostatic chuck 100 is actually installed in a direction different from such a direction. May be done.

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a semiconductor wafer W) by electrostatic attraction, and is used for fixing the wafer W in a vacuum chamber of a semiconductor manufacturing device, for example. The electrostatic chuck 100 includes a plate-shaped member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The plate-shaped member 10 and the base member 20 are arranged so that the lower surface S2 (see FIG. 2) of the plate-shaped member 10 and the upper surface S3 of the base member 20 face each other in the above-mentioned arrangement direction with the joint portion 30 described later interposed therebetween. Will be done. That is, the base member 20 is arranged so that the upper surface S3 of the base member 20 is located on the lower surface S2 side of the plate-shaped member 10.

The plate-shaped member 10 is a member having a substantially circular planar upper surface (hereinafter, referred to as “adsorption surface”) S1 substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction), and is, for example, ceramics (for example, alumina or aluminum nitride). Etc.). The diameter of the plate-shaped member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the plate-shaped member 10 is, for example, about 1 mm to 10 mm. The suction surface S1 of the plate-shaped member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate-shaped member 10 corresponds to the second surface in the claims, and the Z-axis direction is It corresponds to the first direction in the claims. Further, in the present specification, the direction orthogonal to the Z-axis direction is referred to as "plane direction".

As shown in FIG. 2, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged inside the plate-shaped member 10. The shape of the chuck electrode 40 in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction is generated, and the wafer W is attracted and fixed to the suction surface S1 of the plate-shaped member 10 by this electrostatic attraction.

Inside the plate-shaped member 10, a heater electrode 50 composed of a resistance heating element containing a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged. When a voltage is applied to the heater electrode 50 from a power source (not shown), the heater electrode 50 generates heat to heat the plate-shaped member 10, and the wafer W held on the suction surface S1 of the plate-shaped member 10 is warmed. Be done. As a result, the temperature distribution of the wafer W can be controlled.

The base member 20 is, for example, a circular flat plate-shaped member having the same diameter as the plate-shaped member 10 or having a diameter larger than that of the plate-shaped member 10, and is formed of, for example, a metal (aluminum, an aluminum alloy, or the like). The coefficient of thermal expansion (coefficient of thermal expansion) of the base member 20 is different from the coefficient of thermal expansion of the plate-shaped member 10. For example, the base member 20 is made of metal, and the plate-shaped member 10 is made of ceramics. In this case, the coefficient of thermal expansion of the base member 20 is larger than the coefficient of thermal expansion of the plate-shaped member 10. In the present embodiment, a step is formed on the upper surface S3 of the base member 20, and the position of the upper surface S3 of the outer peripheral side portion (hereinafter, referred to as “outer portion OP”) of the base member 20 is the outer portion of the base member 20. It is below the position of the upper surface S3 of the portion adjacent to the inside of the OP (hereinafter, referred to as "inner portion IP"). In the present embodiment, the position of the boundary between the outer OP and the inner IP of the base member 20 substantially coincides with the position of the side surface 11 of the plate-shaped member 10 in the Z-axis direction. The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to the third surface in the claims.

The base member 20 is joined to the plate-shaped member 10 by a joint portion 30 arranged between the lower surface S2 of the plate-shaped member 10 and the upper surface S3 of the base member 20. The thickness of the joint portion 30 is, for example, about 0.1 mm to 1 mm. The joint portion 30 contains a resin material (adhesive material). In the present embodiment, the joint portion 30 contains a resin material as a main component. In the present specification, the main component means a component having a volume content of more than 50 vol%. As the resin material contained in the joint portion 30, various resin materials such as silicone resin, fluororesin, acrylic resin, and epoxy resin can be used, but the silicone resin is a highly heat-resistant and flexible resin material. Or fluororesin is preferably used. The joint portion 30 preferably contains these resin materials within a range that can be elastically deformed and no permanent strain remains. By doing so, even if each member expands and contracts due to a change in temperature, it is possible to suppress the occurrence of wrinkles, slacks, and the like due to permanent strain in the joint portion 30. Further, the joint portion 30 may include, for example, a ceramic filler, in addition to the resin material. The configuration around the joint 30 will be described in detail later.

A refrigerant flow path 21 is formed inside the base member 20. When a refrigerant (for example, a fluorine-based inert liquid, water, etc.) is flowed through the refrigerant flow path 21, the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-shaped member 10 via the joint portion 30. The plate-shaped member 10 is cooled by (heat transfer), and the wafer W held on the suction surface S1 of the plate-shaped member 10 is cooled. As a result, the temperature distribution of the wafer W can be controlled.

Further, as shown in FIG. 2, the electrostatic chuck 100 is formed with a pin insertion hole 140 extending in the vertical direction from the lower surface S4 of the base member 20 to the suction surface S1 of the plate-shaped member 10. That is, the pin insertion hole 140 includes a hole 26 that penetrates the base member 20 in the Z-axis direction, a hole 36 that penetrates the joint portion 30 in the Z-axis direction, and a hole 16 that penetrates the plate-shaped member 10 in the Z-axis direction. Is an integral hole that communicates with each other. The pin insertion hole 140 is a hole for inserting a lift pin (not shown) for pushing up the wafer W held on the suction surface S1 of the plate-shaped member 10 and separating it from the suction surface S1. The hole 36 formed in the joint portion 30 corresponds to the first hole in the claims, and the hole 16 formed in the plate-shaped member 10 corresponds to the second hole in the claims.

Further, as shown in FIG. 2, the electrostatic chuck 100 attracts the plate-shaped member 10 in order to enhance the heat transfer property between the plate-shaped member 10 and the wafer W and further enhance the controllability of the temperature distribution of the wafer W. It has a configuration for supplying an inert gas (for example, helium gas) to the space existing between the surface S1 and the surface of the wafer W. That is, the electrostatic chuck 100 communicates with the first gas flow path hole 131 extending in the vertical direction from the lower surface S4 of the base member 20 to the upper surface of the joint portion 30, and has a plate shape. A second gas flow path hole 132 that opens to the suction surface S1 of the member 10 is formed. The first gas flow path hole 131 is an integral hole in which a hole 25 penetrating the base member 20 in the Z-axis direction and a hole 35 penetrating the joint portion 30 in the Z-axis direction communicate with each other. Further, the lower end portion of the second gas flow path hole 132 is a diameter-expanded portion 134 having an enlarged diameter, and a filling member (breathable plug) 160 having breathability is contained in the diameter-expanded portion 134. It is filled. Further, inside the plate-shaped member 10, a lateral flow path 133 that communicates with the second gas flow path hole 132 and extends in an annular shape in the plane direction is formed. When the helium gas supplied from the helium gas source (not shown) flows into the first gas flow path hole 131, the inflowing helium gas fills the enlarged diameter portion 134 from the first gas flow path hole 131. The suction surface S1 passes through the inside of the filled member 160 having the air permeability, flows into the second gas flow path hole 132 inside the plate-shaped member 10, flows in the surface direction through the lateral flow path 133, and flows in the plane direction. It is ejected from the gas ejection hole formed in. In this way, the helium gas is supplied to the space existing between the suction surface S1 and the surface of the wafer W. The hole 35 formed in the joint portion 30 corresponds to the first hole in the claims, and the second gas flow path hole 132 formed in the plate-shaped member 10 is the second hole in the claims. Corresponds to a hole.

A-2. Detailed configuration around the joint 30:
A2-1. Detailed configuration around the side surface 31 of the joint 30:
Next, the detailed configuration around the side surface (outer peripheral surface) 31 of the joint portion 30 will be described. FIG. 4 is an explanatory view showing a detailed configuration around the side surface 31 of the joint portion 30. FIG. 4 shows an enlarged XZ cross-sectional structure of the X1 portion of FIG. As shown in FIG. 4, in the present embodiment, the position of the side surface 31 of the joint portion 30 is the position of the side surface 11 of the plate-shaped member 10 and the side surface 22 of the inner portion IP of the base member 20 in the Z-axis direction. It is almost the same as the position of.

As shown in FIGS. 1 to 4, the electrostatic chuck 100 of the present embodiment includes a side surface protection member 110 that covers the side surface 31 of the joint portion 30. The side surface protection member 110 is annular in the Z-axis direction in order to cover the side surface 31 over the entire circumference of the joint portion 30. The side protective member 110 corresponds to the first protective member in the claims.

As shown in FIG. 4, the side surface protection member 110 is composed of a side surface protection non-woven fabric 111 and a side surface protection joint 118. The side protective non-woven fabric 111 corresponds to the first non-woven fabric in the claims, and the side protective joint 118 corresponds to the protective joint in the claims.

The side surface protective non-woven fabric 111 is a non-woven fabric composed of inorganic fibers. Here, the non-woven fabric is a cloth made by joining fibers by mechanically, chemically, and thermally treating them. Further, the fiber is a thin thread-like object, and more specifically, an object having an average length ratio (aspect ratio) of 10 or more with respect to an average diameter (diameter in the case of a substantially circular cross section). The diameter of the fibers constituting the side surface protective nonwoven fabric 111 is preferably, for example, 2 μm or more and 0.2 mm or less, and the length of the fibers is preferably, for example, 20 μm or more and 10 mm or less.

The inorganic fibers constituting the side surface protective non-woven fabric 111 include ceramic fibers such as alumina, zirconia, ittoria, and aluminum nitride, glass fibers, metal fibers, and carbons (carbon fibers, carbon nanotubes, graphene, graphite, etc.). Fiber, rock wool (artificial mineral fiber composed of silicon dioxide and calcium oxide) and the like can be used. Among these, it is preferable to use ceramic fibers having excellent plasma resistance and having a small influence on the wafer W, the semiconductor manufacturing apparatus, plasma and the like when volatilized and desorbed.

Further, the thickness (the size in the left-right direction in FIG. 4) and the fiber density of the side surface protective non-woven fabric 111 are in a state where there is no through hole that linearly penetrates the side surface protective non-woven fabric 111 in the thickness direction (that is, the aperture ratio). Is preferably set to be 0%). That is, if the thickness of the side protection non-woven fabric 111 is thin, the fiber density of the side protection non-woven fabric 111 is preferably high, and if the fiber density of the side protection non-woven fabric 111 is low, the thickness of the side protection non-woven fabric 111 is high. Is preferable. This is because the average distance (mean free path) that molecules (ions) can travel in plasma without being disturbed by scattering is compared with 0.1 mm to 10 mm under the pressure of 3 Pa to 30 Pa for etching. This is because if the side surface protective non-woven fabric 111 has the above-mentioned through holes, the molecules reach the joint portion 30 directly and deteriorate the joint portion 30. The thickness of the side surface protective non-woven fabric 111 is preferably 0.1 mm or more and 1 mm or less, and the fiber density of the side surface protective non-woven fabric 111 is the case where the bulk density of the non-woven fabric and the dense body, that is, the porosity is 0%. In comparison with the density, for example, it is preferably 2% or more and 30% or less.

In the present embodiment, the side surface protective non-woven fabric 111 is arranged outside the side surface (outer peripheral surface) 11 of the plate-shaped member 10. As described above, in the present embodiment, the position of the side surface 11 of the plate-shaped member 10 is the position of the side surface 31 of the joint portion 30 and the position of the side surface 22 of the inner portion IP of the base member 20 in the Z-axis direction. The side surface protective non-woven fabric 111 is arranged outside the side surface 31 of the joint portion 30 and the side surface 22 of the inner portion IP of the base member 20. Further, in the present embodiment, the length of the side surface protective non-woven fabric 111 (the size in the vertical direction in FIG. 4) is larger than the thickness of the joint portion 30. That is, in the surface direction view, the side surface protective non-woven fabric 111 includes, in addition to the side surface 31 of the joint portion 30, a part of the side surface 11 of the plate-shaped member 10 adjacent to the joint portion 30 and the side surface of the inner portion IP of the base member 20. It overlaps with a part of 22 adjacent to the joint 30.

The side surface protection joint 118 is located between the side surface 31 of the joint 30 and the side surface protective non-woven fabric 111, and joins the side surface protection non-woven fabric 111 to the side surface 31 of the joint 30. The thickness of the side surface protection joint 118 (the size in the left-right direction in FIG. 4) is preferably 0.1 mm or more and 1 mm or less, for example.

The side protection joint 118 contains a resin material (adhesive material). In the present embodiment, the side surface protection joint 118 contains a resin material as a main component. As the resin material contained in the side surface protection joint 118, various resin materials such as silicone resin, fluororesin, acrylic resin, and epoxy resin can be used in the same manner as the resin material contained in the joint 30. It is preferable to use a silicone resin or a fluororesin, which is a flexible resin material having high heat resistance. Further, the resin material contained in the side surface protection joint 118 may be a heat-shrinkable resin material. Examples of the heat-shrinkable resin material include PFA (perfluoroalkoxyalkane (tetrafluoroethylene / perfluoroalkoxyethylene copolymer resin)) and FEP (perfluoroethylene propene copolymer (tetrafluoroethylene / hexafluoropropylene copolymer)). Resin)), PTFE (polytetrafluoroethylene (tetrafluoroethylene resin)) and the like. The heat-shrinkable resin is a material that shrinks in the radial direction when heated due to the shape memory characteristics of the crosslinked resin, and is produced by four steps of extrusion molding, electron beam irradiation, heating / expansion, and cooling. The resin is molded into a tube shape in the extrusion molding process, the tube is crosslinked in the electron beam irradiation process, the crosslinked tube is heated and softened in the heating / expansion process, and expanded in the radial direction by applying internal pressure. Manufactured by cooling and fixing the shape in the cooling process. Since the crosslinked shape is memorized in the electron beam irradiation step, it shrinks to the diameter after the electron beam irradiation step by heating again to soften it at the time of use. Materials that can be used as the heat-shrinkable resin include silicone resin, polyolefin resin, and the like in addition to the above-mentioned fluororesin. The resin material contained in the side protection joint 118 corresponds to the second resin material within the scope of the claims.

Further, the side surface protection joint 118 may include, for example, a ceramic filler for controlling the thermal conductivity and Young's modulus in addition to the resin material. Examples of the ceramic filler include alumina, silica, aluminum nitride, boron nitride, barium sulfate, calcium carbonate and the like. Further, the side surface protection joint 118 may include a material that is discolored by plasma in addition to the resin material. Examples of the inorganic material discolored by plasma include metal oxide fine particles having an average particle diameter of 50 μm or less containing at least one element selected from the group consisting of Mo, W, Sn, V, Ce, Te and Bi. More specifically, molybdenum oxide fine particles (IV), molybdenum oxide fine particles (VI), tungsten oxide fine particles (VI), tin oxide fine particles (IV), vanadium oxide fine particles (II), vanadium oxide fine particles (III), Vanadium oxide fine particles (IV), vanadium oxide fine particles (V), cerium oxide fine particles (IV), tellurium oxide fine particles (IV), bismuth oxide fine particles (III), bismuth oxide fine particles (III) and vanadium oxide fine particles (IV) And so on. Examples of the organic material that is discolored by plasma include anthraquinone dyes, methine dyes, azo dyes, phthalocyanine dyes, triphenylmethane dyes and xanthene dyes. The content can be appropriately determined depending on the type and hue of the colorant, but is generally about 0.05 to 5% by weight, particularly preferably 0.1 to 1% by weight in the composition. ..

In the present embodiment, the side surface protection joint 118 is arranged on the entire surface of the side protection nonwoven fabric 111 on the side facing the side surface 31 of the joint 30. Further, in addition to the side surface 31 of the joint portion 30, the side surface protection joint portion 118 includes a portion of the plate-shaped member 10 adjacent to the joint portion 30 on the side surface 11 and a joint portion on the side surface 22 of the inner portion IP of the base member 20. It is formed so as to cover a part adjacent to 30. Further, in the present embodiment, a part P1 of the side surface protective non-woven fabric 111 on the side surface 31 side of the joint portion 30 is impregnated with a resin material of the same type as the resin material contained in the side surface protection joint portion 118.

A-2-2. Detailed configuration around the inner peripheral surfaces of the holes 35 and 36 formed in the joint portion 30:
Next, the detailed configuration around the inner peripheral surfaces of the holes 35 and 36 formed in the joint portion 30 will be described. Hereinafter, as a representative, among the holes 35 and 36 formed in the joint portion 30, the detailed configuration around the inner peripheral surface of the holes 36 will be described. The same applies to the configuration around the inner peripheral surface of the other holes 35 formed in the joint portion 30. FIG. 5 is an explanatory view showing a detailed configuration around the inner peripheral surface 32 of the hole 36 formed in the joint portion 30. FIG. 5 shows an enlarged XZ cross-sectional structure of the X2 portion of FIG.

As shown in FIGS. 2 and 5, the electrostatic chuck 100 of the present embodiment includes an inner peripheral surface protecting member 120 that covers the inner peripheral surface 32 of the hole 36 formed in the joint portion 30. The inner peripheral surface protection member 120 is annular in the Z-axis direction in order to cover the inner peripheral surface 32 over the entire circumference of the hole 36. The inner peripheral surface protective member 120 corresponds to a second protective member within the scope of the claims. In FIG. 3, the holes 35 and 36 formed in the joint portion 30 and the inner peripheral surface protecting member 120 covering the inner peripheral surfaces of the holes 35 and 36 are not shown.

As shown in FIG. 5, the inner peripheral surface protecting member 120 is composed of an inner peripheral surface protecting non-woven fabric 122 and an inner peripheral surface protecting joint portion 128. The inner peripheral surface protective non-woven fabric 122 corresponds to the second non-woven fabric within the scope of the claims.

The inner peripheral surface protection non-woven fabric 122 is a non-woven fabric composed of inorganic fibers, similarly to the side surface protection non-woven fabric 111 described above. As the inorganic fibers constituting the inner peripheral surface protective nonwoven fabric 122, the same fibers as the inorganic fibers constituting the side surface protective nonwoven fabric 111 can be used. Similar to the fibers constituting the side surface protective nonwoven fabric 111, the diameter of the fibers constituting the inner peripheral surface protecting nonwoven fabric 122 is preferably, for example, 2 μm or more and 0.2 mm or less, and the length of the fibers is For example, it is preferably 20 μm or more and 10 mm or less.

Further, similarly to the side surface protective non-woven fabric 111, the thickness and fiber density of the inner peripheral surface protective non-woven fabric 122 are in a state where there is no through hole that linearly penetrates the inner peripheral surface protective non-woven fabric 122 in the thickness direction (that is,). It is preferable that the aperture ratio is set to 0%). Similar to the side surface protective non-woven fabric 111, the thickness of the inner peripheral surface protective non-woven fabric 122 is preferably 0.1 mm or more and 1 mm or less, and the fiber density of the inner peripheral surface protective non-woven fabric 122 is that of the non-woven fabric. In comparison with the density and the density in the case of a dense body, that is, a porosity of 0%, for example, it is preferably 2% or more and 30% or less.

In the present embodiment, the length of the non-woven fabric 122 for protecting the inner peripheral surface (the size in the vertical direction in FIG. 5) is larger than the thickness of the joint portion 30. That is, when viewed in the plane direction, the inner peripheral surface protective non-woven fabric 122 has the inner circumference of the hole of the plate-shaped member 10 (the hole constituting the pin insertion hole 140) in addition to the inner peripheral surface 32 of the hole 36 of the joint portion 30. It overlaps a part of the surface adjacent to the joint portion 30 and a portion of the inner peripheral surface of the hole of the base member 20 (the hole forming the pin insertion hole 140) adjacent to the joint portion 30.

The inner peripheral surface protection joint 128 is located between the inner peripheral surface 32 of the hole 36 of the joint 30 and the inner peripheral surface protective non-woven fabric 122, and the inner peripheral surface protective non-woven fabric 122 is inserted into the hole of the joint 30. It is joined to the inner peripheral surface 32 of 36. Similar to the side surface protection joint 118, the thickness of the inner peripheral surface protection joint 128 (the size in the left-right direction in FIG. 5) is preferably 0.1 mm or more and 1 mm or less, for example.

The inner peripheral surface protection joint 128 contains a resin material (adhesive material). In the present embodiment, the joint portion 128 for protecting the inner peripheral surface contains a resin material as a main component. As the resin material contained in the inner peripheral surface protection joint portion 128, various resin materials such as silicone resin, fluororesin, acrylic resin, and epoxy resin are used in the same manner as the resin material contained in the side surface protection joint portion 118. However, it is preferable to use a silicone resin or a fluororesin, which is a resin material having high heat resistance and flexibility. Further, the inner peripheral surface protection joint portion 128 may include, for example, a ceramic filler or a material that is discolored by plasma, in addition to the resin material, as in the side surface protection joint portion 118.

In the present embodiment, the inner peripheral surface protection joint portion 128 is arranged on the entire surface of the inner peripheral surface protection non-woven fabric 122 on the side facing the inner peripheral surface 32 of the hole 36 of the joint portion 30. Further, the joint portion 128 for protecting the inner peripheral surface is a joint portion on the inner peripheral surface of the hole of the plate-shaped member 10 (the hole constituting the pin insertion hole 140) in addition to the inner peripheral surface 32 of the hole 36 of the joint portion 30. It is formed so as to cover a part adjacent to the 30 and a part adjacent to the joint portion 30 on the inner peripheral surface of the hole (the hole forming the pin insertion hole 140) of the base member 20. Further, in the present embodiment, a part P2 on the inner peripheral surface 32 side of the hole 36 of the joint portion 30 in the inner peripheral surface protective nonwoven fabric 122 is a resin material of the same type as the resin material contained in the inner peripheral surface protective joint portion 128. Is impregnated.

A-2-3. Physical properties of the side protection non-woven fabric 111 and the inner peripheral surface protection non-woven fabric 122:
The elongation of the non-woven fabric 111 for protecting the side surface and the non-woven fabric 122 for protecting the inner peripheral surface used in the electrostatic chuck 100 of the present embodiment is 8% or more. That is, the side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 have a certain degree of stretchability.

The elongation of these non-woven fabrics should be specified by using a known specific method (for example, a method of performing a tensile test by a known tensile tester (for example, Autograph AG-IS manufactured by Shimadzu Corporation) as described below). Can be done. The test piece can be produced by molding it into a sheet, heating and curing it according to the material, and then cutting it into a predetermined size. The size of the test piece is, for example, 10 mm in width × 70 mm in length. The 20 mm long portions at both ends of the test piece are held by a jig, and the intermediate 30 mm long portion is set as the initial sample length L0. The moving distance and the load at that time are measured while pulling at a speed of, for example, 50 mm / min until the test piece breaks. The tensile stress is calculated by dividing the load by the cross-sectional area (width x thickness) of the test piece before the test. From the sample length L1 when the tensile stress is maximized and the initial sample length L0, the elongation can be calculated by the following formula. The shape of the test piece may be the dumbbell shape defined in JIS K 6251: 2010.
Elongation (%) = {(L1-L0) / L0} x 100

When measuring the elongation of the bonding material already bonded to the adherend, the bonding material is scraped off from the adherend using a knife or the like, and for example, the test piece is cut into the same width of 10 mm and length of 70 mm as described above. Can be prepared and the elongation can be calculated by the same method as described above.

Further, the Young's modulus of the non-woven fabric 111 for protecting the side surface and the non-woven fabric 122 for protecting the inner peripheral surface used in the electrostatic chuck 100 of this embodiment is 10 MPa or less. That is, the side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 have a certain degree of flexibility or more.

The Young's modulus of these non-woven fabrics is specified by using a known specific method (for example, a method of performing a tensile test by a known tensile tester (for example, Autograph AG-IS manufactured by Shimadzu Corporation) as described below). be able to. The test piece can be produced by molding it into a sheet, heating and curing it according to the material, and then cutting it into a predetermined size. The size of the test piece is, for example, 10 mm in width × 70 mm in length. The 20 mm long portions at both ends of the test piece are held by a jig, and the intermediate 30 mm long portion is used as the sample length. The moving distance and the load at that time are measured while pulling at a speed of, for example, 50 mm / min until the test piece breaks. The tensile stress is calculated by dividing the load by the cross-sectional area (width x thickness) of the test piece before the test, the sample length during the test is L2, and the strain is calculated by the following formula.
Strain (%) = {(L2-L1) / L0} x 100
Young's modulus (elastic modulus) is calculated from the inclination near the origin of the tensile stress-strain diagram. The shape of the test piece may be the dumbbell shape defined in JIS K 6251: 2010.

Further, when measuring the Young's modulus of the bonding material already bonded to the adherend, the bonding material is scraped off from the adherend using a knife or the like, and for example, the same width 10 mm × length 70 mm as described above is cut out and tested. A piece can be prepared and Young's modulus can be calculated by the same method as described above.

A-3. Manufacturing method of electrostatic chuck 100:
The manufacturing method of the electrostatic chuck 100 of this embodiment is as follows, for example. First, the plate-shaped member 10 is manufactured by a known method. For example, a plurality of ceramic green sheets are produced, and a predetermined processing is performed on a predetermined ceramic green sheet. Predetermined processing includes, for example, printing of a metallized paste for forming the chuck electrode 40, the heater electrode 50, etc., drilling for forming various vias, filling of the metallized paste, and the like. A laminated body of ceramic green sheets is produced by laminating these ceramic green sheets, thermocompression bonding, and processing such as cutting. By firing the laminated body of the produced ceramic green sheet, the plate-shaped member 10 which is a fired ceramic body is produced. Further, the base member 20 is manufactured by a known method.

In addition, a sheet-like adhesive for forming the joint portion 30 is produced. Specifically, a sheet-like adhesive is prepared by applying a paste prepared by adding a filler to a liquid resin material, for example, on a release sheet in the form of a film, and then semi-hardening the paste by a predetermined curing treatment. To do. The produced sheet-like adhesive is punched, for example, to make the shape of the sheet-like adhesive a desired shape (for example, substantially circular).

Then, the plate-shaped member 10 and the base member 20 are joined using a sheet-shaped adhesive. Specifically, a sheet-like adhesive is placed on one surface (joint surface) of the plate-shaped member 10 and the base member 20, and the plate-shaped member 10 and the base member 20 are bonded to each other via the sheet-shaped adhesive. , The joint portion 30 is formed by performing a curing treatment for curing the sheet-like adhesive.

Next, the side surface protection member 110 is formed. Specifically, a sheet-like adhesive for forming the side surface protection joint 118 is produced in the same manner as the sheet-like adhesive for forming the above-mentioned joint 30. Further, one surface side of the side surface protective non-woven fabric 111 is impregnated with the resin material for the side surface protective joint 118 by a method such as pressing a sheet-like adhesive, and the sheet-like adhesive and the side surface protective non-woven fabric 111 are impregnated. To prepare a composite sheet-like adhesive in which the above is compounded. By adjusting conditions such as the thickness of the original sheet-like adhesive and the press pressure, the thickness of the side surface protection joint 118 and the impregnated thickness P2 can be controlled in the composite sheet-like adhesive serving as the side surface protection member 110. can do. The surface of the side protection nonwoven fabric 111 may be previously subjected to a treatment (for example, a silane coupling treatment) for promoting impregnation of the resin material. Then, it is cut out from the composite sheet-like adhesive to a predetermined length and width. The length is the length of the circumference to be wound, for example, in FIG. 4, the length of the outer circumference of the plate-shaped member 10, and the width is the height in the Z-axis direction. The cut-out composite sheet-like adhesive is attached to the attachment portion (side surface 31 of the joint portion 30) of the side surface protection member 110. Then, the side surface protection joint portion 118 is formed by performing a curing treatment for curing the composite sheet-like adhesive. As a result, the side surface protection member 110 having a structure in which the side surface protective non-woven fabric 111 is joined to the side surface 31 of the joint portion 30 by the side surface protection joint portion 118 is formed. Similarly, the inner peripheral surface protection member 120 is formed. The hardening treatment for forming the joint portion 30 and the hardening treatment for forming the side surface protection member 110 and the inner peripheral surface protection member 120 may be performed at the same time. The electrostatic chuck 100 of the present embodiment is manufactured mainly by the above steps.

A-4. Effect of this embodiment:
As described above, the electrostatic chuck 100 of the present embodiment includes a plate-shaped member 10, a base member 20, and a joint portion 30. The plate-shaped member 10 has a suction surface S1 substantially orthogonal to the Z-axis direction and a lower surface S2 on the opposite side of the suction surface S1. The base member 20 has an upper surface S3, and the upper surface S3 is arranged so as to be located on the lower surface S2 side of the plate-shaped member 10. The coefficient of thermal expansion of the base member 20 is different from the coefficient of thermal expansion of the plate-shaped member 10. The joint portion 30 is arranged between the lower surface S2 of the plate-shaped member 10 and the upper surface S3 of the base member 20 to join the plate-shaped member 10 and the base member 20. Further, the electrostatic chuck 100 of the present embodiment further includes a side surface protection member 110 that covers the side surface 31 of the joint portion 30. The side surface protection member 110 includes a side surface protection non-woven fabric 111 made of inorganic fibers. The side surface protective non-woven fabric 111 is joined to the side surface 31 of the joint portion 30.

As described above, in the electrostatic chuck 100 of the present embodiment, the side surface protecting member 110 covering the side surface 31 of the joint portion 30 includes the side surface protecting non-woven fabric 111 made of inorganic fibers. The side protection non-woven fabric 111 composed of inorganic fibers has high durability against plasma as compared with an elastomer O-ring. Further, since the side surface protective non-woven fabric 111 composed of inorganic fibers has high flexibility, it can be bent into a shape that covers the side surface 31 of the joint portion 30, and the plate-shaped member 10 and the base member 20 It can be arranged near the side surface 31 of the joint portion 30 where the stress due to the difference in thermal expansion between the joints tends to increase. In this regard, for example, the ceramic sintered plate has high durability against plasma like the non-woven fabric 111 for side protection, but because of its low flexibility, it is bent into a shape that covers the side surface 31 of the joint portion 30. Further, it cannot be arranged near the side surface 31 of the joint portion 30 where the stress due to the difference in thermal expansion between the plate-shaped member 10 and the base member 20 tends to be large. Further, since the side surface protective non-woven fabric 111 is a cloth-like member, the side surface 31 of the joint portion 30 can be effectively covered as compared with the case where an O-ring having a substantially circular cross section is used. Further, in the electrostatic chuck 100 of the present embodiment, since the side surface protective non-woven fabric 111 constituting the side surface protection member 110 is joined to the side surface 31 of the joint portion 30, the side surface protection non-woven fabric 111 and the side surface of the joint portion 30 are joined. It is possible to prevent the formation of a gap from which the plasma enters with the 31. From the above, according to the electrostatic chuck 100 of the present embodiment, the side surface protection member 110 provided with the side surface protective non-woven fabric 111 effectively protects the joint portion 30 from the plasma existing around the electrostatic chuck 100. be able to.

Further, the electrostatic chuck 100 of the present embodiment further includes an inner peripheral surface protection member 120. The inner peripheral surface protection member 120 is holes 35 and 36 penetrating the joint portion 30 in the Z-axis direction, and communicates with holes 16 and 132 opened in the suction surface S1 and the lower surface S2 of the plate-shaped member 10. It covers the inner peripheral surfaces of the holes 35 and 36. The inner peripheral surface protection member 120 includes an inner peripheral surface protective non-woven fabric 122 made of inorganic fibers. The inner peripheral surface protective non-woven fabric 122 is joined to the inner peripheral surface 32 of the holes 35 and 36 of the joint portion 30. The inner peripheral surface protective non-woven fabric 122 composed of inorganic fibers has high durability against plasma. Further, since the inner peripheral surface protective non-woven fabric 122 composed of inorganic fibers has high flexibility, it can be bent into a shape that covers the inner peripheral surface 32 of the holes 35 and 36 of the joint portion 30. Further, since the non-woven fabric 122 for protecting the inner peripheral surface is a cloth-like member, the inner peripheral surface 32 of the holes 35 and 36 of the joint portion 30 can be effectively covered. Further, since the non-woven fabric 122 for protecting the inner peripheral surface is joined to the inner peripheral surfaces 32 of the holes 35 and 36 of the joint portion 30, the non-woven fabric 122 for protecting the inner peripheral surface and the inner circumferences of the holes 35 and 36 of the joint portion 30 are joined. It is possible to prevent the formation of a gap through which plasma enters between the surface 32 and the surface 32. From the above, according to the electrostatic chuck 100 of the present embodiment, the joint portion 30 is formed from the plasma that has entered the holes 35 and 36 of the joint portion 30 by the inner peripheral surface protection member 120 provided with the inner peripheral surface protection non-woven fabric 122. Can be effectively protected.

Further, in the electrostatic chuck 100 of the present embodiment, the side surface protective non-woven fabric 111 constituting the side surface protection member 110 is arranged outside the side surface 11 of the plate-shaped member 10. Further, the side surface protection member 110 is further located between the side surface 31 of the joint portion 30 and the side surface protection non-woven fabric 111, and is a side surface protection joint portion that joins the side surface protection non-woven fabric 111 to the side surface 31 of the joint portion 30. It is equipped with 118. As described above, according to the electrostatic chuck 100 of the present embodiment, since the side surface protective non-woven fabric 111 is arranged outside the side surface 11 of the plate-shaped member 10, it is between the plate-shaped member 10 and the base member 20. The side surface protection member 110 provided with the side surface protective non-woven fabric 111 can protect the joint portion 30 from the plasma existing around the electrostatic chuck 100 without affecting the bondability.

Further, in the electrostatic chuck 100 of the present embodiment, the side surface protection joint 118 constituting the side surface protection member 110 contains a resin material. Further, a part P1 of the side surface protective non-woven fabric 111 on the side surface 31 side of the joint portion 30 is impregnated with a resin material of the same type as the resin material contained in the side surface protection joint portion 118. Therefore, according to the electrostatic chuck 100 of the present embodiment, due to the presence of the resin material impregnated in a part P1 of the side surface protective non-woven fabric 111, the side surface protection member 110 provided with the side surface protective non-woven fabric 111 is attached to the side surface 31 of the joint portion 30. Good adhesion can be achieved, and the junction 30 can be more effectively protected from the plasma existing around the electrostatic chuck 100.

Further, in the electrostatic chuck 100 of the present embodiment, the elongation of the side surface protective non-woven fabric 111 constituting the side surface protection member 110 is 8% or more. That is, the side surface protective non-woven fabric 111 has a certain degree of stretchability. As shown in FIG. 6, when the temperature changes from the state (initial state) shown in FIG. 4, the joint portion 30 and the side surface protection are caused by the difference in thermal expansion between the plate-shaped member 10 and the base member 20. Strain occurs in the member 110. In this state, the side protection nonwoven fabric 111 (more specifically, the portion of the side protection nonwoven fabric 111 facing the joint portion 30) is compared with the length L0 in the initial state. , The portion of the side surface protective non-woven fabric 111 facing the joint portion 30) has a longer length L1. That is, the non-woven fabric for protecting the side surface 111 is stretched (= {(L1-L0) / L0} × 100). In the electrostatic chuck 100 of the present embodiment, since the side surface protective non-woven fabric 111 has a certain degree of stretchability or more, the side surface protective non-woven fabric 111 is caused by the stress due to the difference in thermal expansion between the plate-shaped member 10 and the base member 20. It is possible to prevent the side surface protecting member 110 including the above from peeling from the side surface 31 of the joint portion 30, and to effectively protect the joint portion 30 from the plasma existing around the electrostatic chuck 100 for a long period of time. it can. For example, the plate-shaped member 10 has a diameter of 360 mm, the joint portion 30 has a thickness of 1 mm, the plate-shaped member 10 is formed of alumina (coefficient of thermal expansion: 8.2 ppm / K), and the base member 20 is made of aluminum. When the temperature at which stress is zero, which is formed by (coefficient of thermal expansion: 23 ppm / K), is 100 ° C (curing temperature), and the operating temperature is 150 ° C for the plate-shaped member 10 and 20 ° C for the base member 20, the side surface If the elongation of the protective nonwoven fabric 111 is 8% or more, the side surface protective nonwoven fabric 111 will not peel off.

Further, in the electrostatic chuck 100 of the present embodiment, the Young's modulus of the side surface protective non-woven fabric 111 constituting the side surface protection member 110 is 10 MPa or less. That is, the side surface protective non-woven fabric 111 has a certain degree of flexibility or more. Therefore, according to the electrostatic chuck 100 of the present embodiment, due to the stress due to the difference in thermal expansion between the plate-shaped member 10 and the base member 20, the side surface protection member 110 provided with the side surface protection non-woven fabric 111 is attached to the side surface of the joint portion 30. It is possible to suppress peeling from 31 and effectively protect the junction 30 from the plasma existing around the electrostatic chuck 100 for a long period of time.

In the electrostatic chuck 100 of the present embodiment, the side surface protection joint 118 may include a heat-shrinkable resin material. According to such a configuration, the side surface protection joint 118 contracts due to heat, so that the side surface protection member 110 provided with the side surface protection non-woven fabric 111 can be better adhered to the side surface 31 of the joint 30. The junction 30 can be extremely effectively protected from the plasma existing around the electrostatic chuck 100.

Further, in the electrostatic chuck 100 of the present embodiment, the side surface protection joint portion 118 may include a material that is discolored by plasma. According to such a configuration, the degree of deterioration of the side surface protection joint 118 due to the influence of plasma can be easily detected.

B. Second embodiment:
FIG. 7 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 100a of the second embodiment. In the following, among the configurations of the electrostatic chuck 100a of the second embodiment, the same configurations as the configurations of the electrostatic chuck 100 of the first embodiment described above will be appropriately omitted by adding the same reference numerals. ..

As shown in FIG. 7, the electrostatic chuck 100a of the second embodiment has a different configuration of the plate-shaped member 10a, the joint portion 30a, and the side surface protection member 110a as compared with the electrostatic chuck 100 of the first embodiment. There is. Specifically, in the present embodiment, the position of the side surface 11 of the plate-shaped member 10a is located outside the position of the boundary between the outer OP and the inner IP of the base member 20 in the Z-axis direction. ..

Further, in the present embodiment, the position of the side surface 31 of the joint portion 30a is located inside the position of the side surface 11 of the plate-shaped member 10a in the Z-axis direction view. That is, in the Z-axis direction, a space where the joint portion 30a does not exist (as described later, the side surface protective non-woven fabric 111 is arranged between the outer peripheral portion of the plate-shaped member 10a and the outer portion OP of the base member 20. Space) is secured. In the present embodiment, the position of the side surface 31 of the joint portion 30a is located outside the position of the side surface 22 of the inner portion IP of the base member 20 in the Z-axis direction view. Therefore, the thickness of the joint portion 30a is a portion sandwiched between the plate-shaped member 10a and the outer portion OP of the base member 20 (hereinafter referred to as “outer joint portion 302”) in the outer peripheral side portion. It is thicker (hereinafter referred to as "inner joint 301"). As in the first embodiment, the joint portion 30a may contain a resin material as a main component, and the joint portion 30a may contain a material that is discolored by plasma.

Further, in the present embodiment, the side surface protection member 110a covering the side surface 31 of the joint portion 30a is composed of the side surface protective non-woven fabric 111. The side surface protective non-woven fabric 111 is arranged between the plate-shaped member 10a and the outer side OP of the base member 20 in the Z-axis direction, and is directly bonded to the side surface 31 of the joint portion 30a. In the present embodiment, the position of the side surface (outer peripheral surface) 112 of the side surface protecting nonwoven fabric 111 substantially coincides with the position of the side surface 11 of the plate-shaped member 10a in the Z-axis direction. The side protective member 110a corresponds to the first protective member in the claims.

Further, in the present embodiment, the length (vertical size in the vertical direction) of the side surface protective non-woven fabric 111 constituting the side surface protection member 110a is larger than the thickness of the inner joint portion 301 in the joint portion 30a and is joined. It is substantially the same as the thickness of the outer joint portion 302 in the portion 30a. Further, in the present embodiment, a part P1 of the side surface protective nonwoven fabric 111 on the side surface 31 side of the joint portion 30a is impregnated with a resin material of the same type as the resin material contained in the joint portion 30a. The resin material contained in the joint portion 30a corresponds to the first resin material within the scope of the claims.

The electrostatic chuck 100a of the second embodiment having such a configuration can be manufactured by, for example, the same method as the manufacturing method of the electrostatic chuck 100 of the first embodiment described above. However, in the method for manufacturing the electrostatic chuck 100 of the first embodiment described above, the "joint portion 30" is read as the "inner joint portion 301 of the joint portion 30a", and the "side surface protection joint portion 118" is replaced with the "joint portion 30a". It should be read as "outer joint 302". That is, the plate-shaped member 10a and the base member 20 are manufactured, and the plate-shaped member 10a and the base member 20 are bonded to each other via a sheet-like adhesive for forming the inner joint portion 301 of the joint portion 30a, and the sheet is formed. The inner joint portion 301 of the joint portion 30a is formed by performing a curing treatment for curing the adhesive. Further, a sheet-like adhesive for forming the outer joint portion 302 of the joint portion 30a is arranged on the surface of the side surface protective non-woven fabric 111 impregnated with the resin material, and the sheet-like adhesive is applied to the inner joint portion of the joint portion 30a. The outer joint portion 302 of the joint portion 30a is formed by affixing it to the side surface of the 301 and performing a curing treatment for curing the sheet-like adhesive. As a result, the side surface protection member 110a having a structure in which the side surface protective non-woven fabric 111 is bonded to the side surface 31 of the joint portion 30a (inner joint portion 301 and outer joint portion 302) is formed. The electrostatic chuck 100a of the present embodiment is manufactured mainly by the above steps.

As described above, in the electrostatic chuck 100a of the second embodiment, the side surface protective non-woven fabric 111 constituting the side surface protection member 110a is arranged between the plate-shaped member 10a and the base member 20 in the Z-axis direction. ing. Therefore, according to the electrostatic chuck 100a of the second embodiment, the side surface protection member 110a provided with the side surface protective non-woven fabric 111 can effectively suppress the joint portion 30a from being exposed to plasma, and the electrostatic chuck can be effectively suppressed from being exposed to plasma. The junction 30a can be effectively protected from the plasma existing around the 100a. Further, since the side surface protective non-woven fabric 111 has sufficient flexibility, even if the side surface protective non-woven fabric 111 is arranged between the plate-shaped member 10a and the base member 20, the side surface protective non-woven fabric 111 has a plate shape due to the reaction force. It is possible to prevent the joining of the member 10a and the base member 20 from being hindered.

Further, in the electrostatic chuck 100a of the second embodiment, a part P1 of the side surface protective non-woven fabric 111 on the side surface 31 side of the joint portion 30a is impregnated with a resin material of the same type as the resin material contained in the joint portion 30a. Therefore, according to the electrostatic chuck 100a of the second embodiment, due to the presence of the resin material impregnated in a part P1 of the side surface protecting non-woven fabric 111, the side surface protecting member 110a provided with the side surface protecting non-woven fabric 111 is attached to the side surface 31 of the joint portion 30a. The junction 30a can be more effectively protected from the plasma existing around the electrostatic chuck 100a.

Further, in the electrostatic chuck 100a of the second embodiment, the joint portion 30a may include a material that is discolored by plasma. According to such a configuration, the degree of deterioration of the joint portion 30a due to the influence of plasma can be easily detected.

C. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof, and for example, the following modifications are also possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example and can be variously deformed. For example, in the above embodiment, the length of the side surface protective non-woven fabric 111 is larger than the thickness of the joint portion 30, but the length of the side surface protective non-woven fabric 111 may be substantially the same as the thickness of the joint portion 30.

In the first embodiment, the side surface protective non-woven fabric 111 is joined to the side surface 31 of the joint portion 30 by the side surface protection joint portion 118, but the side surface protective non-woven fabric 111 is directly joined to the side surface 31 of the joint portion 30. It may have been done.

In the second embodiment, the position of the side surface 31 of the joint portion 30a is outside the position of the side surface 22 of the inner portion IP of the base member 20 in the Z-axis direction, but the position of the side surface 31 of the joint portion 30a is. , The position of the side surface 22 of the inner side IP of the base member 20 may be substantially the same, or may be inside the position of the side surface 22 of the inner side IP of the base member 20. In this case, the thickness of the joint portion 30a may be substantially uniform. Further, in the second embodiment, the position of the side surface 112 of the side surface protective non-woven fabric 111 is substantially the same as the position of the side surface 11 of the plate-shaped member 10a in the Z-axis direction, but the side surface of the side surface protective non-woven fabric 111. The position of 112 may be inside the position of the side surface 11 of the plate-shaped member 10a, or may be inside the position of the side surface 22 of the inner portion IP of the base member 20.

In the above embodiment, a step (a step at the boundary position between the inner portion IP and the outer portion OP) exists on the upper surface S3 of the base member 20, but the step may not be present.

In the above embodiment, the inner peripheral surface protection member 120 may not be arranged on the inner peripheral surface of the holes for a part or all of the plurality of holes formed in the joint portion 30.

In the above embodiment, the resin material is impregnated in a part P1 of the side surface protective non-woven fabric 111 and a part P2 of the inner peripheral surface protective non-woven fabric 122, but the entire side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 are covered. The resin material may be impregnated, or the side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 may not be impregnated with the resin material.

In the above embodiment, the elongation of the side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 is 8% or more, and the Young's modulus of the side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 is 10 MPa or less. However, the numerical range of these physical property values is a preferable range, and it is not always essential to satisfy the numerical range of these physical property values.

In the above embodiment, the heater electrode 50 is arranged inside the plate-shaped member 10, but the heater electrode 50 does not necessarily have to be arranged inside the plate-shaped member 10. Further, in the above embodiment, the refrigerant flow path 21 is formed in the base member 20, but it is not always necessary that the refrigerant flow path 21 is formed in the base member 20.

In the above embodiment, a unipolar method in which one chuck electrode 40 is provided inside the plate-shaped member 10 is adopted, but a bipolar method in which a pair of chuck electrodes 40 are provided inside the plate-shaped member 10 is adopted. It may be adopted.

The material for forming each member in the electrostatic chuck 100 of the above embodiment is merely an example and can be arbitrarily changed. For example, in the above embodiment, the plate-shaped member 10 is formed of ceramics, but the plate-shaped member 10 may be formed of a material other than ceramics (for example, a resin material). Further, in the first embodiment, the resin material contained in the joint portion 30 and the resin material contained in the side surface protection joint portion 118 and the inner peripheral surface protection joint portion 128 may be of the same type or different types. Further, in the second embodiment, the resin material contained in the inner joint portion 301 of the joint portion 30a and the resin material contained in the outer joint portion 302 of the joint portion 30a may be of the same type or different types. However, if these resin materials are of the same type, the coefficients of thermal expansion are close to each other and the mutual adhesiveness is good, which is preferable. Further, in the above embodiment, the joint portion 30, the side surface protection joint portion 118, and the inner peripheral surface protection joint portion 128 contain the resin material as a main component, but at least one of them contains the resin material as a sub component. It may be used, or it may not contain a resin material.

The method for manufacturing the electrostatic chuck 100 of the above embodiment is merely an example, and various modifications can be made. For example, in the second embodiment, after the plate-shaped member 10a and the base member 20 are joined by the inner joining portion 301 of the joining portion 30a, the side surface protective non-woven fabric 111 is joined by the outer joining portion 302 of the joining portion 30a. However, at the time of joining the plate-shaped member 10a and the base member 20, the inner joint portion 301, the outer joint portion 302, and the side surface protective non-woven fabric 111 of the joint portion 30a may be formed. Further, it is not necessary to impregnate the side surface protective non-woven fabric 111 and the inner peripheral surface protective non-woven fabric 122 with the resin material in advance, and the resin material exudes from the joint portion 30a, the side surface protective joint portion 118, and the inner peripheral surface protective joint portion 128. The resin material may be impregnated into the side surface protective non-woven fabric 111 or the inner peripheral surface protective non-woven fabric 122.

The present invention is not limited to the electrostatic chuck 100 that holds the wafer W by utilizing electrostatic attraction, and includes a plate-shaped member, a base member, and a joint portion, and holds an object on the surface of the plate-shaped member. It is also applicable to other holding devices (for example, vacuum chucks, etc.).

10: Plate-shaped member 11: Side surface 16: Hole 20: Base member 21: Refrigerant flow path 22: Side surface 25: Hole 26: Hole 30: Joint 31: Side surface 32: Inner peripheral surface 35: Hole 36: Hole 40: Chuck Electrode 50: Heater electrode 100: Electrostatic chuck 110: Side protection member 111: Side protection non-woven fabric 112: Side surface 118: Side protection joint 120: Inner peripheral surface protection member 122: Inner peripheral surface protection non-woven fabric 128: Inner circumference Surface protection joint 131: First gas flow path hole 132: Second gas flow path hole 133: Horizontal flow path 134: Expanded diameter part 140: Pin insertion hole 160: Filling member 301: Inner joint part 302: Outer joint Part IP: Inner part OP: Outer part S1: Adsorption surface S2: Lower surface S3: Upper surface S4: Lower surface W: Non-woven fabric

Claims (11)

A plate-like member having a first surface substantially orthogonal to the first direction and a second surface opposite to the first surface.
A base having a third surface, the third surface being arranged so as to be located on the second surface side of the plate-shaped member, and having a coefficient of thermal expansion different from the coefficient of thermal expansion of the plate-shaped member. Members and
A joint portion arranged between the second surface of the plate-shaped member and the third surface of the base member to join the plate-shaped member and the base member.
In order to protect the joint from plasma, a first protective member covering the side surface of the joint and
In a holding device for holding an object on the first surface of the plate-shaped member.
The first protective member is a first non-woven fabric composed of inorganic fibers, and includes a first non-woven fabric bonded to the side surface of the joint portion.
A holding device characterized by that. In the holding device according to claim 1, further
A first hole that penetrates the joint portion in the first direction in order to protect the joint portion from plasma, and is opened in the first surface and the second surface of the plate-shaped member. A second protective member covering the inner peripheral surface of the first hole communicating with the second hole is provided.
The second protective member is a second non-woven fabric composed of inorganic fibers, and includes a second non-woven fabric bonded to the inner peripheral surface of the first hole of the joint portion.
A holding device characterized by that. In the holding device according to claim 1 or 2.
The first nonwoven fabric is arranged between the plate-shaped member and the base member in the first direction.
A holding device characterized by that. In the holding device according to claim 3,
The joint contains a first resin material and contains
At least a part of the joint portion of the first nonwoven fabric on the side surface side is impregnated with the first resin material.
A holding device characterized by that. In the holding device according to any one of claims 1 to 4.
The junction contains a material that is discolored by plasma.
A holding device characterized by that. In the holding device according to claim 1 or 2.
The first non-woven fabric is arranged outside the side surface of the plate-shaped member.
The first protective member is further located between the side surface of the joint portion and the first non-woven fabric, and further provides a protective joint portion for joining the first non-woven fabric to the side surface of the joint portion. Prepare, prepare
A holding device characterized by that. In the holding device according to claim 6,
The protective joint contains a second resin material and contains.
At least a part of the side surface side of the joint portion of the first nonwoven fabric is impregnated with the second resin material.
A holding device characterized by that. In the holding device according to claim 6 or 7.
The protective joint comprises a heat shrinkable resin material.
A holding device characterized by that. In the holding device according to any one of claims 6 to 8.
The protective junction comprises a material that is discolored by plasma.
A holding device characterized by that. In the holding device according to any one of claims 1 to 9.
The elongation of the first non-woven fabric is 8% or more.
A holding device characterized by that. In the holding device according to any one of claims 1 to 10.
The Young's modulus of the first non-woven fabric is 10 MPa or less.
A holding device characterized by that.

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