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JP2006142611A - Composite sheet for thermal press bonding and its manufacturing method - Google Patents

Composite sheet for thermal press bonding and its manufacturing method Download PDF

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Publication number
JP2006142611A
JP2006142611A JP2004334694A JP2004334694A JP2006142611A JP 2006142611 A JP2006142611 A JP 2006142611A JP 2004334694 A JP2004334694 A JP 2004334694A JP 2004334694 A JP2004334694 A JP 2004334694A JP 2006142611 A JP2006142611 A JP 2006142611A
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Prior art keywords
composite sheet
thermocompression bonding
thickness
metal foil
release layer
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Japanese (ja)
Inventor
Tomoyoshi Nagayama
知義 永山
Seiichi Takaoka
誠一 高岡
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2004334694A priority Critical patent/JP2006142611A/en
Priority to PCT/JP2005/020575 priority patent/WO2006054473A1/en
Publication of JP2006142611A publication Critical patent/JP2006142611A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/107Ceramic
    • B32B2264/108Carbon, e.g. graphite particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/10Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/204Plasma displays

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  • Laminated Bodies (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite sheet for thermal press bonding having good cushioning properties, heat conductivity and mold releasability and hard to cause thermal deformation or ply separation, and its manufacturing method. <P>SOLUTION: The composite sheet for thermal press bonding is constituted of a metal foil 12, the mold release layer 11, which contains a fluoroplastic resin and has a thickness of 3-20 μm, provided on one side thereof and the heat conductive rubber layer 13 with a thickness of 30-200 μm provided on the other surface of the metal foil. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、電子・電子機器部品、特に液晶ディスプレイ、プラズマディスプレイ等の加熱圧着による接合等に用いられ、加熱圧着板の熱を被圧着体に伝達するための加熱圧着用複合シート、及びその製造方法に関する。   The present invention is used for bonding by thermocompression bonding of electronic / electronic device parts, particularly liquid crystal displays, plasma displays, etc., and a thermocompression bonding composite sheet for transferring heat of a thermocompression bonding plate to a member to be bonded, and its manufacture. Regarding the method.

従来、上記のような部品を用いた電子機器の製造プロセスにおいては、図1に示すプロセスに従って、図2に示す装置などを用いた加熱圧着作業が行われている。このプロセスは、1)液晶パネル1を搬送するパネル搬送工程、2)異方導電性フィルム2(ACF)を液晶パネル1の電極形成部1aに仮着する仮圧着工程、3)TAB3(又はCOG)を接合する位置に搭載する搭載工程、4)異方導電性フィルム2による本圧着工程から成っている。   2. Description of the Related Art Conventionally, in an electronic device manufacturing process using the above components, a thermocompression bonding operation using the apparatus shown in FIG. 2 or the like is performed according to the process shown in FIG. This process includes 1) a panel transporting process for transporting the liquid crystal panel 1, 2) a temporary press-bonding process for temporarily attaching the anisotropic conductive film 2 (ACF) to the electrode forming portion 1a of the liquid crystal panel 1, and 3) TAB3 (or COG). 4) a mounting step of mounting at a position where the bonding is performed, and 4) a main pressing step with the anisotropic conductive film 2.

この工程で使用されるフィルム(シートを含む、以下同様)や複合シートの代表的なものを、図3から図5に示す。現在では、これらのフィルム等を用いた加熱圧着方法が行われている。なお、異方導電性フィルム2は、加熱圧着板4によって加熱圧着されることで、上下に位置するTAB3の電極3aと液晶パネル1の電極1aとを電気的に接続する。   3 to 5 show typical films (including sheets, the same applies hereinafter) and composite sheets used in this step. At present, a thermocompression bonding method using these films or the like is performed. The anisotropic conductive film 2 is thermocompression bonded by the thermocompression bonding plate 4 to electrically connect the electrodes 3a of the TAB 3 and the electrodes 1a of the liquid crystal panel 1 positioned above and below.

図3に示すものは、PTFEフィルム21若しくは金属箔にフッ素樹脂コートを行って一体化した複合シート(例えば、特許文献1参照)である。   What is shown in FIG. 3 is a composite sheet (for example, refer to Patent Document 1) in which a PTFE film 21 or a metal foil is integrated by applying a fluororesin coat.

図4に示すものは、PTFEフィルム21とシリコーンゴムシート22の組み合わせ、若しくはPTFEフィルム21とシリコーンゴムシート22を一体化した複合シートである(例えば、特許文献2参照)。   4 shows a combination of PTFE film 21 and silicone rubber sheet 22, or a composite sheet in which PTFE film 21 and silicone rubber sheet 22 are integrated (see, for example, Patent Document 2).

図5に示すものは、ポリイミドフィルム23とシリコーンゴムシート22とガラスクロス含浸布24とを組み合わせたもの、若しくは一体化した複合シートである。   What is shown in FIG. 5 is a combination sheet of polyimide film 23, silicone rubber sheet 22, and glass cloth impregnated cloth 24, or an integrated composite sheet.

しかしならが、図3に示すタイプは、最近のように電子機器部品が大きくなると、加熱圧着時の当たりにムラが出来るために、大型の部品には使用できないといった欠点がある。   However, the type shown in FIG. 3 is disadvantageous in that it cannot be used for large-sized components because when electronic component components become large as in recent years, unevenness occurs at the time of thermocompression bonding.

また、図4と5に示すタイプのうち複数のフィルム等を使用するものでは、それぞれのフィルム等に対して、繰り出しと巻取りの装置が必要であるため夫々のフィルム強度がある程度なければ繰り出し巻取りに耐え切れず断裂してしまう。また、各フィルム(シート)間に空気が介在するため熱伝導性が悪くなり、圧着温度を高くするか加熱時間を長くしなければならない。そのため、生産性、省エネルギーといった観点から問題がある。また、夫々のフィルム(シート)を重ね合わせて使用するためにフィルム(シート)がシワになり易く、フィルム(シート)の有効使用率の低下や製品の歩留まり低下をもたらしている。更に、使用する材料の厚さが繰り出し巻取り装置に耐えうる厚さでなければ成らない為に経済性が悪い。   4 and 5 that use a plurality of films, etc., require a feeding and winding device for each film, etc., so that if each film does not have a certain degree of strength, the film is wound. It can't stand taking and tears. Moreover, since air intervenes between the films (sheets), the thermal conductivity is deteriorated, and it is necessary to increase the pressure bonding temperature or to increase the heating time. Therefore, there are problems from the viewpoint of productivity and energy saving. Further, since the films (sheets) are used in an overlapping manner, the films (sheets) are likely to be wrinkled, resulting in a decrease in the effective usage rate of the films (sheets) and a decrease in product yield. Furthermore, since the material used must have a thickness that can withstand the take-up and winding device, it is not economical.

一方、図4と5に示すタイプのうち、複数のフィルム等を一体化した複合シートを使用するものでは、層間の接着性の問題や、厚みが厚くなることによる熱伝導性の問題などが生じ易い。また、特に図4に示すタイプでは、樹脂又はゴム材料のみで構成されるため、熱変形の問題も生じ易い。
特開2003−100807号公報 特開平5−315401号公報
On the other hand, among the types shown in FIGS. 4 and 5, those using a composite sheet in which a plurality of films and the like are integrated cause problems of adhesion between layers and thermal conductivity due to increase in thickness. easy. In particular, the type shown in FIG. 4 is composed only of a resin or a rubber material, so that a problem of thermal deformation is likely to occur.
JP 2003-100807 A JP-A-5-315401

そこで、本発明の目的は、クッション性、熱伝導性、離型性が良好で、熱変形や層間剥離も生じにくい加熱圧着用複合シート、及びその製造方法を提供することにある。   Accordingly, an object of the present invention is to provide a thermocompression bonding composite sheet that has good cushioning properties, thermal conductivity, and releasability, and that hardly causes thermal deformation or delamination, and a method for manufacturing the same.

本発明者らは、上記目的を達成すべく鋭意研究したところ、離型層とゴム層とを金属箔を介して接着一体化しつつ、各層の厚みを所定の範囲とすることで上記目的を達成できることを見出し、本発明を完成するに至った。   As a result of intensive research to achieve the above object, the present inventors achieved the above object by bringing the release layer and the rubber layer into a predetermined range while adhering and integrating the release layer and the rubber layer through a metal foil. The present inventors have found that this can be done and have completed the present invention.

即ち、本発明の加熱圧着用複合シートは、金属箔と、その一方の面側に設けられフッ素系樹脂を含有する厚さ3〜20μmの離型層と、前記金属箔の他方の面側に設けられた厚さ30〜200μmの熱伝導性のゴム層とを具備することを特徴とする。   That is, the composite sheet for thermocompression bonding of the present invention has a metal foil, a release layer having a thickness of 3 to 20 μm, which is provided on one surface side and contains a fluorine-based resin, and the other surface side of the metal foil. And a thermally conductive rubber layer having a thickness of 30 to 200 μm provided.

本発明の加熱圧着用複合シートによると、金属箔が離型層とゴム層との間に介在するため、圧着時に熱変形や層間剥離が起こりにくく、熱伝導性も良好にすることができる。また、金属箔の一方の面側に、フッ素系樹脂を含有する適度な厚さの離型層を設けているため、熱伝導性を維持しつつ、離型性を良好にすることができる。更に、金属箔の他方の面側に適度な厚さの熱伝導性のゴム層を設けているため、熱伝導性およびクッション性を良好にすることができる。従って、加熱圧着時の当たりにムラが生じにくく、大型の部品にも使用することができる。   According to the composite sheet for thermocompression bonding of the present invention, since the metal foil is interposed between the release layer and the rubber layer, thermal deformation and delamination are unlikely to occur at the time of compression bonding, and the thermal conductivity can be improved. In addition, since a release layer having an appropriate thickness containing a fluororesin is provided on one surface side of the metal foil, the release property can be improved while maintaining thermal conductivity. Furthermore, since the heat conductive rubber layer having an appropriate thickness is provided on the other surface side of the metal foil, the heat conductivity and the cushioning property can be improved. Therefore, unevenness does not easily occur at the time of thermocompression bonding, and it can be used for large parts.

上記において、前記ゴム層は、シリコーンゴム及び金属化合物粒子を含有することが好ましい。シリコーンゴムは耐熱性が良好で、金属化合物粒子の含有によって熱伝導性を向上させることができる。   In the above, the rubber layer preferably contains silicone rubber and metal compound particles. Silicone rubber has good heat resistance, and the thermal conductivity can be improved by containing metal compound particles.

また、本発明の加熱圧着用複合シートは、金属箔を使用しているので、帯電防止機能が優れているが、更にこの機能を向上させるために、前記離型層に、カーボンブラックを添加して帯電防止機能を向上させることができる。帯電防止機能によって、電子部品等の静電気による破損や、粉塵の付着による問題を効果的に防止することができる。   In addition, since the composite sheet for thermocompression bonding of the present invention uses a metal foil, the antistatic function is excellent, but in order to further improve this function, carbon black is added to the release layer. Thus, the antistatic function can be improved. The antistatic function can effectively prevent problems such as damage caused by static electricity of electronic parts and the like and adhesion of dust.

一方、本発明の加熱圧着用複合シートの製造方法は、金属箔の一方の面側にフッ素系樹脂を含有するディスパージョンを塗布し、分散溶媒を蒸発除去した後に焼成して、厚さ3〜20μmの離型層を形成する工程と、前記金属箔の他方の面側に厚さ30〜200μmの熱伝導性のゴム層を形成する工程とを含むことを特徴とする。   On the other hand, in the method for producing a thermocompression bonding composite sheet according to the present invention, a dispersion containing a fluororesin is applied to one surface side of a metal foil, and the dispersion solvent is removed by evaporation, followed by firing. The method includes a step of forming a release layer having a thickness of 20 μm and a step of forming a heat conductive rubber layer having a thickness of 30 to 200 μm on the other surface side of the metal foil.

本発明の製造方法によると、上記のようなクッション性、熱伝導性、離型性が良好で、熱変形や層間剥離も生じにくい加熱圧着用複合シートを製造することができる。特に、上記のごとき方法で金属箔の表面に離型層とゴム層とが形成されるため、層間の接着性をより高めることができる。   According to the production method of the present invention, it is possible to produce a thermocompression-bonding composite sheet that has good cushioning properties, thermal conductivity, and releasability as described above, and that hardly undergoes thermal deformation or delamination. In particular, since the release layer and the rubber layer are formed on the surface of the metal foil by the method as described above, the adhesion between the layers can be further improved.

以下、本発明の実施の形態について、図面を参照しながら説明する。図1は、本発明の加熱圧着用複合シートの一例を示す断面図である。また、図2は、本発明の加熱圧着用複合シートの製造に用いられる装置の一例を示す概略構成図である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of the thermocompression bonding composite sheet of the present invention. Moreover, FIG. 2 is a schematic block diagram which shows an example of the apparatus used for manufacture of the composite sheet for thermocompression bonding of this invention.

本発明の加熱圧着用複合シートは、図1に示すように、金属箔12と、その一方の面側に設けられた離型層11と、金属箔12の他方の面側に設けられた熱伝導性のゴム層13とを具備する。   As shown in FIG. 1, the thermocompression bonding composite sheet of the present invention has a metal foil 12, a release layer 11 provided on one surface side thereof, and a heat provided on the other surface side of the metal foil 12. And a conductive rubber layer 13.

離型層11には、フッ素系樹脂を含有している。フッ素系樹脂としては、例えば、ポリテトラフルオロエチレン(PTFE)、テトラフルオロエチレン/ヘキサフルオロプロピレン共重合体(FEP)、テトラフルオロエチレン/パーフルオロアルキルビニルエーテル共重合体(PFA)、ポリフッ化ビニリデンなどが挙げられる。   The release layer 11 contains a fluorine resin. Examples of the fluororesin include polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), and polyvinylidene fluoride. Can be mentioned.

フッ素系樹脂は、カーボンブラックや金属粉などの導電性物質を添加して帯電防止機能を持たせたものでもよい。その場合、導電性物質の添加量は、離型層11中に5〜20重量%が好ましい。カーボンブラックとしては、ファーネスブラック、チャンネルブラック、サーマルブラック、アセチレンブラックなどが使用できる。   The fluororesin may be a resin having an antistatic function by adding a conductive material such as carbon black or metal powder. In that case, the addition amount of the conductive substance is preferably 5 to 20% by weight in the release layer 11. As carbon black, furnace black, channel black, thermal black, acetylene black, etc. can be used.

離型層11の厚みとしては、3〜20μmであり、5〜10μmが好ましい。厚さが3μm未満の場合は、離型層の機械的強度が無いために、ピンホール、傷等の欠陥部分が生じ易く離型効果が十分に発揮出来ない場合が生じる。また、20μmを越えると熱伝導率の低下を生じ実用上好ましくない。   The thickness of the release layer 11 is 3 to 20 μm, and preferably 5 to 10 μm. When the thickness is less than 3 μm, the release layer does not have the mechanical strength, so that defective portions such as pinholes and scratches are likely to occur, and the release effect may not be sufficiently exhibited. On the other hand, if it exceeds 20 μm, the thermal conductivity is lowered, which is not preferable for practical use.

ゴム層13には、シリコーンゴム、フッ素ゴム、アクリルゴムなどが使用される。ゴム層13は、熱伝導性であり、熱伝導性物質を含有する。熱伝導性物質としては、金属化合物粒子、金属粉末、ガラス類などが挙げられる。金属化合物粒子としては、窒化ボロン、窒化アルミニウムなどの金属窒化物、酸化マグネシウムなどの金属酸化物、炭化ケイ素などの金属炭化物などが挙げられる。熱伝導性物質の含有量としては、ゴム層13中に90〜95重量%が好ましい。   For the rubber layer 13, silicone rubber, fluorine rubber, acrylic rubber, or the like is used. The rubber layer 13 is thermally conductive and contains a thermally conductive substance. Examples of the thermally conductive substance include metal compound particles, metal powder, and glasses. Examples of the metal compound particles include metal nitrides such as boron nitride and aluminum nitride, metal oxides such as magnesium oxide, and metal carbides such as silicon carbide. The content of the heat conductive material is preferably 90 to 95% by weight in the rubber layer 13.

従って、ゴム層13を形成するには、市販品の放熱用シリコーンゴム加熱硬化タイプエラストマー(信越シリコーン製のKE1867、X‐32‐2020、X‐32‐2152、東レ・ダウコーニング製のSE4450、GE東芝シリコーン製のTSE3281‐G)を使用するのが好ましい。   Therefore, in order to form the rubber layer 13, a commercially available silicone rubber heat curing type elastomer for heat radiation (KE1867 made by Shin-Etsu silicone, X32-2020, X32-2152, SE4450 made by Toray Dow Corning, GE It is preferable to use TSE3281-G) manufactured by Toshiba Silicone.

ゴム層13の厚みとしては、30〜200μmであり、50〜200μmが好ましい。厚さが、30μm未満の場合はクッション効果が十分でなく、大型の電子機器の場合には、当たりが不均一になるという問題がある。反対に200μmを超えると、熱伝導率が悪くなり好ましくない。   The thickness of the rubber layer 13 is 30 to 200 μm, and preferably 50 to 200 μm. When the thickness is less than 30 μm, the cushioning effect is not sufficient, and in the case of a large-sized electronic device, there is a problem that the contact is not uniform. On the other hand, if it exceeds 200 μm, the thermal conductivity deteriorates, which is not preferable.

金属箔12は、市販のステンレス、アルミ、銅などを使用することができる。金属箔12の厚さは10〜50μmが好ましく、20〜30μmがより好ましい。10μmより薄いと作業性が悪くなり、シワが入り密着性に欠ける傾向があり、50μmより厚いと必要な熱伝導性を確保できない傾向がある。   As the metal foil 12, commercially available stainless steel, aluminum, copper, or the like can be used. 10-50 micrometers is preferable and, as for the thickness of the metal foil 12, 20-30 micrometers is more preferable. If the thickness is less than 10 μm, the workability is deteriorated and wrinkles tend to enter and lack in adhesion, and if it is thicker than 50 μm, the necessary thermal conductivity tends not to be ensured.

金属箔12には、必要に応じて、粗面化処理、プライマー処理などの接着性改善処理を行ってもよい。   If necessary, the metal foil 12 may be subjected to an adhesion improving process such as a roughening process or a primer process.

本発明の加熱圧着用複合シートは、本発明の製造方法、即ち、金属箔の一方の面側にフッ素系樹脂を含有するディスパージョンを塗布し、分散溶媒を蒸発除去した後に焼成して、厚さ3〜20μmの離型層を形成する工程と、前記金属箔の他方の面側に厚さ30〜200μmの熱伝導性のゴム層を形成する工程とを含む製造方法によって、好適に製造することができる。以下、本発明の製造方法について説明する。   The composite sheet for thermocompression bonding of the present invention is manufactured by the manufacturing method of the present invention, that is, a dispersion containing a fluororesin is applied to one surface side of a metal foil, the dispersion solvent is removed by evaporation, and then fired. It is preferably manufactured by a manufacturing method including a step of forming a release layer having a thickness of 3 to 20 μm and a step of forming a heat conductive rubber layer having a thickness of 30 to 200 μm on the other surface side of the metal foil. be able to. Hereinafter, the production method of the present invention will be described.

離型層を形成する工程で用いるディスパージョンは、水系の分散溶媒を含むものが好ましい。分散溶媒の蒸発除去は、分散溶媒の沸点付近の温度で行うのが好ましい。また、焼成は、フッ素系樹脂の融点以上の温度で行うのが好ましい。   The dispersion used in the step of forming the release layer preferably contains an aqueous dispersion solvent. The removal of the dispersion solvent by evaporation is preferably performed at a temperature near the boiling point of the dispersion solvent. The firing is preferably performed at a temperature equal to or higher than the melting point of the fluororesin.

離型層を形成する工程とゴム層を形成する工程とは、いずれを先に行ってもよいが、焼成温度の関係から、離型層を先に形成するのが好ましい。ディッピング(浸漬)による塗布を行う場合、二枚重ねた金属箔を使用し、塗布後に両者を剥離する方法が挙げられる。   Any of the step of forming the release layer and the step of forming the rubber layer may be performed first, but it is preferable to form the release layer first from the viewpoint of the firing temperature. In the case of applying by dipping (immersion), there is a method of using two stacked metal foils and peeling them after application.

ゴム層を形成する工程は、例えば金属箔の片面に溶剤に溶かしたゴム成分を塗布し、次に加熱して溶剤を飛散させる方法が挙げられる。必要であれば、この加熱工程で架橋(加硫)を行う。   The step of forming the rubber layer includes, for example, a method in which a rubber component dissolved in a solvent is applied to one side of a metal foil and then heated to scatter the solvent. If necessary, crosslinking (vulcanization) is performed in this heating step.

ゴム層を形成する方法として、上記したように溶剤に溶かしたゴム成分を塗布する代わりに、予めフィルム(シート)状に仕上げたゴム層に接着剤を用いて加熱圧着し、アルミ箔と貼り合せても良い。この場合に使用する接着剤としては、エポキシ系、シリコーン系、ゴム系などが挙げられる。   As a method of forming a rubber layer, instead of applying a rubber component dissolved in a solvent as described above, a rubber layer that has been finished in the form of a film (sheet) is heat-pressed with an adhesive and bonded to an aluminum foil. May be. Examples of the adhesive used in this case include an epoxy system, a silicone system, and a rubber system.

各層の形成には、各種コータを用いた塗工・加熱装置を使用することができる。例えば、ゴム層を形成する場合、図2に示す連続型の装置を使用することができる。この装置では、繰出ロール31から金属箔12(又は金属箔12と離型層11の積層体)を繰り出しながら、ガイドロールRを経由して、コンマロールコーター33でゴム成分を塗布し、乾燥ゾーン34で加熱乾燥させた後、ニップロール35で製品を挟みながら送り出し、巻取ロール36で製品を巻き取る。   For the formation of each layer, a coating / heating device using various coaters can be used. For example, when forming a rubber layer, the continuous type apparatus shown in FIG. 2 can be used. In this apparatus, the rubber component is applied by the comma roll coater 33 via the guide roll R while feeding the metal foil 12 (or the laminate of the metal foil 12 and the release layer 11) from the feeding roll 31, and the drying zone. After heating and drying at 34, the product is sent out while being sandwiched by the nip roll 35, and the product is taken up by the take-up roll 36.

このようにして得られた加熱圧着用複合シートは、電子・電子機器部品、特に液晶ディスプレイ、プラズマディスプレイ等をACFを用いて加熱圧着により接合するプロセスに好適に用いることができる。   The composite sheet for thermocompression bonding thus obtained can be suitably used for a process of joining electronic / electronic device parts, particularly a liquid crystal display, a plasma display, etc. by thermocompression bonding using ACF.

以下、本発明の構成と効果を具体的に示す実施例等について説明する。なお、実施例等における評価項目は下記のようにして測定を行った。   Examples and the like specifically showing the configuration and effects of the present invention will be described below. In addition, the evaluation item in an Example etc. measured as follows.

(1)熱伝導性
図1に示す加熱圧着装置(日化設備エンジニアリング(株)製、アニソルム熱圧着機AC−S50)を用いて、フレキシブル配線基板5とACF2とガラス板6とを積層し、上面に配置した加熱圧着用複合シートSを介して加熱圧着した。その際、設定温度300℃、設定圧力3.0MPa、設定時間20秒、複合シートSのサイズ25mm×100mmの条件で行い、ACF2の下面側の温度をデジタル温度計(理化工業(株)製、DP−500)の熱電対で測定した。設定温度300℃における到達温度によって、熱伝導性を評価した。
(1) Thermal conductivity Using the thermocompression bonding apparatus shown in FIG. 1 (manufactured by Nikka Equipment Engineering Co., Ltd., Anisolum thermocompression bonding machine AC-S50), the flexible wiring board 5, the ACF2, and the glass plate 6 are laminated, Thermocompression bonding was performed through the thermocompression bonding composite sheet S disposed on the upper surface. At that time, the setting temperature is 300 ° C., the setting pressure is 3.0 MPa, the setting time is 20 seconds, the size of the composite sheet S is 25 mm × 100 mm, and the temperature on the lower surface side of the ACF 2 is a digital thermometer (Rika Kogyo Co., Ltd., DP-500). The thermal conductivity was evaluated by the reached temperature at a set temperature of 300 ° C.

(2)クッション性
上記(1)の加熱圧着試験において、ガラス板の裏側から顕微鏡によってACF内の導電性粒子の変形を観察することで評価した。○はACF内の導電性粒子が均等に変形した場合、×はACF内の導電性粒子が均等に変形してない場合である。
(2) Cushioning property In the thermocompression bonding test of (1) above, evaluation was performed by observing deformation of conductive particles in the ACF from the back side of the glass plate with a microscope. ○ is when the conductive particles in the ACF are uniformly deformed, and × is when the conductive particles in the ACF are not uniformly deformed.

(3)熱変形性
上記(1)の加熱圧着試験において、目視により複合シートSの変形の程度を評価した。○は熱変形が全くない、×は熱変形が発生する場合である。
(3) Thermal deformability In the thermocompression bonding test of (1) above, the degree of deformation of the composite sheet S was evaluated visually. A circle indicates no thermal deformation, and a circle indicates a case where thermal deformation occurs.

(4)離型性
上記(1)の加熱圧着において、加熱後、加熱圧着板が開放する時に複合シートSが加熱圧着板に付着するか付着しないかを目視で評価した。○は加熱圧着板に複合シートSが付着しない場合、×は加熱圧着板に複合シートSが付着する場合である。
(4) Releasability In the thermocompression bonding of (1) above, it was visually evaluated whether the composite sheet S adhered to the thermocompression bonding plate or not when the thermocompression bonding plate was opened after heating. ○ indicates that the composite sheet S does not adhere to the thermocompression bonding plate, and x indicates that the composite sheet S adheres to the thermocompression bonding plate.

〔実施例1〕
二枚重ねたアルミ箔(厚さ25μm)にフッ素系樹脂PTFEの水系ディスパージョン(旭ガラス社製、フルオンAD−938)をディッピング(浸漬)により塗布し、100℃で4分間加熱して水分を蒸発除去した。その後、約400℃で加熱し、二枚重ねたアルミ箔どうしを剥し、アルミ箔片面に厚み5μmのフッ素樹脂の離型層を形成した。このアルミ箔の片面に、溶剤(トルエン)と金属化合物粒子を含むゴム成分(放熱用シリコーンゴム、加熱硬化タイプエラストマー、信越シリコーン製KE1867、希釈ベース濃度90重量%)をコンマコーターで塗布し、次に150℃で5分間加熱して、溶剤の飛散と架橋を行って厚み200μmの熱伝導性のゴム層を形成し、加熱圧着用複合シートを作製した。なお、ゴム層と離型層とは金属箔に十分な強度で接着しており、層間剥離させるのは困難であった(実施例2〜5も同様)。
[Example 1]
An aqueous dispersion of fluororesin PTFE (Asahi Glass Co., Ltd., Fullon AD-938) was applied by dipping (immersion) on two aluminum foils (thickness 25 μm) and heated at 100 ° C. for 4 minutes to evaporate and remove moisture. did. Then, it heated at about 400 degreeC, the aluminum foil which piled up two sheets was peeled, and the mold release layer of the fluororesin with a thickness of 5 micrometers was formed in the aluminum foil single side | surface. Apply a rubber component containing solvent (toluene) and metal compound particles (heat-dissipating silicone rubber, heat-curing type elastomer, Shin-Etsu Silicone KE1867, dilution base concentration 90% by weight) on one side of this aluminum foil with a comma coater. The mixture was heated at 150 ° C. for 5 minutes to disperse and crosslink the solvent to form a heat conductive rubber layer having a thickness of 200 μm, thereby producing a thermocompression bonding composite sheet. The rubber layer and the release layer were adhered to the metal foil with sufficient strength, and it was difficult to delaminate (the same applies to Examples 2 to 5).

〔実施例2〜5〕
実施例1において、各層の厚みを表1に示す値に設定すること以外は、実施例1と同様にして加熱圧着用複合シートを作製した。なお、フッ素樹脂の離型層が厚み10μmの場合には、塗布、乾燥、焼成を2回づつ繰り返した。
[Examples 2 to 5]
In Example 1, a composite sheet for thermocompression bonding was produced in the same manner as in Example 1 except that the thickness of each layer was set to the values shown in Table 1. When the fluororesin release layer had a thickness of 10 μm, coating, drying and firing were repeated twice.

〔比較例1〜4〕
実施例1において、各層の厚みを表1に示す値に設定すること以外は、実施例1と同様にして加熱圧着用複合シートを作製した。なお、フッ素樹脂の離型層が厚み30μmの場合には、塗布、乾燥、焼成を4回づつ繰り返した。
[Comparative Examples 1-4]
In Example 1, a composite sheet for thermocompression bonding was produced in the same manner as in Example 1 except that the thickness of each layer was set to the values shown in Table 1. When the fluororesin release layer had a thickness of 30 μm, coating, drying, and firing were repeated four times.

これらの実施例1〜6、比較例1〜4で得られた加熱圧着用複合シートを用いて、前記の評価を実施した。これらの結果を下記の表1に示す。   Said evaluation was implemented using the composite sheet for thermocompression bonding obtained in these Examples 1-6 and Comparative Examples 1-4. These results are shown in Table 1 below.

Figure 2006142611
表1の結果が示すように、実施例1〜6は何れも熱伝導性、クッション性、耐熱性、離型性ともに良好な値を示している事が判る。これに対し、比較例1、3はPTFE層の厚さが3μmの為離型性がない。比較例1、4はシリコーンゴム層が20μmの為、クッション性がない。比較例2、3はシリコーンゴム層が220μmの為、熱伝導性がないことがわかる。
Figure 2006142611
As shown in the results of Table 1, it can be seen that Examples 1 to 6 all show good values for thermal conductivity, cushioning properties, heat resistance, and releasability. On the other hand, Comparative Examples 1 and 3 have no releasability because the thickness of the PTFE layer is 3 μm. Comparative Examples 1 and 4 do not have cushioning properties because the silicone rubber layer is 20 μm. It can be seen that Comparative Examples 2 and 3 have no thermal conductivity because the silicone rubber layer is 220 μm.

本発明の加熱圧着用複合シートの一例を示す断面図Sectional drawing which shows an example of the composite sheet for thermocompression bonding of this invention 本発明の加熱圧着用複合シートの製造に用いられる装置の一例を示す概略構成図The schematic block diagram which shows an example of the apparatus used for manufacture of the composite sheet for thermocompression bonding of this invention 従来のACFを用いた製造プロセスの一例を示す工程図Process diagram showing an example of a manufacturing process using a conventional ACF 従来のACFを用いた製造プロセスの加熱圧着工程の一例を示す斜視図The perspective view which shows an example of the thermocompression bonding process of the manufacturing process using the conventional ACF 従来のACFを用いた製造プロセスの加熱圧着工程の一例を示す斜視図The perspective view which shows an example of the thermocompression bonding process of the manufacturing process using the conventional ACF 従来のACFを用いた製造プロセスの加熱圧着工程の一例を示す斜視図The perspective view which shows an example of the thermocompression bonding process of the manufacturing process using the conventional ACF 従来のACFを用いた製造プロセスの加熱圧着工程の一例を示す斜視図The perspective view which shows an example of the thermocompression bonding process of the manufacturing process using the conventional ACF 実施例等の評価で用いた加熱圧着装置の一例を示す概略構成図Schematic configuration diagram showing an example of a thermocompression bonding apparatus used in the evaluation of Examples etc.

符号の説明Explanation of symbols

11 離型層
12 金属箔
13 ゴム層
S 加熱圧着用複合シート
11 Release layer 12 Metal foil 13 Rubber layer S Composite sheet for thermocompression bonding

Claims (4)

金属箔と、その一方の面側に設けられフッ素系樹脂を含有する厚さ3〜20μmの離型層と、前記金属箔の他方の面側に設けられた厚さ30〜200μmの熱伝導性のゴム層とを具備する加熱圧着用複合シート。   Metal foil, a release layer having a thickness of 3 to 20 μm provided on one surface side and containing a fluorine-based resin, and a thermal conductivity of 30 to 200 μm in thickness provided on the other surface side of the metal foil. A composite sheet for thermocompression bonding comprising a rubber layer. 前記ゴム層は、シリコーンゴム及び金属化合物粒子を含有する請求項1記載の加熱圧着用複合シート。   The composite sheet for thermocompression bonding according to claim 1, wherein the rubber layer contains silicone rubber and metal compound particles. 前記離型層は、カーボンブラックを添加して帯電防止機能を持たせたものである請求項1又は2に記載の加熱圧着用複合シート。   The composite sheet for thermocompression bonding according to claim 1 or 2, wherein the release layer is provided with an antistatic function by adding carbon black. 金属箔の一方の面側にフッ素系樹脂を含有するディスパージョンを塗布し、分散溶媒を蒸発除去した後に焼成して、厚さ3〜20μmの離型層を形成する工程と、前記金属箔の他方の面側に厚さ30〜200μmの熱伝導性のゴム層を形成する工程とを含む加熱圧着用複合シートの製造方法。
Applying a dispersion containing a fluorine-based resin on one surface side of the metal foil, evaporating and removing the dispersion solvent, and firing to form a release layer having a thickness of 3 to 20 μm; And a step of forming a thermally conductive rubber layer having a thickness of 30 to 200 μm on the other surface side.
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