JP6726862B2 - Heat dissipation device for heat-generating electronic components and in-vehicle charger - Google Patents

Description

The present invention, heat-generating electronic component of the heat dissipation device, a contact and on-board charger.

Conventionally, it is known that a substrate or an electronic component is stored in a substantially rectangular parallelepiped casing formed of a heat radiating member, and heat generated from the electronic component is radiated through the casing. As a method of manufacturing such a structure of a substantially rectangular parallelepiped housing, a method of integrally covering the upper surface and the side surface into a box shape and covering the housing with an opened lower surface from above, and a method of forming the lower surface (bottom surface) and the side surface into a box shape There are two known methods of covering a housing that is integrally molded with a casing having an opened upper surface with a lid member (upper surface).

When using a method in which the top and side surfaces are integrally molded into a box shape and the bottom surface is opened from the top, the side surface does not exist when mounting a substrate or electronic component on the bottom surface, so the electronic components However, on the other hand, there are restrictions on the arrangement of terminals (connectors) for electrically connecting the electronic components stored in the housing to the electronic components outside the housing.

In general, when the connector is provided on the side surface, it is preferable to use a method of covering the housing having the lower surface and the side surface integrally formed in a box shape and having the upper surface opened with the lid member (upper surface).

However, in the method in which the lid member (upper surface) is covered on the housing in which the lower surface and the side surface are integrally molded in the box shape and the upper surface is opened, the lower surface and the side surface are integrally molded in the box shape, so It is impossible to screw electronic components, and it is necessary to screw them from the opened top surface.

As a method of screwing to fix the electronic component from the opened upper surface, the lead wire of the heat-generating electronic component is bent to dispose the heat-dissipating surface of the heat-generating electronic component in direct contact with the bottom surface. It is conceivable to screw the elastic member from above so that the elastic member disclosed in 1) presses the surface opposite to the heat radiation surface.

JP, 2002-217343, A

However, in the above-described method of disposing the heat-generating electronic component on the bottom surface of the heat-dissipating mechanism, the area of the portion of the bottom surface of the heat-dissipating mechanism that is in contact with the heat-dissipating surface of the heat-dissipating electronic component and the elastic member are provided in order to secure the heat-dissipating effect. The area of the part is required, and there is a possibility that the bottom area becomes large and that the entire apparatus becomes large.

An object of the present invention is to dissipate heat in a heat-generating electronic component that is capable of coping with heat dissipation in a heat-generating electronic component while suppressing an increase in size when using a heat-dissipating mechanism that is integrally molded in a box shape and has an opening provided on only one surface. apparatus, is to provide you and the vehicle-mounted charger.

In a heat dissipation device for heat-generating electronic components according to an aspect of the present invention, a heat generating electronic component having a circuit board, a lead wire that self-heats when energized, and has a lead wire connected to the circuit board, and a heat radiating surface of the heat generating electronic component are in contact A heat transfer body on which the heat-generating electronic component is arranged, a first surface integrally formed in a box shape, on which the heat transfer body is arranged, and an opening provided opposite to the first surface. A heat dissipating component that dissipates heat from the heat transfer body, and the heat generating electronic component is fixed to a surface of the heat transfer body that intersects the first surface. is, the heat transfer body and the circuit board, along a first direction perpendicular to the first surface, the heat transfer from the first surface, are arranged in the order of the circuit board The heat transfer body has a housing portion in which a space for housing the component is provided, and the component is thermally connected to the heat dissipation component via the housing portion .

An in- vehicle charger according to an aspect of the present invention, a circuit board, a heat-generating electronic component having a lead wire that is self-heated by energization and connected to the circuit board, and a heat-radiating surface of the heat-generating electronic component are in contact with each other, and A heat transfer body on which the heat-generating electronic component is arranged, a first surface formed in a box shape on which the heat transfer body is arranged, and a second surface facing the first surface and provided with an opening. A heat-dissipating component that dissipates heat from the heat conductor, and the heat-generating electronic component is fixed to a surface of the heat conductor that intersects the first surface, The heat body and the circuit board are arranged in this order from the first surface to the heat transfer body and the circuit board along a first direction perpendicular to the first surface. The body has an accommodating portion provided with a space for accommodating the component, and the component is thermally connected to the heat dissipation component via the accommodating portion .

According to the present invention, when a heat dissipation mechanism integrally formed in a box shape and having an opening provided on only one surface is used, it is possible to cope with heat dissipation of heat-generating electronic components while suppressing an increase in size.

The perspective view which shows an example of the heat dissipation structure of the heat-generating electronic component which concerns on embodiment of this invention. The front view which shows an example of the heat dissipation structure of the heat generating electronic component which concerns on embodiment of this invention. The side view which shows an example of the heat dissipation structure of the heat generating electronic component which concerns on embodiment of this invention. The top perspective view which shows an example of the heat dissipation structure of the heat generating electronic component which concerns on embodiment of this invention. The top perspective view which shows the structural example of the heat dissipation structure of the heat-generating electronic component which concerns on the modification 1 of this invention. The top perspective view which shows the structural example of the heat dissipation structure of the heat-generating electronic component which concerns on the modification 2 of this invention.

(Embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First, a configuration example of the heat dissipation structure 1 of the heat-generating electronic component according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing an example of a heat dissipation structure 1 of a heat-generating electronic component. FIG. 2 is a front view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 3 is a side view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. FIG. 4 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component. 1 and 2, the illustration of the front surface portion of the heat sink 2 is omitted, and in FIG. 3, the illustration of the side surface portion of the heat sink 2 is omitted. Further, in FIG. 4, the circuit board 9 shown in FIGS. 1 to 3 is omitted.

The heat dissipation structure 1 of the heat-generating electronic component is used, for example, in a charger, an inverter or the like mounted on a vehicle. The heat dissipation structure 1 of the heat-generating electronic component includes a heat sink 2, an aluminum block 3, electronic components 5a and 5b, and a circuit board 9.

The heat sink 2 (an example of a heat dissipation mechanism) is integrally molded in a box shape, and an opening is provided only on one surface. F1 is an opening surface (an example of a second surface), and F2 is a bottom surface (an example of a first surface) facing the opening surface F1.

Posts 2a, 2b, 2c, and 2d are provided at four corners of the bottom surface F2 of the heat sink 2 along a vertical direction D (hereinafter, simply referred to as “vertical direction”) with respect to the bottom surface F2. Screw holes (not shown) are formed in each of the columns 2a to 2d, and a circuit board 9 described later is screwed thereto.

The aluminum block 3 (an example of a heat transfer body) is a substantially rectangular parallelepiped member made of aluminum. The aluminum block 3 is arranged inside the heat sink 2 such that its longitudinal direction is along the vertical direction D.

The aluminum block 3 has a substantially rectangular parallelepiped fastening portion 3a at the bottom thereof. The fastening portion 3a is screwed to the bottom surface F2 with screws 4a and 4b (an example of a fixing member). As a result, the aluminum block 3 is fixed in contact with the bottom surface F2.

The electronic components 5a and 5b (an example of heat-generating electronic components) are electronic components that self-heat when energized, such as discrete components and FETs (Field Effect Transistors). The electronic components 5a and 5b have lead wires 6a and 6b, respectively.

The electronic components 5a and 5b are attached to the aluminum block 3 such that the heat radiation surfaces of the electronic components 5a and 5b come into contact with the side surfaces of the aluminum block 3. For example, the electronic components 5a and 5b are pressed by the springs 7a and 7b (an example of a holding member) from the surface facing the heat radiation surface, and are fixedly held on the side surface of the aluminum block 3. The springs 7a and 7b are screwed to the side surfaces of the aluminum block 3 by screws 8a and 8b, respectively.

The electronic components 5a and 5b fixed to the aluminum block 3 are upright along the vertical direction D. Further, the electronic components 5 a and 5 b fixed to the aluminum block 3 do not come into contact with the heat sink 2.

The heat generated from the electronic components 5a and 5b fixed to the aluminum block 3 as described above is transferred to the heat sink 2 via the aluminum block 3. Thereby, heat dissipation of the electronic components 5a and 5b is realized.

1 to 4, two electronic components are fixed to the aluminum block 3 as an example, but the number may be one, or three or more. Further, the plurality of electronic components may be fixed to not only one surface of the aluminum block 3 but also a plurality of surfaces.

The circuit board 9 is a printed board on which a pattern is formed and a predetermined semiconductor element (not shown) is mounted. The circuit board 9 is placed on the columns 2a to 2d described above. Then, the circuit board 9 is screwed to the columns 2a to 2d with screws 10a, 10b, 10c, and 10d. As a result, the circuit board 9 is fixed to the columns 2a to 2d.

The circuit board 9 is connected to the lead wire 6a of the electronic component 5a and the lead wire 6b of the electronic component 5b by, for example, soldering.

The aluminum block 3 and the circuit board 9 are arranged along the vertical direction D in this order from the bottom surface F2 to the aluminum block 3 and the circuit board 9.

Further, the aluminum block 3 and the circuit board 9 are bonded and fixed to each other by bonds 11a and 11b (an example of an adhesive member). As a result, the number of fixing points on the circuit board 9 increases, and it is possible to prevent the lead wires 6a and 6b from being broken. This is particularly effective when the columns 2a to 2d are high and a large amount of vibration occurs.

Further, the bonds 11a and 11b preferably have at least one of insulating property and heat dissipation property. When the bonds 11a and 11b have an insulating property, a pattern can be formed or a semiconductor element can be mounted on the circuit board 9 at a position corresponding to the bonds 11a and 11b. Further, when the bonds 11a and 11b have a heat dissipation property, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 through the bonds 11a and 11b.

Although not shown in FIGS. 1 to 4, a cover for closing the opening face F1 may be provided above the circuit board 9.

As described above, in the heat dissipation structure 1 for heat-generating electronic components according to the present embodiment, the heat dissipation surfaces of the electronic components 5a and 5b are arranged in contact with the aluminum block 3 arranged in contact with the heat sink 2. As compared with the case where the heat radiating surfaces of the electronic components 5a and 5b are placed in contact with the bottom surface F2 of the heat sink 2, it is possible to cope with heat radiating of the electronic components while suppressing an increase in size.

The configuration example of the heat dissipation structure 1 of the heat-generating electronic component has been described above.

Next, a method of manufacturing the heat dissipation structure 1 of the heat-generating electronic component will be described with reference to FIGS.

First, the electronic components 5a and 5b are fixed and adhered to the aluminum block 3 using the springs 7a and 7b and the screws 8a and 8b. At this time, the heat dissipation surfaces of the electronic components 5a and 5b are brought into contact with the aluminum block 3. If the electronic components 5a and 5b are of a type that requires insulation, it is preferable to provide a heat radiation insulating sheet (not shown) between the heat radiation surface of the electronic components 5a and 5b and the aluminum block 3.

Next, the aluminum block 3 to which the electronic components 5a and 5b are fixed is housed inside the heat sink 2 from the opening face F1 of the heat sink 2, and the aluminum block 3 is arranged on the bottom face F2. Then, the fastening portion 3a is screwed to the bottom surface F2 using the screws 4a and 4b.

Next, the circuit board 9 is housed inside the heat sink 2 from the opening surface of the heat sink 2 and arranged on the columns 2a to 2d. At this time, the lead wires 6a and 6b are soldered to the circuit board 9. Then, the circuit board 9 is screwed to the columns 2a to 2d using the screws 10a to 10d.

By the above manufacturing method, the heat dissipation structure 1 of the heat-generating electronic component shown in FIGS. 1 to 4 is manufactured.

A cover (not shown) that closes the opening surface F1 may be provided above the circuit board 9 after the circuit board 9 is screwed.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and various modifications can be made. Hereinafter, modified examples will be described.

(Modification 1)
The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 5 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to the present modification. 5, the same components as those in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 5, the circuit board 9 shown in FIGS. 1 to 3 is omitted.

As shown in FIG. 5, the present modification example is different from FIGS. 1 to 4 in that the heat sink 2 includes an aluminum block 30 and an electronic component 32.

The aluminum block 30 has a substantially rectangular parallelepiped fastening portion 30a at the bottom thereof. In addition, in FIG. 5, only the fastening portion 30a between the columns 2a and 2b is shown, but similarly, the fastening portion 30a exists between the columns 2d and 2c.

The fastening portion 30a is screwed to the bottom surface F2 with the screw 31. As a result, the aluminum block 30 is fixed in contact with the bottom surface F2.

The aluminum block 30 also has a housing portion 30b in which a substantially rectangular parallelepiped space is provided. An electronic component 32 (for example, a reactor component, which is an example of a tall component) is accommodated in the space of the accommodation portion 30b. The bottom surface of the electronic component 32 contacts and is fixed to the bottom surface F2 of the heat sink 2. Although illustration is omitted, a potting material is filled between the electronic component 32 and the housing portion 30b.

The electronic component 32 is arranged upright between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3) such that the longitudinal direction of the electronic component 32 is along the vertical direction D (see FIGS. 1 to 3). It The length of the electronic component 32 in the vertical direction D (the length of the electronic component 32 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the length of the electronic components 5a and 5b in the longitudinal direction). Longer than.

In this way, by disposing the electronic component 32 on the bottom surface F2, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not increase in size in the height direction (vertical direction D).

According to this modification, in addition to the effect described in the first embodiment, the electronic component 32 arranged on the bottom surface F2 of the heat sink 2 can be fixed (vibration countermeasure). When the potting material is a heat-dissipating potting material, the electronic component 32 can be fixed (vibration countermeasure) and heat can be dissipated.

(Modification 2)
The heat dissipation structure 1 of the heat-generating electronic component according to this modification will be described with reference to FIG. FIG. 6 is a top perspective view showing an example of the heat dissipation structure 1 of the heat-generating electronic component according to the present modification. In FIG. 6, the same components as those in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted. Further, in FIG. 6, the circuit board 9 shown in FIGS. 1 to 3 is omitted.

In this modified example, as shown in FIG. 6, the heat sink 2 is provided with electronic components 33 and 34, which is different from FIGS. 1 to 4.

The electronic components 33 and 34 (for example, a reactor component, an example of a high-profile component) are in contact with and fixed to the bottom surface F2 of the heat sink 2.

The electronic components 33 and 34 are erected so that the longitudinal direction of the electronic components 33 and 34 is along the vertical direction D (see FIGS. 1 to 3) between the bottom surface F2 and the circuit board 9 (see FIGS. 1 to 3). Will be placed. The length of the electronic components 33 and 34 in the vertical direction D (the length of the electronic components 33 and 34 in the longitudinal direction) is the length of the electronic components 5a and 5b in the vertical direction D (the longitudinal direction of the electronic components 5a and 5b). Longer than).

By arranging the electronic components 33 and 34 on the bottom surface F2 in this manner, a space is provided between the circuit board 9 and the bottom surface F2, and the aluminum block 3 can be arranged in the space. Therefore, the heat dissipation structure 1 of the heat-generating electronic component does not increase in size in the height direction (vertical direction D).

In this modification, in addition to the effect described in the first embodiment, heat dissipation of the electronic components 33 and 34 arranged on the bottom surface F2 of the heat sink 2 can also be performed.

(Modification 3)
In the embodiment, the case where air cooling is performed using the heat sink 2 has been described as an example, but water cooling may be applied instead of air cooling.

(Modification 4)
In the embodiment, the case where screws are used for fastening to the bottom surface F2 of the aluminum block 3, fastening of the springs 7a and 7b to the aluminum block 3, and fastening to the columns 2a to 2d of the circuit board 9 has been described as an example. However, a bond may be used instead of the screw. Further, in the embodiment, the case where the spring is used to fix the electronic components 5a and 5b to the aluminum block 3 has been described as an example, but a screw may be used instead of the spring.

(Modification 5)
Further, although the aluminum block 3 and the circuit board 9 are described as an example in which the aluminum blocks 3 and the circuit board 9 are bonded and fixed to each other by the bonds 11a and 11b (an example of an adhesive member), grease, a gap filler (an example of a heat dissipation member), or the like. A heat dissipation member having no adhesiveness may be provided between the aluminum block 3 and the circuit board 9. Thereby, the heat generated in the circuit board 9 can be transferred to the aluminum block 3 via the grease, the gap filler, or the like. Further, when the grease or the gap filler has an insulating property, it is possible to form a pattern or mount a semiconductor element on a portion of the circuit board 9 corresponding to the grease or the gap filler.

The present invention, heat-generating electronic component of the heat dissipation device, useful for your and board charger.

DESCRIPTION OF SYMBOLS 1 Heat dissipation structure of heat-generating electronic components 2 Heat sinks 2a, 2b, 2c, 2d Struts 3, 30 Aluminum blocks 3a, 30a Fastening parts 4a, 4b, 8a, 8b, 10a, 10b, 10c, 10d, 31 Screws 5a, 5b Electronic components 6a, 6b Lead wire 7a, 7b Spring 9 Circuit board 30b Storage part 32, 33, 34 Electronic component

Claims (12)

Circuit board,
A heat-generating electronic component that has a lead wire that is self-heated by energization and that is connected to the circuit board;
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is in contact with the heat generating electronic component,
From the heat transfer body, which is integrally molded in a box shape and has a first surface on which the heat transfer body is arranged and a second surface facing the first surface and provided with an opening. And a heat dissipation component that dissipates the heat of
The heat-generating electronic component is fixed to a surface of the heat transfer body that intersects with the first surface,
The heat transfer body and the circuit board, along a first direction perpendicular to the first surface, the heat transfer from the first surface, are arranged in the order of the circuit board,
The heat transfer body has a housing portion provided with a space for housing components,
The component is thermally connected to the heat dissipation component via the accommodation portion,
Heat dissipation device for heat-generating electronic components. The heat-generating electronic component is
The heat generating electronic component is fixed to the heat transfer body in a state in which the longitudinal direction thereof is parallel to the first direction and in a state of not contacting the heat radiating component,
The heat dissipation device for the heat-generating electronic component according to claim 1. The heat transfer body is
The circuit board is adhered and fixed by an adhesive member,
The heat dissipation device for the heat-generating electronic component according to claim 1. The adhesive member is
Having at least one of insulation and heat dissipation,
The heat dissipation device for the heat-generating electronic component according to claim 3. A heat dissipation member is disposed between the heat transfer body and the circuit board,
The heat dissipation device for the heat-generating electronic component according to claim 1. A member having an insulating property and a heat dissipation property is disposed between the heat transfer member and the circuit board,
In the circuit board, a pattern is formed at a location corresponding to the member having the insulating property and the heat dissipation property,
The heat dissipation device for the heat-generating electronic component according to claim 1. The insulating and heat-dissipating member also has adhesiveness,
The heat dissipation device for the heat-generating electronic component according to claim 6 . The component is a high-profile component between the bottom surface of the heat dissipation component and the circuit board,
The length of the high-height component in the first direction is longer than the length of the heat-generating electronic component in the first direction,
The heat dissipation device for the heat-generating electronic component according to claim 1 . The bottom surface of the component is fixed in contact with the bottom surface of the heat dissipation component,
Heat radiator of the heat generating electronic component according to claim 1 or 8. The accommodating portion is filled with a heat-dissipating potting material,
A heat dissipation device for a heat-generating electronic component according to any one of claims 1 to 9 . The heat transfer body is
Fixed in contact with the first surface of the heat dissipation component,
The heat dissipation device for the heat-generating electronic component according to claim 1. Circuit board,
A heat-generating electronic component that has a lead wire that is self-heated by energization and that is connected to the circuit board;
A heat transfer body in which the heat dissipation surface of the heat generating electronic component is in contact with the heat generating electronic component,
A box-shaped molded body having a first surface on which the heat transfer body is arranged and a second surface facing the first surface and provided with an opening, And a heat dissipation component that dissipates heat,
The heat-generating electronic component is fixed to a surface of the heat transfer body that intersects with the first surface,
The heat conductor and the circuit board are arranged along a first direction perpendicular to the first surface,
The heat transfer from the first surface, are arranged in the order of the circuit board,
The heat transfer body has a housing portion provided with a space for housing components,
The component is thermally connected to the heat dissipation component via the accommodation portion,
In-vehicle charger.