JP6473307B2 - Manufacturing method of conductor for electric wire - Google Patents

Description

  The present invention relates to a conductor for electric wires used in automobiles, robots and the like.

  First, electric wires used for automobiles, robots, and the like include a power supply signal line and a signal line. Of these, a signal line is generally used in which a conductor obtained by bundling a plurality of copper wires is covered with an insulator. As the conductor of the signal line, a conductor with excellent bending resistance is required, and a soft copper wire having a flexible wire diameter is often used.

However, in a movable part of an electronic device used for an automobile, a robot, or the like, there is a part where bending or twisting is applied, and if the signal line is used in such a part, there is a problem that metal fatigue is likely to cause disconnection. there were.
In addition, when the signal line is attached to an automobile or a robot, there is a problem that it is difficult to work because the tensile strength is weak.

  On the other hand, a metal-coated fiber obtained by performing plating on a high-strength fiber substrate such as an aramid fiber as described in Patent Document 1 is disclosed, and such a metal-coated fiber is used as a conductor for electric wires such as signal lines Considered to use.

JP 2010-059532 A

  However, when only a metal-coated fiber as described in Patent Document 1 is used as a conductor for an electric wire, although it is excellent in bending resistance, it is difficult to obtain an electric resistance necessary for a signal line. For example, the thickness of a metal plating film provided on the fiber It was necessary to increase the number of metal plating fibers to be thickened or bundled. And, in order to obtain the electric resistance necessary for the signal line, it is necessary to make the thickness of the metal plating film 2 μm or more. If the film thickness is increased in this way, the metal plating film is liable to break and the bending resistance is lowered. Happened. Alternatively, when the number of metal plating fibers to be bundled is increased, the wire diameter of the conductor is increased, and there is a problem that workability when attaching electric wires such as signal wires is lowered.

  Moreover, when providing a metal plating film on a fiber, in order to improve the adhesiveness of a fiber base material and a metal plating film as described in Patent Document 1, the metal plating film is applied after plasma treatment on the fiber base material. Although there is a method of providing, this method has a problem that the tensile strength of the fiber base material itself is lowered, and as a result, workability when attaching electric wires such as signal wires is lowered.

  Usually, when a metal plating film is provided on a fiber, the fiber base is treated with an acid or alkali to form fine irregularities on the surface of the fiber base, and the metal plating film is bitten into the irregularities. This improves the adhesion between the metal and the metal plating film, but this also reduces the tensile strength of the fiber base material itself, resulting in a problem of reduced workability when attaching electric wires such as signal wires. there were.

  Accordingly, an object of the present invention is to provide an electric wire conductor that has an electric resistance necessary as an electric wire conductor such as a signal line, is excellent in bending resistance, and is excellent in tensile strength.

The electric wire conductor of the present invention is an electric wire conductor of the following (A) or (B), (A) an electric wire conductor formed by twisting at least one metal wire and a plurality of metal-coated fibers, B) An electric wire conductor in which a metal wire is spirally wound on the outside of at least one metal-coated fiber, and further, the metal-coated fiber is provided with a plating base layer on a fiber base material, and there is no coating on the plating base layer. A metal plating film is provided by an electrolytic plating method, and the plating base layer functions as a compound having (i) a heterocyclic ring and (ii) an oxidant on a fiber base material, and a catalytic ability of electroless plating. By contacting with a metal salt having an acid, a compound having a heterocyclic ring in an oxidized state on the fiber substrate is polymerized on the surface of the fiber substrate and reduced and adsorbed on the surface of the polymer compound. Ri Do and a metal which acts as a catalyst, wherein Compounds having a heterocycle is Pirorumonoma - and metal salts having catalytic ability of functional and non-electrolytic plating as the oxidizing agent, wherein the palladium chloride der Rukoto.

  The electric wire conductor of the present invention has electrical resistance necessary for electric wire conductors such as signal lines, for example, has excellent bending resistance and excellent tensile strength.

(A) The figure explaining the cross-sectional state of the conductor for electric wires formed by twisting together at least one metal wire and a plurality of metal-coated fibers. (B) The figure explaining the conductor for electric wires which wound the metal wire helically on the outer side of at least 1 metal-coated fiber.

The present invention will be described in detail.
The present invention is the following (A) or (B) electric wire conductor, (A) an electric wire conductor formed by twisting at least one metal wire and a plurality of metal-coated fibers, (B) at least one A conductor for electric wire in which a metal wire is spirally wound on the outer side of the metal-coated fiber, and further, the metal-coated fiber is provided with a plating base layer on a fiber substrate, and the electroplating method is applied on the plating base layer A metal salt provided with a metal plating film, wherein the plating base layer is (i) a compound having a heterocyclic ring, and (ii) a metal salt that functions as an oxidizing agent and has a catalytic ability for electroless plating. As a catalyst in which a compound having a heterocyclic ring in an oxidized state is polymerized on the surface of the fiber base material and a catalyst that is reduced and adsorbed on the surface of the polymer compound. Ri Do and a metal acting, having a said heterocyclic Compound, Pirorumonoma - and metal salts having catalytic ability of functional and non-electrolytic plating as the oxidizing agent, wherein the palladium chloride der Rukoto.

(Wire conductor)
The conductor for electric wires of the present invention includes (A) a conductor for electric wires formed by twisting at least one metal wire and a plurality of metal-coated fibers, or (B) a metal wire on the outside of at least one metal-coated fiber. Is a conductor for electric wires wound in a spiral.

First, (A) the conductor for electric wires formed by twisting at least one metal wire and a plurality of metal-coated fibers is, for example, a twist of one metal wire and a plurality of metal-coated fibers. Alternatively, a plurality of metal wires and a plurality of metal-coated fibers may be twisted together.
Moreover, in the cross section of the electric wire conductor, as shown in FIG. 1 (a), the electric wire conductor may be twisted by arranging and twisting so that a plurality of metal-coated fibers are positioned outside the metal wire. As shown in FIG. 1 (b), a conductor for an electric wire in which a metal wire is arranged and twisted together with a plurality of metal-coated fibers around the metal-coated fiber as shown in FIG. A conductor for electric wires in which a plurality of metal wires are arranged and twisted together with a plurality of metal-coated fibers at the center may be used.

Subsequently, (B) the conductor for electric wires in which a metal wire is spirally wound around the outside of at least one metal-coated fiber is, for example, a metal wire on the outside of one metal-coated fiber as shown in FIG. It may be spirally wound, or may be one in which a metal wire is spirally wound around a plurality of metal-coated fibers (not shown).
In addition, as used herein, “winding a metal wire in a spiral (horizontal winding)” means, for example, as shown in FIG. 2, a metal-coated fiber located at the center of a wire conductor is spirally wound without a gap. Although not shown, it may be wound spirally while providing a gap with respect to the metal-coated fiber located at the center of the conductor for electric wire.

(Metal wire)
As the metal wire of the present invention, a linear wire made of metal or a metal foil can be used. And as a metal wire, a thin linear thing with a diameter of 0.01-0.5 mm can be preferably used from the reason of a softness | flexibility.
The metal preferably has a specific resistance of 1 × 10 ⁻⁴ Ω · cm or less, more preferably 1 × 10 ⁻⁵ Ω · cm or less, such as copper (0.2 × 10 ⁻⁵ Ω · cm). cm), aluminum (0.3 × 10 ⁻⁵ Ω · cm), and the like.

  The metal wire is preferably a copper wire that is relatively inexpensive, has low electrical resistance, and can be easily thinned. Copper wire is generally soft copper wire or tin-copper alloy wire, but strong copper alloy with enhanced strength (for example, oxygen-free copper added with iron, phosphorus, indium, etc.), tin, gold, silver Alternatively, a material that is plated with platinum to prevent oxidation, or a material that is surface-treated with gold or another element in order to improve electric signal transmission characteristics can be used.

(Metal-coated fiber)
The metal-coated fiber of the present invention is obtained by providing a plating base layer on a fiber base material and providing a metal plating film on the plating base layer by an electroless plating method.
And the said plating base layer is a fiber base material by contacting (ii) the compound which has a heterocyclic ring, and (ii) the metal salt which functions as an oxidizing agent, and has the catalyst ability of electroless plating. It consists of a polymer compound in which a compound having a heterocyclic ring in an oxidized state is polymerized on the surface of the fiber substrate, and a metal acting as a catalyst that is reduced and adsorbed on the surface of the polymer compound.

(Fiber base)
The fiber substrate used in the present invention may be an organic fiber, and preferably a high-strength organic fiber. The high-strength organic fiber is not particularly limited, and examples thereof include an aramid fiber, an aromatic polyester fiber, and a polyparaphenylene benzobisoxazole fiber.

  The fiber substrate may be a monofilament (single yarn) or a multifilament, but is preferably a multifilament. The “multifilament” referred to here is a single yarn composed of several to several thousand monofilaments (single yarn).

Further, the multifilament may be subjected to twisting processing. When performing the twisting process, the twisting coefficient k of the following formula 1 is preferably 4200 or less, and preferably 500 to 4200. (Expression 1) k = T × √D (T = number of twisted yarns (T / m), D = total fineness (dtex))
Thus, “twisted yarn coefficient k” is a value obtained by multiplying T = twisted yarn count by √D = total fineness.
And when the twisting coefficient k is less than 500, for example, the strength is likely to decrease due to immersion in an alkaline solution, and when the twisting coefficient k exceeds 4200, the plating base layer and electroless plating treatment described later up to the inside of the fiber base material. Since the liquid does not permeate, as a result, it is difficult to obtain an electric resistance value necessary as a conductor for an electric wire such as a signal line, and the adhesion between the fiber base material and the metal plating film is likely to be lowered.
Further, “D = total fineness (dtex)” here represents the thickness of the yarn. Since the cross-section of the thread is not a perfect circle, but can have various shapes, the thickness is expressed by the ratio of length to weight. In the case of a filament yarn, “decitex (dtex)” is used. Decitex is the number of grams per 10,000 m.
Further, “T = twisted yarn number (T / m)” here is the number of twists per 1 m.

(Plating underlayer)
The plating underlayer of the present invention is obtained by bringing a fiber base material into contact with (i) a compound having a heterocyclic ring and (ii) a metal salt that functions as an oxidizing agent and has an electroless plating catalytic ability. It consists of a polymer compound in which a compound having a heterocyclic ring in an oxidized state is polymerized on the surface of the fiber substrate, and a metal acting as a catalyst that is reduced and adsorbed on the surface of the polymer compound.
As a method of contacting (i) a compound having a heterocyclic ring with (ii) a metal salt that functions as an oxidizing agent and has a catalytic ability for electroless plating, any of the following (a) to (c) Can be adopted.
(A) a step of immersing and pulling up the fiber substrate in an aqueous solution containing (i) a compound having a heterocyclic ring and (ii) a metal salt that functions as an oxidizing agent and has a catalytic ability for electroless plating. Method,
(B) a method comprising the steps of: (i) immersing the fibrous base material in an aqueous solution containing a compound having a heterocyclic ring; and (ii) immersing the pulled material in an aqueous solution containing a metal salt;
(C) A method comprising the steps of: (ii) immersing the fibrous base material in an aqueous solution containing a metal salt, and contacting the pulled material with (i) a vapor containing a compound having a heterocyclic ring. This can be done using means known to those skilled in the art.

In the method (a), when preparing an aqueous solution containing (i) a compound having a heterocyclic ring and (ii) a metal salt, (i) a compound having a heterocyclic ring and (ii) a metal salt (= having a heterocyclic ring) The compound / metal salt concentration ratio is 0.1 to 80, preferably 0.1 to 40.
When the concentration ratio is less than 0.1, the oxidation state and polymerization of the compound having a heterocyclic ring are insufficient, and the reduction state of the metal salt is also insufficient, so that it can act as a catalyst for electroless plating. It becomes difficult. On the other hand, if the concentration ratio is greater than 80, the metal salt cannot be uniformly deposited on the material, so that the metal plating film may not be formed uniformly in the subsequent plating process.
Further, the treatment temperature of the step of immersing the material in an aqueous solution containing (i) a compound having a heterocyclic ring and (ii) a metal salt is 10 ° C. to 130 ° C., and the treatment time is 0.1 minute to 120 minutes. Preferably, it is 20 minutes to 60 minutes.

In the method (b), the concentration of the aqueous solution containing the compound (i) having a heterocyclic ring is 5 × 10 ^{−4 to} 0.9M, preferably 0.01 to 0.5M.
In addition, the treatment temperature of the step of immersing the material in an aqueous solution containing a compound having a heterocyclic ring (i) is 10 ° C. to 130 ° C., and the treatment time is 0.1 minute to 50 minutes, preferably 1 minute to 40 minutes.

In the methods (b) and (c), a preferable aqueous solution containing (ii) a metal salt is 0.02% palladium chloride-0.01% hydrochloric acid aqueous solution (pH 3).
Moreover, the process temperature in the process of immersing a material in the aqueous solution containing (ii) metal salt is 10 degreeC-130 degreeC, and process time is 0.1 minute-50 minutes, Preferably it is 1 minute-40 minutes. is there.

In the method (c), the vapor containing the compound having a heterocyclic ring (i) may be a vapor obtained by vaporizing an aqueous solution containing the compound having a heterocyclic ring, but preferably the compound itself having a heterocyclic ring is used. Vaporized vapor.
In addition, (i) the treatment temperature in the step of contacting with the vapor containing the compound having a heterocyclic ring is 10 ° C. to 130 ° C., and the treatment time is 0.1 minute to 40 minutes, preferably 1 minute to 30 minutes. Yes, the processing pressure may be normal pressure or reduced pressure.

Moreover, you may hydrophilize the surface of a fiber base material before forming the said plating base layer. By subjecting the surface of the base material to hydrophilic treatment, the functional group generated from the surface of the base material and the compound having a heterocyclic ring can be hydrogen-bonded to improve adhesion. Furthermore, it becomes easy to form a plating base layer, and the deposition and adhesion of the metal plating film by the electroless plating method are improved.
Arbitrary appropriate methods are employ | adopted as a method of hydrophilizing the fiber base-material surface, and a dry process and a wet process are mentioned. Examples of the dry treatment include discharge treatment such as corona discharge treatment and glow discharge treatment; ozone treatment; UV ozone treatment; ionizing active ray treatment such as ultraviolet treatment and electron beam treatment. Examples of the wet treatment include ultrasonic treatment using a solvent such as water and acetone; alkali treatment; anchor coat treatment. These processes may be performed independently or in combination of two or more.

(Compound having a heterocyclic ring)
Examples of the compound having a heterocyclic ring of the present invention include pyrrole, N-methylpyrrole, N-ethylpyrrole, N-phenylpyrrole, N-naphthylpyrrole, N-methyl-3-methylpyrrole, N-methyl-3- Ethyl pyrrole, N-phenyl-3-methyl pyrrole, N-phenyl-3-ethyl pyrrole, 3-methyl pyrrole, 3-ethyl pyrrole, 3-n-butyl pyrrole, 3-methoxy pyrrole, 3-ethoxy pyrrole, 3- n-propoxypyrrole, 3-n-butoxypyrrole, 3-phenylpyrrole, 3-toluylpyrrole, 3-naphthylpyrrole, 3-phenoxypyrrole, 3-methylphenoxypyrrole, 3-aminopyrrole, 3-dimethylaminopyrrole, 3 -Diethylaminopyrrole, 3-diphenylaminopyrrole, 3-methyl Pyrrole derivatives such as ruphenylaminopyrrole and 3-phenylnaphthylaminopyrrole; thiophene, 3-methylthiophene, 3-n-butylthiophene, 3-n-pentylthiophene, 3-n-hexylthiophene, 3-n-heptylthiophene , 3-n-octylthiophene, 3-n-nonylthiophene, 3-n-decylthiophene, 3-n-undecylthiophene, 3-n-dodecylthiophene, 3-methoxythiophene, 3-naphthoxythiophene and 3, Examples include thiophene derivatives such as 4-ethylenedioxythiophene, preferably pyrrole, thiophene, and 3,4-ethylenedioxythiophene, and more preferably pyrrole.

  In addition, the treatment temperature for polymerizing a compound having a heterocyclic ring is appropriately selected depending on the type of the compound having a heterocyclic ring used in the present invention, but is preferably 10 ° C to 130 ° C.

(Metal salt that functions as an oxidant and has electroless plating catalytic ability)
Examples of the metal salt that functions as an oxidizing agent of the present invention and has a catalytic ability for electroless plating include, for example, silver nitrate, silver acetate, silver sulfate, silver perchlorate, silver fluoride, silver nitrite, silver chloride, bromide. Silver, silver propionate, silver tartrate, silver methyl ethyl acetate, silver trimethyl acetate, silver carbonate, silver oxalate, silver thrombate; copper nitrate, copper sulfate, copper chloride, copper chlorate, copper perchlorate, Copper salts such as copper bromide, copper acetate, copper carbonate, copper oxalate; nickel salts such as nickel nitrate, nickel sulfate, nickel chloride, nickel bromide, nickel acetate, nickel carbonate, nickel oxalate; palladium sulfate, palladium nitrate And palladium salts such as palladium acetate, palladium chloride, palladium bromide and palladium iodide. Among these, halides are preferable, and palladium chloride is particularly preferable.

(Metal plating film)
The metal plating film of the present invention is formed on the plating base layer using an electroless plating method. Specifically, a plating base layer is formed on the fiber substrate by the above methods (a) to (c), and subsequently immersed in an electroless plating solution, whereby a metal plating film by an electroless plating method is formed. It is formed.
The electroless plating solution is not particularly limited as long as it is a plating solution usually used for electroless plating. That is, as a metal that can be used for electroless plating, for example, copper, gold, silver, nickel, chromium, and the like can be applied, but copper is preferable. Specific examples of the electroless plating bath include ATS add-copper IW bath (Okuno Pharmaceutical Co., Ltd.) and the like.
The treatment temperature for electroless plating is 20 ° C. to 50 ° C., preferably 30 ° C. to 40 ° C., and the treatment time is 10 minutes to 40 minutes, preferably 15 minutes to 30 minutes.

  Moreover, it is preferable that the thickness of the metal plating film formed by the electroless plating method is 0.3 to 3 μm. If the thickness of the metal plating film exceeds 3 μm, the flexibility may decrease and the bending resistance may decrease. If the thickness is less than 0.3 μm, for example, the electrical power necessary for the center line or signal line of the wire Resistance is difficult to obtain.

  Alternatively, hot tin plating or electroplating may be performed on a metal plating film formed by an electroless plating method. In particular, when a fiber base material having high heat resistance is used, hot-dip tin plating is effective.

  Moreover, after providing a plating base layer on a fiber base material and providing a metal plating film on the plating base layer by an electroless plating method to form a metal-coated fiber, twisting may be additionally performed.

[Example 1]
<Process for forming a plating underlayer on a fiber substrate>
A pyrrole monomer 6.5 mM, palladium chloride aqueous solution 0.25 mM, and hydrochloric acid 10 mM were added to ion-exchange water, and the liquid mixture was obtained. And, in this mixed solution, a fiber substrate made of multifilament (Kevlar, Toray DuPont Co., Ltd., aramid fiber, total fineness = 110 dtex, number of twists = 100 T / m) is immersed at 80 ° C. for 30 minutes, Then, the fiber base material which consists of a multifilament which wash | cleaned with ion-exchange water and was made to dry and formed the plating base layer was obtained.

<Process for forming a metal plating film on the plating underlayer by electroless plating>
Next, the fiber base material composed of multifilaments on which the plating base layer is formed is immersed in a plating solution (Melplate CU5100P manufactured by Meltex Co., Ltd.) at 50 ° C. for 10 minutes, and a copper film is formed on the plating base layer. A metal-coated fiber having a metal plating film formed of was obtained.
The resistance value of the obtained metal-coated fiber is 20,000 Ω / km, and the tensile strength (according to JIS L1013) is 90% of the tensile strength with respect to the raw yarn before forming the metal plating film, There was no significant reduction in strength.

<Process of twisting a metal wire and a plurality of metal-coated fibers to form a conductor for electric wire>
Next, the metal wire (one piece) which consists of an annealed copper wire with a diameter of 0.2 mm, and the said metal-coated fiber (six pieces) were twisted together, and the conductor for electric wires was obtained.

[Example 2]
The same operation as in Example 1 was performed to obtain a metal-coated fiber.
Next, a metal wire (one wire) made of annealed copper wire having a diameter of 0.2 mm is spirally wound around the metal-coated fiber stranded wire obtained by twisting the metal-coated fibers (7 wires) (hereinafter referred to as “horizontal”). A conductor for electric wires was obtained.

[Example 3]
As the fiber base material, the same as in Example 1 except that a fiber base material made of multifilament (Kevlar manufactured by Toray DuPont Co., Ltd., aramid fiber, total fineness = 800 dtex, number of twists = 30 T / m) was used. The operation was performed to obtain a metal-coated fiber. In addition, the resistance value of the obtained metal-coated fiber was 3400 Ω / km.
Next, a metal wire (one piece) made of an annealed copper wire having a diameter of 0.2 mm was spirally wound around the outside of the metal-coated fiber (one piece) to obtain a conductor for electric wires.

[Comparative Example 1]
<Process for forming metal plating film by electroless plating after treating fiber substrate with acid to form fine irregularities on the surface of the substrate>
1) Pre-treatment step A fiber substrate made of multifilament (Kevlar, aramid fiber, total fineness = 110 dtex, number of twists = 100 T / m, manufactured by Toray DuPont Co., Ltd.) is used as a surfactant solution for basic fiber cleaning. It was immersed for 3 minutes at 25 ° C. and washed with ion exchange water.
Next, it was immersed in a 90% sulfuric acid solution at 30 ° C. for 30 seconds and washed with ion-exchanged water.
2) Catalyst application step Subsequently, the pretreated fiber substrate was immersed in a 35% hydrochloric acid aqueous solution containing Sn-Pd colloid for 3 minutes at 30 ° C and washed with ion-exchanged water.
3) Activation step Subsequently, the fiber base material to which the catalyst was applied was immersed in a 98% sulfuric acid solution 100 mL / L at 40 ° C. for 3 minutes and washed with ion-exchanged water.
4) Electroless plating step Subsequently, the fiber substrate subjected to the activation step is immersed in a plating solution (Melplate CU5100P manufactured by Meltex Co., Ltd.) at 50 ° C. for 10 minutes to form a metal plating film made of a copper film. Thus, a metal-coated fiber formed was obtained.
The resistance value of the obtained metal-coated fiber is 30,000 Ω / km, and the tensile strength (according to JIS L1013) is 40% of the tensile strength before forming the metal plating film, A significant decrease in strength was observed.

<Process of twisting a metal wire and a plurality of metal-coated fibers to form a conductor for electric wire>
Next, the metal wire (one piece) which consists of an annealed copper wire with a diameter of 0.2 mm, and the said metal-coated fiber (six pieces) were twisted together, and the conductor for electric wires was obtained.

[Comparative Example 2]
Only metal wires (7 wires) made of annealed copper wires having a diameter of 0.2 mm were twisted to obtain a conductor for electric wires.

[Comparative Example 3]
The same operation as in Example 1 was performed to obtain a metal-coated fiber.
Next, only the metal-coated fibers (7 pieces) were twisted to obtain a conductor for electric wires.

Test example 1
Various evaluation tests were performed on the electric wire conductors of Examples 1 to 3 and Comparative Examples 1 to 3 manufactured above, and the results are summarized in Table 1. The evaluation method is as follows.

(Tensile strength)
In accordance with JIS L1013 (chemical fiber filament system test method), a tensile test of each electric wire conductor was performed.

(Resistance value before bending)
The electric wire conductors of Examples 1 to 3 and Comparative Examples 1 to 3 were covered with a vinyl chloride resin having a thickness of 0.2 mm using an extruder to produce electric wires.
Subsequently, the resistance per meter of each electric wire conductor was measured between two terminals using a digital tester (CDM-2000D manufactured by CUSTOM Co., Ltd.). In addition, the electric wire part which contacts the said terminal was made into the conductor which removed the vinyl chloride resin.

(Resistance value after bending)
Each wire produced when measuring the above (resistance value before bending) was bent 10,000 times at 90 degrees left and right under the conditions of a bending radius of 2.5 mm and a load of 500 g. The resistance value was measured in the same manner as the measurement method of (resistance value).
A resistance value after bending of 1000 Ω / km or less is a preferable value for electric wires such as signal lines.

※１：『製法Ａ』とは、繊維基材上にめっき下地層を設け、該めっき下地層上に無電解めっき法により金属めっき膜を形成した製法
※２：『製法Ｂ』とは、繊維基材を酸で処理して該基材表面に微細な凹凸を形成させた後、無電解めっき法により金属めっき膜を形成した製法
※３：『撚線』とは、金属線および／または金属被覆繊維を撚り合わせ加工して電線用導体を形成したもの
※４：『横巻』とは、金属被覆繊維外側に、金属線を螺旋状に巻き付け加工して電線用導体を形成したもの

* 1: “Manufacturing method A” is a manufacturing method in which a plating base layer is provided on a fiber substrate and a metal plating film is formed on the plating base layer by an electroless plating method. * 2: “Manufacturing method B” is a fiber. A method in which a substrate is treated with an acid to form fine irregularities on the surface of the substrate, and then a metal plating film is formed by an electroless plating method. * 3: “Twisted wire” means metal wire and / or metal A wire conductor formed by twisting coated fibers * 4: “Horizontal winding” is a wire conductor formed by spirally winding a metal wire on the outside of a metal-coated fiber.

  The electric wire conductor of the present invention can be used as an electric wire conductor such as a signal line.

1 Metal wire 2 Metal-coated fiber

Claims (1)

In the following wire conductor (A) or (B):
(A) a conductor for electric wires formed by twisting at least one metal wire and a plurality of metal-coated fibers;
(B) a conductor for electric wires in which a metal wire is spirally wound around at least one metal-coated fiber;
Further, the metal-coated fiber is provided with a plating base layer on a fiber substrate, and a metal plating film is provided on the plating base layer by an electroless plating method,
When the plating base layer is brought into contact with (i) a compound having a heterocyclic ring and (ii) a metal salt that functions as an oxidizing agent and has a catalytic ability for electroless plating on the fiber substrate, the fiber substrate above, Ri Do and a metal which acts as a high molecular compound a compound having a heterocyclic ring has become oxidized state are polymerized with the fiber base material surface, adsorbed is reduced on the surface of the polymer compound catalyst,
The compound having a heterocyclic ring is a pyrrole monomer;
The metal salts having catalytic ability of functional and electroless plating as an oxidizing agent, the manufacturing method of the wire conductor, wherein palladium der chloride Rukoto.

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