JP6277249B2 - Imaging module and endoscope - Google Patents

Description

  The present invention relates to an imaging module and an endoscope.

Conventionally, a small imaging module using a solid-state imaging device is known. Such an imaging module is used for an endoscope, for example.
As a structure of the imaging module, a structure using a flexible substrate on which a solid-state imaging device having a through wiring is mounted is known (see, for example, Patent Document 1). In the imaging module disclosed in Patent Document 1, the solid-state imaging device is mounted so that the shape (projection shape) of the flexible substrate viewed from the imaging surface of the solid-state imaging device does not exceed the outer range of the solid-state imaging device. The flexible substrate is bent from both sides of the portion of the flexible substrate toward the opposite side of the imaging surface (toward the back of the solid-state imaging device).
Furthermore, as another structure of the imaging module, a film in which a solid-state imaging device, electronic components, terminals connected to a signal cable, and wirings connected to the solid-state imaging device are formed on a T-shaped multilayer ceramic substrate is formed. Such a structure is known (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2011-217887 JP 2000-199863 A

In the process of manufacturing an imaging module using a flexible substrate as disclosed in Patent Document 1, the wiring formed on the flexible substrate is easily broken, and the shape and dimensions of the wiring are difficult to stabilize. There was a problem of low reliability.
An imaging module using a multilayer ceramic substrate as disclosed in Patent Document 2 has high reliability, but requires an extremely large number of layers in order to obtain a T-shaped multilayer structure. For this reason, the multilayer ceramic substrate is not suitable for downsizing the imaging module, and there is a problem that the manufacturing cost is greatly increased.
It is also possible to manufacture a T-shaped multilayer structure by bonding a plurality of layers. In this case, the number of layers is reduced, but it is extremely difficult to maintain the bonding positional accuracy. is there. Further, when such a bonding process is adopted, the layers adjacent to each other are bonded using an adhesive, but the adhesive oozes out between the bonded layers, and the adhesive oozes out. It is also difficult to stabilize the amount. As a result, it is not easy to manufacture a T-shaped multilayer structure by bonding.

  One aspect of the present invention has been proposed in view of such conventional circumstances, and includes an ultrafine imaging module that can be easily manufactured while maintaining high reliability, and the imaging module. Another objective is to provide an endoscope.

  In order to achieve the above object, an imaging module according to a first aspect of the present invention includes a solid-state imaging device having an imaging device terminal, a first end surface, and a second end surface located on the side opposite to the first end surface. A first side surface orthogonal to the first end surface, a second side surface orthogonal to the first end surface and the first side surface, a main body that is an insulating member, and a first embedded conductor embedded in the main body. A second embedded conductor embedded in the main body and longer than the first embedded conductor, and provided on the first end face and electrically connected to the imaging element terminal and one of the first embedded conductors And a second mounting terminal that is a part of the first embedded conductor and between the first side surface and the second side surface. The first groove portion provided and the second embedding A second groove portion provided between the first side surface and the second side surface and having a third mounting terminal as a part of the conductor; and the first groove portion and the second groove portion in the extending direction of the main body. A connection body having a third groove portion located between the inner conductor portion, an inner conductor portion disposed in the first groove portion and electrically connected to the second mounting terminal, and in the second groove portion. A coaxial cable including a sheath conductor portion disposed and electrically connected to the third mounting terminal; and a covering portion disposed in the third groove portion.

  In the imaging module according to the first aspect of the present invention, the first embedded conductor includes a first internal extension conductor extending in a direction from the first end surface toward the second end surface, and the first internal extension. A first internal connection conductor extending from the existing conductor toward the first groove portion, and the second mounting terminal may be connected to the first internal connection conductor.

  In the imaging module according to the first aspect of the present invention, the first inner extension conductor and the first inner connection conductor constituting the first embedded conductor are in a first inner bent portion located inside the main body. A first inner bent conductor that bends may be formed.

  In the imaging module according to the first aspect of the present invention, the second mounting terminal and the first internal connection conductor constituting the first embedded conductor are located outside the main body with respect to the first inner bent portion. A first outer bent conductor that bends at the first outer bent portion may be formed.

  In the imaging module according to the first aspect of the present invention, the second embedded conductor includes a second internal extension conductor extending in a direction from the first end surface toward the second end surface, and the second internal extension. A second internal connection conductor extending from the existing conductor toward the second groove portion, and the third mounting terminal may be connected to the second internal connection conductor.

  In the imaging module according to the first aspect of the present invention, the second inner extension conductor and the second inner connection conductor constituting the second embedded conductor are in a second inner bent portion located inside the main body. A second inner bent conductor that bends may be formed.

  In the imaging module according to the first aspect of the present invention, the third mounting terminal and the second internal connection conductor constituting the second embedded conductor are located outside the main body with respect to the second inner bent portion. A second outer bent conductor that bends at the second outer bent portion may be formed.

  In the imaging module according to the first aspect of the present invention, the second internal connection conductor may be a branch conductor branched from the second embedded conductor at a branch portion located inside the main body.

  In the imaging module according to the first aspect of the present invention, the first mounting terminal includes a first conductor terminal constituting a part of the first embedded conductor and a second conductor constituting a part of the second embedded conductor. And a conductor terminal.

  In the imaging module according to the first aspect of the present invention, the depth of the third groove is greater than the depth of the first groove, the depth of the second groove is greater than the depth of the third groove, The diameter of the covering portion may be larger than the diameter of the inner conductor portion, and the diameter of the sheath conductor portion may be larger than the diameter of the covering portion.

  The imaging module according to the first aspect of the present invention may include a fourth mounting terminal provided on the second end surface, and an electronic component may be connected to the fourth mounting terminal.

  The imaging module according to the first aspect of the present invention may include a lens unit that forms an image of light on a light receiving surface of the solid-state imaging device.

  The imaging module according to the first aspect of the present invention may include an insulating tube that covers a part of the coaxial cable and the connection body.

  An imaging module according to a first aspect of the present invention includes a housing that covers a part of the solid-state imaging device, the connection body, and the coaxial cable, and a resin portion that is filled in an internal space of the housing. May be.

  In the imaging module according to the first aspect of the present invention, the length of the inner conductor portion, the length of the sheath conductor portion, and the length of the covering portion may be 0.1 to 1.0 mm. .

  In the imaging module according to the first aspect of the present invention, the distance between the pair of second mounting terminals and the distance between the pair of third mounting terminals may be 0.1 to 1.0 mm. .

  The imaging module according to the first aspect of the present invention is configured to electrically connect a fifth mounting terminal, a fifth mounting terminal, and the coaxial cable that are provided on the second end surface and constitute a part of the second embedded conductor. And the fifth mounting terminal has a terminal tip located at a position away from the connection surface between the second mounting terminal and the coaxial cable, and the coaxial cable includes the sheath conductor. A jacket provided on the outer periphery of the portion, and a cable boundary portion located at a boundary between the sheath conductor portion and the jacket, the cable boundary portion is located outside the second end surface, The solder may cover the fifth mounting terminal and the sheath conductor portion so as to form a curved surface extending from the terminal tip portion toward the cable boundary portion.

  An endoscope according to a second aspect of the present invention includes the imaging module according to the first aspect.

  As described above, according to the above-described aspect of the present invention, it is possible to provide an ultrafine imaging module that can be easily manufactured while maintaining high reliability. In addition, it is possible to provide an endoscope including an ultrafine imaging module.

It is a figure which shows the principal part of the endoscope which concerns on one Embodiment of this invention, Comprising: It is sectional drawing which shows the structure of an imaging module. It is a figure which shows the principal part of the endoscope which concerns on one Embodiment of this invention, Comprising: It is sectional drawing which shows the structure of an imaging module. It is a perspective view which shows the connection body which comprises the imaging module which concerns on one Embodiment of this invention. It is a figure explaining the positional relationship of the connection body which comprises the imaging module which concerns on one Embodiment of this invention, and a coaxial cable, Comprising: It is sectional drawing in alignment with line AA of FIG. It is a top view which shows the connection body which comprises the imaging module which concerns on one Embodiment of this invention. It is sectional drawing which shows the connection body which comprises the imaging module which concerns on one Embodiment of this invention. It is sectional drawing which shows the connection body which comprises the imaging module which concerns on one Embodiment of this invention. It is sectional drawing which shows the connection body which comprises the imaging module which concerns on one Embodiment of this invention. It is a bottom view which shows the connection body which comprises the imaging module which concerns on one Embodiment of this invention. FIG. 5 is a partial cross-sectional view showing a state in which the embedded terminal and the conductor portion of the coaxial cable are joined by solder in the connection body constituting the imaging module according to the embodiment of the present invention. It is a figure which shows the principal part of the endoscope which concerns on the modification 1 of embodiment of this invention, Comprising: It is a top view which shows the structure of an imaging module. FIG. 12 is a diagram showing a main part of an endoscope according to a first modification of the embodiment of the present invention, and is a cross-sectional view showing the structure of the imaging module along the line X-X ′ of FIG. It is a top view which shows the connection body which comprises the imaging module which concerns on the modification 2 of embodiment of this invention. It is a top view which shows the connection body which comprises the imaging module which concerns on the modification 3 of embodiment of this invention. It is a fragmentary sectional view showing the state where the embedded terminal and the sheath conductor part of the coaxial cable are joined with solder in the connection body which constitutes the imaging module concerning modification 4 of the embodiment of the present invention. It is sectional drawing which shows the principal part of the endoscope provided with the imaging module which concerns on the modification 4 of embodiment of this invention. It is an expanded sectional view which shows the principal part of the connection body which comprises the imaging module which concerns on the modification 4 of embodiment of this invention. It is sectional drawing explaining the positional relationship of the connection body which comprises the imaging module which concerns on the modification 6 of embodiment of this invention, and a coaxial cable.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the drawings for explaining the embodiments of the present invention, the dimensions and ratios of the respective constituent elements are appropriately changed from the actual ones so that the respective constituent elements can be recognized on the drawing.

(Endoscope 100)
1 and 2 are views showing the main part of an endoscope 100 according to an embodiment of the present invention, and are cross-sectional views showing the structure of the imaging module 10. In particular, FIG. 1 is a sectional view seen from the Y direction, and FIG. 2 is a sectional view seen from the X direction.
The imaging module 10 includes a solid-state imaging device 20, a connection body 30, two coaxial cables 40 (first coaxial cable and second coaxial cable), a capacitor 50 (electronic component), a lens unit 60, and an insulating tube. 70. In the imaging module 10, the solid-state imaging device 20 is electrically connected to the two coaxial cables 40 via the connection body 30.

(Solid-state imaging device 20)
The solid-state image sensor 20 includes a light receiving surface 21 positioned on the upper surface of the solid-state image sensor 20 and an image sensor terminal 22 provided on the lower surface of the solid-state image sensor 20. A lens unit 60 is mounted on the light receiving surface 21. The image sensor terminal 22 is a terminal connected to a mounting pad (described later) provided on the upper surface 30 t of the connection body 30.
For example, a CMOS (complementary metal oxide semiconductor) is preferably used as the solid-state imaging device 20.

  The lens unit 60 has a configuration in which an objective lens (not shown) is incorporated in a cylindrical barrel (not shown). The optical axis of the lens unit 60 is aligned with the light receiving surface 21 of the solid-state imaging device 20. One end of the lens barrel in the axial direction is fixed to the cover member 62. The lens unit 60 forms an image on the light receiving surface 21 of the solid-state imaging device 20 with light that is incident from the front side (left side in FIG. 1) of the lens unit 60 and guided through the lens in the lens barrel.

The insulating tube 70 covers at least the connection body 30 and a part of the coaxial cable 40 connected to the connection body 30. In the present embodiment in which the capacitor 50 is connected to the connection body 30, the insulating tube 70 covers the connection body 30, a part of the coaxial cable 40, and the capacitor 50 together. Here, a part of the coaxial cable 40 means not only a region (exposed region) in which the inner conductor portion 41, the covering portion 42, and the sheath conductor portion 43 are formed, but also an outer sheath located near the connection body 30. 44 (described later). In particular, in the present embodiment, as shown in FIG. 1, the insulating tube 70 covers the coaxial cable 40 so as to protrude outward (right side) from the end of the capacitor 50. With this structure, the insulating tube 70 can protect the connection body 30, the coaxial cable 40, and the capacitor 50 and realize high insulation.
The insulating tube 70 is a resin tube having electrical insulation. As the insulating tube 70, a heat shrinkable tube is used. Examples of the material of the insulating tube 70 include polyimide resins, silicone resins, polyethylene terephthalate (PET), polyolefins such as nylon, polyethylene, and polypropylene, and fluorine resins such as polytetrafluoroethylene (PTFE). .

(Connector 30)
FIG. 3 is a perspective view showing the connection body 30. 4 is a view for explaining the positional relationship between the connection body 30 and the coaxial cable 40, and is a cross-sectional view taken along line AA in FIG. FIG. 5 is a top view showing an upper surface of the connection body 30. 6 is a cross-sectional view of the connection body 30 at a point P2 shown in FIGS. FIG. 7 is a cross-sectional view of the connection body 30 at a point P4 shown in FIGS. FIG. 8 is a cross-sectional view of the connection body 30 at a point P6 shown in FIGS. FIG. 9 is a bottom view showing the bottom surface of the connection body 30.
In the example shown in FIGS. 3 and 4, a plurality of points P <b> 0 to P <b> 7 arranged in the Z direction are attached to the connection body 30. In the following description, an upper surface, a cross section, and a lower surface of the connection body 30 at points P0 to P7 will be described, and further, a region between two points selected from the points P0 to P7 will be described. In particular, a region of the connection body 30 located between the points P0 and P1 is referred to as a first region 81. A region of the connection body 30 located between the points P1 and P3 is referred to as a second region 82. A region of the connection body 30 located between the points P3 and P5 is referred to as a third region 83. A region of the connection body 30 located between the points P5 and P7 is referred to as a fourth region 84.
In addition, the points P0 to P7 are points given as an example to explain the structure of the connection body 30 that is an integrated product, and do not mean that the connection body 30 is formed of a plurality of members.

As shown in FIGS. 3 and 4, the length (X direction and Y direction) of one side of the upper surface 30t of the connection body 30 is 2 mm or less. The connection body 30 includes a main body 31 (insulating member) that functions as an insulator, and an embedded conductor 33A (first embedded conductor) and an embedded conductor 33B (second embedded conductor) provided inside the main body 31. The main body 31 includes an upper surface 30t (first end surface), a lower surface 30b (second end surface) located on the opposite side of the upper surface 30t, a first side surface 31F orthogonal to the upper surface 30t, and the upper surface 30t and the first side surface 31F. It has the 2nd side 31S which intersects perpendicularly. The buried conductor 33A (first inner extending conductor) and the buried conductor 33B (second inner extending conductor) extend in the extending direction of the main body 31 (Z direction, the direction from the first end face toward the second end face). Exists. With respect to the length of the buried conductor in the Z direction, the buried conductor 33B is longer than the buried conductor 33A.
In the example shown in FIG. 4, the embedded conductor 33A extends in the Z direction from the upper surface 30t (point P0) to the lower end (point P3) of the second region 82, and the third region 83 and the fourth region 84 include Not provided. On the other hand, the embedded conductor 33B (internally extending conductor) extends in the Z direction from the upper surface 30t (point P0) to the lower end (point P7) of the fourth region 84, and extends from the upper surface 30t to the lower surface 30b. 31 is provided so as to penetrate through. The present invention is not limited to the wiring structure shown in FIG. The embedded conductor 33 </ b> A does not necessarily extend so as to reach the lower end (point P <b> 3) of the second region 82, and may have a three-dimensional conductor pattern that is bent inside the connection body 30. Similarly, the embedded conductor 33 </ b> B does not necessarily extend so as to reach the lower surface 30 b, and may have a three-dimensional conductor pattern that bends inside the connection body 30. An example regarding the three-dimensional wiring structure of the embedded conductor 33A and the embedded conductor 33B will be described later.

  Next, the structure of the connection body 30 in each of the first region 81, the second region 82, the third region 83, and the fourth region 84 will be described.

(First region 81)
The first region 81 is located at the tip of the connection body 30 in the Z direction and faces the solid-state imaging device 20. The upper surface 30t of the first region 81 includes two first upper surface exposed portions 32T1 (first conductor terminals, first mounting terminals) and two second upper surface exposed portions 32T2 (second conductor terminals, first mounting terminals). have. That is, four upper surface exposed portions 32T are provided on the upper surface 30t. Each of the four upper surface exposed portions 32 </ b> T is a mounting pad 34 (first mounting terminal) connected to the image sensor terminal 22 of the solid-state image sensor 20.
Thereby, when the solid-state imaging device 20 is mounted on the upper surface 30t, the imaging device terminal 22 and the mounting pad 34 are electrically connected.
Inside the first region 81, through holes 30H1 and 30H2 extending in the Z direction are provided at positions corresponding to the first upper surface exposed portion 32T1 and the second upper surface exposed portion 32T2. Among these, the through hole 30H1 is filled with the buried conductor 33A. The through hole 30H2 is filled with a buried conductor 33B.

(Second region 82)
As shown in FIGS. 4 and 6, in the second region 82, an internal connection conductor 36 (first internal connection conductor, first embedded conductor) is provided. The internal connection conductor 36 is electrically connected to the embedded conductor 33A. The internal connection conductor 36 constitutes a part of the embedded conductor 33A and is integrated with the embedded conductor 33A. The internal connection conductor 36 protrudes from the embedded conductor 33A in a direction perpendicular to the extending direction of the main body 31. That is, the internal connection conductor 36 extends from the embedded conductor 33A toward the outside of the main body 31 (a groove 30M2 described later). The internal connection conductor 36 has an embedded terminal 32A (second mounting terminal, first embedded conductor). That is, the embedded terminal 32 </ b> A is connected to the internal connection conductor 36. The embedded terminal 32A is exposed to the outside of the connection body 30 (inside the groove 30M2).

In the second region 82, a groove 30M2 (first groove) from which a part of the main body 31 and a part of the embedded conductor 33A are removed is formed. In the groove portion 30M2, the embedded terminal 32A is exposed. Specifically, two grooves 30M2 are provided in the second region 82, and the embedded terminal 32A is exposed in each groove 30M2. In other words, the second region 82 includes two (a pair of) embedded terminals 32A. The distance between the two embedded terminals 32A is 0.1 to 1.0 mm.
The embedded terminal 32A constitutes a part of the embedded conductor 33A. From the upper end surface of the second region 82 (the boundary (point P1) between the first region 81 and the second region 82), the second region 82 is provided. Extending in the Z direction toward the lower end surface (the boundary (point P3) between the second region 82 and the third region 83). In the Y direction of the groove 30M2, the depth of the groove 30M2 from the side surface 39 where the groove 30M2 is formed is D1.

  Inside the second region 82, the embedded conductor 33A and the embedded conductor 33B are provided so as to extend in the extending direction (Z direction) of the main body 31. As shown in FIG. 4, the internal connection conductor 36 extends in the Y direction. That is, the extending direction of the inner connecting conductor 36 is different from the extending direction (Z direction) of the inner extending conductor 38A (first inner extending conductor, embedded conductor 33A). The upper surface of the internal connection conductor 36 is located at the point P 1, that is, the upper end of the second region 82. The internal extension conductor 38A, the internal connection conductor 36, and the embedded terminal 32A constituting the embedded conductor 33A are a three-dimensional structure integrally formed inside the main body 31.

  In the example shown in FIG. 6, the position of the internal connection conductor 36 (position in the X direction and the Y direction) overlaps the mounting pad 34. In the direction from the rear end 36B of the internal connection conductor 36 (the end of the internal connection conductor 36 located inside the main body 31) to the embedded terminal 32A, the width of the internal connection conductor 36 gradually increases. In other words, the planar pattern of the internal connection conductor 36 has a substantially sector shape. The shape of the internal connection conductor 36 is not limited to a substantially sector shape. The internal connection conductor 36 may extend from the internal extension conductor 38A (embedded conductor 33A) toward the groove 30M2. The shape of the internal connection conductor 36 is not limited.

  The embedded terminal 32A is exposed to the outside of the second region 82 by removing (grinding) the corner region 30KA of the second region 82, and has a curved surface corresponding to the shape of the grinding tool. The embedded terminal 32A extends in the Z direction. As shown in FIG. 4, the inner conductor portion 41 of the coaxial cable 40 is connected to the embedded terminal 32 </ b> A.

In FIG. 6, a dotted line 31a shows the outer shape of the second region 82 before the corner region 30KA is removed. Before the corner region 30KA is removed, the embedded terminal 32A is embedded in the corner region 30KA. More specifically, the corner region 30KA before the corner region 30KA is removed is filled with the embedded member that becomes the embedded terminal 32A and the insulating member that constitutes the main body 31.
The embedded terminal 32A is formed by grinding the embedded member and the insulating member located in the corner area 30KA, that is, by removing the portion indicated by the dotted line 31a. In other words, the embedded terminal 32A can also be referred to as an exposed terminal in which a part of the internal connection conductor 36 is exposed.
By grinding the corner region 30KA, the groove 30M2 is formed in the second region 82 of the connection body 30, and the embedded terminal 32A is provided on the wall surface 30W2 of the groove 30M2. In the groove portion 30M2, the embedded terminal 32A is exposed.
Further, it can be said that the wall surface 30W2 of the groove portion 30M2 is a ground surface formed by grinding and having a grinding mark generated by contact between the grinding tool and the main body 31.
Before the corner region 30KA is removed, the embedded member that becomes the embedded terminal 32A may be filled in the corner region 30KA. Even in this case, the groove 30M2 is formed by the above-described grinding.

In particular, the groove 30M2 in which the embedded terminal 32A is formed is provided at a position corresponding to the position of the corner area 30KA. In particular, the second region 82 has a first side surface 31F (a surface perpendicular to the X direction) and a second side surface 31S (a surface perpendicular to the Y direction). The first side surface 31F and the second side surface 31S are surfaces orthogonal to the upper surface 30t (surface perpendicular to the Z direction) of the connection body 30. The groove portion 30M2 is provided between the first side surface 31F and the second side surface 31S.
As shown by the dotted line in FIG. 6, the first virtual extension surface 31f extending from the first side surface 31F and the second virtual extension surface 31s extending from the second side surface 31S intersect each other at the intersection point Px. .
That is, a space surrounded by the wall surface 30W2, the first virtual extension surface 31f, and the second virtual extension surface 31s of the groove 30M2 corresponds to the groove 30M2. As will be described later, the embedded terminal 32A and the inner conductor portion 41 of the coaxial cable 40 are electrically connected inside the groove portion 30M2.

  On the other hand, the embedded conductor 33 </ b> B is not ground in the second region 82 and is located inside the second region 82. In other words, the embedded conductor 33B extends from the upper end surface of the second region 82 (the boundary (point P1) between the first region 81 and the second region 82) to the lower end surface of the second region 82 (the second region 82 and the second region 82). It extends in the Z direction toward the boundary (point P3) between the three regions 83.

(Third region 83)
As shown in FIG. 7, in the third region 83, a groove 30M3 (third groove) from which a part of the main body 31 is removed is formed. The groove part 30M3 is located between the groove part 30M2 and the groove part 30M4 in the Z direction.
In the groove 30M3, only a part of the main body 31 is removed, and there is no structure for partially removing the embedded conductor 33B. In the Y direction of the groove portion 30M3, the depth of the groove portion 30M3 from the side surface 39 where the groove portion 30M3 is formed is D2, which is larger than the depth D1 of the groove portion 30M2 described above. The groove portion 30M3 is a space in which the covering portion 42 of the coaxial cable 40 is disposed.

In FIG. 7, a dotted line 31b shows the outer shape of the third region 83 in the corner region 30KB before the corner region 30KB is removed in the corner region 30KB.
Groove 30M3 is formed by grinding corner region 30KB, that is, by removing the portion indicated by dotted line 31b.
Further, it can be said that the wall surface 30W3 of the groove portion 30M3 is a ground surface formed by grinding and having a grinding mark generated by contact between the grinding tool and the main body 31.

In particular, the groove 30M3 is provided at a position corresponding to the position of the corner area 30KB. In particular, the third region 83 has a first side surface 31F (a surface perpendicular to the X direction) and a second side surface 31S (a surface perpendicular to the Y direction). The first side surface 31F and the second side surface 31S are surfaces orthogonal to the upper surface 30t (surface perpendicular to the Z direction) of the connection body 30. The groove 30M3 is provided between the first side surface 31F and the second side surface 31S.
As shown by the dotted line in FIG. 7, the first virtual extension surface 31f extending from the first side surface 31F and the second virtual extension surface 31s extending from the second side surface 31S intersect each other at the intersection point Px. .
That is, the space surrounded by the wall surface 30W3, the first virtual extension surface 31f, and the second virtual extension surface 31s of the groove 30M3 corresponds to the groove 30M3.

  On the other hand, the embedded conductor 33 </ b> B is not ground in the third region 83 and is located inside the third region 83. That is, the embedded conductor 33B extends from the upper end surface of the third region 83 (the boundary (point P3) between the second region 82 and the third region 83) to the lower end surface of the third region 83 (the third region 83 and the third region 83). It extends in the Z direction toward the boundary (point P5) between the four regions 84.

(Fourth region 84)
As shown in FIGS. 4 and 8, in the fourth region 84, an internal connection conductor 37 (second internal connection conductor, second embedded conductor) is provided. The internal connection conductor 37 is electrically connected to the embedded conductor 33B. The internal connection conductor 37 constitutes a part of the embedded conductor 33B and is integrated with the embedded conductor 33B. The internal connection conductor 37 protrudes from the embedded conductor 33B in a direction perpendicular to the extending direction of the main body 31. That is, the internal connection conductor 37 extends from the embedded conductor 33B toward the outside of the main body 31 (a groove portion 30M4 described later). The internal connection conductor 37 has a buried terminal 32B (third mounting terminal, second buried conductor). That is, the embedded terminal 32 </ b> B is connected to the internal connection conductor 37. The embedded terminal 32B is exposed to the outside of the connection body 30 (inside the groove 30M4).
In the fourth region 84, a groove 30M4 (second groove) from which a part of the main body 31 and a part of the embedded conductor 33B are removed is formed. In the groove 30M4, the embedded terminal 32B is exposed. Specifically, two grooves 30M4 are provided in the fourth region 84, and the embedded terminal 32B is exposed in each groove 30M4. That is, the fourth region 84 includes two (a pair of) embedded terminals 32B. The distance between the two embedded terminals 32B is 0.1 to 1.0 mm.
The embedded terminal 32 </ b> B constitutes a part of the embedded conductor 33 </ b> B. From the upper end surface of the fourth region 84 (the boundary between the third region 83 and the fourth region 84 (point P <b> 5)), the fourth region 84. It extends in the Z direction toward the lower end surface (lower surface 30b, point P7). In the Y direction of the groove 30M4, the depth of the groove 30M4 from the side surface 39 where the groove 30M4 is formed is D3, which is larger than the depth D2 of the groove 30M3 described above.

Inside the fourth region 84, the embedded conductor 33 </ b> B is provided to extend in the extending direction (Z direction) of the main body 31. As shown in FIG. 4, the internal connection conductor 37 extends in the Y direction. That is, the extending direction of the inner connecting conductor 37 is different from the extending direction (Z direction) of the inner extending conductor 38B (second inner extending conductor, embedded conductor 33B). The upper surface of the internal connection conductor 37 is located at the point P 5, that is, the upper end of the fourth region 84. The internal connection conductor 37 and the internal extension conductor 38B are connected at the first end P10 of the internal connection conductor 37, and the internal connection conductor 37 and the embedded terminal 32B are connected at the second end P11 of the internal connection conductor 37. Has been. Here, the first end P <b> 10 is an end portion inside the main body 31 among the end portions of the internal connection conductor 37. The second end P11 is located on the side opposite to the first end P10, and is an end located at a position close to the embedded terminal 32B (position close to the outside of the main body 31) among the ends of the internal connection conductor 37.
The internal extension conductor 38B, the internal connection conductor 37, and the embedded terminal 32B constituting the embedded conductor 33B are a three-dimensional structure integrally formed inside the main body 31.

  In this three-dimensional structure, the internal connection conductor 37 branches off from the embedded conductor 33B at a point P10 (a branch portion located inside the main body 31). That is, the internal connection conductor 37 is a branch conductor provided inside the main body 31. The internal connection conductor 37 and the embedded terminal 32B form a second outer bent conductor that bends at the point P11 (bent portion). Here, the point P11 is a second outer bent portion located outside the main body 31 with respect to the point P10 (branch portion).

  In the example illustrated in FIG. 8, the position of the internal connection conductor 37 (position in the X direction and the Y direction) overlaps the mounting pad 34. In the direction from the rear end 37B of the internal connection conductor 37 (the end of the internal connection conductor 37 positioned inside the main body 31) to the embedded terminal 32B, the width of the internal connection conductor 37 gradually increases. In other words, the planar pattern of the internal connection conductor 37 has a substantially sector shape. The shape of the internal connection conductor 37 is not limited to a substantially sector shape. The internal connection conductor 37 may extend from the internal extension conductor 38B (embedded conductor 33B) toward the groove 30M4. The shape of the internal connection conductor 37 is not limited.

  The embedded terminal 32B is exposed to the outside of the fourth region 84 by removing (grinding) the corner region 30KC of the fourth region 84, and has a curved surface corresponding to the shape of the grinding tool. The embedded terminal 32B extends in the Z direction. As shown in FIG. 4, the sheath conductor 43 of the coaxial cable 40 is connected to the embedded terminal 32B.

In FIG. 8, a dotted line 31c indicates the outer shape of the fourth region 84 before the corner region 30KC is removed. Before the corner region 30KC is removed, the embedded terminal 32B is embedded in the corner region 30KC. More specifically, the corner region 30KC before the corner region 30KC is removed is filled with the embedded member that becomes the embedded terminal 32B and the insulating member that constitutes the main body 31.
The embedded terminal 32B is formed by grinding the embedded member and the insulating member located in the corner region 30KC, that is, by removing the portion indicated by the dotted line 31c. In other words, the embedded terminal 32B can also be referred to as an exposed terminal in which a part of the internal connection conductor 37 is exposed.
By grinding the corner region 30KC, the groove portion 30M4 is formed in the fourth region 84 of the connection body 30, and the embedded terminal 32B is provided on the wall surface 30W4 of the groove portion 30M4. In the groove 30M4, the embedded terminal 32B is exposed.
Further, it can be said that the wall surface 30W4 of the groove portion 30M4 is a grinding surface formed by grinding and has a grinding mark generated by contact between the grinding tool and the main body 31.
Before the corner region 30KC is removed, the embedded member that becomes the embedded terminal 32B may be filled in the corner region 30KC. Even in this case, the groove 30M4 is formed by the above-described grinding.

In particular, the groove 30M4 in which the embedded terminal 32B is formed is provided at a position corresponding to the position of the corner region 30KC. In particular, the fourth region 84 has a first side surface 31F (a surface perpendicular to the X direction) and a second side surface 31S (a surface perpendicular to the Y direction). The first side surface 31F and the second side surface 31S are surfaces orthogonal to the upper surface 30t (surface perpendicular to the Z direction) of the connection body 30. The groove 30M4 is provided between the first side surface 31F and the second side surface 31S.
As shown by the dotted line in FIG. 8, the first virtual extension surface 31f extending from the first side surface 31F and the second virtual extension surface 31s extending from the second side surface 31S intersect each other at the intersection point Px. .
That is, the space surrounded by the wall surface 30W4, the first virtual extension surface 31f, and the second virtual extension surface 31s of the groove 30M4 corresponds to the groove 30M4. As will be described later, the embedded terminal 32B and the sheath conductor 43 of the coaxial cable 40 are electrically connected inside the groove 30M4.

  Further, the embedded terminals 32A and 32B have a completely different structure from the coating film formed on the substrate surface using a known film forming method. That is, the embedded terminals 32 </ b> A and 32 </ b> B have a metal conductor embedded in an internal region located inside the main body 31. That is, the embedded terminals 32A and 32B are different from the thin film formed on the surface of the main body 31 by a known film forming method.

As a material constituting the main body 31, a known material is used. For example, a sintered member such as alumina or LTCC may be used. Moreover, as a material which comprises the main body 31, you may employ | adopt a glass epoxy board | substrate (FR-4), a ferrule board | substrate, a silicon substrate, or a glass substrate, for example.
A known material is used as a material constituting the embedded terminals 32A and 32B. For example, copper, silver, nickel, gold, tungsten, or the like may be adopted as a material constituting the embedded terminals 32A and 32B.

(Coaxial cable 40)
As shown in FIG. 1, each of the two coaxial cables 40 includes an inner conductor portion 41, a covering portion 42 (insulator), and a sheath conductor portion 43. The length of the inner conductor portion 41, the length of the sheath conductor portion 43, and the length of the covering portion 42 positioned between the inner conductor portion 41 and the sheath conductor portion 43 are 0.1 to 1.0 mm.
The inner conductor portion 41 is disposed in the groove portion 30M2 and connected to the embedded terminal 32A by the solder 35. The covering portion 42 is disposed in the groove portion 30M3. The sheath conductor 43 is disposed in the groove 30M4, and is connected to the embedded terminal 32B by solder 35 (see FIG. 10).
2 and 4 show examples of the structure in which the covering portion 42 is in contact with the wall surface 30W3, but the present invention is not limited to this structure. A gap may be formed between the covering portion 42 and the wall surface 30W3.

Further, the diameter of the covering portion 42 is larger than the diameter of the inner conductor portion 41, and the diameter of the sheath conductor portion 43 is larger than the diameter of the covering portion 42. On the other hand, the depth D2 of the groove portion 30M3 in which the covering portion 42 is disposed is set larger than the depth D1 of the groove portion 30M2 in which the internal conductor portion 41 is disposed. Further, the depth D3 of the groove 30M4 in which the sheath conductor 43 is disposed is set larger than the depth D2 of the groove 30M3 in which the covering portion 42 is disposed. For this reason, even when the coaxial cable 40 is connected to the connection body 30, unevenness due to the difference in the diameters of the internal conductor portion 41, the covering portion 42, and the sheath conductor portion 43 does not occur in the connection body 30. Thereby, it is possible to suppress the occurrence of distortion in the inner conductor portion 41, the covering portion 42, and the sheath conductor portion 43, and to connect the coaxial cable 40 to the connection body 30 stably. Further, the coaxial cable 40 can be easily connected to the connection body 30.
Furthermore, it is desirable that the depths D1, D2, and D3 of the groove portions 30M2, 30M3, and 30M4 are set so that the center lines of the inner conductor portion 41, the covering portion 42, and the sheath conductor portion 43 are aligned. Thereby, when connecting the coaxial cable 40 to the connection body 30, since it is not necessary to bend the coaxial cable 40, connection reliability can further be improved.

In the connection body 30 configured integrally with the first region 81, the second region 82, the third region 83, and the fourth region 84 described above, the first upper surface exposed portion 32T1 is coaxial with the embedded conductor 33A. It is electrically connected to the inner conductor portion 41 of the cable 40. The second upper surface exposed portion 32T2 is electrically connected to the sheath conductor portion 43 of the coaxial cable 40.
Since the first upper surface exposed portion 32T1 and the second upper surface exposed portion 32T2 are terminals connected to the solid-state imaging device 20, the coaxial cable 40 can be electrically connected to the solid-state imaging device 20 through the connection body 30. It becomes.

Next, a structure in which the sheath conductor portion 43 is connected to the embedded terminal 32B by the solder 35 will be described with reference to FIG.
FIG. 10 is a partial cross-sectional view showing a state where the embedded terminal 32 </ b> B and the sheath conductor portion 43 are joined by the solder 35.
As shown in FIG. 10, the side surface of the embedded terminal 32B, that is, the embedded terminal 32B of the embedded terminal 32B is used as a mounting surface, and the sheath conductor portion 43 is mounted on this mounting surface. Furthermore, the solder 35 is formed so as to cover the sheath conductor 43 and the embedded terminal 32B in a state where the sheath conductor 43 and the embedded terminal 32B are connected. In particular, since the embedded terminal 32B has a curved surface, when the sheath conductor portion 43 is disposed on the embedded terminal 32B, the sheath conductor portion 43 is supported by the curved surface of the embedded terminal 32B, and the sheath conductor portion 43 is positioned. Can be easily performed. Furthermore, when the sheath conductor 43 and the embedded terminal 32B are soldered, the solder 35 stays within the curved surface of the embedded terminal 32B, so that the solder 35 can be prevented from flowing outside the main body 31. . That is, the embedded terminal 32B having a curved surface functions as a solder receiving portion.

  Similarly, the inner conductor portion 41 is electrically connected to the embedded terminal 32 </ b> A by the solder 35. Further, since the embedded terminal 32 </ b> A also has a curved surface, it functions as a solder receiving portion, and it is possible to prevent the solder 35 from flowing outside the main body 31.

As shown in FIG. 9, a mounting pad 30 p (fourth mounting terminal) is provided on the lower surface 30 b of the connection body 30. A capacitor 50 is connected to the mounting pad 30p.
The mounting pad 30p is an end portion of the embedded conductor 33B that penetrates the first region 81, the second region 82, the third region 83, and the fourth region 84 of the connection body 30. That is, in the X direction and the Y direction, the position of the embedded conductor 33B and the position of the mounting pad 30p coincide.

Thereby, the solid-state imaging device 20, the capacitor 50, and the coaxial cable 40 are electrically connected via the embedded conductor, the mounting pad 34, and the mounting pad 30p provided in the connection body 30 described above.
The electronic component mounted on the mounting pad 30p is not limited to the capacitor 50, and a resistor or a coil may be mounted on the mounting pad 30p.

In the embodiment described above, the case where the position of the embedded conductor 33B in the X direction and the Y direction coincides with the position of the mounting pad 30p has been described, but the present invention is not limited to this embodiment. As an example, a wiring that is a conductive member different from the embedded conductor 33B and the mounting pad 30p may be formed on the lower surface 30b. In this configuration, the mounting pad 30p and the buried conductor 33B are electrically connected via the wiring. This wiring is a part of the embedded conductor embedded in the connection body 30. This wiring is formed by grinding the end face of the connection body 30 and exposing the lower surface 30 b to the outside of the connection body 30.
The wiring may be the same conductive member as the embedded conductor 33B and the mounting pad 30p. Further, the wiring does not necessarily have to be embedded in the connection body 30. For example, a wiring may be provided on the lower surface 30 b of the connection body 30. When the wiring is formed on the lower surface 30b, the wiring is formed mainly by patterning using a printing method. This wiring electrically connects the conductor 33B and the mounting pad 30p on the lower surface 30b.

Next, a method for forming the connection body 30 including the embedded terminals 32A and 32B described above will be described.
When using a sintered member as an example of a member constituting the connection body 30, it is conceivable to form the connection body 30 by the following materials and methods.
First, an insulating member having a through hole is formed using a material such as ceramic. Specifically, four insulating members corresponding to the first region 81, the second region 82, the third region 83, and the fourth region 84 described above are formed. These four members have through holes formed at positions corresponding to the positions of the embedded conductors shown in FIGS. Next, a conductive material is filled in the through holes of the four insulating members, and filled vias are formed. Such filling vias are formed individually for each of the four insulating members, rather than collectively for the four insulating members. Thereafter, four members (insulating members) in which filling vias are formed in the through holes are laminated so as to correspond to the first region 81, the second region 82, the third region 83, and the fourth region 84 (lamination process). ).

  Thereafter, in the sintering step, the laminated insulating member (laminated body of four members) on which the filled vias are formed is sintered to form a sintered member. Subsequently, using a grinding tool having a diameter larger than the via diameter of the filled via, the corner region of the sintered member is ground and removed as shown in FIG. 3 (grinding step). Thereby, the insulating member of the sintered member and a part of the filling via are lost, and the connection body 30 in which the embedded terminals 32A and 32B are formed is obtained.

  In addition, in the formation method of the connection body 30 mentioned above, although a lamination process, a sintering process, and a grinding process are performed in order, you may change the order of this process. For example, a grinding process may be performed before the sintering process. Moreover, you may perform a grinding process before a lamination process. When the grinding step is performed before the sintering step, there is an advantage that grinding can be easily performed because the insulating member is relatively soft. Moreover, when performing a grinding process before a lamination | stacking process, since the position accuracy of the Z direction of a grinding tool is not requested | required, there exists a merit that manufacture becomes easy.

Next, another method for forming the connection body 30 including the embedded terminals 32A and 32B described above will be described.
When a glass epoxy substrate or a ferrule substrate is used as an example of a member constituting the connection body 30, it is conceivable to form the connection body 30 by the following materials and methods.
First, four insulating members corresponding to the first region 81, the second region 82, the third region 83, and the fourth region 84 described above are prepared. These four insulating members are a glass epoxy substrate or a ferrule substrate. Next, a through hole is formed in each of the four insulating members at the position of the embedded conductor shown in FIGS. Further, a filling via is formed in each through hole of the four insulating members by a technique such as plating. Thereafter, four members (insulating members) in which filling vias are formed in the through holes are laminated so as to correspond to the first region 81, the second region 82, the third region 83, and the fourth region 84 (lamination process). ).

  Subsequently, using a tool having a diameter larger than that of the filled via, the corner region of the laminated member is ground and removed as shown in FIG. 3 (grinding step). Thereby, a part of the main body 31 and a part of the filling via are lost, and the connection body 30 in which the embedded terminals 32A and 32B are formed is obtained.

  In the method for forming the connection body 30 described above, a grinding process may be performed before the stacking process. In this case, since the positional accuracy of the grinding tool in the Z direction is not required, there is an advantage that the manufacturing becomes easy.

Next, another method for forming the connection body 30 including the embedded terminals 32A and 32B described above will be described.
When a silicon substrate or a glass substrate is used as an example of a member constituting the connection body 30, it is conceivable that the connection body 30 is formed by the following materials and methods.
First, four insulating members corresponding to the first region 81, the second region 82, the third region 83, and the fourth region 84 described above are prepared. These four insulating members are a silicon substrate or a glass substrate. Next, a through hole is formed in each of the four insulating members at the position of the embedded conductor shown in FIGS. Further, a through wiring (through silicon via, TSV) is formed in each through hole of the four insulating members. Thereafter, four members (insulating members) in which through wirings are formed in the through holes are laminated so as to correspond to the first region 81, the second region 82, the third region 83, and the fourth region 84 (lamination process). ).

  Subsequently, using a tool having a diameter larger than the diameter of the through wiring, the corner region of the laminated member is ground and removed as shown in FIG. 3 (grinding step). Thereby, a part of the main body 31 and a part of the through wiring are lost, and the connection body 30 in which the embedded terminals 32A and 32B are formed is obtained.

  In the method for forming the connection body 30 described above, a grinding process may be performed before the stacking process. In this case, since the positional accuracy of the grinding tool in the Z direction is not required, there is an advantage that the manufacturing becomes easy.

  According to the imaging module 10 according to the above-described embodiment, the connection body 30 is employed, unlike the flexible substrate that is liable to cause the breakage of the wiring, so that the connection stability between the coaxial cable 40 and the solid-state imaging element 20 is ensured, High reliability can be maintained. Furthermore, as described above, since the structure in which the coaxial cable 40 is connected to the embedded terminals 32A and 32B exposed on the side surface of the connection body 30 is adopted, the number of layers constituting the connection body 30 can be reduced. it can. Furthermore, since the embedded terminals 32A and 32B are provided in the corner region of the connection body 30, it is possible to reduce the size of the imaging module.

  Moreover, the connection body 30 can be manufactured easily. In particular, by applying the imaging module 10 according to the present embodiment to an ultra-thin module in which the outer diameter of the imaging module is 2 mm, the imaging module 10 can be arranged in a limited space, and the module can be downsized. Greatly contributes.

(Modification 1 of imaging module)
FIG. 11 is a top view illustrating a main part of the endoscope according to the first modification of the embodiment of the present invention. FIG. 12 is a diagram illustrating the main part of the endoscope according to the first modification of the embodiment of the present invention, and is a cross-sectional view illustrating the structure of the imaging module along the line XX ′ in FIG. 11.
11 and 12, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
As shown in FIG. 11, the imaging module 10 is covered with a housing 90. As a material of the housing 90, it is desirable to select a material having biocompatibility. For example, ceramics such as stainless steel, aluminum, titanium, alumina and zirconia are preferably used.
As shown in FIG. 12, in the inside of the housing 90, the gap (internal space) between the housing 90 and the imaging module 10 is filled with resin 95 (resin portion), and the imaging module 10 is fixed by the resin 95. Yes. In such a configuration, the use of the casing 90 improves resistance to external forces such as bending.
According to the imaging module according to the first modification, the same effect as that obtained by the insulating tube 70 described above can be obtained, and the imaging module 10 having high strength can be realized.

(Modification 2 of imaging module)
FIG. 13 is a top view showing a structure of a connection body constituting an imaging module according to Modification 2 of the embodiment of the present invention. In FIG. 13, the same members as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
In the above-described embodiment, the wall surface 30W4 and the embedded terminal 32B formed by grinding have a curved surface in the groove 30M4. In the second modification, the wall surface 30W4 and the embedded terminal 32B formed in the groove 30M4 are inclined surfaces (planes) formed from the first side surface 31F toward the second side surface 31S. The angle of the slope is 45 degrees. Even in such a shape, the embedded terminal 32B can be reliably exposed to the outside of the main body 31, and the embedded terminal 32B can function as a mounting terminal. According to the second modification, since the corner portion of the main body 31 (the corner portion between the wall surface 30W4 and the first side surface 31F) is chamfered, stress applied to the insulating tube in contact with the corner portion can be reduced. it can.

(Modification 3 of imaging module)
FIG. 14 is a top view showing a structure of a connection body constituting an imaging module according to Modification 3 of the embodiment of the present invention. In FIG. 14, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
In the third modification, a first vertical wall surface 30WX perpendicular to the first side surface 31F and a second vertical wall surface 30WY perpendicular to the second side surface 31S are formed in the wall surface 30W4. In each of the first vertical wall surface 30WX and the second vertical wall surface 30WY, the embedded terminal 32B is exposed in the wall surface 30W4. Even in such a shape, the embedded terminal 32B can be reliably exposed, and the embedded terminal 32B can function as a mounting terminal. Further, since the embedded terminals 32B formed on the first vertical wall surface 30WX and the second vertical wall surface 30WY are orthogonal to each other, they function as a solder receiving portion that holds the flowing solder. Therefore, according to the third modification, in addition to the effects of the above-described embodiment, it is possible to prevent the solder from flowing outside the main body 31.
The above-described modified examples 2 and 3 show modified examples of the structure in the fourth region 84 that is a part of the connection body 30. Modifications 2 and 3 described above can also be applied to the second region 82 that is a part of the connection body 30.

(Modification 4 of imaging module)
Further, in the above-described embodiment, as shown in FIG. 10, the structure in which the sheath conductor portion 43 having a diameter smaller than the embedded terminal 32B (the opening width of the groove portion 30M4) is disposed inside the groove portion 30M4 has been described. The present invention does not limit the ratio of the radius of the sheath conductor portion 43 to the size (the size and width of the opening) of the embedded terminal 32B. The diameter of the sheath conductor 43 may be larger than the size of the embedded terminal 32B, and the sheath conductor 43 may partially protrude from the groove 30M.
FIG. 15 is a partial cross-sectional view showing a connection body constituting an imaging module according to Modification 4 of the embodiment of the present invention. In particular, FIG. 15 is a diagram showing a state in which the embedded terminal and the sheath conductor 43 of the coaxial cable 40 are joined by solder. FIG. 16 is a cross-sectional view showing a main part of an endoscope provided with an imaging module according to Modification 4 of the embodiment of the present invention. FIG. 17 is an enlarged cross-sectional view showing a main part of a connection body constituting an imaging module according to Modification 4 of the embodiment of the present invention. 15 to 17, the same members as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  In the example shown in FIG. 15, at least a part of the sheath conductor portion 43 is disposed inside the groove portion 30M4, and the other portion of the sheath conductor portion 43 faces the outside of the groove portion 30M4 from the first side surface 31F and the second side surface 31S. It protrudes. When a part of the sheath conductor 43 is located outside the groove 30M4 as described above, it is preferable that a curved surface (back fillet 35B) is formed on the surface of the solder 35 as shown in FIG.

As shown in FIG. 17, fillet forming terminals 46 (fifth mounting terminals) are provided on the lower surface 30 b of the connection body 30. The fillet forming terminal 46 is connected to the end of the embedded terminal 32B on the lower surface 30b, and constitutes a part of the embedded conductor 33B. That is, the embedded conductor 33B integrally forms the embedded terminal 32B, the internal connection conductor 37, the internal extension conductor 38B, the mounting pad 34, and the fillet forming terminal 46.
The fillet forming terminal 46 has a terminal tip 47. The terminal tip 47 is located away from the connection surface between the embedded terminal 32 </ b> B and the sheath conductor 43 of the coaxial cable 40. In the example shown in FIG. 17, the terminal tip portion 47 is at a substantially central position of the connection body 30. That is, the terminal tip 47 is not formed on the entire lower surface 30b. Solder 35 is formed on the lower surface 30b so as to cover the fillet forming terminal 46 and the embedded terminal 32B.

  The coaxial cable 40 includes a jacket 44 covering the sheath conductor 43 and a cable boundary 45 positioned at the boundary between the sheath conductor 43 and the jacket 44. The cable boundary portion 45 is located outside the lower surface 30b, that is, at a position away from the lower surface 30b. The solder 35 electrically connects the fillet forming terminal 46 and the sheath conductor portion 43. In particular, the solder 35 covers the fillet forming terminal 46 and the sheath conductor portion 43 so as to form a curved surface extending from the terminal tip portion 47 toward the cable boundary portion 45.

According to Modification 4 described above, the same effects as those of the imaging module according to the embodiment described above can be obtained. Furthermore, since the fillet forming terminal 46 and the sheath conductor 43 can be electrically connected by the solder 35 as well as the electrical connection between the embedded terminal 32B and the sheath conductor 43, the reliability of the electrical connection is improved. Can be improved.
Furthermore, when the sheath conductor 43 connected to the embedded terminal 32B has a large diameter that protrudes to the outside of the groove 30M4, it is necessary to check the connection state between the sheath conductor 43 and the connection body 30. In this case, it is possible to determine whether the solder 35 has a fillet shape (back fillet 35B) at the fillet forming terminal 46 by observing the lower surface 30b, and the connection state between the sheath conductor 43 and the connection body 30 is easy. Can be confirmed.

In the example shown in FIG. 17, the mounting pad 30p is not shown, but the present invention is not limited to the example shown in FIG. Both the mounting pad 30p and the fillet forming terminal 46 may be provided on the lower surface 30b. In this case, a common terminal (terminal, pad, electrode) common to the mounting pad 30p and the fillet forming terminal 46 is provided on the lower surface 30b. This common terminal is connected to the embedded terminal 32B. Specifically, since the capacitor 50 has two terminals, two separate common terminals are formed on the lower surface 30b, and the two common terminals are respectively connected to the two embedded terminals 32B. The common terminal may be an embedded terminal embedded in the main body 31.
When such a common terminal is provided on the lower surface 30b, the insulating coat layer is shared so as to be positioned between the mounting pad 30p and the fillet forming terminal 46 and to cross the two common terminals. It may be provided on the terminal. In this case, for example, the insulating coat layer extends in a direction orthogonal to the direction in which the common terminal extends.

(Modification 5 of imaging module)
Although the said modification 4 has shown the structure which applied the back fillet 35B to the structure where the sheath conductor part 43 protrudes partially from the groove part 30M, this invention is not limited to this structure. The back fillet may be applied to a structure in which the sheath conductor part 43 does not protrude from the groove part 30M (a structure in which the sheath conductor part 43 is disposed inside the groove part 30M). That is, as a fifth modification of the imaging module, the back fillet 35B shown in FIGS. 16 and 17 may be applied to the wiring structure shown in FIG.
In this case, as shown in FIG. 16, the solder 35 is formed along the surface shapes of the fillet forming terminal 46 and the sheath conductor portion 43, and the cross-sectional shape of the solder 35 is L-shaped. Specifically, the solder 35 connects the fillet forming terminal 46 and the sheath conductor 43 so as to form a three-dimensional connection structure that spreads from the sheath conductor 43 to the entire surface of the fillet forming terminal 46. . Since the solder 35 is in close contact between the fillet forming terminal 46 and the sheath conductor 43, the mechanical strength between the fillet forming terminal 46 and the sheath conductor 43 can be improved.

(Modification 6 of imaging module)
FIG. 18 is a cross-sectional view illustrating the positional relationship between a connection body and a coaxial cable that constitute an imaging module according to Modification 6 of the embodiment of the present invention. In FIG. 18, the same members as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
The present invention is not limited to the structure of the connection body 30 shown in FIG. The present invention includes, for example, the structure of the connection body 30 according to the sixth modification shown in FIG.

The inner extension conductor 38A penetrates the first region 81 and does not penetrate the second region 82. As shown in FIG. 18, the internal connection conductor 36 extends in the Y direction. That is, the extending direction of the inner connecting conductor 36 is different from the extending direction (Z direction) of the inner extending conductor 38A. The upper surface of the internal connection conductor 36 is located at the point P 1, that is, the upper end of the second region 82.
At the first end P12 of the internal connection conductor 36, the internal connection conductor 36 and the internal extension conductor 38A are connected. That is, the embedded conductor 33A forms a first inner bent conductor that bends at the first end P12 (first inner bent portion located inside the main body 31). Specifically, the inner extension conductor 38A and the inner connection conductor 36 form a first inner bent conductor that bends at the first end P12.

On the other hand, the internal connection conductor 36 and the embedded conductor 33A are connected at the second end P13 of the internal connection conductor 36 (the end opposite to the first end P12). The internal connection conductor 36 and the embedded terminal 32A form a first outer bent conductor that bends at the second end P13 (bent portion). Here, the second end P13 is a first outer bent portion located outside the main body 31 with respect to the first inner bent portion (first end P12).
The internal extension conductor 38A, the internal connection conductor 36, and the embedded terminal 32A constituting the embedded conductor 33A are a three-dimensional structure integrally formed inside the main body 31, and are bent at the two bent portions P12 and P13. Thus, the conductor is formed in a substantially inverted S-shape.

  The internal extension conductor 38B does not penetrate the main body 31. The internal extension conductor 38B has an end portion (inner end portion) located on the side opposite to the mounting pad 34 (outer end portion). The inner end 38 </ b> C of the inner extension conductor 38 </ b> B is located inside the main body 31. At the first end P <b> 10 of the internal connection conductor 37, the inner end portion 38 </ b> C is connected to the internal connection conductor 37. That is, the embedded conductor 33B forms a second inner bent conductor that bends at the first end P10 (second inner bent portion located inside the main body 31). Specifically, the inner extension conductor 38B and the inner connection conductor 37 form a second inner bent conductor that bends at the first end P10.

The embedded terminal 32B has a first connection end 32BU and a second connection end 32BL located on the opposite side of the first connection end 32BU. The first connection end 32BU is located at the upper end of the embedded terminal 32B. The second connection end 32BL is located at the lower end of the embedded terminal 32B.
The first connection end 32BU is connected to the second end P11 of the internal connection conductor 37. That is, the internal connection conductor 37 and the embedded terminal 32B form an outer bent conductor that bends at the second end P11 (bent portion). Here, the second end P11 is a second outer bent portion located outside the main body 31 with respect to the second inner bent portion (first end P10).

A lower end embedded conductor 48 is provided on the lower surface 30 b of the connection body 30. The lower embedded conductor 48 has a first wiring end 48L and a second wiring end 48R located on the opposite side of the first wiring end 48L. The first wiring end 48L is located at the left end of the lower embedded conductor 48. The second wiring end 48R is located at the right end of the lower embedded conductor 48 and is connected to the mounting pad 30p.
The second connection end 32BL of the embedded terminal 32B is connected to the first wiring end 48L of the lower embedded conductor 48. That is, the lower embedded conductor 48 and the embedded terminal 32B form a bent conductor that bends at the second connection end 32BL (bent portion). Here, the second connection end 32BL is an outer bent portion positioned outside the main body 31 with respect to the inner bent portion.
That is, the internal extension conductor 38B, the internal connection conductor 37, the embedded terminal 32B, and the lower end embedded conductor 48 constituting the embedded conductor 33B are a three-dimensional structure integrally formed inside the main body 31.

  This three-dimensional structure has three bent portions (a first end P10, a second end P11, and a second connection end 32BL). In other words, the embedded conductor 33B includes a first conductor formed in a substantially inverted S shape that is bent at the first end P10 and the second end P11, and a U shape that is bent at the second end P11 and the second connection end 32BL. And a second conductor formed on the substrate. The embedded conductor 33B is configured by a combination of a first conductor and a second conductor.

The mounting pad 34 and the mounting pad 30p are electrically connected through the embedded conductor 33B having such a configuration.
In the case of the sixth modification, in order to prevent the occurrence of a solder bridge between the capacitor 50 and the solder 35, which are electronic components, on the lower end embedded conductor 48 and between the mounting pad 30p and the embedded terminal 32B. Alternatively, a resist made of an insulator may be disposed.
Also in Modification 6 described above, the same effect as described above can be obtained.

  In the above-described modification 6, the structure in which the lower end embedded conductor is provided on the lower surface 30b has been described, but the present invention is not limited to this structure. For example, a wiring may be provided on the lower surface 30b. In this case, the wiring has a first wiring end 48L and a second wiring end 48R, and is connected to the second connection end 32BL. When the wiring is formed on the lower surface 30b, the wiring is formed mainly by patterning using a printing method. This wiring electrically connects the second connection end 32BL and the mounting pad 30p on the lower surface 30b.

  While preferred embodiments of the present invention have been described and described above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is limited by the scope of the claims.

  In the embodiment and the modification described above, the embedded terminals 32A and 32B are exposed by grinding the corner regions 30KA and 30KC of the connection body 30, but the corner regions 30KA and 30KC are polished. The corner regions 30KA and 30KC may be removed to expose the embedded terminals 32A and 32B. In this case, it can be said that the wall surfaces of the grooves 30M2 and 30M4 are polished surfaces formed by polishing and have polishing marks generated by the contact between the polishing tool and the main body 31.

  In each of the second region 82 and the fourth region 84, the number of embedded terminals was two. The present invention is not limited to this, and the number of embedded terminals in each of the second region 82 and the fourth region 84 may be three or more. In this case, it is desirable that the two embedded terminals are provided in the corner region of the connection body 30 and are arranged on the diagonal lines (positions facing each other). Thereby, size reduction of an imaging module is realizable.

  Further, in the above-described embodiment, in each of the second region 82 and the fourth region 84, two groove portions are provided so as to sandwich the side surface 39, and a buried terminal is provided in each of the groove portions. The present invention is not limited to this, and the two groove portions may be arranged on the diagonal line of the connection body 30 (positions facing each other). In this case, a buried terminal is provided in each of the two groove portions. In this case, the two embedded terminals are arranged on the diagonal line of the connection body 30.

  In addition, regarding the depths D1, D2, and D3 of the groove portions 30M2, 30M3, and 30M4, in the above-described embodiment, the relationship of D1 <D2 <D3 is satisfied. The present invention does not limit such a relationship, and the depths D1, D2, and D3 may be constant (that is, the relationship D1 = D2 = D3 is satisfied). In this case, since the grooves 30M2, 30M3, and 30M4 can be formed using the same grinding tool, there is an advantage that a common grinding tool can be used in the grinding process, and manufacturing is facilitated.

  In the above-described embodiment, an example in which the “first end surface” of the present invention is the upper surface 30t and an example of the “second end surface” of the present invention is the lower surface 30b has been described. The present invention does not limit the positions of the “first end face” and the “second end face”. An example of the first end surface may be the lower surface 30b, and an example of the second end surface may be the upper surface 30t. When the imaging module is arranged so that the direction from the first end surface toward the second surface intersects the direction of gravity, the first end surface may be the left end surface, and the second end surface is the right end surface. May be. Conversely, the first end surface may be the right end surface, and the second end surface may be the left end surface.

DESCRIPTION OF SYMBOLS 10 ... Imaging module, 20 ... Solid-state image sensor, 21 ... Light receiving surface, 22 ... Image sensor terminal, 30 ... Connection body, 30b ... Lower surface (2nd end surface), 30H1, 30H2 ... Through-hole, 30KA, 30KB, 30KC ... Angle Part region, 30M2 ... groove (first groove), 30M3 ... groove (third groove), 30M4 ... groove (second groove), 30p ... mounting pad (fourth mounting terminal), 30t ... upper surface (first end surface), 30W2, 30W3, 30W4 ... wall surface, 30WX ... first vertical wall surface, 30WY ... second vertical wall surface, 31 ... main body, 31f ... first virtual extension surface, 31F ... first side surface, 31s ... second virtual extension surface, 31S ... Second side, 32A ... Embedded terminal (second mounting terminal, first embedded conductor), 32B ... Embedded terminal (third mounting terminal, second embedded conductor), 32BL ... Second connection end, 32BU ... First connection end, 2T1 ... first upper surface exposed portion (first conductor terminal, first mounting terminal), 32T2 ... second upper surface exposed portion (second conductor terminal, first mounting terminal), 33A ... embedded conductor (first embedded conductor), 33B ... Embedded conductor (second embedded conductor) 34 ... Mounting pad (first mounting terminal), 35 ... Solder, 35B ... Back fillet, 36 ... Internal connection conductor (first internal connection conductor, first embedded conductor), 37 ... Internal connection conductor (second internal connection conductor, second embedded conductor), 38A ... Internal extension conductor (first internal extension conductor, embedded conductor 33A), 38B ... Internal extension conductor (second internal extension conductor, embedded) Conductor 33B), 38C ... inner end, 39 ... side, 40 ... coaxial cable, 41 ... inner conductor, 42 ... sheath, 43 ... sheath conductor, 44 ... jacket, 45 ... cable boundary, 46 ... fillet Forming terminal (5th mounting terminal), 47 ... terminal tip, 48 ... bottom embedded conductor, 48L ... first wiring end, 48R ... second wiring end, 50 ... capacitor (electronic component), 60 ... lens unit, 62 ... cover member, DESCRIPTION OF SYMBOLS 70 ... Insulation tube, 81 ... 1st area | region, 82 ... 2nd area | region, 83 ... 3rd area | region, 84 ... 4th area | region, 90 ... Housing | casing, 95 ... Resin, 100 ... Endoscope, D1, D2, D3 ... depth

Claims (18)

An imaging module,
A solid-state image sensor having an image sensor terminal;
A first end face, a second end face located opposite to the first end face, a first side face perpendicular to the first end face, a second side face perpendicular to the first end face and the first side face, A main body which is an insulating member, a first embedded conductor embedded in the main body, a second embedded conductor embedded in the main body and longer than the first embedded conductor, and provided on the first end surface A first mounting terminal electrically connected to the imaging element terminal and constituting a part of the first embedded conductor and a part of the second embedded conductor, and a first integrated with the first embedded conductor. The second mounting terminal is exposed, the first groove portion provided between the first side surface and the second side surface, the third mounting terminal integrated with the second embedded conductor is exposed, and the first side surface Second groove provided between the second side surface , A third groove located between the first groove and the second groove in the extending direction of the main body, and a fifth mounting provided on the second end face and integral with the second embedded conductor A connection body having a terminal;
An inner conductor portion disposed in the first groove portion and electrically connected to the second mounting terminal; and an inner conductor portion disposed in the second groove portion and electrically connected to the third mounting terminal. A coaxial cable including a sheath conductor portion and a covering portion disposed in the third groove portion;
An imaging module comprising: The imaging module according to claim 1,
The first buried conductor extends in a direction from the first end surface toward the second end surface, and extends from the first inner extension conductor toward the first groove portion. An imaging module having a first internal connection conductor, wherein the second mounting terminal is connected to the first internal connection conductor. The imaging module according to claim 2,
The first inner extending conductor and the first inner connecting conductor constituting the first embedded conductor form a first inner bent conductor that is bent at a first inner bent portion located inside the main body. module. The imaging module according to claim 3,
The second mounting terminal and the first internal connection conductor constituting the first embedded conductor are bent at a first outer bent portion located outside the main body with respect to the first inner bent portion. Forming imaging module. The imaging module according to any one of claims 1 to 4, wherein
The second embedded conductor extends in a direction from the first end surface toward the second end surface, and extends from the second internal extension conductor toward the second groove portion. An imaging module having a second internal connection conductor, wherein the third mounting terminal is connected to the second internal connection conductor. The imaging module according to claim 5,
The second inner extension conductor and the second inner connection conductor constituting the second embedded conductor form a second inner bent conductor that is bent at a second inner bent portion located inside the main body. module. The imaging module according to claim 6,
The third mounting terminal and the second internal connection conductor constituting the second embedded conductor are bent at a second outer bent portion located outside the main body than the second inner bent portion. Forming imaging module. The imaging module according to claim 6,
The imaging module, wherein the second internal connection conductor is a branch conductor branched from the second embedded conductor at a branch portion located inside the main body. The imaging module according to any one of claims 1 to 5,
The imaging module, wherein the first mounting terminal includes a first conductor terminal constituting a part of the first embedded conductor and a second conductor terminal constituting a part of the second embedded conductor. The imaging module according to claim 1,
The depth of the third groove is greater than the depth of the first groove, the depth of the second groove is greater than the depth of the third groove,
An imaging module in which the diameter of the covering portion is larger than the diameter of the inner conductor portion, and the diameter of the sheath conductor portion is larger than the diameter of the covering portion. The imaging module according to claim 1 or 10,
A fourth mounting terminal provided on the second end surface;
An imaging module in which an electronic component is connected to the fourth mounting terminal. The imaging module according to any one of claims 1 to 11,
An imaging module comprising a lens unit that focuses light on a light receiving surface of the solid-state imaging device. The imaging module according to any one of claims 1 to 12,
An imaging module comprising an insulating tube covering a part of the coaxial cable and the connection body. The imaging module according to any one of claims 1 to 13,
A housing that covers a part of the solid-state imaging device, the connection body, and the coaxial cable;
A resin portion filled in the internal space of the housing;
An imaging module comprising: The imaging module according to any one of claims 1 to 14,
The length of the said internal conductor part, the length of the said sheath conductor part, and the length of the said coating | coated part are 0.1-1.0 mm, The imaging module. The imaging module according to any one of claims 1 to 15,
The imaging module in which a distance between the pair of second mounting terminals and a distance between the pair of third mounting terminals is 0.1 to 1.0 mm. The imaging module according to any one of claims 1 to 16, wherein
Comprising solder for electrically connecting the fifth mounting terminal and the coaxial cable;
The fifth mounting terminal has a terminal tip located at a position away from the connection surface between the second mounting terminal and the coaxial cable,
The coaxial cable has a jacket provided on the outer periphery of the sheath conductor portion, and a cable boundary portion located at a boundary between the sheath conductor portion and the jacket,
The cable boundary is located outside the second end face;
The imaging module that covers the fifth mounting terminal and the sheath conductor so that the solder forms a curved surface extending from the terminal tip to the cable boundary. An endoscope,
An endoscope comprising the imaging module according to any one of claims 1 to 17.

Images